WO2003017322A2 - A method and system for measurements in patterned structures - Google Patents
A method and system for measurements in patterned structures Download PDFInfo
- Publication number
- WO2003017322A2 WO2003017322A2 PCT/IL2002/000655 IL0200655W WO03017322A2 WO 2003017322 A2 WO2003017322 A2 WO 2003017322A2 IL 0200655 W IL0200655 W IL 0200655W WO 03017322 A2 WO03017322 A2 WO 03017322A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- patterned structure
- electrical
- apphed
- measurements
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Definitions
- This invention is generally in the field of measurement techniques aimed at confrolling a certain process of the structure manufacture, and relates to a method and system for measurements in patterned structures.
- the present invention is particularly useful with conductive layer bearing structures for contact or contactless electrical testing.
- the manufacture of semiconductor devices typically includes a process of depositing a metal layer onto a semiconductor wafer in order to define interconnects.
- the quality of this process, as well as that of a process of removing the metal from selected regions (e.g., ponshing) that follows the deposition process, should be controlled.
- Fig. 1 illustrates a cross section of a stack-like copper-based wafer structure 10 (utilizing copper interconnects patterned with a known dual Damascene process) prior to the appHcation of a CMP process.
- the structure 10 includes a substrate 11 with an ILD layer 12 thereon, optional so-called "etch stop" layer 14 (e.g., SiN), ILD layer portions 16 and 18, and a copper layer 20.
- etch stop layer 14 e.g., SiN
- These stack layers define a dense structure 22, which is composed of the ILD layer portions 18 and copper layer 20, and is surrounded by the ILD layer portions 16. Copper is deposited by one of the known techniques, such as CVD, PVD electroplating or electroless plating.
- the uppermost copper layer 20 has certain topography, namely, has the topology within the dense structure 22 repeating that of the underlying pattern.
- a thin copper seed layer 24 (with the thickness of about 1000-5000A) should be deposited onto the structure prior to the deposition of the layer 20 as a prerequisite for electroplating. The thickness of this layer could be measured by optical- or electrical-based techniques.
- a barrier layer (TaN or Ta) is typically provided above the ILD layer portions 16 and 18 to prevent copper migration therein.
- Copper CMP is a complex process because of the need to completely remove the barrier layers and copper, without the overpohshing of any feature. This is difficult because current copper deposition processes are not as uniform as the oxide deposition process. To this end, the quahty of the copper deposition process should be controlled.
- the main idea of the present invention consists of providing a compact system of a desired footprint so as to be installable within a processing machine, in particular at an exit station of this machine.
- the technique according to the invention combines an optical unit and an electrical measurement unit, in order to enable measurements in predetermined sites of a patterned structure.
- a patterned structure to be measured by the present invention is any structure progressing on a production line and having a pattern in the form of a surface rehef of its uppermost layer made of a conductive material capable of reflecting incident Hght.
- the pattern may be created by the topology of the uppermost layer defined by a pattern of underneath layer or layers in the structure.
- the need for measurements in predetermined sites is essential when measuring in patterned structures, aimed at preventing damages of specific sites in the structure.
- the pattern is defined by features (dies), and the measurements are preferably apphed to regions between the dies (scribe lines).
- an ahgnment system based on pattern recognition is used. Since the surface of a wafer after the deposition of a metal layer (e.g., copper) thereon is typicahy substantiaUy reflective and is characterized by opticaUy uniform properties, the conventional pattern recognition based systems cannot be used.
- the pattern recognition technique utilized in such systems is based on different contrasts of different regions of the pattern on the surface of a structure (if the uppermost layer is opaque, or on the underneath layers (if the uppermost layer is transparent).
- the technique of the present invention consists of the foUowing. At least a portion of the patterned structure is mu inated, an image of the structure formed by Hght returned therefrom is acquired, and pattern recognition is apphed to this image in order to locate the measurement sites. Then, electrical measurements are apphed to the measurement sites.
- a method for measuring in a patterned structure to thereby enabling to control a process, which has been apphed or is to be apphed to the patterned structure comprising the following steps:
- patterned structure signifies a structure formed with at least one layer, wherein at least one the two layers has a certain surface reHef.
- a structure may be a stack of layers of different materials that has undergone one or more phoththography processes.
- the measured parameter is preferably a thickness of an uppermost layer of the structure.
- the operating conditions of the process to be controlled may, for example, be the rate of a pohshing head (pohsher), the speed or material flow of the layer deposition.
- the measured data can be used for feed back process control, and if the method is apphed to the structure prior to be processed, the measured data is used for feed forward process control. Hence, the measured data is analyzed, and the operating conditions
- the electrical measurements are apphed to a plurahty of sites within the entire surface of the patterned structure.
- an appropriate relative displacement between the structure and an electrical measuring assembly (probe) is provided.
- a method for processing a patterned structure comprising the steps of: - supplying the patterned structure to a measurement system; - ahgning the patterned structure with an electrical measuring unit of the measurement system;
- the patterned structure may be a semiconductor wafer.
- the predetermined measurement sites are preferably located within the scribe lines of the wafer.
- the wafer or the electrical measuring assembly is mounted for displacement along at least one axis of the horizontal plane.
- the wafer or probe may be displaced along one horizontal axis only (Y-axis). If the electrical measuring assembly utilizes one such probe unit (e.g., 4- probe unit), the displacement for a distance of about the wafer's radius along the Y- axis is sufficient, provided the relative position between the wafer and the probe unit is such that the probe unit is vertically ahgned with the center and edge regions of the wafer at, respectively, two extreme position of the wafer (or probe unit, as the case may be).
- one such probe unit e.g., 4- probe unit
- the electrical measuring assembly utilizes two such probe units ahgned in a spaced-apart relationship along the Y-axis, the displacement along this axis for a distance up to (Y+ ⁇ Y) is required, wherein ⁇ Y is the distance between the probe units. If at least one dimension of the probe unit is larger than the width of the scribe line, the displacement along two mutually perpendicular horizontal axes is provided: for a distance of about the wafer's radius
- a method for measuring in a semiconductor wafer progressing on a production line to thereby enabling to control a process, which has been apphed or is to be apphed to the wafer comprising the following steps:
- a measurement system to be used for conttolling a process, which has been apphed or is to be apphed to a patterned structure by a processing machine, the system comprising an optical unit, an electrical measuring assembly, and a support stage for supporting the patterned structure during measurements, the system being designed so as to be installable within said processing machine.
- a measurement system to be used for conttolling a process, which has been apphed or is to be apphed to a patterned structure comprising:
- an optical unit operable to acquire an image of at least a region of the patterned structure formed by Hght returned from the uminated region of the structure, to thereby enable to determine sites to which electrical measurements are to be apphed;
- an electrical measuring assembly operable to apply said electrical measurements to the predetermined sites on the patterned structure, and generate measured data indicative of at least one parameter of the structure, to be used for adjusting operating conditions of the process;
- the support stage has a supporting surface of dimensions of about the dimensions of the patterned structure, and is displaceable along a horizontal axis for a distance of about of the structure's dimension.
- a processing machine comprising:
- the measurement system accommodated adjacent to the processing tool and defining a measurement area outside the processing area, the measurement system comprising an optical unit operable to acquire an image of at least a region of the structure and define predetermine sites on the patterned structure, an electrical measuring assembly operable to apply electrical measurements to the predetermined sites on the structure, and a support stage to support the patterned structure during the imaging and measurements; and a translation assembly for ttanslating the patterned structure between the processing and measurement areas.
- Fig. 1 is a cross-sectional view of a wafer structure, utilizing copper interconnects patterned with a known dual Damascene process;
- FIG. 2 schematically iUustrates a processing machine utilizing an integrated system according to the invention
- Fig. 3 schematically illustrates the main constructional parts of the system according to the invention
- Figs. 4 and 5 schematically illustrate two possible examples, respectively, of the wafer's movement within the system according to the invention.
- Fig. 1 illustrates the stack-like copper-based wafer structure 10 with copper interconnects patterned with the known dual Damascene process, showing that the uppermost copper layer 20 has the topography within the dense structure 22 repeating that of the underlying pattern.
- a processing machine 30 for processing a semiconductor wafer, for example, for the deposition of a metal layer or for poHshing the deposited metal layer.
- the machine 30 comprises such main constructional parts as a processing tool 32 associated with an interface assembly 34, which typically includes at least one input and at least one output cassettes 36 and 38.
- the machine 30 also comprises a measurement system 40.
- the system 40 is constructed so as to be instaUable in the interface assembly (exit station).
- Wafers are transferred within the machine 30 to and from the processing tool 32 by means of an internal robot (not shown). It should be understood that, if the processing tool 32 is the copper deposition tool, wafers are suppHed to the system 40 for measurements before and/or after being processed, thereby enabling feed forward and/or feed back process control. To this end, the output of the system 40 is connected to a control unit (not shown) of the processing tool.
- Fig. 3 illustrates more specifically the construction of the measurement system 40.
- the system 40 comprises a support stage 42, which is driven along the Z- axis to thereby support the wafer W in a measurement plane (X-Y-plane) during measurements, and is driven for movement along at least one of the X- and Y-axes, as will be described more specificaUy further below. AdditionaUy, the stage 42 is rotatable about the Z-axis.
- the stage driving assembly 43 (such as a computer controUed step motor or position servo motor) is operable by a suitable control unit 52, which may be located remotely to the system 40.
- the system 40 further comprises a measuring head 44 composed of an optical unit 46 and an electrical measuring assembly (probe) 48.
- the optical unit is designed to enable electrical measurements in predetermined sites of the wafer, namely, to muminate the wafer with incident Hght, detect Hght returned from the muminated region, and form the image of the iUuminated region enabling recognition of the measurement sites, to which the electrical measurements are then apphed.
- the optical unit 46 includes a Hght source, which is preferably a broad-band or monochromatic Hght source (e.g., LED) for dark field umination, and a suitable detector such as CCD camera.
- the image obtained on the CCD camera is contour-like (i.e., showing the edges of different regions of the surface relief), and is processed by the control unit 52 to locate features on the wafer surface to thereby enable ahgnment of the wafer.
- Ahgnment techniques suitable to be used in the present invention may be of the kind based on scribe lines or asymmetrical features within the die, for example as disclosed in US Patents Nos. 5,682,242 and 5,867,590 assigned to the assignee of the present appHcation. Any detectable feature from the dark field edge image could be used for ahgnment. Such dedicated ahgnment techniques are preferred when measurement sites are to be located within the dies.
- Electrical measurements within the dies are preferably carried out by non-contact methods, in order to avoid damages of the metal layer under measurements.
- measurement sites can also be located within the die area. If the electrical contact is soft enough and may cause local destruction of the top metal layer only, it is acceptable because in the CMP process this layer is removed, so the underlying layers remain non-destructed.
- measurement sites are located within the scribe lines, and contact 2- or 4-probe electrical measuring assembly is used.
- the optical measurements aimed at locating the measurement sites are based on detection of the scribe lines intersections.
- the optical unit 40 comprises an auto-focusing sub-system, for example, the dynamic auto-focusing described in U.S. Patent No. 5,604,344 assigned to the assignee of the present appHcation.
- This patent is therefore incorporated herein by reference with respect to one specific example of the optical unit suitable to be used in the present invention.
- at least one pattern (grid) is imaged onto the wafer surface along the main optical path trough an objective lens.
- the image of the pattern is then combined with an image of the wafer and is reflected towards the image plane along the main optical path.
- the imaging detector CCD
- a focus analyser determines the extent of sharpness of the pattern by analysing the output of the image detector.
- the stage is moved along the Z-axis, in order to provide the in- focus position thereof. Since the in-focus position of the stage corresponds to the fixed distance ⁇ Z between the probe and the wafer's surface, this signal can then be used for moving the stage along the Z-axis on this distance to approach the probe.
- Additional means for conttolling the distance between the probe and wafer's surface may be used, for example, based on changing capacitance of the probe-wafer system.
- one of the electrodes of the probe may be shghtly shifted (e.g., a 0.1 ⁇ m shift) along the Z-axis towards the wafer. In that case, contacting of this electrode with wafer surface will result in closing of an electrical circuit and producing appropriate control signal to the control unit. Then, the probe may be brought into contact by relative translation on that shift distance.
- the system provides very delicate contact with the measured surface in order to avoid metal layer damages.
- the auto-focusing assists in the image processing, and enables to control a distance between the measuring head and the wafer's surface. Conttolling of this distance is important to provide soft contact between the electrical probe (e.g., four-probe) and the wafer's surface, when contact measurements are used, or to maintain desired distance for non-contact measurements utilizing any suitable contactless probe, for example, that disclosed in U.S. PatentNo. 5,781,018.
- the probe as weh as an objective lens of the optical unit, can be moved along the Z-axis with respect to the stage.
- the probe and optical unit are stationary mounted and the stage is movable.
- a pre-alignment sensing unit which is of any suitable design (e.g., an optical system) capable of providing irrformation about the wafer's orientation based on a notch or flat mark formed in the wafer.
- an optical system may be similar to that disclosed in U.S. Patent 6,038,029 assigned to the assignee of the present appHcation.
- Figs. 4 and 5 illustrating two examples, respectively, of the wafer's movement within the system 40 during measurements
- the geometry of the stage and movements are such as to provide measurements within the entire surface of the wafer with the minimal footprint of the system 40.
- the stage is mounted for rotation in the X-Y-plane, sHding movement along the Z-axis, and sHding movement along the Y-axis (generally, along the length of the stage) for a length L equal to or shghtiy higher than the radius r of the wafer.
- the width h of the stage with a wafer on it is equal to or shghtiy higher than the wafer's diameter.
- the probe 48 is stationary mounted so as to be ahgned (along the Z-axis) either with the center of the wafer at the two extreme locations of the stage along the Y-axis.
- a 4-probe assembly is used.
- the angular orientation of the wafer with respect to the probe 48 is not critical.
- the electrical measurements are performed on the scribe lines, and the probe's dimensions are less than the width of the scribe line (e.g., about 50 ⁇ m) at any wafer's orientation. Consequently, the stage movement along the X-axis is not needed.
- an additional probe 48A can be provided being spaced from the probe 48 a distance AL along the Y-axis.
- the length of the stage movement along the Y-axis is equal to (L+A ).
- one of the probe's dimensions is greater than the width of the scribe line SL, for example the length of the 4-probe assembly is higher than the width of the scribe line. Therefore, the orientation of the scribe lines (grid like pattern) with respect to the probe 48 should be such as to ensure that this longer dimension of the probe assembly is arranged along the scribe line.
- measurements are carried out along two mutually pe endicular scribe lines in the vicinity of the wafer's center. These measurements are sufficient when dealing with symmetric structures resulting from the deposition process apphed to a rotating structure.
- the stage is also mounted for sHding movement along the X-axis.
- a minimal distance AX equal to at least the die maximal dimension is needed to allow diametric scan over the wafer, where the measurement site may be located at any coordinate along the die dimension.
- the probe head may be mounted for movement along the X-axis within the range __X equal to at least the die maximal dimension.
- the angular orientation of the wafer is controUed by the optical system (not shown), which observes the edge of the wafer to detect the position of notch (flat) by utilizing any suitable detector, e.g., an opto-couple detector, CCD camera, etc. It should be noted that the angular orientation of the wafer may be performed on an additional support assembly prior to loading the wafer onto the stage.
- the system of the present invention is capable of measuring at least one film (layer) characteristic, e.g., thickness, electrical conductivity (resistively), reflectivity (grain structure of layer, chemical composition).
- the layer reflectivity could be measured by the optical unit 46 using additional spectroscopic channel either included in the system 46 or not combined.
- Such a combined spectroscopic and imaging system may be the NovaScan, Integrated Thickness Monitoring System, commercially available from the assignee of the present appHcation, and is preferred when integrated within a pohsher.
- the electrical thickness measurements by means of 4-probe or the non-contact probe of the above-indicated U.S. Patent No. 5,781,018.
- the system aUows more comprehensive process control, e.g., of the CMP process.
- informative parameters as post- CMP erosion, (hshing and residues may be detected and measured using the technique disclosed in WO 00/54325 assigned to the assignee of the present apphcation.
- Electrode thickness measurements are performed indirectly by sheet resistance measurements, which, for the 4-probe assembly, consist of the foUowing: An electrical current of the known value / is passed between the two of the four probes, and voltage V between the two other probes is measured.
- Various correction factors are used to relate the sheet resistance to the ratio V/ ⁇ , depending inter alia on the probe configuration.
- the layer thickness t and sheet resistance R s are related by wherein p is the specific resistivity of the layer material. Hence, by knowing the value of p, e.g., through caHbration measurements, the layer thickness can be determined. Such a technique is weU known per se and therefore need not be more specifically described.
- the present invention thus presents an integrated measuring tool that may be used with a layer deposition clusters (electrical plating, PVD, CVD, etc.).
- the system of the present invention additionally equipped with the optical (spectroscopic) channel and integrated within the deposition tool could provide optical thickness measurements of the barrier and seed layers.
- the measured parameters of the deposited metal layer may be suppHed to the CMP (poHsher) tool for initial thickness estimation.
Abstract
Description
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002324314A AU2002324314A1 (en) | 2001-08-15 | 2002-08-08 | A method and system for measurements in patterned structures |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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IL144911 | 2001-08-15 | ||
IL144911A IL144911A (en) | 2001-08-15 | 2001-08-15 | Method and system for measurements in patterned structures |
Publications (2)
Publication Number | Publication Date |
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WO2003017322A2 true WO2003017322A2 (en) | 2003-02-27 |
WO2003017322A3 WO2003017322A3 (en) | 2009-06-11 |
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Application Number | Title | Priority Date | Filing Date |
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PCT/IL2002/000655 WO2003017322A2 (en) | 2001-08-15 | 2002-08-08 | A method and system for measurements in patterned structures |
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AU (1) | AU2002324314A1 (en) |
IL (1) | IL144911A (en) |
WO (1) | WO2003017322A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10355573A1 (en) * | 2003-11-28 | 2005-07-07 | Advanced Micro Devices, Inc., Sunnyvale | A method and system for increasing production yield by controlling lithography based on electrical velocity data |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4786867A (en) * | 1986-09-02 | 1988-11-22 | Canon Kabushiki Kaisha | Wafer prober |
US6428673B1 (en) * | 2000-07-08 | 2002-08-06 | Semitool, Inc. | Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology |
US6587744B1 (en) * | 1999-06-22 | 2003-07-01 | Brooks Automation, Inc. | Run-to-run controller for use in microelectronic fabrication |
-
2001
- 2001-08-15 IL IL144911A patent/IL144911A/en not_active IP Right Cessation
-
2002
- 2002-08-08 AU AU2002324314A patent/AU2002324314A1/en not_active Abandoned
- 2002-08-08 WO PCT/IL2002/000655 patent/WO2003017322A2/en not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4786867A (en) * | 1986-09-02 | 1988-11-22 | Canon Kabushiki Kaisha | Wafer prober |
US6587744B1 (en) * | 1999-06-22 | 2003-07-01 | Brooks Automation, Inc. | Run-to-run controller for use in microelectronic fabrication |
US6428673B1 (en) * | 2000-07-08 | 2002-08-06 | Semitool, Inc. | Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10355573A1 (en) * | 2003-11-28 | 2005-07-07 | Advanced Micro Devices, Inc., Sunnyvale | A method and system for increasing production yield by controlling lithography based on electrical velocity data |
DE10355573B4 (en) * | 2003-11-28 | 2007-12-20 | Advanced Micro Devices, Inc., Sunnyvale | A method of increasing production yield by controlling lithography based on electrical velocity data |
US7325224B2 (en) | 2003-11-28 | 2008-01-29 | Advanced Micro Devices, Inc. | Method and system for increasing product yield by controlling lithography on the basis of electrical speed data |
Also Published As
Publication number | Publication date |
---|---|
IL144911A0 (en) | 2002-06-30 |
WO2003017322A3 (en) | 2009-06-11 |
IL144911A (en) | 2007-02-11 |
AU2002324314A8 (en) | 2009-07-30 |
AU2002324314A1 (en) | 2003-03-03 |
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