WO2003046950A3 - Semiconductor component handling device having a performance film - Google Patents
Semiconductor component handling device having a performance film Download PDFInfo
- Publication number
- WO2003046950A3 WO2003046950A3 PCT/US2002/037860 US0237860W WO03046950A3 WO 2003046950 A3 WO2003046950 A3 WO 2003046950A3 US 0237860 W US0237860 W US 0237860W WO 03046950 A3 WO03046950 A3 WO 03046950A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- containment
- moldable material
- handling device
- semiconductor component
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 239000004696 Poly ether ether ketone Substances 0.000 abstract 1
- 238000005299 abrasion Methods 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 abstract 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 abstract 1
- 239000000969 carrier Substances 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 238000010943 off-gassing Methods 0.000 abstract 1
- 229920002530 polyetherether ketone Polymers 0.000 abstract 1
- 229920006254 polymer film Polymers 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 238000007493 shaping process Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 229920001169 thermoplastic Polymers 0.000 abstract 1
- 239000004416 thermosoftening plastic Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
- H01L21/67323—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
- H01L21/6733—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2004-7007895A KR20040062643A (en) | 2001-11-27 | 2002-11-26 | Semiconductor component handling device having a performance film |
JP2003548277A JP2005521236A (en) | 2001-11-27 | 2002-11-26 | Semiconductor parts handling equipment with performance film |
AU2002346528A AU2002346528A1 (en) | 2001-11-27 | 2002-11-26 | Semiconductor component handling device having a performance film |
US10/496,754 US20050236110A1 (en) | 2001-11-27 | 2002-11-26 | Semiconductor component handling device having a performance film |
EP02784595A EP1567034A4 (en) | 2001-11-27 | 2002-11-26 | Semiconductor component handling device having a performance film |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33368901P | 2001-11-27 | 2001-11-27 | |
US60/333,689 | 2001-11-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003046950A2 WO2003046950A2 (en) | 2003-06-05 |
WO2003046950A3 true WO2003046950A3 (en) | 2005-06-02 |
Family
ID=23303851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/037860 WO2003046950A2 (en) | 2001-11-27 | 2002-11-26 | Semiconductor component handling device having a performance film |
Country Status (8)
Country | Link |
---|---|
US (1) | US20050236110A1 (en) |
EP (1) | EP1567034A4 (en) |
JP (1) | JP2005521236A (en) |
KR (1) | KR20040062643A (en) |
CN (1) | CN1636275A (en) |
AU (1) | AU2002346528A1 (en) |
TW (1) | TW200300996A (en) |
WO (1) | WO2003046950A2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003046952A2 (en) * | 2001-11-27 | 2003-06-05 | Entegris, Inc | Semiconductor component handling device having an electrostatic dissipating film |
EP2386400A1 (en) | 2010-05-11 | 2011-11-16 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern frame embedded therein, mold therefor and method of manufacturing thereof |
EP2387106B1 (en) | 2010-05-11 | 2013-01-23 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having low frequency antenna pattern embedded therein, mold therefor and method of manufacturing thereof |
JP5321989B2 (en) | 2010-05-11 | 2013-10-23 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Electronic device case in which antenna pattern is embedded, manufacturing mold and manufacturing method thereof |
US9079714B2 (en) * | 2012-07-31 | 2015-07-14 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Glass substrate cassette and pick-and-place system for glass substrate |
KR20170048429A (en) * | 2014-08-28 | 2017-05-08 | 엔테그리스, 아이엔씨. | Substrate container |
DE112017002783T5 (en) | 2016-06-01 | 2019-02-21 | Entegris, Inc. | Fluid circuit with integrated electrostatic discharge mitigation |
KR102624664B1 (en) | 2018-05-07 | 2024-01-15 | 엔테그리스, 아이엔씨. | Fluid circuit with integrated electrostatic discharge mitigation |
EP3929969B1 (en) * | 2020-06-22 | 2023-12-06 | Siltronic AG | Method for manufacturing a process container for semiconductor workpieces and process container |
EP4068343A1 (en) | 2021-04-01 | 2022-10-05 | Siltronic AG | Device for transporting semiconductor wafers |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5194327A (en) * | 1990-04-20 | 1993-03-16 | Teijin Limited | Antistatic polyester film |
US5593916A (en) * | 1988-08-12 | 1997-01-14 | Mitsui Toatsu Chemicals, Incorporated | Processing of glass substrates using holding container and holding container |
US6039186A (en) * | 1997-04-16 | 2000-03-21 | Fluoroware, Inc. | Composite transport carrier |
US6068137A (en) * | 1997-09-16 | 2000-05-30 | Sumitomo Metal Industries, Ltd. | Semiconductor wafer carrier |
US6079565A (en) * | 1998-12-28 | 2000-06-27 | Flouroware, Inc. | Clipless tray |
US6382419B1 (en) * | 1999-04-20 | 2002-05-07 | Shin-Etsu Polymer Co. Ltd. | Wafer container box |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH088294B2 (en) * | 1988-05-17 | 1996-01-29 | 三井東圧化学株式会社 | IC wafer container |
DE29924287U1 (en) * | 1998-05-28 | 2002-08-29 | Fluoroware Inc | Carrier for disks to be machined, stored and / or transported |
US6428729B1 (en) * | 1998-05-28 | 2002-08-06 | Entegris, Inc. | Composite substrate carrier |
WO2003046952A2 (en) * | 2001-11-27 | 2003-06-05 | Entegris, Inc | Semiconductor component handling device having an electrostatic dissipating film |
-
2002
- 2002-11-26 CN CNA028275292A patent/CN1636275A/en active Pending
- 2002-11-26 KR KR10-2004-7007895A patent/KR20040062643A/en not_active Application Discontinuation
- 2002-11-26 EP EP02784595A patent/EP1567034A4/en not_active Withdrawn
- 2002-11-26 AU AU2002346528A patent/AU2002346528A1/en not_active Abandoned
- 2002-11-26 JP JP2003548277A patent/JP2005521236A/en active Pending
- 2002-11-26 US US10/496,754 patent/US20050236110A1/en not_active Abandoned
- 2002-11-26 WO PCT/US2002/037860 patent/WO2003046950A2/en active Search and Examination
- 2002-11-27 TW TW091134457A patent/TW200300996A/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5593916A (en) * | 1988-08-12 | 1997-01-14 | Mitsui Toatsu Chemicals, Incorporated | Processing of glass substrates using holding container and holding container |
US5194327A (en) * | 1990-04-20 | 1993-03-16 | Teijin Limited | Antistatic polyester film |
US6039186A (en) * | 1997-04-16 | 2000-03-21 | Fluoroware, Inc. | Composite transport carrier |
US6068137A (en) * | 1997-09-16 | 2000-05-30 | Sumitomo Metal Industries, Ltd. | Semiconductor wafer carrier |
US6079565A (en) * | 1998-12-28 | 2000-06-27 | Flouroware, Inc. | Clipless tray |
US6382419B1 (en) * | 1999-04-20 | 2002-05-07 | Shin-Etsu Polymer Co. Ltd. | Wafer container box |
Also Published As
Publication number | Publication date |
---|---|
CN1636275A (en) | 2005-07-06 |
KR20040062643A (en) | 2004-07-07 |
AU2002346528A8 (en) | 2003-06-10 |
WO2003046950A2 (en) | 2003-06-05 |
TW200300996A (en) | 2003-06-16 |
JP2005521236A (en) | 2005-07-14 |
EP1567034A2 (en) | 2005-08-31 |
EP1567034A4 (en) | 2007-11-14 |
US20050236110A1 (en) | 2005-10-27 |
AU2002346528A1 (en) | 2003-06-10 |
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