WO2003014658A3 - Method and apparatus for process control in the semiconductor manufacturing - Google Patents

Method and apparatus for process control in the semiconductor manufacturing Download PDF

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Publication number
WO2003014658A3
WO2003014658A3 PCT/IL2002/000656 IL0200656W WO03014658A3 WO 2003014658 A3 WO2003014658 A3 WO 2003014658A3 IL 0200656 W IL0200656 W IL 0200656W WO 03014658 A3 WO03014658 A3 WO 03014658A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
optical path
optical
detector
directing assembly
Prior art date
Application number
PCT/IL2002/000656
Other languages
French (fr)
Other versions
WO2003014658A2 (en
Inventor
Moshe Finarov
Original Assignee
Nova Measuring Instr Ltd
Moshe Finarov
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nova Measuring Instr Ltd, Moshe Finarov filed Critical Nova Measuring Instr Ltd
Priority to AU2002321815A priority Critical patent/AU2002321815A1/en
Publication of WO2003014658A2 publication Critical patent/WO2003014658A2/en
Publication of WO2003014658A3 publication Critical patent/WO2003014658A3/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating

Abstract

An optical system is presented for use in a measurement system (OS) for measuring in patterned structures, which is particularly useful controlling processing of the structure progressing on a production line. The system comprises (OS) an illuminator unit (10) producing illuminating light to be directed to the structure to produce returned light, a detector unit comprising an imaging detector (26) and a spectrophotometer detector (30), and a light directing assembly (31). The light directing assembly (31) defines first and second optical paths for the light propagation. The optical elements accommodated in the first optical path affect the light to provide a relatively small measuring area of the structure's plane. The second optical path is located outside the first optical path, the light propagation through the second optical path providing a relatively large measuring area, as compared to that of the first optical path.
PCT/IL2002/000656 2001-08-08 2002-08-08 Method and apparatus for process control in the semiconductor manufacturing WO2003014658A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002321815A AU2002321815A1 (en) 2001-08-08 2002-08-08 Method and apparatus for process control in the semiconductor manufacturing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL14480601A IL144806A (en) 2001-08-08 2001-08-08 Method and apparatus for process control in semiconductor manufacturing
IL144806 2001-08-08

Publications (2)

Publication Number Publication Date
WO2003014658A2 WO2003014658A2 (en) 2003-02-20
WO2003014658A3 true WO2003014658A3 (en) 2003-11-20

Family

ID=11075678

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2002/000656 WO2003014658A2 (en) 2001-08-08 2002-08-08 Method and apparatus for process control in the semiconductor manufacturing

Country Status (4)

Country Link
US (1) US6806971B2 (en)
AU (1) AU2002321815A1 (en)
IL (1) IL144806A (en)
WO (1) WO2003014658A2 (en)

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US20080246951A1 (en) * 2007-04-09 2008-10-09 Phillip Walsh Method and system for using reflectometry below deep ultra-violet (DUV) wavelengths for measuring properties of diffracting or scattering structures on substrate work-pieces
US8564780B2 (en) 2003-01-16 2013-10-22 Jordan Valley Semiconductors Ltd. Method and system for using reflectometry below deep ultra-violet (DUV) wavelengths for measuring properties of diffracting or scattering structures on substrate work pieces
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
JP2007517231A (en) 2003-12-24 2007-06-28 カスケード マイクロテック インコーポレイテッド Active wafer probe
US7176705B2 (en) * 2004-06-07 2007-02-13 Cascade Microtech, Inc. Thermal optical chuck
US7362448B1 (en) 2004-09-08 2008-04-22 Nanometrics Incorporated Characterizing residue on a sample
DE202005021435U1 (en) 2004-09-13 2008-02-28 Cascade Microtech, Inc., Beaverton Double-sided test setups
JP2006195362A (en) * 2005-01-17 2006-07-27 Pentax Corp Photometry device
US7656172B2 (en) * 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
ATE512412T1 (en) * 2005-04-25 2011-06-15 Network Appliance Inc SYSTEM AND METHOD FOR CAPACING NETWORK FILE SYSTEMS
US7449899B2 (en) * 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
JP5080459B2 (en) * 2005-06-13 2012-11-21 カスケード マイクロテック インコーポレイテッド Wideband active / passive differential signal probe
US20070042510A1 (en) * 2005-08-19 2007-02-22 Wafermasters, Incorporated In situ process monitoring and control
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US20080129986A1 (en) * 2006-11-30 2008-06-05 Phillip Walsh Method and apparatus for optically measuring periodic structures using orthogonal azimuthal sample orientations
IL185043A0 (en) * 2007-08-05 2008-01-06 Nova Measuring Instr Ltd Optical method and system
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
US8867041B2 (en) 2011-01-18 2014-10-21 Jordan Valley Semiconductor Ltd Optical vacuum ultra-violet wavelength nanoimprint metrology
US8565379B2 (en) 2011-03-14 2013-10-22 Jordan Valley Semiconductors Ltd. Combining X-ray and VUV analysis of thin film layers
JP6410618B2 (en) * 2015-01-19 2018-10-24 株式会社ニューフレアテクノロジー Defect inspection equipment
US9372881B1 (en) * 2015-12-29 2016-06-21 International Business Machines Corporation System for identifying a correspondence between a COBOL copybook or PL/1 include file and a VSAM or sequential dataset
US10886155B2 (en) * 2019-01-16 2021-01-05 Applied Materials, Inc. Optical stack deposition and on-board metrology

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US5900633A (en) * 1997-12-15 1999-05-04 On-Line Technologies, Inc Spectrometric method for analysis of film thickness and composition on a patterned sample
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Also Published As

Publication number Publication date
US20030030822A1 (en) 2003-02-13
IL144806A (en) 2005-11-20
IL144806A0 (en) 2002-06-30
US6806971B2 (en) 2004-10-19
AU2002321815A1 (en) 2003-02-24
WO2003014658A2 (en) 2003-02-20

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