WO2003038858A3 - A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor - Google Patents

A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor Download PDF

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Publication number
WO2003038858A3
WO2003038858A3 PCT/JP2002/011450 JP0211450W WO03038858A3 WO 2003038858 A3 WO2003038858 A3 WO 2003038858A3 JP 0211450 W JP0211450 W JP 0211450W WO 03038858 A3 WO03038858 A3 WO 03038858A3
Authority
WO
WIPO (PCT)
Prior art keywords
sample
unit
built
polishing apparatus
chemical
Prior art date
Application number
PCT/JP2002/011450
Other languages
French (fr)
Other versions
WO2003038858A2 (en
WO2003038858A8 (en
Inventor
Tohru Satake
Nobuharu Noji
Original Assignee
Ebara Corp
Tohru Satake
Nobuharu Noji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Tohru Satake, Nobuharu Noji filed Critical Ebara Corp
Priority to JP2003541016A priority Critical patent/JP2005507561A/en
Priority to KR10-2004-7006609A priority patent/KR20040062609A/en
Priority to US10/492,172 priority patent/US7361600B2/en
Priority to EP02775468A priority patent/EP1440457A2/en
Publication of WO2003038858A2 publication Critical patent/WO2003038858A2/en
Publication of WO2003038858A3 publication Critical patent/WO2003038858A3/en
Publication of WO2003038858A8 publication Critical patent/WO2003038858A8/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2813—Scanning microscopes characterised by the application
    • H01J2237/2817—Pattern inspection

Abstract

According to the present invention, a chemical and mechanical polishing apparatus (100) for a sample such as a wafer includes a built-in inspection apparatus (25) incorporated therein. The polishing apparatus (100) further comprises a load unit (21), a chemical and mechanical polishing unit (22), a cleaning unit (23), a drying unit (24) and an unload unit (26). The chemical and mechanical polishing apparatus (100) receives a sample from a preceding step (107), carries out respective processes for the sample by said respective units disposed within the polishing apparatus (100) and then transfers the processed sample to a subsequent step (109). Sample loading and unloading means and a sample transfer means are no more necessary for transferring the sample between respective units.
PCT/JP2002/011450 2001-11-02 2002-11-01 A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor WO2003038858A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003541016A JP2005507561A (en) 2001-11-02 2002-11-01 Semiconductor manufacturing apparatus incorporating inspection apparatus and device manufacturing method using the manufacturing apparatus
KR10-2004-7006609A KR20040062609A (en) 2001-11-02 2002-11-01 A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor
US10/492,172 US7361600B2 (en) 2001-11-02 2002-11-01 Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufacturing method using said manufacturing apparatus
EP02775468A EP1440457A2 (en) 2001-11-02 2002-11-01 A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-337602 2001-11-02
JP2001337602 2001-11-02

Publications (3)

Publication Number Publication Date
WO2003038858A2 WO2003038858A2 (en) 2003-05-08
WO2003038858A3 true WO2003038858A3 (en) 2003-10-16
WO2003038858A8 WO2003038858A8 (en) 2004-02-19

Family

ID=19152209

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/011450 WO2003038858A2 (en) 2001-11-02 2002-11-01 A semiconductor manufacturing apparatus having a built-in inspection apparatus and method therefor

Country Status (6)

Country Link
US (1) US7361600B2 (en)
EP (2) EP1440457A2 (en)
JP (1) JP2005507561A (en)
KR (1) KR20040062609A (en)
CN (1) CN1302515C (en)
WO (1) WO2003038858A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6843855B2 (en) * 2002-03-12 2005-01-18 Applied Materials, Inc. Methods for drying wafer
JP2004363085A (en) * 2003-05-09 2004-12-24 Ebara Corp Inspection apparatus by charged particle beam and method for manufacturing device using inspection apparatus
JP4519567B2 (en) * 2004-08-11 2010-08-04 株式会社日立ハイテクノロジーズ Scanning electron microscope and sample observation method using the same
TWI330506B (en) * 2007-01-15 2010-09-11 Chimei Innolux Corp Method and apparatus for repairing metal line
GB2472638B (en) * 2009-08-14 2014-03-19 Edwards Ltd Vacuum system
CN101934497A (en) * 2010-08-11 2011-01-05 中国电子科技集团公司第四十五研究所 Single-sided chemically mechanical polishing method and device of silicon chip
TW201336624A (en) * 2012-03-12 2013-09-16 Falcon Machine Tools Co Ltd Grinding machine control method and control system employing the method
CN104253061A (en) * 2013-06-28 2014-12-31 上海华虹宏力半导体制造有限公司 Method for detecting surface abnormalities of source polycrystalline silicon after chemical mechanical grinding
US20150017745A1 (en) * 2013-07-08 2015-01-15 Ebara Corporation Polishing method and polishing apparatus
US10056224B2 (en) * 2015-08-10 2018-08-21 Kla-Tencor Corporation Method and system for edge-of-wafer inspection and review
KR20180083557A (en) * 2017-01-13 2018-07-23 (주)제이티 Device handler
US10777377B2 (en) * 2017-02-05 2020-09-15 Kla-Tencor Corporation Multi-column spacing for photomask and reticle inspection and wafer print check verification
JP7083695B2 (en) * 2018-05-11 2022-06-13 株式会社荏原製作所 Bump height inspection device, substrate processing device, bump height inspection method, storage medium
CN110534428B (en) * 2019-09-05 2022-02-15 武汉新芯集成电路制造有限公司 Method for manufacturing metal layer structure, semiconductor device and method for manufacturing semiconductor device
CN112355886A (en) * 2020-10-30 2021-02-12 长江存储科技有限责任公司 Chemical mechanical polishing machine, method and defect detection method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010012392A1 (en) * 1998-07-20 2001-08-09 Rodney C. Langley Method and apparatus for inspecting wafers
US6281962B1 (en) * 1998-12-17 2001-08-28 Tokyo Electron Limited Processing apparatus for coating substrate with resist and developing exposed resist including inspection equipment for inspecting substrate and processing method thereof

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4011838A (en) * 1976-03-25 1977-03-15 Alfa-Laval Ab Electronic milker
US4823006A (en) * 1987-05-21 1989-04-18 Electroscan Corporation Integrated electron optical/differential pumping/imaging signal detection system for an environmental scanning electron microscope
US5141403A (en) * 1990-12-07 1992-08-25 Cornell Research Foundation, Inc. Two-level vacuum system controller with adjustable speed drive
JPH05159735A (en) 1991-12-03 1993-06-25 Pioneer Electron Corp Electron beam projecting device
US5827110A (en) 1994-12-28 1998-10-27 Kabushiki Kaisha Toshiba Polishing facility
US5664987A (en) * 1994-01-31 1997-09-09 National Semiconductor Corporation Methods and apparatus for control of polishing pad conditioning for wafer planarization
JPH08510596A (en) 1994-03-18 1996-11-05 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ Particle optics with secondary electron deflection unit
US6012966A (en) * 1996-05-10 2000-01-11 Canon Kabushiki Kaisha Precision polishing apparatus with detecting means
JP3942213B2 (en) 1996-10-08 2007-07-11 株式会社ルネサステクノロジ Semiconductor manufacturing method and inspection method and apparatus therefor
JP3858370B2 (en) 1997-08-20 2006-12-13 株式会社ニコン Inspection device
JPH1167134A (en) 1997-08-25 1999-03-09 Nikon Corp Inspection device
US6110011A (en) * 1997-11-10 2000-08-29 Applied Materials, Inc. Integrated electrodeposition and chemical-mechanical polishing tool
US6244931B1 (en) 1999-04-02 2001-06-12 Applied Materials, Inc. Buffer station on CMP system
US6117780A (en) * 1999-04-22 2000-09-12 Mosel Vitelic Inc. Chemical mechanical polishing method with in-line thickness detection
US6252705B1 (en) * 1999-05-25 2001-06-26 Schlumberger Technologies, Inc. Stage for charged particle microscopy system
US6300630B1 (en) * 1999-12-09 2001-10-09 Etec Systems, Inc. Annular differential seal for electron beam apparatus using isolation valve and additional differential pumping
AU2001249277A1 (en) * 2000-03-17 2001-10-03 Wafer Solutions, Inc. Grind polish cluster and double side polishing of substrates
US20020190207A1 (en) * 2000-09-20 2002-12-19 Ady Levy Methods and systems for determining a characteristic of micro defects on a specimen

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010012392A1 (en) * 1998-07-20 2001-08-09 Rodney C. Langley Method and apparatus for inspecting wafers
US6281962B1 (en) * 1998-12-17 2001-08-28 Tokyo Electron Limited Processing apparatus for coating substrate with resist and developing exposed resist including inspection equipment for inspecting substrate and processing method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CLAASEN-VUJCIC T ET AL: "ANALYSIS OF A 200/300NM VERTICAL FURNACE WITH INTEGRATED METROLOGY", SOLID STATE TECHNOLOGY, COWAN PUBL.CORP. WASHINGTON, US, vol. 44, no. 4, 1 April 2001 (2001-04-01), pages S06 - S08,S10,S12, XP001025036, ISSN: 0038-111X *

Also Published As

Publication number Publication date
US7361600B2 (en) 2008-04-22
EP1440457A2 (en) 2004-07-28
JP2005507561A (en) 2005-03-17
US20040248329A1 (en) 2004-12-09
KR20040062609A (en) 2004-07-07
WO2003038858A2 (en) 2003-05-08
WO2003038858A8 (en) 2004-02-19
CN1302515C (en) 2007-02-28
EP1744348A2 (en) 2007-01-17
EP1744348A3 (en) 2007-06-20
CN1579003A (en) 2005-02-09

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