WO2003056609A3 - Apparatus and method for electroplating a wafer surface - Google Patents

Apparatus and method for electroplating a wafer surface Download PDF

Info

Publication number
WO2003056609A3
WO2003056609A3 PCT/IB2002/005396 IB0205396W WO03056609A3 WO 2003056609 A3 WO2003056609 A3 WO 2003056609A3 IB 0205396 W IB0205396 W IB 0205396W WO 03056609 A3 WO03056609 A3 WO 03056609A3
Authority
WO
WIPO (PCT)
Prior art keywords
electroplating
wafer surface
wafer
axis
rotation
Prior art date
Application number
PCT/IB2002/005396
Other languages
French (fr)
Other versions
WO2003056609A2 (en
Inventor
Kubber Daan L De
Original Assignee
Koninkl Philips Electronics Nv
Kubber Daan L De
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Kubber Daan L De filed Critical Koninkl Philips Electronics Nv
Priority to JP2003557031A priority Critical patent/JP2005520930A/en
Priority to AU2002367224A priority patent/AU2002367224A1/en
Priority to US10/499,270 priority patent/US20050072680A1/en
Priority to EP02805861A priority patent/EP1527215A2/en
Publication of WO2003056609A2 publication Critical patent/WO2003056609A2/en
Publication of WO2003056609A3 publication Critical patent/WO2003056609A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes

Abstract

The present invention provides for a method of electroplating a wafer surface comprising introducing a plating liquid to the wafer surface in a chamber and rotating the wafer about an axis of rotation passing through the surface to be plated, and including the further step of moving the wafer such that its axis of rotation is itself caused to rotate about a second axis of rotation.
PCT/IB2002/005396 2001-12-24 2002-12-12 Apparatus and method for electroplating a wafer surface WO2003056609A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003557031A JP2005520930A (en) 2001-12-24 2002-12-12 Apparatus and method for electroplating a wafer surface
AU2002367224A AU2002367224A1 (en) 2001-12-24 2002-12-12 Apparatus and method for electroplating a wafer surface
US10/499,270 US20050072680A1 (en) 2001-12-24 2002-12-12 Apparatus and method for electroplating a wafer surface
EP02805861A EP1527215A2 (en) 2001-12-24 2002-12-12 Apparatus and method for electroplating a wafer surface

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP01205083 2001-12-24
EP01205083.7 2001-12-24

Publications (2)

Publication Number Publication Date
WO2003056609A2 WO2003056609A2 (en) 2003-07-10
WO2003056609A3 true WO2003056609A3 (en) 2005-03-10

Family

ID=8181506

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2002/005396 WO2003056609A2 (en) 2001-12-24 2002-12-12 Apparatus and method for electroplating a wafer surface

Country Status (7)

Country Link
US (1) US20050072680A1 (en)
EP (1) EP1527215A2 (en)
JP (1) JP2005520930A (en)
CN (1) CN1630739A (en)
AU (1) AU2002367224A1 (en)
TW (1) TW200411089A (en)
WO (1) WO2003056609A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007026633B4 (en) * 2007-06-06 2009-04-02 Atotech Deutschland Gmbh Apparatus and method for the electrolytic treatment of plate-shaped goods
CN102268719B (en) * 2010-06-03 2013-10-30 台湾积体电路制造股份有限公司 Vertical plating equipment and plating method thereof
CN104233410A (en) * 2013-06-24 2014-12-24 马悦 Device for electrochemically depositing metals on substrate
EP3176288A1 (en) * 2015-12-03 2017-06-07 ATOTECH Deutschland GmbH Method for galvanic metal deposition

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997003230A1 (en) * 1995-07-11 1997-01-30 American Plating Systems Electrolytic plating apparatus and method
JP2001316890A (en) * 2000-05-08 2001-11-16 Tokyo Electron Ltd Method and equipment for plating

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997003230A1 (en) * 1995-07-11 1997-01-30 American Plating Systems Electrolytic plating apparatus and method
US5670034A (en) * 1995-07-11 1997-09-23 American Plating Systems Reciprocating anode electrolytic plating apparatus and method
JP2001316890A (en) * 2000-05-08 2001-11-16 Tokyo Electron Ltd Method and equipment for plating

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 03 3 April 2002 (2002-04-03) *

Also Published As

Publication number Publication date
EP1527215A2 (en) 2005-05-04
AU2002367224A1 (en) 2003-07-15
JP2005520930A (en) 2005-07-14
US20050072680A1 (en) 2005-04-07
WO2003056609A2 (en) 2003-07-10
TW200411089A (en) 2004-07-01
CN1630739A (en) 2005-06-22
AU2002367224A8 (en) 2003-07-15

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