WO2003030274A1 - Dispositif emetteur de lumiere et procede de fabrication associe - Google Patents

Dispositif emetteur de lumiere et procede de fabrication associe Download PDF

Info

Publication number
WO2003030274A1
WO2003030274A1 PCT/JP2002/009996 JP0209996W WO03030274A1 WO 2003030274 A1 WO2003030274 A1 WO 2003030274A1 JP 0209996 W JP0209996 W JP 0209996W WO 03030274 A1 WO03030274 A1 WO 03030274A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
recesses
mounting substrate
emitting elements
metallic
Prior art date
Application number
PCT/JP2002/009996
Other languages
English (en)
French (fr)
Inventor
Kenji Takine
Original Assignee
Nichia Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corporation filed Critical Nichia Corporation
Priority to US10/490,763 priority Critical patent/US20050073846A1/en
Priority to JP2003533358A priority patent/JPWO2003030274A1/ja
Publication of WO2003030274A1 publication Critical patent/WO2003030274A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
PCT/JP2002/009996 2001-09-27 2002-09-27 Dispositif emetteur de lumiere et procede de fabrication associe WO2003030274A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/490,763 US20050073846A1 (en) 2001-09-27 2002-09-27 Lightemitting device and method of manufacturing the same
JP2003533358A JPWO2003030274A1 (ja) 2001-09-27 2002-09-27 発光装置およびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001/297249 2001-09-27
JP2001297249 2001-09-27

Publications (1)

Publication Number Publication Date
WO2003030274A1 true WO2003030274A1 (fr) 2003-04-10

Family

ID=19118360

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/009996 WO2003030274A1 (fr) 2001-09-27 2002-09-27 Dispositif emetteur de lumiere et procede de fabrication associe

Country Status (3)

Country Link
US (1) US20050073846A1 (ja)
JP (1) JPWO2003030274A1 (ja)
WO (1) WO2003030274A1 (ja)

Cited By (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004107443A1 (de) * 2003-06-03 2004-12-09 Asetronics Ag Isoliertes metallsubstrat mit wenigstens einer leuchtdiode, leuchtdiodenmatrix und herstellungsverfahren
WO2005067064A1 (en) * 2003-11-25 2005-07-21 Shichao Ge Light emitting diode and light emitting diode lamp
JP2006041380A (ja) * 2004-07-29 2006-02-09 Nippon Leiz Co Ltd 光源装置
EP1635403A1 (de) * 2004-09-08 2006-03-15 Asetronics AG Isoliertes Metallsubstrat mit mehreren Leuchtdioden
JP2006093711A (ja) * 2004-09-24 2006-04-06 Shogen Koden Kofun Yugenkoshi 半導体発光素子ユニット
JP2006319290A (ja) * 2005-05-16 2006-11-24 Citizen Electronics Co Ltd 発光ダイオード光源ユニット及びバルブ型発光ダイオード光源
JP2007043126A (ja) * 2005-06-30 2007-02-15 Matsushita Electric Works Ltd Ｌｅｄを用いた照明器具
JP2007510297A (ja) * 2003-11-07 2007-04-19 トリドニック オプトエレクトロニクス ゲゼルシャフト ミット ベシュレンクテル ハフツング 放熱板を有する発光ダイオードの構成
JP2007109701A (ja) * 2005-10-11 2007-04-26 Hitachi Aic Inc 発光素子搭載用基板
US7253447B2 (en) 2003-02-28 2007-08-07 Citizen Electronics Co., Ltd. Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element
JP2007300010A (ja) * 2006-05-02 2007-11-15 Nichia Chem Ind Ltd 発光装置及び照明装置
JP2007536729A (ja) * 2004-05-06 2007-12-13 ソウル オプト デバイス カンパニー リミテッド 発光装置
JP2008010486A (ja) * 2006-06-27 2008-01-17 Nichia Chem Ind Ltd 発光装置及びその製造方法
JP2008078401A (ja) * 2006-09-21 2008-04-03 Toshiba Lighting & Technology Corp 照明装置
JP2008085302A (ja) * 2006-08-29 2008-04-10 Toshiba Lighting & Technology Corp 照明装置
JP2008098600A (ja) * 2006-10-11 2008-04-24 Alti Electronics Co Ltd 発光ダイオードパッケージ
JP2008518461A (ja) * 2004-10-25 2008-05-29 クリー インコーポレイテッド 固体金属ブロック半導体発光デバイス実装基板ならびにキャビティおよびヒートシンクを含むパッケージ、ならびにそれらをパッケージングする方法
JP2008205501A (ja) * 2002-06-14 2008-09-04 Lednium Technology Pty Ltd Ｌｅｄのパッケージ方法およびパッケージングされたｌｅｄ
JP2008235867A (ja) * 2007-02-22 2008-10-02 Sharp Corp 表面実装型発光ダイオードおよびその製造方法
KR100866436B1 (ko) * 2006-06-02 2008-10-31 엔이씨 라이팅 가부시키가이샤 전자 장치 제조 방법
JP2009010360A (ja) * 2007-05-31 2009-01-15 Toshiba Lighting & Technology Corp 照明装置
JP2009032828A (ja) * 2007-07-25 2009-02-12 Mitsubishi Cable Ind Ltd Ｌｅｄチップ固定用基板およびその製造方法
JP2009038125A (ja) * 2007-07-31 2009-02-19 Sanyo Electric Co Ltd 発光モジュールおよびその製造方法
WO2009028738A1 (ja) * 2007-08-31 2009-03-05 Sanyo Electric Co., Ltd. 発光モジュールおよびその製造方法
JP2009081194A (ja) * 2007-09-25 2009-04-16 Sanyo Electric Co Ltd 発光モジュールおよびその製造方法
JP2009081193A (ja) * 2007-09-25 2009-04-16 Sanyo Electric Co Ltd 発光モジュールおよびその製造方法
JP2009194112A (ja) * 2008-02-14 2009-08-27 Dainippon Printing Co Ltd Ｌｅｄモジュール用基板とその作製方法、および該ｌｅｄモジュール用基板を用いたｌｅｄモジュール
JP2009200187A (ja) * 2008-02-21 2009-09-03 Kamakura Denshi Kogyo Kk 照明装置のｌｅｄ実装方法及びｌｅｄ照明装置
WO2009119461A1 (ja) * 2008-03-26 2009-10-01 島根県 半導体発光モジュールおよびその製造方法
JP2009272363A (ja) * 2008-05-01 2009-11-19 Rohm Co Ltd Ｌｅｄランプ
JP2010010558A (ja) * 2008-06-30 2010-01-14 Nec Lighting Ltd 発光装置及び発光装置の製造方法
US7648775B2 (en) 2004-12-03 2010-01-19 Ngk Spark Plug Co., Ltd. Ceramic substrate, ceramic package for housing light emitting element
US7699500B2 (en) 2005-06-07 2010-04-20 Fujikura Ltd. Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment
JP2010123768A (ja) * 2008-11-20 2010-06-03 Kanehirodenshi Corp Ｌｅｄランプ
JP2010530632A (ja) * 2007-06-22 2010-09-09 ウエイブニクス インク． 金属ベースの光素子パッケージモジュールおよびその製造方法
JP2010219562A (ja) * 2006-08-29 2010-09-30 Toshiba Lighting & Technology Corp 照明装置
JP2011513966A (ja) * 2008-05-06 2011-04-28 ソンノ ユン プレス鍛造方式の発光ダイオード金属製ハウジング及び金属製ハウジングを用いた発光ダイオード金属製パッケージ
JP2011139059A (ja) * 2009-12-25 2011-07-14 Bright Led Electronics Corp 発光モジュール及びその製造方法
US8044424B2 (en) 2005-06-30 2011-10-25 Panasonic Electric Works Co., Ltd. Light-emitting device
JP2011249855A (ja) * 2007-08-02 2011-12-08 Lextar Electronics Corp 発光ダイオードパッケージ
US8098003B2 (en) 2009-06-01 2012-01-17 Toshiba Lighting & Technology Corporation Light emitting module and illumination device
US8167456B2 (en) 2006-11-30 2012-05-01 Toshiba Lighting & Technology Corporation Illumination device with semiconductor light-emitting elements
JPWO2010119580A1 (ja) * 2009-04-16 2012-10-22 株式会社光波 光源モジュール
JP2013030812A (ja) * 2012-11-06 2013-02-07 Mitsubishi Chemicals Corp Ｌｅｄチップ固定用基板およびその製造方法
US8421088B2 (en) 2007-02-22 2013-04-16 Sharp Kabushiki Kaisha Surface mounting type light emitting diode
JP2013229639A (ja) * 2013-08-13 2013-11-07 Nec Lighting Ltd 発光装置及び発光装置の製造方法
KR101349701B1 (ko) 2012-11-28 2014-01-13 주식회사 루멘스 자외선 발광소자 패키지
US8847254B2 (en) 2005-12-15 2014-09-30 Seoul Semiconductor Co., Ltd. Light emitting device
US8883040B2 (en) 2004-06-10 2014-11-11 Seoul Semiconductor Co., Ltd. Luminescent material
US8900482B2 (en) 2004-06-10 2014-12-02 Seoul Semiconductor Co., Ltd. Light emitting device
JP2015070242A (ja) * 2013-10-01 2015-04-13 シチズン電子株式会社 半導体発光装置
US9312246B2 (en) 2006-03-31 2016-04-12 Seoul Semiconductor Co., Ltd. Light emitting device and lighting system having the same
US10186642B2 (en) 2004-05-13 2019-01-22 Seoul Semiconductor Co., Ltd. Light emitting device including RGB light emitting diodes and phosphor
EP1735844B1 (en) * 2004-03-18 2019-06-19 Phoseon Technology, Inc. Use of a high-density light emitting diode array comprising micro-reflectors for curing applications

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050077616A1 (en) * 2003-10-09 2005-04-14 Ng Kee Yean High power light emitting diode device
US20050264194A1 (en) * 2004-05-25 2005-12-01 Ng Kee Y Mold compound with fluorescent material and a light-emitting device made therefrom
EP1878062A2 (en) * 2005-04-28 2008-01-16 Koninklijke Philips Electronics N.V. Light source comprising led arranged in recess
US7319246B2 (en) * 2005-06-23 2008-01-15 Lumination Llc Luminescent sheet covering for LEDs
TWI314366B (en) * 2006-04-28 2009-09-01 Delta Electronics Inc Light emitting apparatus
JP2009538532A (ja) 2006-05-23 2009-11-05 クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド 照明装置
KR100759896B1 (ko) * 2006-06-15 2007-09-18 삼성전자주식회사 적어도 하나의 발광소자가 장착된 백라이트 모듈 및 그제작 방법
US7677765B2 (en) * 2006-06-15 2010-03-16 Avago Technologies General Ip (Singapore) Pte. Ltd. Light emitting device having a metal can package for improved heat dissipation
US7425758B2 (en) * 2006-08-28 2008-09-16 Micron Technology, Inc. Metal core foldover package structures
US7811842B2 (en) * 2007-01-11 2010-10-12 SemiLEDs Optoelectronics Co., Ltd. LED array
DE102007061261A1 (de) * 2007-12-19 2009-07-02 Bayer Materialscience Ag Leuchtkörper mit LED-DIEs und deren Herstellung
JP5288161B2 (ja) * 2008-02-14 2013-09-11 東芝ライテック株式会社 発光モジュール及び照明装置
KR100992778B1 (ko) 2008-05-23 2010-11-05 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
KR101301445B1 (ko) * 2008-12-30 2013-08-28 엘지디스플레이 주식회사 발광 다이오드 모듈 및 이를 구비한 백라이트 어셈블리
KR101077264B1 (ko) * 2009-02-17 2011-10-27 (주)포인트엔지니어링 광소자용 기판, 이를 갖는 광소자 패키지 및 이의 제조 방법
CN101907249B (zh) * 2009-06-08 2013-12-11 鸿富锦精密工业（深圳）有限公司 背光模组
KR20110018777A (ko) * 2009-08-18 2011-02-24 삼성엘이디 주식회사 발광 다이오드 패키지
JP2012049495A (ja) * 2010-01-29 2012-03-08 Nitto Denko Corp 発光ダイオード装置
US8749978B2 (en) 2010-01-29 2014-06-10 Nitto Denko Corporation Power module
KR101028329B1 (ko) * 2010-04-28 2011-04-12 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
US20120193671A1 (en) * 2011-02-01 2012-08-02 Chi Mei Lighting Technology Corp. Light-emitting diode device and method for manufacturing the same
TWI431218B (zh) * 2011-03-11 2014-03-21 Lingsen Precision Ind Ltd The manufacturing method and structure of LED light bar
TW201242122A (en) * 2011-04-15 2012-10-16 Chi Mei Lighting Tech Corp Light-emitting diode device
KR101799449B1 (ko) * 2011-05-04 2017-11-20 엘지이노텍 주식회사 발광소자 모듈 및 이를 포함하는 조명 시스템
KR101785645B1 (ko) * 2011-05-30 2017-10-16 엘지이노텍 주식회사 발광소자 모듈 및 이를 포함하는 조명 시스템
US20140055991A1 (en) * 2012-08-23 2014-02-27 Forrest Starnes McCanless Printed Circuit Boards with Deformations
DE102013201775A1 (de) * 2013-02-04 2014-08-07 Osram Gmbh Beleuchtungsmodul und Verfahren zur Herstellung eines Beleuchtungsmoduls
WO2015027180A1 (en) 2013-08-23 2015-02-26 Molex Incorporated Led module
KR101557942B1 (ko) * 2014-01-08 2015-10-12 주식회사 루멘스 발광 소자 패키지 및 발광 소자 패키지의 제조 방법
JP2017199803A (ja) 2016-04-27 2017-11-02 日立マクセル株式会社 三次元成形回路部品
JP6967961B2 (ja) * 2017-12-21 2021-11-17 スタンレー電気株式会社 車両用灯具用光源ユニット及び車両用灯具
CN111341750B (zh) * 2018-12-19 2024-03-01 奥特斯奥地利科技与系统技术有限公司 包括有导电基部结构的部件承载件及制造方法
DE102019118966A1 (de) * 2019-07-12 2021-01-14 Automotive Lighting Reutlingen Gmbh Verfahren zum Herstellen einer Schaltungsträgerplatte und Schaltungsträgerplatte
US11655968B2 (en) * 2020-09-24 2023-05-23 Koito Manufacturing Co., Ltd. Light-emitting module

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233185A (ja) * 1988-07-22 1990-02-02 Mitsubishi Cable Ind Ltd 発光ダイオード表示装置
JPH0278102A (ja) * 1987-12-24 1990-03-19 Mitsubishi Cable Ind Ltd 発光ダイオード照明具
JPH1098215A (ja) * 1996-09-24 1998-04-14 Toyoda Gosei Co Ltd 発光ダイオード装置
JPH10284759A (ja) * 1997-04-10 1998-10-23 Nichia Chem Ind Ltd 発光装置及びそれを用いた表示装置
JPH11298048A (ja) * 1998-04-15 1999-10-29 Matsushita Electric Works Ltd Ｌｅｄ実装基板
JP2000196150A (ja) * 1998-12-25 2000-07-14 Nichia Chem Ind Ltd 光半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3480294D1 (en) * 1984-11-15 1989-11-30 Japan Traffic Manage Tech Ass Signal light unit having heat dissipating function
US4935665A (en) * 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
US6428189B1 (en) * 2000-03-31 2002-08-06 Relume Corporation L.E.D. thermal management
DE10147040A1 (de) * 2001-09-25 2003-04-24 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Beleuchtungseinheit mit mindestens einer LED als Lichtquelle

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0278102A (ja) * 1987-12-24 1990-03-19 Mitsubishi Cable Ind Ltd 発光ダイオード照明具
JPH0233185A (ja) * 1988-07-22 1990-02-02 Mitsubishi Cable Ind Ltd 発光ダイオード表示装置
JPH1098215A (ja) * 1996-09-24 1998-04-14 Toyoda Gosei Co Ltd 発光ダイオード装置
JPH10284759A (ja) * 1997-04-10 1998-10-23 Nichia Chem Ind Ltd 発光装置及びそれを用いた表示装置
JPH11298048A (ja) * 1998-04-15 1999-10-29 Matsushita Electric Works Ltd Ｌｅｄ実装基板
JP2000196150A (ja) * 1998-12-25 2000-07-14 Nichia Chem Ind Ltd 光半導体装置

Cited By (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008205501A (ja) * 2002-06-14 2008-09-04 Lednium Technology Pty Ltd Ｌｅｄのパッケージ方法およびパッケージングされたｌｅｄ
US7745835B2 (en) 2003-02-28 2010-06-29 Citizen Electronics Co., Ltd. Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode
US7737462B2 (en) 2003-02-28 2010-06-15 Citizen Electronics Co., Ltd Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode
DE102004009998B4 (de) * 2003-02-28 2010-05-06 Citizen Electronics Co., Ltd., Fujiyoshida-shi Licht ausstrahlende Diode und Licht ausstrahlende Diodenvorrichtung umfassend eine Licht ausstrahlende Diode
US7253447B2 (en) 2003-02-28 2007-08-07 Citizen Electronics Co., Ltd. Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element
WO2004107443A1 (de) * 2003-06-03 2004-12-09 Asetronics Ag Isoliertes metallsubstrat mit wenigstens einer leuchtdiode, leuchtdiodenmatrix und herstellungsverfahren
US8766283B2 (en) 2003-11-07 2014-07-01 Tridonic Optoelectronics Gmbh Light-emitting diode arrangement with heat dissipating plate
DE10351934B4 (de) * 2003-11-07 2017-07-13 Tridonic Jennersdorf Gmbh Leuchtdioden-Anordnung mit wärmeabführender Platine
JP2007510297A (ja) * 2003-11-07 2007-04-19 トリドニック オプトエレクトロニクス ゲゼルシャフト ミット ベシュレンクテル ハフツング 放熱板を有する発光ダイオードの構成
WO2005067064A1 (en) * 2003-11-25 2005-07-21 Shichao Ge Light emitting diode and light emitting diode lamp
EP1735844B1 (en) * 2004-03-18 2019-06-19 Phoseon Technology, Inc. Use of a high-density light emitting diode array comprising micro-reflectors for curing applications
JP2007536729A (ja) * 2004-05-06 2007-12-13 ソウル オプト デバイス カンパニー リミテッド 発光装置
US10916684B2 (en) 2004-05-13 2021-02-09 Seoul Semiconductor Co., Ltd. Light emitting device including RGB light emitting diodes and phosphor
US11605762B2 (en) 2004-05-13 2023-03-14 Seoul Semiconductor Co., Ltd. Light emitting device including RGB light emitting diodes and phosphor
US10186642B2 (en) 2004-05-13 2019-01-22 Seoul Semiconductor Co., Ltd. Light emitting device including RGB light emitting diodes and phosphor
US10672956B2 (en) 2004-05-13 2020-06-02 Seoul Semiconductor Co., Ltd. Light emitting device including RGB light emitting diodes and phosphor
US8883040B2 (en) 2004-06-10 2014-11-11 Seoul Semiconductor Co., Ltd. Luminescent material
US8900482B2 (en) 2004-06-10 2014-12-02 Seoul Semiconductor Co., Ltd. Light emitting device
JP2006041380A (ja) * 2004-07-29 2006-02-09 Nippon Leiz Co Ltd 光源装置
EP1635403A1 (de) * 2004-09-08 2006-03-15 Asetronics AG Isoliertes Metallsubstrat mit mehreren Leuchtdioden
JP2006093711A (ja) * 2004-09-24 2006-04-06 Shogen Koden Kofun Yugenkoshi 半導体発光素子ユニット
US7906793B2 (en) 2004-10-25 2011-03-15 Cree, Inc. Solid metal block semiconductor light emitting device mounting substrates
US8598606B2 (en) * 2004-10-25 2013-12-03 Cree, Inc. Solid metal block semiconductor light emitting device mounting substrates and packages
JP2008518461A (ja) * 2004-10-25 2008-05-29 クリー インコーポレイテッド 固体金属ブロック半導体発光デバイス実装基板ならびにキャビティおよびヒートシンクを含むパッケージ、ならびにそれらをパッケージングする方法
US7648775B2 (en) 2004-12-03 2010-01-19 Ngk Spark Plug Co., Ltd. Ceramic substrate, ceramic package for housing light emitting element
JP2006319290A (ja) * 2005-05-16 2006-11-24 Citizen Electronics Co Ltd 発光ダイオード光源ユニット及びバルブ型発光ダイオード光源
US7699500B2 (en) 2005-06-07 2010-04-20 Fujikura Ltd. Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment
US8044424B2 (en) 2005-06-30 2011-10-25 Panasonic Electric Works Co., Ltd. Light-emitting device
JP2007043126A (ja) * 2005-06-30 2007-02-15 Matsushita Electric Works Ltd Ｌｅｄを用いた照明器具
JP2007109701A (ja) * 2005-10-11 2007-04-26 Hitachi Aic Inc 発光素子搭載用基板
US8847254B2 (en) 2005-12-15 2014-09-30 Seoul Semiconductor Co., Ltd. Light emitting device
US9312246B2 (en) 2006-03-31 2016-04-12 Seoul Semiconductor Co., Ltd. Light emitting device and lighting system having the same
US11322484B2 (en) 2006-03-31 2022-05-03 Seoul Semiconductor Co., Ltd. Light emitting device and lighting system having the same
US9576939B2 (en) 2006-03-31 2017-02-21 Seoul Semiconductor Co., Ltd. Light emitting device and lighting system having the same
JP2007300010A (ja) * 2006-05-02 2007-11-15 Nichia Chem Ind Ltd 発光装置及び照明装置
KR100866436B1 (ko) * 2006-06-02 2008-10-31 엔이씨 라이팅 가부시키가이샤 전자 장치 제조 방법
JP2008010486A (ja) * 2006-06-27 2008-01-17 Nichia Chem Ind Ltd 発光装置及びその製造方法
JP2008085302A (ja) * 2006-08-29 2008-04-10 Toshiba Lighting & Technology Corp 照明装置
JP2010219562A (ja) * 2006-08-29 2010-09-30 Toshiba Lighting & Technology Corp 照明装置
JP4678391B2 (ja) * 2006-08-29 2011-04-27 東芝ライテック株式会社 照明装置
US8558272B2 (en) 2006-08-29 2013-10-15 Toshiba Lighting & Technology Corporation Illumination apparatus having a plurality of semiconductor light-emitting devices
US7989840B2 (en) 2006-08-29 2011-08-02 Toshiba Lighting & Technology Corporation Illumination apparatus having a plurality of semiconductor light-emitting devices
JP2008078401A (ja) * 2006-09-21 2008-04-03 Toshiba Lighting & Technology Corp 照明装置
JP2008098600A (ja) * 2006-10-11 2008-04-24 Alti Electronics Co Ltd 発光ダイオードパッケージ
US8167456B2 (en) 2006-11-30 2012-05-01 Toshiba Lighting & Technology Corporation Illumination device with semiconductor light-emitting elements
JP2008235867A (ja) * 2007-02-22 2008-10-02 Sharp Corp 表面実装型発光ダイオードおよびその製造方法
US8421088B2 (en) 2007-02-22 2013-04-16 Sharp Kabushiki Kaisha Surface mounting type light emitting diode
JP2009010360A (ja) * 2007-05-31 2009-01-15 Toshiba Lighting & Technology Corp 照明装置
JP2010530632A (ja) * 2007-06-22 2010-09-09 ウエイブニクス インク． 金属ベースの光素子パッケージモジュールおよびその製造方法
JP2009032828A (ja) * 2007-07-25 2009-02-12 Mitsubishi Cable Ind Ltd Ｌｅｄチップ固定用基板およびその製造方法
JP2009038125A (ja) * 2007-07-31 2009-02-19 Sanyo Electric Co Ltd 発光モジュールおよびその製造方法
JP2011249855A (ja) * 2007-08-02 2011-12-08 Lextar Electronics Corp 発光ダイオードパッケージ
JP2009059870A (ja) * 2007-08-31 2009-03-19 Sanyo Electric Co Ltd 発光モジュールおよびその製造方法
KR101129117B1 (ko) * 2007-08-31 2012-03-23 산요덴키가부시키가이샤 발광 모듈 및 그 제조 방법
WO2009028738A1 (ja) * 2007-08-31 2009-03-05 Sanyo Electric Co., Ltd. 発光モジュールおよびその製造方法
JP2009081194A (ja) * 2007-09-25 2009-04-16 Sanyo Electric Co Ltd 発光モジュールおよびその製造方法
JP2009081193A (ja) * 2007-09-25 2009-04-16 Sanyo Electric Co Ltd 発光モジュールおよびその製造方法
JP2009194112A (ja) * 2008-02-14 2009-08-27 Dainippon Printing Co Ltd Ｌｅｄモジュール用基板とその作製方法、および該ｌｅｄモジュール用基板を用いたｌｅｄモジュール
JP2009200187A (ja) * 2008-02-21 2009-09-03 Kamakura Denshi Kogyo Kk 照明装置のｌｅｄ実装方法及びｌｅｄ照明装置
KR101182742B1 (ko) 2008-03-26 2012-09-13 가부시키가이샤 시마네 덴시 이마후쿠 세이사쿠쇼 반도체 발광모듈 및 그 제조방법
WO2009119461A1 (ja) * 2008-03-26 2009-10-01 島根県 半導体発光モジュールおよびその製造方法
KR101209759B1 (ko) 2008-03-26 2012-12-06 가부시키가이샤 시마네 덴시 이마후쿠 세이사쿠쇼 반도체 발광모듈 및 그 제조방법
EP2819190A1 (en) * 2008-03-26 2014-12-31 Shimane Prefectural Government Semiconductor light emitting module and method for manufacturing the same
US9484515B2 (en) 2008-03-26 2016-11-01 S.E.I Inc. Semiconductor light emitting module comprising an exposed plate surface
US9022613B2 (en) 2008-03-26 2015-05-05 Shimane Prefectural Government Semiconductor light emitting device comprising cut-and-bent portions
JP2009272363A (ja) * 2008-05-01 2009-11-19 Rohm Co Ltd Ｌｅｄランプ
JP2011513966A (ja) * 2008-05-06 2011-04-28 ソンノ ユン プレス鍛造方式の発光ダイオード金属製ハウジング及び金属製ハウジングを用いた発光ダイオード金属製パッケージ
JP2010010558A (ja) * 2008-06-30 2010-01-14 Nec Lighting Ltd 発光装置及び発光装置の製造方法
JP2010123768A (ja) * 2008-11-20 2010-06-03 Kanehirodenshi Corp Ｌｅｄランプ
JP5635495B2 (ja) * 2009-04-16 2014-12-03 株式会社光波 光源モジュール及び面状発光装置
JPWO2010119580A1 (ja) * 2009-04-16 2012-10-22 株式会社光波 光源モジュール
US8098003B2 (en) 2009-06-01 2012-01-17 Toshiba Lighting & Technology Corporation Light emitting module and illumination device
JP2011139059A (ja) * 2009-12-25 2011-07-14 Bright Led Electronics Corp 発光モジュール及びその製造方法
JP2013030812A (ja) * 2012-11-06 2013-02-07 Mitsubishi Chemicals Corp Ｌｅｄチップ固定用基板およびその製造方法
KR101349701B1 (ko) 2012-11-28 2014-01-13 주식회사 루멘스 자외선 발광소자 패키지
JP2013229639A (ja) * 2013-08-13 2013-11-07 Nec Lighting Ltd 発光装置及び発光装置の製造方法
JP2015070242A (ja) * 2013-10-01 2015-04-13 シチズン電子株式会社 半導体発光装置

Also Published As

Publication number Publication date
JPWO2003030274A1 (ja) 2005-01-20
US20050073846A1 (en) 2005-04-07

Similar Documents

Publication Publication Date Title
WO2003030274A1 (fr) Dispositif emetteur de lumiere et procede de fabrication associe
AU2006254610B2 (en) Package structure of semiconductor light-emitting device
EP2278856B1 (en) Tubular led lighting device
RU2576379C2 (ru) Низкозатратная установка светодиодов в модифицированные люминесцентные трубки
KR100764432B1 (ko) 아노다이징 절연 층을 갖는 엘이디 패키지 및 그 제조방법
SG143063A1 (en) Light emitting device and method of manufacturing the same
TW200623450A (en) Package structure of light emitting diode and its manufacture method
KR101068398B1 (ko) 조명 장치 및 이의 제조방법
AU2002360581A1 (en) Light-emitting diode with planar omni-directional reflector
CA2342267A1 (en) Led integrated heat sink
KR20060128443A (ko) Ｌｅｄ 패키지 및 그 제조방법과 이를 이용한 ｌｅｄ어레이 모듈
EP1467414A4 (en) LED AND LED LAMP
JP2004265626A (ja) Ｌｅｄ光源用ソケット
TW200516788A (en) Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same
JP3152802U (ja) Ｌｅｄのパッケージングおよびそれを応用した直管ランプ
EP1120838A3 (en) Organic light emitting device and method for mounting
KR101001600B1 (ko) 조명 장치
JP2001345179A5 (ja)
CN103165592A (zh) 发光装置
WO2013009082A2 (ko) 광 디바이스용 기판
TW200505055A (en) Light-emitting devices having an active region with electrical contacts coupled to opposing surfaces thereof and methods of forming the same
WO2006013503A3 (en) Light emitting diode assembly
TWI419381B (zh) 發光二極體燈條及其製造方法
KR101340029B1 (ko) 반도체 패키지용 리드프레임 및 그 조립체
CN217114432U (zh) 一种五色led灯的电路结构

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CN JP

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FR GB GR IE IT LU MC NL PT SE SK TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2003533358

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 10490763

Country of ref document: US

122 Ep: pct application non-entry in european phase