WO2003046950A2 - Semiconductor component handling device having a performance film - Google Patents
Semiconductor component handling device having a performance film Download PDFInfo
- Publication number
- WO2003046950A2 WO2003046950A2 PCT/US2002/037860 US0237860W WO03046950A2 WO 2003046950 A2 WO2003046950 A2 WO 2003046950A2 US 0237860 W US0237860 W US 0237860W WO 03046950 A2 WO03046950 A2 WO 03046950A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- containment
- thermoplastic
- semiconductor
- handling
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 55
- 238000000465 moulding Methods 0.000 claims abstract description 57
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 53
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 50
- 239000000463 material Substances 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims abstract description 43
- 230000001681 protective effect Effects 0.000 claims abstract description 26
- 239000004696 Poly ether ether ketone Substances 0.000 claims abstract description 22
- 229920002530 polyetherether ketone Polymers 0.000 claims abstract description 22
- 238000005299 abrasion Methods 0.000 claims abstract description 19
- 230000008569 process Effects 0.000 claims abstract description 18
- 238000012545 processing Methods 0.000 claims abstract description 17
- 238000007493 shaping process Methods 0.000 claims abstract description 14
- 239000012530 fluid Substances 0.000 claims abstract description 12
- 238000010943 off-gassing Methods 0.000 claims abstract description 12
- 238000010521 absorption reaction Methods 0.000 claims abstract description 11
- 239000000126 substance Substances 0.000 claims abstract description 11
- 235000012431 wafers Nutrition 0.000 claims description 65
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000004697 Polyetherimide Substances 0.000 claims description 9
- 230000006750 UV protection Effects 0.000 claims description 9
- 229920001601 polyetherimide Polymers 0.000 claims description 9
- 239000012815 thermoplastic material Substances 0.000 claims description 9
- 239000004812 Fluorinated ethylene propylene Substances 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 8
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 8
- 229920009441 perflouroethylene propylene Polymers 0.000 claims description 8
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 8
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 7
- 229920001774 Perfluoroether Polymers 0.000 claims description 7
- 239000004793 Polystyrene Substances 0.000 claims description 7
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims description 7
- 229920000728 polyester Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 230000000087 stabilizing effect Effects 0.000 claims description 7
- 230000004224 protection Effects 0.000 claims description 5
- 230000008901 benefit Effects 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims 12
- 239000004695 Polyether sulfone Substances 0.000 claims 6
- 229920006393 polyether sulfone Polymers 0.000 claims 6
- 229920002223 polystyrene Polymers 0.000 claims 6
- 238000003856 thermoforming Methods 0.000 claims 1
- 239000000969 carrier Substances 0.000 abstract description 21
- 229920006254 polymer film Polymers 0.000 abstract description 8
- 230000009467 reduction Effects 0.000 abstract description 5
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 12
- 239000004417 polycarbonate Substances 0.000 description 11
- 229920000515 polycarbonate Polymers 0.000 description 11
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- 229920003023 plastic Polymers 0.000 description 8
- 239000004033 plastic Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000012876 carrier material Substances 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 229920001002 functional polymer Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
- H01L21/67323—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
- H01L21/6733—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2004-7007895A KR20040062643A (en) | 2001-11-27 | 2002-11-26 | Semiconductor component handling device having a performance film |
JP2003548277A JP2005521236A (en) | 2001-11-27 | 2002-11-26 | Semiconductor parts handling equipment with performance film |
AU2002346528A AU2002346528A1 (en) | 2001-11-27 | 2002-11-26 | Semiconductor component handling device having a performance film |
US10/496,754 US20050236110A1 (en) | 2001-11-27 | 2002-11-26 | Semiconductor component handling device having a performance film |
EP02784595A EP1567034A4 (en) | 2001-11-27 | 2002-11-26 | Semiconductor component handling device having a performance film |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33368901P | 2001-11-27 | 2001-11-27 | |
US60/333,689 | 2001-11-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003046950A2 true WO2003046950A2 (en) | 2003-06-05 |
WO2003046950A3 WO2003046950A3 (en) | 2005-06-02 |
Family
ID=23303851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/037860 WO2003046950A2 (en) | 2001-11-27 | 2002-11-26 | Semiconductor component handling device having a performance film |
Country Status (8)
Country | Link |
---|---|
US (1) | US20050236110A1 (en) |
EP (1) | EP1567034A4 (en) |
JP (1) | JP2005521236A (en) |
KR (1) | KR20040062643A (en) |
CN (1) | CN1636275A (en) |
AU (1) | AU2002346528A1 (en) |
TW (1) | TW200300996A (en) |
WO (1) | WO2003046950A2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1470570A2 (en) * | 2001-11-27 | 2004-10-27 | Entegris, Inc. | Semiconductor component handling device having an electrostatic dissipating film |
US8711041B2 (en) | 2010-05-11 | 2014-04-29 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern embedded therein and mold and method for manufacturing the same |
US8976074B2 (en) | 2010-05-11 | 2015-03-10 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having low frequency antenna pattern embedded therein, mold therefor and method of manufacturing thereof |
US9266266B2 (en) | 2010-05-11 | 2016-02-23 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern frame embedded therein, mold therefor and method of manufacturing thereof |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9079714B2 (en) * | 2012-07-31 | 2015-07-14 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Glass substrate cassette and pick-and-place system for glass substrate |
KR20170048429A (en) * | 2014-08-28 | 2017-05-08 | 엔테그리스, 아이엔씨. | Substrate container |
DE112017002783T5 (en) | 2016-06-01 | 2019-02-21 | Entegris, Inc. | Fluid circuit with integrated electrostatic discharge mitigation |
KR102624664B1 (en) | 2018-05-07 | 2024-01-15 | 엔테그리스, 아이엔씨. | Fluid circuit with integrated electrostatic discharge mitigation |
EP3929969B1 (en) * | 2020-06-22 | 2023-12-06 | Siltronic AG | Method for manufacturing a process container for semiconductor workpieces and process container |
EP4068343A1 (en) | 2021-04-01 | 2022-10-05 | Siltronic AG | Device for transporting semiconductor wafers |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5194327A (en) * | 1990-04-20 | 1993-03-16 | Teijin Limited | Antistatic polyester film |
US5593916A (en) * | 1988-08-12 | 1997-01-14 | Mitsui Toatsu Chemicals, Incorporated | Processing of glass substrates using holding container and holding container |
US6039186A (en) * | 1997-04-16 | 2000-03-21 | Fluoroware, Inc. | Composite transport carrier |
US6068137A (en) * | 1997-09-16 | 2000-05-30 | Sumitomo Metal Industries, Ltd. | Semiconductor wafer carrier |
US6079565A (en) * | 1998-12-28 | 2000-06-27 | Flouroware, Inc. | Clipless tray |
US6382419B1 (en) * | 1999-04-20 | 2002-05-07 | Shin-Etsu Polymer Co. Ltd. | Wafer container box |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH088294B2 (en) * | 1988-05-17 | 1996-01-29 | 三井東圧化学株式会社 | IC wafer container |
DE29924287U1 (en) * | 1998-05-28 | 2002-08-29 | Fluoroware Inc | Carrier for disks to be machined, stored and / or transported |
US6428729B1 (en) * | 1998-05-28 | 2002-08-06 | Entegris, Inc. | Composite substrate carrier |
WO2003046952A2 (en) * | 2001-11-27 | 2003-06-05 | Entegris, Inc | Semiconductor component handling device having an electrostatic dissipating film |
-
2002
- 2002-11-26 CN CNA028275292A patent/CN1636275A/en active Pending
- 2002-11-26 KR KR10-2004-7007895A patent/KR20040062643A/en not_active Application Discontinuation
- 2002-11-26 EP EP02784595A patent/EP1567034A4/en not_active Withdrawn
- 2002-11-26 AU AU2002346528A patent/AU2002346528A1/en not_active Abandoned
- 2002-11-26 JP JP2003548277A patent/JP2005521236A/en active Pending
- 2002-11-26 US US10/496,754 patent/US20050236110A1/en not_active Abandoned
- 2002-11-26 WO PCT/US2002/037860 patent/WO2003046950A2/en active Search and Examination
- 2002-11-27 TW TW091134457A patent/TW200300996A/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5593916A (en) * | 1988-08-12 | 1997-01-14 | Mitsui Toatsu Chemicals, Incorporated | Processing of glass substrates using holding container and holding container |
US5194327A (en) * | 1990-04-20 | 1993-03-16 | Teijin Limited | Antistatic polyester film |
US6039186A (en) * | 1997-04-16 | 2000-03-21 | Fluoroware, Inc. | Composite transport carrier |
US6068137A (en) * | 1997-09-16 | 2000-05-30 | Sumitomo Metal Industries, Ltd. | Semiconductor wafer carrier |
US6079565A (en) * | 1998-12-28 | 2000-06-27 | Flouroware, Inc. | Clipless tray |
US6382419B1 (en) * | 1999-04-20 | 2002-05-07 | Shin-Etsu Polymer Co. Ltd. | Wafer container box |
Non-Patent Citations (1)
Title |
---|
See also references of EP1567034A2 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1470570A2 (en) * | 2001-11-27 | 2004-10-27 | Entegris, Inc. | Semiconductor component handling device having an electrostatic dissipating film |
EP1470570A4 (en) * | 2001-11-27 | 2007-12-12 | Entegris Inc | Semiconductor component handling device having an electrostatic dissipating film |
US8711041B2 (en) | 2010-05-11 | 2014-04-29 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern embedded therein and mold and method for manufacturing the same |
US8976074B2 (en) | 2010-05-11 | 2015-03-10 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having low frequency antenna pattern embedded therein, mold therefor and method of manufacturing thereof |
US9266266B2 (en) | 2010-05-11 | 2016-02-23 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern frame embedded therein, mold therefor and method of manufacturing thereof |
Also Published As
Publication number | Publication date |
---|---|
CN1636275A (en) | 2005-07-06 |
KR20040062643A (en) | 2004-07-07 |
AU2002346528A8 (en) | 2003-06-10 |
TW200300996A (en) | 2003-06-16 |
WO2003046950A3 (en) | 2005-06-02 |
JP2005521236A (en) | 2005-07-14 |
EP1567034A2 (en) | 2005-08-31 |
EP1567034A4 (en) | 2007-11-14 |
US20050236110A1 (en) | 2005-10-27 |
AU2002346528A1 (en) | 2003-06-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20040238623A1 (en) | Component handling device having a film insert molded RFID tag | |
US6428729B1 (en) | Composite substrate carrier | |
US8734698B2 (en) | Composite substrate carrier | |
US20050236110A1 (en) | Semiconductor component handling device having a performance film | |
US20170294327A1 (en) | Substrate container | |
US20050056601A1 (en) | Semiconductor component handling device having an electrostatic dissipating film | |
WO2008008270A2 (en) | Wafer cassette | |
US6808668B2 (en) | Process for fabricating composite substrate carrier | |
CN1791881A (en) | Component handling device having a film insert molded RFID tag | |
TW200301209A (en) | Informational polymer film insert molding | |
JP2007161314A (en) | Tray for carrying electronic components | |
JP2006143246A (en) | Tool for storage, and semi-conductor manufacturing method using the same | |
JP2022062633A (en) | Tray for article conveyance and its manufacturing method | |
MXPA99005039A (en) | Subject carrier compue |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LU MC NL PT SE SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1020047007895 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2003548277 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2002784595 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 20028275292 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10496754 Country of ref document: US |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
WWP | Wipo information: published in national office |
Ref document number: 2002784595 Country of ref document: EP |