WO2003042094A8 - Multi-chip module integrating mems mirror array with electronics - Google Patents

Multi-chip module integrating mems mirror array with electronics

Info

Publication number
WO2003042094A8
WO2003042094A8 PCT/US2002/035890 US0235890W WO03042094A8 WO 2003042094 A8 WO2003042094 A8 WO 2003042094A8 US 0235890 W US0235890 W US 0235890W WO 03042094 A8 WO03042094 A8 WO 03042094A8
Authority
WO
WIPO (PCT)
Prior art keywords
mcm
mirrors
mems
carrier
chip module
Prior art date
Application number
PCT/US2002/035890
Other languages
French (fr)
Other versions
WO2003042094A3 (en
WO2003042094A2 (en
Inventor
Amal Bhattarai
Narayanan Rajan
Original Assignee
Movaz Networks Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Movaz Networks Inc filed Critical Movaz Networks Inc
Priority to US10/290,743 priority Critical patent/US20030122206A1/en
Priority to AU2002363793A priority patent/AU2002363793A1/en
Publication of WO2003042094A2 publication Critical patent/WO2003042094A2/en
Publication of WO2003042094A3 publication Critical patent/WO2003042094A3/en
Publication of WO2003042094A8 publication Critical patent/WO2003042094A8/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/04—Networks or arrays of similar microstructural devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00238—Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches

Abstract

An integrated module including an array of electrostatically actuated mirrors usable as an optical switch. An array of tiltable mirrors (70, 72) is formed as a micro electromechanical system (MEMS) in one substrate carrier (60). A ceramic multi-chip module (MCM) (62) is formed having multiple layers (80) of wiring and electrodes (94) at one surface forming one side part of the electrostatic capacitive actuators. The MEMS substrate is bonded to the carrier (62) with the carrier electrodes (94) in opposition to the mirrors (70, 72), which form counter electrodes. Advantageously, a handle layer of the MEMS substrate is not removed and the mirrors released until after the bonding with the MCM. Separate high-voltage integrated circuits (ICs) (66) driving the actuators and low-voltage ICs controlling the high-voltage ICs (66) are bonded on the side of the MCM (62) opposite the MEMS (60) with the MCM providing electrical interconnections (68).
PCT/US2002/035890 2001-11-09 2002-11-07 Multi-chip module integrating mems mirror array with electronics WO2003042094A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/290,743 US20030122206A1 (en) 2001-11-09 2002-11-07 Multi-chip module integrating MEMS mirror array with electronics
AU2002363793A AU2002363793A1 (en) 2001-11-09 2002-11-07 Multi-chip module integrating mems mirror array with electronics

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34446701P 2001-11-09 2001-11-09
US60/344,467 2001-11-09

Publications (3)

Publication Number Publication Date
WO2003042094A2 WO2003042094A2 (en) 2003-05-22
WO2003042094A3 WO2003042094A3 (en) 2004-02-12
WO2003042094A8 true WO2003042094A8 (en) 2004-04-22

Family

ID=23350657

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/035890 WO2003042094A2 (en) 2001-11-09 2002-11-07 Multi-chip module integrating mems mirror array with electronics

Country Status (3)

Country Link
US (1) US20030122206A1 (en)
AU (1) AU2002363793A1 (en)
WO (1) WO2003042094A2 (en)

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JP3908503B2 (en) * 2001-10-30 2007-04-25 富士通株式会社 Light switch
US20030107794A1 (en) * 2001-12-11 2003-06-12 Siekkinen James W. Micro mirror array
US6732908B2 (en) * 2002-01-18 2004-05-11 International Business Machines Corporation High density raised stud microjoining system and methods of fabricating the same
US7027203B2 (en) * 2002-03-19 2006-04-11 Xanoptix Inc. Combination micromachine and optical device array
US7203394B2 (en) * 2003-07-15 2007-04-10 Rosemount Aerospace Inc. Micro mirror arrays and microstructures with solderable connection sites
US20080229835A1 (en) * 2005-06-07 2008-09-25 Koninklijke Philips Electronics, N.V. Mullticomponent Backing Block for Ultrasound Sensor Assemblies
US7859277B2 (en) * 2006-04-24 2010-12-28 Verigy (Singapore) Pte. Ltd. Apparatus, systems and methods for processing signals between a tester and a plurality of devices under test at high temperatures and with single touchdown of a probe array
US8124429B2 (en) 2006-12-15 2012-02-28 Richard Norman Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
JP5603739B2 (en) * 2010-11-02 2014-10-08 キヤノン株式会社 Capacitance type electromechanical transducer
US9515579B2 (en) * 2010-11-15 2016-12-06 Digitaloptics Corporation MEMS electrical contact systems and methods
EP2718225A4 (en) * 2011-06-07 2015-01-07 Wispry Inc Systems and methods for current density optimization in cmos-integrated mems capacitive devices
WO2013062533A1 (en) * 2011-10-25 2013-05-02 Intel Corporation Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips
US9368429B2 (en) * 2011-10-25 2016-06-14 Intel Corporation Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips
DE102013217146A1 (en) 2013-08-28 2015-03-05 Carl Zeiss Smt Gmbh Optical component
DE102013222823B4 (en) * 2013-11-11 2023-06-15 Robert Bosch Gmbh Process for the production of micromechanical components
CN108726470B (en) * 2017-04-21 2020-02-21 华为技术有限公司 MEMS chip and electrical packaging method thereof
US10057976B1 (en) * 2017-08-31 2018-08-21 Xilinx, Inc. Power-ground co-reference transceiver structure to deliver ultra-low crosstalk
US10551611B2 (en) 2018-04-18 2020-02-04 Microsoft Technology Licensing, Llc Techniques for removing particulate from an optical surface
CN110790216B (en) * 2018-08-01 2023-06-27 华域视觉科技(上海)有限公司 Transmission type MEMS chip and lighting system
CN109650324A (en) * 2018-12-05 2019-04-19 全普光电科技(上海)有限公司 MEMS chip structure and preparation method, mask plate, device
US20220146637A1 (en) * 2020-11-10 2022-05-12 Beijing Voyager Technology Co., Ltd. Aperiodic mirror array for suppressed side lobe intensity

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JPH0651250A (en) * 1992-05-20 1994-02-25 Texas Instr Inc <Ti> Monolithic space optical modulator and memory package
US5761350A (en) * 1997-01-22 1998-06-02 Koh; Seungug Method and apparatus for providing a seamless electrical/optical multi-layer micro-opto-electro-mechanical system assembly
US6288821B1 (en) * 1999-10-01 2001-09-11 Lucent Technologies, Inc. Hybrid electro-optic device with combined mirror arrays
US6348991B1 (en) * 1999-10-29 2002-02-19 Intel Corporation Integrated circuit with opposed spatial light modulator and processor
US20020071169A1 (en) * 2000-02-01 2002-06-13 Bowers John Edward Micro-electro-mechanical-system (MEMS) mirror device
US6374007B1 (en) * 2000-04-14 2002-04-16 C Speed Corporation Double hermetic package for fiber optic cross connect
US6396711B1 (en) * 2000-06-06 2002-05-28 Agere Systems Guardian Corp. Interconnecting micromechanical devices
US6519075B2 (en) * 2000-11-03 2003-02-11 Agere Systems Inc. Packaged MEMS device and method for making the same
US6480320B2 (en) * 2001-02-07 2002-11-12 Transparent Optical, Inc. Microelectromechanical mirror and mirror array
US6491404B2 (en) * 2001-02-23 2002-12-10 Jds Uniphase Corporation Microelectromechanical apparatus with tiltable bodies including variable tilt-stop engaging portions and methods of operation and fabrication therefor

Also Published As

Publication number Publication date
WO2003042094A3 (en) 2004-02-12
WO2003042094A2 (en) 2003-05-22
US20030122206A1 (en) 2003-07-03
AU2002363793A1 (en) 2003-05-26

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