WO2003056636A1 - A led and led lamp - Google Patents
A led and led lamp Download PDFInfo
- Publication number
- WO2003056636A1 WO2003056636A1 PCT/CN2002/000930 CN0200930W WO03056636A1 WO 2003056636 A1 WO2003056636 A1 WO 2003056636A1 CN 0200930 W CN0200930 W CN 0200930W WO 03056636 A1 WO03056636 A1 WO 03056636A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- emitting diode
- base
- led
- light emitting
- Prior art date
Links
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/06—Optical design with parabolic curvature
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
- G02B6/0031—Reflecting element, sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0085—Means for removing heat created by the light source from the package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
- F21W2111/02—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00 for roads, paths or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Definitions
- the invention relates to a light-emitting diode and a light-emitting diode lamp, in particular to a high-power, high-efficiency, long-life light-emitting diode and a light-emitting diode lamp used for devices such as lighting, traffic lights, and information display. Background technique
- a typical high-power light-emitting diode is installed on a reflective surface 102 of a metal base 103.
- the metal base 103 is attached to the circuit board 106 with epoxy resin 111, and the circuit board 106 is reused.
- the glue 112 is connected to the heat sink 113; the electrodes of the light-emitting diode chip 101 are connected to the conductive layer 107 on the circuit board 106 through the lead 104 and the pin 105.
- the chip has an optical glue 108 and a lens 109, and 110 is a fixed device.
- the light-emitting diode chip is heat-dissipated only after the metal base 103 (the thermal resistance is), the epoxy resin layer 111 (the thermal resistance is), the circuit board (the thermal resistance is R P ), and the adhesive 112 (the thermal resistance is).
- the metal base on which the chip is mounted is glued to the metal base.
- the heating rate is different. When it is cold, it is hot, and when it is expanded, it shrinks.
- the purpose of the present invention is to overcome the shortcomings that the existing thermal resistance between the light emitting diode and the heat sink is very large, the temperature of the chip is easily increased, and the luminous efficiency caused by the chip is rapidly decreased; and the glue between the metal base and the circuit board The thermal expansion coefficients of the circuit board and the metal base are different. It is easy to crack the glue for a long time, which causes the thermal resistance between the light emitting diode and the heat sink to be greatly increased, and the disadvantages of the light emitting diode being overheated and burned out, thereby providing a high power, high Efficiency, long life LED and LED lamps.
- a light emitting diode provided by the present invention includes: at least one light emitting diode chip mounted on a high thermal conductivity base, the light emitting diode chip is electrically connected to a power source through a circuit board, and the light emitting diode There is a light-transmitting medium above the chip; the upper surface of the base is a light reflecting surface or a light reflecting surface is installed around the base, and is characterized in that a circuit board is installed above or around the base.
- the light-emitting diode further includes a heat sink for directly mechanically connecting at least one spiral or spiral hole under the base.
- the transparent medium is an optical glue and a lens.
- the light emitting diode chip is a plurality of chips emitting the same light color or chips emitting different light colors, and the chips are connected in series, in parallel, or in series or in parallel.
- the base is composed of a metal base, a super thermal conductivity tube, or a super thermal conductivity tube provided below the metal base.
- the light reflector has an optical reflecting surface, and the mounting angle between the light reflecting surface and the light emitting diode axis is 10-70 degrees.
- a light-emitting diode lamp made of the above-mentioned light-emitting diodes is characterized in that it comprises at least one of the above-mentioned light-emitting diodes.
- the light-emitting diodes are in direct mechanical contact with a heat sink through a screw or screw hole on a base of the light-emitting diodes. It is electrically connected with a driving circuit, and the driving circuit is electrically connected with the electrical connector through its shell, and a light-transmitting blister is set on the light-emitting diode.
- the electrical connector is a two-pin, multi-pin straight-in lamp cap or a spiral lamp cap.
- the light-transmitting bubble shell is a transparent, colored or diffused bubble shell made of glass or plastic.
- a light conversion material layer is disposed on an inner wall of the light-transmitting bubble shell.
- the radiator is a radiator with fins.
- the radiating fin is a spiral radiating fin with a single or multiple spirals.
- the inner surface of the radiating fin is a light reflecting surface.
- the inner surface is conical or parabolic.
- a traffic light made of the above-mentioned light emitting diode lamp characterized in that the light emitting angle of the light emitting diode is 3-60 degrees, and it is installed near the focus of the parabolic light reflector of the original traffic light, and a part of each light emitting diode The light emitted by the light-emitting diode is directly emitted by the original traffic light transmission window, and the other part is reflected by the original traffic light parabolic light reflector and emitted, so as to obtain the required focused and uniformly distributed outgoing light.
- a light reflector is disposed on the back and the periphery of the light guide plate of the light source, and on two sides or the periphery of the light emitting diode.
- the light emitting diode is a plurality of light emitting diodes emitting the same light color or light emitting diodes emitting different light colors.
- circuit board is placed above or around the metal base, while not increasing the thermal resistance between the chip and the heat sink, it also facilitates the connection with the chip and facilitates high-density installation.
- the light-emitting diode of the present invention not only overcomes the problems of large thermal resistance of the existing light-emitting diode and easy cracking of the glue, but also has a much smaller volume than the existing light-emitting diode and is suitable for high-density installation.
- FIG. 1 is a schematic structural diagram of a conventional light emitting diode
- FIG. 2 is a schematic structural diagram of a light emitting diode according to the present invention.
- FIG. 3 is a schematic structural diagram of a lower lead embodiment of a light emitting diode of the present invention
- FIG. 4 is a schematic structural diagram of an embodiment in which a light reflector is installed with a light reflector according to the present invention.
- FIG. 5 is a schematic structural diagram of another embodiment in which a light reflector is installed with a light reflector according to the present invention.
- FIG. 6 is a structural schematic diagram of a light emitting diode lamp according to the present invention.
- FIG. 7A is a structure of an embodiment of a light emitting diode lamp of the present invention equipped with a parabolic heat sink.
- FIG. 7B is a structure of another embodiment of a light emitting diode lamp of the present invention equipped with a cone heat sink.
- Schematic diagram of the structure of the embodiment of the catheter Figure 9 is a schematic diagram of the structure of the embodiment of the light-emitting diode lamp of the present invention equipped with a bulb-shaped heat sink.
- FIG. 11 is a schematic structural diagram of a planar light source made of a light emitting diode according to the present invention.
- At least one light-emitting diode chip 101 is, for example, a light-emitting diode that emits yellow light.
- the chip is mounted on the reflective surface 102 of the metal base 103.
- the metal base 103 is tightly thermally and mechanically connected with at least one screw 204 and the heat sink 113; in order to obtain better thermal contact, there can also be heat conduction between the two Adhesive 206, the circuit board 106 is disposed above the metal base 103, and the upper surface is provided with a conductive layer 107 to connect the lead-out wire 209.
- the lead-out wire 209 is electrically insulated from the metal base 103 and the heat sink 113.
- the lead 104 is electrically connected, and the lead 209 is used to connect an external power source.
- the light-emitting diode chip 101 has an optical glue 108 and a lens 109, and a light conversion material 213 between the optical glue 108 and the lens 109 converts light emitted by the chip into other colors.
- Light; the metal base 103 is made of copper with very low thermal resistance, so the heat generated by the light emitting diode chip 101 It is easily dissipated through the heat sink 113, so that the light emitting diode chip 101 operates in a state of high light emitting efficiency at a relatively low temperature.
- At least one light-emitting diode chip 101 is manufactured by using a light-emitting diode according to the present invention.
- two light-emitting diode chips 101 are mounted on a reflective surface 102 of a metal base 103.
- Light-emitting diode chips of different light colors the metal base 103 has at least one screw 204 for tightly thermal and mechanical connection with the heat sink 113, and the circuit board 106 is arranged around the metal base 103, and a conductive layer 107 is connected on the upper surface thereof to the lead-out wires 209, the bow I outlet 209 passes through the insulating layer 303 and connects to the external power source vertically.
- the light-emitting diode chip 101 has a light-transmitting medium.
- the light-transmitting medium is optical glue 108, and the top surface 109 can meet the light distribution requirements of the output light.
- the metal base 103 is made of aluminum or an aluminum alloy with very low thermal resistance, and the rest is the same as that of the first embodiment.
- a light-emitting diode with a light reflector according to the present invention is manufactured, as shown in FIG. 4, which is characterized in that a light reflector 406 is added above at least one light-emitting diode chip 101, so that light 402 originally emitted to the side of the light-emitting diode is reflected back to emit light. After the diode chip 101 or the reflective surface 102, it is emitted to the front of the light emitting diode to improve the effective utilization of light.
- two or more light emitting diode chips are light emitting diode chips that emit different light colors, in order to improve the color mixing effect of light, There may be a color mixing agent 409 between the reflector 406 and the light emitting diode chip 101.
- one electrode of the light emitting diode chip 101 is connected to the metal base 103 through a lead 104, it is led out from at least one screw hole 408 and a screw 204.
- the other electrode is connected to the lead-out wire 209 through the lead 104, and is connected to the external power supply after being led out through the insulating layer 303.
- 410 is the connection between the light-emitting diode chips; the heat sink 113 is provided with heat-dissipating fins 404, and the heat-conducting layer 407 is a heat-conducting insulation , Others are the same as in Example 2.
- a light-emitting diode with a light reflector according to the present invention is manufactured.
- a light reflector 406 is added above the light-emitting diode chip 101, and the light 503 originally emitted from the light-emitting diode chip 101 to the side is directly reflected to Front to improve the utilization of light; the light conversion material 213 is disposed on the surface of the light emitting diode chip 101; at least two lead wires 209 of the circuit board 106 pass through the metal base 103 and connect the external power supply vertically downward, the other is the same as in embodiment 3 .
- a light-emitting diode lamp made of the light-emitting diode of the present invention is manufactured. As shown in FIG. 6, at least one light-emitting diode chip 101 is mounted on a heat sink 113; the lead-out wire 209 of the light-emitting diode is electrically connected to a driving circuit 603 to drive The circuit 603 and its casing 604 are electrically connected to an electrical connector 605 through an input lead 607, and the electrical connector 605 is a screw-type lamp cap.
- the driving circuit 603 converts the input external voltage into a voltage suitable for the operation of the light emitting diode to illuminate the light emitting diode.
- a light-transmitting blister 608 made of glass with a light conversion material layer 609 on the inner surface is set on the light emitting diode. The light emitted by it is converted into light of a desired color.
- a light emitting diode lamp with a heat sink installed according to the present invention is manufactured.
- the light emitting diode 701 is installed in a parabolic heat sink 113, or as shown in FIG. 7B, the light emitting diode 701 is installed in a conical heat sink 113.
- Radiator fins 404 may be provided on the radiator 113.
- the inner surface of the radiator 113 is a reflective surface 702.
- the electrical connector 605 connected to the external power source in FIG. 7A is a two-pin direct plug-in lamp cap, and the electrical connector connected to the external power source in FIG. 7B
- the connector 605 is a three-pin in-line lamp holder, and a driving circuit 603 is installed in a housing 604 of the driving circuit. The rest are the same as those in the first embodiment.
- a light emitting diode lamp equipped with a super heat pipe is manufactured.
- At least one light emitting diode chip 101 is mounted on a heat absorption end 803 of a super heat pipe 801 (referred to as a heat pipe).
- the other end is connected to the heat sink 113; because the heat pipe has a high thermal conductivity about 1500 times higher than that of copper, and its thermal resistance is almost equal to zero, the heat generated by the light emitting diode chip 101 is quickly transmitted to the heat sink through the heat pipe 801 and is dissipated.
- Example 5 Example 8
- a light emitting diode lamp with a super heat pipe and a light bulb-shaped heat sink is manufactured according to the present invention.
- the light emitting diode lamp at least one light emitting diode chip 101 or light emitting diode 701 is installed on the top of the super heat pipe 801.
- a metal base 103 made of an alloy with a very small thermal resistance on the upper side, and the other end of the heat pipe is connected to a radiator 113 with single or multiple spiral bulb-shaped spiral fins.
- the spiral fins can accelerate the air flow between the fins and improve the heat dissipation effect of the radiator.
- the metal base 103 is provided with a reflective surface 102 on the periphery, which is located above the radiator 113 and has a layer of light-transmitting material 213 in it.
- the bubble shell 608 is installed above the light-emitting diode, and a second light-transmitting bubble shell 908 can be further mounted outside the same, and the others are the same as those in the fifth embodiment.
- a light-emitting diode 701 is installed on a metal base 103 with good heat conduction, and the metal base 103 is connected to the heat sink 113.
- the light emitting angle of the light-emitting diode is 3-60 degrees, and it is installed on the original parabolic light reflector of a traffic light.
- the LED traffic light can directly replace the existing tungsten wire traffic light, and the rest is the same as in Embodiment 5.
- a flat light source made of the light-emitting diode of the present invention is manufactured.
- the light-emitting diode 701 is mounted on a heat sink 113 made of a large-area flat heat-dissipating plate 1103, which is located on the flat light source and the back
- the back and surroundings of the light guide plate 1104 of the illumination light source may have a second circuit board 1106 on the outside for connecting between the light emitting diodes 701 and the power source, and the heat dissipation plate 1103 may further include a heat dissipation fin 404 and a light reflector 406.
- the light source has an optical plate 1107.
- the optical plate is a liquid crystal display panel, a light enhancement plate, A diffusion plate or a light-transmitting plate with graphic text;
- the at least one light-emitting diode 701 is a light-emitting diode that emits the same light color or a different light-color; by controlling the brightness of each light-emitting diode that emits a different light-color, Available in white or colored, discolored flat light sources and backlight sources with different color temperatures.
Description
Claims
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002367196A AU2002367196A1 (en) | 2001-12-29 | 2002-12-30 | A led and led lamp |
KR1020047010358A KR100991830B1 (ko) | 2001-12-29 | 2002-12-30 | Led 및 led램프 |
US10/500,315 US7497596B2 (en) | 2001-12-29 | 2002-12-30 | LED and LED lamp |
EP02790249A EP1467414A4 (en) | 2001-12-29 | 2002-12-30 | LED AND LED LAMP |
JP2003557050A JP2005513815A (ja) | 2001-12-29 | 2002-12-30 | 発光ダイオード及び発光ダイオード・ランプ |
CNB028261275A CN100373638C (zh) | 2001-12-29 | 2002-12-30 | 发光二极管及其发光二极管灯 |
US11/430,914 US7347589B2 (en) | 2001-12-29 | 2006-05-10 | LED and LED lamp |
US12/265,911 US7736027B2 (en) | 2001-12-29 | 2008-11-06 | LED and LED lamp |
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB011457333A CN100468609C (zh) | 2001-12-29 | 2001-12-29 | 超导热管灯 |
CN01145733.3 | 2001-12-29 | ||
CN02203989U CN2517112Y (zh) | 2002-01-24 | 2002-01-24 | 大功率发光二极管 |
CN02203989.9 | 2002-01-24 | ||
CN02207287U CN2526981Y (zh) | 2002-03-09 | 2002-03-09 | 高效率发光二极管 |
CN02207287.X | 2002-03-09 | ||
CN02236692.X | 2002-06-03 | ||
CN02236692U CN2540685Y (zh) | 2002-06-03 | 2002-06-03 | 高效率大功率发光二极管 |
CN02251586U CN2585273Y (zh) | 2002-12-12 | 2002-12-12 | 发光二极管照明装置 |
CN02251586.0 | 2002-12-12 |
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US10500315 A-371-Of-International | 2002-12-30 | ||
US11/430,914 Division US7347589B2 (en) | 2001-12-29 | 2006-05-10 | LED and LED lamp |
US12/265,911 Division US7736027B2 (en) | 2001-12-29 | 2008-11-06 | LED and LED lamp |
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WO2003056636A1 true WO2003056636A1 (en) | 2003-07-10 |
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Family Applications (1)
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PCT/CN2002/000930 WO2003056636A1 (en) | 2001-12-29 | 2002-12-30 | A led and led lamp |
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US (3) | US7497596B2 (zh) |
EP (1) | EP1467414A4 (zh) |
JP (3) | JP2005513815A (zh) |
KR (4) | KR100991830B1 (zh) |
CN (1) | CN100373638C (zh) |
AU (1) | AU2002367196A1 (zh) |
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WO2005074044A1 (ja) | 2004-01-30 | 2005-08-11 | Ccs Inc. | Led及びledの取付構造 |
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WO2006058481A1 (fr) * | 2004-12-02 | 2006-06-08 | Simon Mo Chan Ho | Voyant a led et son support, et deux autres voyants a led |
WO2006080198A1 (ja) * | 2005-01-28 | 2006-08-03 | Minebea Co., Ltd. | 面状照明装置 |
JP2006313718A (ja) * | 2005-04-08 | 2006-11-16 | Toshiba Lighting & Technology Corp | 電球型ランプ |
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JP2008542976A (ja) * | 2005-03-31 | 2008-11-27 | 新灯源科技有限公司 | 高効率の熱放散を備えた高出力ledを使用した照明機器 |
JP2009021264A (ja) * | 2008-10-17 | 2009-01-29 | Sanyo Electric Co Ltd | 照明装置 |
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JP2010086973A (ja) * | 2005-04-08 | 2010-04-15 | Toshiba Lighting & Technology Corp | 電球型ランプ |
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US20120176770A1 (en) * | 2003-05-05 | 2012-07-12 | Bohler Christopher L | Led-based light bulb |
JP2012142314A (ja) * | 2012-04-27 | 2012-07-26 | Sanyo Electric Co Ltd | 照明装置 |
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Families Citing this family (395)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
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US20040229391A1 (en) * | 2003-04-25 | 2004-11-18 | Kazuyuki Ohya | LED lamp manufacturing process |
US7329024B2 (en) * | 2003-09-22 | 2008-02-12 | Permlight Products, Inc. | Lighting apparatus |
US7102172B2 (en) * | 2003-10-09 | 2006-09-05 | Permlight Products, Inc. | LED luminaire |
JP2005310892A (ja) * | 2004-04-19 | 2005-11-04 | Nippon Seiki Co Ltd | 発光装置 |
US8188503B2 (en) | 2004-05-10 | 2012-05-29 | Permlight Products, Inc. | Cuttable illuminated panel |
JP2007538356A (ja) * | 2004-05-17 | 2007-12-27 | レスメド リミテッド | 姿勢感知照明システム |
US7997771B2 (en) * | 2004-06-01 | 2011-08-16 | 3M Innovative Properties Company | LED array systems |
CA2589570C (en) * | 2004-06-15 | 2010-04-13 | Henkel Corporation | High power led electro-optic assembly |
US7236366B2 (en) * | 2004-07-23 | 2007-06-26 | Excel Cell Electronic Co., Ltd. | High brightness LED apparatus with an integrated heat sink |
DE102004042186B4 (de) * | 2004-08-31 | 2010-07-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US7625091B2 (en) * | 2004-09-06 | 2009-12-01 | Nikon Corporation | Illuminating device and projector device |
CN100516631C (zh) * | 2004-09-27 | 2009-07-22 | 陈仕群 | Led灯 |
TWI257465B (en) * | 2004-10-11 | 2006-07-01 | Neobulb Technologies Inc | Lighting device with high heat dissipation efficiency |
DE102004051362A1 (de) * | 2004-10-21 | 2006-04-27 | Harvatek Corp. | Gehäuseaufbau fotoelektrischer Halbleiter |
JP2006128265A (ja) * | 2004-10-27 | 2006-05-18 | Kyocera Corp | 発光素子用配線基板ならびに発光装置 |
TWI262608B (en) * | 2004-12-08 | 2006-09-21 | Univ Nat Central | Light emitting device |
KR100646093B1 (ko) | 2004-12-17 | 2006-11-15 | 엘지이노텍 주식회사 | 발광소자 패키지 |
US7296916B2 (en) | 2004-12-21 | 2007-11-20 | 3M Innovative Properties Company | Illumination assembly and method of making same |
US20060131601A1 (en) * | 2004-12-21 | 2006-06-22 | Ouderkirk Andrew J | Illumination assembly and method of making same |
US7285802B2 (en) | 2004-12-21 | 2007-10-23 | 3M Innovative Properties Company | Illumination assembly and method of making same |
KR101115800B1 (ko) * | 2004-12-27 | 2012-03-08 | 엘지디스플레이 주식회사 | 발광소자 패키지, 이의 제조 방법 및 백라이트 유닛 |
KR100631901B1 (ko) * | 2005-01-31 | 2006-10-11 | 삼성전기주식회사 | Led 패키지 프레임 및 이를 채용하는 led 패키지 |
US20060187653A1 (en) * | 2005-02-10 | 2006-08-24 | Olsson Mark S | LED illumination devices |
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JP4542453B2 (ja) * | 2005-03-24 | 2010-09-15 | 日亜化学工業株式会社 | 発光装置 |
US7396142B2 (en) | 2005-03-25 | 2008-07-08 | Five Star Import Group, L.L.C. | LED light bulb |
CN1840958B (zh) * | 2005-03-28 | 2012-07-04 | 新灯源科技有限公司 | 系统构装的高功率高效率二极管灯泡 |
JP4569465B2 (ja) * | 2005-04-08 | 2010-10-27 | 東芝ライテック株式会社 | ランプ |
KR100688626B1 (ko) * | 2005-05-07 | 2007-03-02 | 아로 주식회사 | 발광다이오드용 패키지 및 이를 이용한 백라이트 유닛 |
US7918591B2 (en) * | 2005-05-13 | 2011-04-05 | Permlight Products, Inc. | LED-based luminaire |
JP4697533B2 (ja) * | 2005-06-08 | 2011-06-08 | ミネベア株式会社 | 面状照明装置 |
US9412926B2 (en) | 2005-06-10 | 2016-08-09 | Cree, Inc. | High power solid-state lamp |
KR100684429B1 (ko) * | 2005-06-30 | 2007-02-16 | 서울반도체 주식회사 | 발광 다이오드 램프 |
KR200397921Y1 (ko) * | 2005-07-19 | 2005-10-10 | 홍길표 | 개량된 일체형 교통신호등 |
CN2821749Y (zh) * | 2005-07-21 | 2006-09-27 | 新灯源科技有限公司 | 发光显示面板 |
JP2007048727A (ja) * | 2005-08-07 | 2007-02-22 | 3Force:Kk | 発光ダイオードユニット |
US20070041195A1 (en) * | 2005-08-16 | 2007-02-22 | Excel Cell Electronic Co., Ltd. | Light emitting assembly |
ATE415596T1 (de) * | 2005-08-17 | 2008-12-15 | Excel Cell Elect Co Ltd | Kühlvorrichtung für lichtemittierende elemente |
AU2005335695A1 (en) * | 2005-08-19 | 2007-02-22 | Neobulb Technologies, Inc. | An efficient high-power system-in-package led lamp |
JP5055756B2 (ja) * | 2005-09-21 | 2012-10-24 | 東京エレクトロン株式会社 | 熱処理装置及び記憶媒体 |
JP2007087712A (ja) * | 2005-09-21 | 2007-04-05 | Toshiba Lighting & Technology Corp | ランプ |
JP4497074B2 (ja) * | 2005-10-05 | 2010-07-07 | 市光工業株式会社 | 車両用灯具 |
JP4791794B2 (ja) * | 2005-10-21 | 2011-10-12 | パナソニック株式会社 | Led照明用アタッチメント |
JP4940883B2 (ja) * | 2005-10-31 | 2012-05-30 | 豊田合成株式会社 | 発光装置 |
US20070103914A1 (en) * | 2005-11-08 | 2007-05-10 | United Technologies Corporation | LED replacement bulb |
JP4940635B2 (ja) | 2005-11-14 | 2012-05-30 | 東京エレクトロン株式会社 | 加熱装置、熱処理装置及び記憶媒体 |
JP2007165811A (ja) | 2005-12-16 | 2007-06-28 | Nichia Chem Ind Ltd | 発光装置 |
CN100447483C (zh) * | 2005-12-29 | 2008-12-31 | 吴佰军 | 大功率led灯的散热组件结构 |
EP1977456A4 (en) * | 2005-12-29 | 2014-03-05 | Lam Chiang Lim | HIGH POWER LIGHT EMITTING DIODE HOUSING FIXED REMOVABLE TO A HEAT SINK |
KR101240650B1 (ko) * | 2006-01-18 | 2013-03-08 | 삼성디스플레이 주식회사 | 발광 다이오드 모듈, 이를 구비한 백라이트 어셈블리 및이를 구비한 표시 장치 |
DE102006003045B4 (de) * | 2006-01-20 | 2013-10-02 | Simon-Boris Estermann | Leuchtmitteleinheit, insbesondere für den Einsatz in Outdoor-Beleuchtungsvorrichtungen |
KR100764388B1 (ko) * | 2006-03-17 | 2007-10-05 | 삼성전기주식회사 | 양극산화 금속기판 모듈 |
US20070230182A1 (en) * | 2006-03-28 | 2007-10-04 | Yun Tai | Led module |
US20070236628A1 (en) * | 2006-03-31 | 2007-10-11 | 3M Innovative Properties Company | Illumination Light Unit and Optical System Using Same |
US20070247852A1 (en) * | 2006-04-21 | 2007-10-25 | Xiaoping Wang | Multi chip LED lamp |
CN101432899B (zh) * | 2006-04-28 | 2014-05-28 | 岛根县 | 半导体发光组件及其制造方法、半导体发光装置 |
US20070253202A1 (en) * | 2006-04-28 | 2007-11-01 | Chaun-Choung Technology Corp. | LED lamp and heat-dissipating structure thereof |
JP2009535784A (ja) | 2006-05-02 | 2009-10-01 | スーパーバルブス・インコーポレイテッド | Led電球用熱除去設計 |
CN101484964A (zh) | 2006-05-02 | 2009-07-15 | 舒伯布尔斯公司 | 用于发光二极管及其构成的灯泡分散光并优先散射某些波长的光的方法 |
WO2007130358A2 (en) | 2006-05-02 | 2007-11-15 | Superbulbs, Inc. | Plastic led bulb |
TWI349146B (en) * | 2006-05-15 | 2011-09-21 | Epistar Corp | A light-mixing type light-emitting device |
JP4439014B2 (ja) | 2006-06-08 | 2010-03-24 | 三星エスディアイ株式会社 | 発光装置、および表示装置 |
KR20070117335A (ko) * | 2006-06-08 | 2007-12-12 | 삼성에스디아이 주식회사 | 발광 장치 및 이를 백 라이트 유닛으로 사용하는 액정 표시장치 |
US7795632B2 (en) * | 2006-06-26 | 2010-09-14 | Osram Sylvania Inc. | Light emitting diode with direct view optic |
KR100726972B1 (ko) * | 2006-06-30 | 2007-06-14 | 한국광기술원 | 조립이 용이한 플런저 발광 다이오드 패키지 |
WO2008011756A1 (en) * | 2006-07-19 | 2008-01-31 | Jen-Shyan Chen | High power light emitting diode illuminating equipment with efficiently heat-dissipating module |
US7545461B2 (en) * | 2006-07-25 | 2009-06-09 | Kyocera Corporation | Liquid crystal display device |
US20080029720A1 (en) | 2006-08-03 | 2008-02-07 | Intematix Corporation | LED lighting arrangement including light emitting phosphor |
US20080062698A1 (en) * | 2006-09-13 | 2008-03-13 | Yun Tai | LED module |
US20080266869A1 (en) * | 2006-09-13 | 2008-10-30 | Yun Tai | LED module |
WO2008055422A1 (en) * | 2006-11-10 | 2008-05-15 | Shenzhen Gasun Energy Technology Co., Ltd. | High-luminance led street lamp |
US20080117362A1 (en) * | 2006-11-21 | 2008-05-22 | 3M Innovative Properties Company | Organic Light Emitting Diode Devices With Optical Microstructures |
EP2091079A1 (en) | 2006-11-30 | 2009-08-19 | NeoBulb Technologies, Inc. | Outdoor-type high-power light emitting diode illumination device |
CN100433391C (zh) * | 2006-11-30 | 2008-11-12 | 何永祥 | 一种采用多孔金属材料作为散热装置的大功率发光二极管 |
CN101210664A (zh) * | 2006-12-29 | 2008-07-02 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
WO2008085017A1 (es) * | 2007-01-08 | 2008-07-17 | Laura Patricia Vargas Maclel | Lampara de leds de alta potencia |
KR200446340Y1 (ko) * | 2007-01-23 | 2009-10-22 | 광성전기산업(주) | 교류 전원용 발광 다이오드 램프 |
KR100756897B1 (ko) | 2007-01-26 | 2007-09-07 | 주식회사 혜성엘앤엠 | Led 발광 조명등 |
US7922360B2 (en) * | 2007-02-14 | 2011-04-12 | Cree, Inc. | Thermal transfer in solid state light emitting apparatus and methods of manufacturing |
JP5830224B2 (ja) * | 2007-02-26 | 2015-12-09 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 照明装置の駆動 |
JP4882795B2 (ja) * | 2007-02-27 | 2012-02-22 | 岩崎電気株式会社 | 防犯灯 |
US20080220389A1 (en) * | 2007-03-07 | 2008-09-11 | Shu-Lung Wang | Circulating cooling structure for optical curing apparatus |
EP1975505A1 (en) * | 2007-03-26 | 2008-10-01 | Koninklijke Philips Electronics N.V. | Lighting device |
TW200902906A (en) * | 2007-05-07 | 2009-01-16 | Cree Led Lighting Solutions | Light fixtures and lighting devices |
TW200847467A (en) * | 2007-05-23 | 2008-12-01 | Tysun Inc | Light emitting diode lamp |
DE102007023918A1 (de) * | 2007-05-23 | 2008-11-27 | Siemens Ag Österreich | Beleuchtungseinheit |
EP2163808B1 (en) | 2007-05-23 | 2014-04-23 | Sharp Kabushiki Kaisha | Lighting device |
US8436371B2 (en) * | 2007-05-24 | 2013-05-07 | Cree, Inc. | Microscale optoelectronic device packages |
TWI337410B (en) * | 2007-05-28 | 2011-02-11 | Everlight Electronics Co Ltd | A light emitting diode package with two heat disspation paths |
US7638814B2 (en) * | 2007-06-19 | 2009-12-29 | Philips Lumileds Lighting Company, Llc | Solderless integrated package connector and heat sink for LED |
CN201078679Y (zh) * | 2007-07-02 | 2008-06-25 | 深圳市泓亚光电子有限公司 | Led直插式多芯大功率光源 |
KR100767738B1 (ko) * | 2007-07-04 | 2007-10-18 | 주식회사세오 | Led 발광 조명등 |
TWM327090U (en) * | 2007-07-30 | 2008-02-11 | Topco Technologies Corp | Light emitting diode lamp |
CN101368719B (zh) * | 2007-08-13 | 2011-07-06 | 太一节能系统股份有限公司 | 发光二极管灯具 |
KR101365621B1 (ko) | 2007-09-04 | 2014-02-24 | 서울반도체 주식회사 | 열 방출 슬러그들을 갖는 발광 다이오드 패키지 |
KR101533128B1 (ko) * | 2007-09-21 | 2015-07-01 | 쿠퍼 테크놀로지스 컴파니 | 발광 다이오드 매입 조명기구 |
JP5298486B2 (ja) * | 2007-09-27 | 2013-09-25 | 豊田合成株式会社 | 光源装置及び実装部材 |
WO2009045438A1 (en) * | 2007-10-03 | 2009-04-09 | Superbulbs, Inc. | Glass led light bulbs |
US8736197B2 (en) * | 2007-10-09 | 2014-05-27 | Koninklijke Philips N.V. | Methods and apparatus for controlling respective load currents of multiple series-connected loads |
CA2706975A1 (en) | 2007-10-24 | 2009-04-30 | Superbulbs, Inc. | Diffuser for led light sources |
CN102943966B (zh) * | 2007-12-13 | 2015-02-11 | 皇家飞利浦电子股份有限公司 | 用于安装到散热器的发光二极管 |
US7625104B2 (en) * | 2007-12-13 | 2009-12-01 | Philips Lumileds Lighting Company, Llc | Light emitting diode for mounting to a heat sink |
KR100910054B1 (ko) * | 2007-12-18 | 2009-07-30 | 에스엘 주식회사 | Led방열 장치 |
WO2009076770A1 (en) * | 2007-12-19 | 2009-06-25 | Phoster Industries | Modular led lighting device |
CN101251230B (zh) * | 2007-12-20 | 2010-06-16 | 和谐光电科技(泉州)有限公司 | 模组化大功率led路灯及其标准化led光源模组单元 |
US8118447B2 (en) | 2007-12-20 | 2012-02-21 | Altair Engineering, Inc. | LED lighting apparatus with swivel connection |
US7712918B2 (en) | 2007-12-21 | 2010-05-11 | Altair Engineering , Inc. | Light distribution using a light emitting diode assembly |
TWI372918B (en) | 2007-12-27 | 2012-09-21 | Everlight Electronics Co Ltd | Edge lighting light-emitting diode backlight module |
JP4945433B2 (ja) * | 2007-12-28 | 2012-06-06 | シャープ株式会社 | 照明装置 |
KR100872140B1 (ko) * | 2007-12-28 | 2008-12-10 | (주)블루글라스코리아 | 발광다이오드 램프 모듈 |
ATE537405T1 (de) * | 2008-01-04 | 2011-12-15 | Albert Stekelenburg | Led-lampe mit wärmeabfuhrvorrichtung |
JP5353216B2 (ja) * | 2008-01-07 | 2013-11-27 | 東芝ライテック株式会社 | Led電球及び照明器具 |
US20110001417A1 (en) * | 2008-01-15 | 2011-01-06 | Albert Stekelenburg | LED bulb with heat removal device |
JP4985422B2 (ja) * | 2008-01-22 | 2012-07-25 | Necライティング株式会社 | 発光モジュール |
FR2926926A1 (fr) * | 2008-01-30 | 2009-07-31 | Fd Eclairage Architectural Sa | Source lumineuse a diodes led |
KR100892224B1 (ko) * | 2008-01-30 | 2009-04-06 | (주)썬웨이브 | 핀 타입형 파워 엘이디(led) 방열구조 |
CN101521253B (zh) * | 2008-02-29 | 2011-02-16 | 富士迈半导体精密工业(上海)有限公司 | 固态发光元件及光源模组 |
TWM342619U (en) * | 2008-03-14 | 2008-10-11 | Qiao-En Huang | Light emitting body structure |
DE102008022344A1 (de) * | 2008-04-30 | 2009-11-05 | Siemens Aktiengesellschaft | Lichtsignal |
US20090273940A1 (en) * | 2008-05-01 | 2009-11-05 | Cao Group, Inc. | LED lighting device |
CN101498407B (zh) * | 2008-05-06 | 2012-04-18 | 天津市数通科技有限公司 | 一种led灯条组成的照明灯具 |
CN101581439A (zh) * | 2008-05-16 | 2009-11-18 | 富准精密工业(深圳)有限公司 | 发光二极管照明装置 |
US20090290343A1 (en) * | 2008-05-23 | 2009-11-26 | Abl Ip Holding Inc. | Lighting fixture |
US8360599B2 (en) | 2008-05-23 | 2013-01-29 | Ilumisys, Inc. | Electric shock resistant L.E.D. based light |
US8013501B2 (en) * | 2008-06-04 | 2011-09-06 | Forever Bulb, Llc | LED-based light bulb device |
CN101615643A (zh) * | 2008-06-25 | 2009-12-30 | 富准精密工业(深圳)有限公司 | 发光二极管结构 |
WO2009157285A1 (ja) * | 2008-06-27 | 2009-12-30 | 東芝ライテック株式会社 | 発光素子ランプ及び照明器具 |
US7976196B2 (en) | 2008-07-09 | 2011-07-12 | Altair Engineering, Inc. | Method of forming LED-based light and resulting LED-based light |
US8492179B2 (en) * | 2008-07-11 | 2013-07-23 | Koninklijke Philips N.V. | Method of mounting a LED module to a heat sink |
US7946729B2 (en) | 2008-07-31 | 2011-05-24 | Altair Engineering, Inc. | Fluorescent tube replacement having longitudinally oriented LEDs |
EP2154419B1 (en) | 2008-07-31 | 2016-07-06 | Toshiba Lighting & Technology Corporation | Self-ballasted lamp |
CN201246616Y (zh) | 2008-08-19 | 2009-05-27 | 鑫谷光电股份有限公司 | 一种新型大功率led烛型灯 |
WO2010020105A1 (zh) * | 2008-08-22 | 2010-02-25 | Lou Mane | 直接用交流电驱动的发光二极管 |
US20100053978A1 (en) * | 2008-08-26 | 2010-03-04 | Han-Ming Lee | Radiating semi-conductor light |
GB2463057A (en) * | 2008-08-30 | 2010-03-03 | Design 360 Ltd | Light emitting diode lighting housing comprising a reflector and heat sink |
US8674626B2 (en) | 2008-09-02 | 2014-03-18 | Ilumisys, Inc. | LED lamp failure alerting system |
US8256924B2 (en) | 2008-09-15 | 2012-09-04 | Ilumisys, Inc. | LED-based light having rapidly oscillating LEDs |
TW201013102A (en) * | 2008-09-19 | 2010-04-01 | Univ Ishou | Light emitting diode lamp tube device |
DE102008047934B4 (de) * | 2008-09-19 | 2015-02-26 | Osram Gmbh | Beleuchtungsvorrichtung mit einem Kühlkörper |
US20100080003A1 (en) * | 2008-09-29 | 2010-04-01 | Han-Ming Lee | Radiating cold light polymer lamp structure |
KR101012308B1 (ko) | 2008-10-01 | 2011-02-08 | 주식회사 아모럭스 | 방열장치 및 이를 이용한 전구형 led 조명장치 |
KR101007913B1 (ko) * | 2008-10-01 | 2011-01-14 | 주식회사 아모럭스 | 나선형 방열장치 및 이를 이용한 전구형 led 조명장치 |
TWI439635B (zh) | 2008-10-08 | 2014-06-01 | Ind Tech Res Inst | 發光裝置 |
KR101515833B1 (ko) * | 2008-10-08 | 2015-05-04 | 삼성전자주식회사 | 광학 장치 |
KR101006357B1 (ko) * | 2008-10-21 | 2011-01-10 | 주식회사 케이엠더블유 | 멀티칩 엘이디 패키지 |
US8324817B2 (en) | 2008-10-24 | 2012-12-04 | Ilumisys, Inc. | Light and light sensor |
US8444292B2 (en) | 2008-10-24 | 2013-05-21 | Ilumisys, Inc. | End cap substitute for LED-based tube replacement light |
US8901823B2 (en) | 2008-10-24 | 2014-12-02 | Ilumisys, Inc. | Light and light sensor |
US8342709B2 (en) * | 2008-10-24 | 2013-01-01 | Hubbell Incorporated | Light emitting diode module, and light fixture and method of illumination utilizing the same |
US8653984B2 (en) | 2008-10-24 | 2014-02-18 | Ilumisys, Inc. | Integration of LED lighting control with emergency notification systems |
US7938562B2 (en) | 2008-10-24 | 2011-05-10 | Altair Engineering, Inc. | Lighting including integral communication apparatus |
US8214084B2 (en) | 2008-10-24 | 2012-07-03 | Ilumisys, Inc. | Integration of LED lighting with building controls |
JP2010135309A (ja) | 2008-11-06 | 2010-06-17 | Rohm Co Ltd | Ledランプ |
WO2010053147A1 (ja) * | 2008-11-06 | 2010-05-14 | ローム株式会社 | Ledランプ |
DE102008057140A1 (de) * | 2008-11-13 | 2010-05-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US20100226139A1 (en) * | 2008-12-05 | 2010-09-09 | Permlight Products, Inc. | Led-based light engine |
CN202049991U (zh) * | 2008-12-09 | 2011-11-23 | 楼满娥 | 用于发光二极管的散热组件和发光二极管及发光二极管灯 |
US8556452B2 (en) | 2009-01-15 | 2013-10-15 | Ilumisys, Inc. | LED lens |
US8362710B2 (en) | 2009-01-21 | 2013-01-29 | Ilumisys, Inc. | Direct AC-to-DC converter for passive component minimization and universal operation of LED arrays |
US8664880B2 (en) | 2009-01-21 | 2014-03-04 | Ilumisys, Inc. | Ballast/line detection circuit for fluorescent replacement lamps |
US20100188860A1 (en) * | 2009-01-28 | 2010-07-29 | Been-Yu Liaw | Lotus blossom heat dissipating device |
EP2530378B1 (en) | 2009-02-04 | 2015-09-23 | Panasonic Intellectual Property Management Co., Ltd. | Bulb-shaped lamp and lighting device |
EP2403017A4 (en) | 2009-02-27 | 2014-07-02 | Toshiba Lighting & Technology | LIGHT-EMITTING MODULE AND LIGHTING DEVICE |
JP5333758B2 (ja) * | 2009-02-27 | 2013-11-06 | 東芝ライテック株式会社 | 照明装置および照明器具 |
FR2944854B1 (fr) * | 2009-03-12 | 2016-07-22 | Blachere Iluminations | Lampe comportant un culot surmonte d'une ampoule a l'interieur de laquelle sont disposees des diodes lumineuses |
KR101038213B1 (ko) * | 2009-04-02 | 2011-05-31 | 이춘희 | 고휘도 엘이디용 쾌속 방열장치 |
KR101030755B1 (ko) * | 2009-04-20 | 2011-04-26 | (주)다노테크 | 엘이디 가로등용 등기구 |
KR20120030404A (ko) * | 2009-05-04 | 2012-03-28 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 반투명 외부 엔벌로프 내에 배열된 광 방출기를 포함하는 광원 |
CH700967A1 (de) * | 2009-05-04 | 2010-11-15 | Martin Dr Ziegler | LED-Leuchtmittel in Glühbirnenform. |
EP2251915A1 (en) * | 2009-05-11 | 2010-11-17 | Foxsemicon Integrated Technology, Inc. | Light emitting diode and light source module having same |
US8952613B2 (en) * | 2009-05-12 | 2015-02-10 | Leroy E. Anderson | LED room light |
US8330381B2 (en) | 2009-05-14 | 2012-12-11 | Ilumisys, Inc. | Electronic circuit for DC conversion of fluorescent lighting ballast |
US7956546B2 (en) * | 2009-05-15 | 2011-06-07 | Bridgelux, Inc. | Modular LED light bulb |
US8299695B2 (en) | 2009-06-02 | 2012-10-30 | Ilumisys, Inc. | Screw-in LED bulb comprising a base having outwardly projecting nodes |
US20100301728A1 (en) * | 2009-06-02 | 2010-12-02 | Bridgelux, Inc. | Light source having a refractive element |
DE102009024181A1 (de) * | 2009-06-08 | 2010-12-09 | Yi-Jin Industrial Co., Ltd., Xin-Zhuang | Leuchtdiodenbirne und deren Birnenkolben |
US8421366B2 (en) | 2009-06-23 | 2013-04-16 | Ilumisys, Inc. | Illumination device including LEDs and a switching power control system |
US8186852B2 (en) | 2009-06-24 | 2012-05-29 | Elumigen Llc | Opto-thermal solution for multi-utility solid state lighting device using conic section geometries |
JP5354191B2 (ja) * | 2009-06-30 | 2013-11-27 | 東芝ライテック株式会社 | 電球形ランプおよび照明器具 |
JP5348410B2 (ja) | 2009-06-30 | 2013-11-20 | 東芝ライテック株式会社 | 口金付ランプおよび照明器具 |
CN101581408B (zh) * | 2009-07-01 | 2011-01-05 | 北京高科能光电技术有限公司 | 一种led灯泡 |
US8476812B2 (en) * | 2009-07-07 | 2013-07-02 | Cree, Inc. | Solid state lighting device with improved heatsink |
JP5477895B2 (ja) * | 2009-07-15 | 2014-04-23 | 神保電器株式会社 | Led照明装置 |
CN104534426B (zh) | 2009-07-21 | 2018-11-09 | 库柏技术公司 | 将发光二极管模块连接于散热器组件、反光件以及电路 |
US8596837B1 (en) | 2009-07-21 | 2013-12-03 | Cooper Technologies Company | Systems, methods, and devices providing a quick-release mechanism for a modular LED light engine |
JP2011049527A (ja) * | 2009-07-29 | 2011-03-10 | Toshiba Lighting & Technology Corp | Led照明装置 |
CN101994936A (zh) * | 2009-08-20 | 2011-03-30 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
KR101014063B1 (ko) | 2009-08-26 | 2011-02-10 | 엘지이노텍 주식회사 | 발광 소자 및 이를 이용한 라이트 유닛 |
CN201487668U (zh) * | 2009-09-09 | 2010-05-26 | 珠海晟源同泰电子有限公司 | 集束组合led照明光源 |
KR200452816Y1 (ko) * | 2009-09-14 | 2011-03-21 | (주) 코콤 | 안정기 회로기판 보호용 절연벽을 구비한 엘이디 램프 |
NL2003489C2 (en) * | 2009-09-14 | 2011-03-15 | Wen-Sung Hu | Illumination-improving structure for led or smd led lights. |
JP5601512B2 (ja) | 2009-09-14 | 2014-10-08 | 東芝ライテック株式会社 | 発光装置および照明装置 |
KR100939231B1 (ko) | 2009-09-23 | 2010-01-29 | 제이에스제이텍(주) | 엘이디 조명램프 |
JP2011071242A (ja) * | 2009-09-24 | 2011-04-07 | Toshiba Lighting & Technology Corp | 発光装置及び照明装置 |
US8324789B2 (en) | 2009-09-25 | 2012-12-04 | Toshiba Lighting & Technology Corporation | Self-ballasted lamp and lighting equipment |
CN102032481B (zh) | 2009-09-25 | 2014-01-08 | 东芝照明技术株式会社 | 附带灯口的照明灯及照明器具 |
JP2011091033A (ja) | 2009-09-25 | 2011-05-06 | Toshiba Lighting & Technology Corp | 発光モジュール、電球形ランプおよび照明器具 |
WO2011035490A1 (zh) * | 2009-09-27 | 2011-03-31 | 东莞市莱硕光电科技有限公司 | 用于三维照明的led器件 |
JP2011076833A (ja) * | 2009-09-30 | 2011-04-14 | Sharp Corp | Led照明装置 |
CN102032474B (zh) * | 2009-09-30 | 2013-04-24 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管灯具 |
US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
EP2491296A4 (en) * | 2009-10-22 | 2013-10-09 | Light Prescriptions Innovators | SEMICONDUCTOR ELECTRIC BULB |
TWM382586U (en) * | 2009-10-29 | 2010-06-11 | Ind Tech Res Inst | Hermetic light emitting device |
CN102052593A (zh) * | 2009-11-10 | 2011-05-11 | 张浙东 | Led灯泡 |
US20110122630A1 (en) * | 2009-11-26 | 2011-05-26 | Dsem Holdings Sdn. Bhd. | Solid State Lamp Having Vapor Chamber |
EP2508797A4 (de) * | 2009-12-03 | 2013-08-28 | With Ltd Liability Dis Plus Soc | Verfahren zur herstellung einer led-lampe, auf diese weise gewonnene led-lampe und radiator für diese lampe |
KR20110072334A (ko) * | 2009-12-22 | 2011-06-29 | 엘지이노텍 주식회사 | 엘이디 전광판 |
CN101839415B (zh) * | 2010-01-23 | 2013-01-09 | 鸿富锦精密工业(深圳)有限公司 | Led照明灯具 |
DE202010002125U1 (de) * | 2010-02-10 | 2011-08-30 | Zumtobel Lighting Gmbh | Anordnung zur Lichtabgabe mit punktförmigen Lichtquellen und Reflektor |
JP5257622B2 (ja) * | 2010-02-26 | 2013-08-07 | 東芝ライテック株式会社 | 電球形ランプおよび照明器具 |
US9062830B2 (en) * | 2010-03-03 | 2015-06-23 | Cree, Inc. | High efficiency solid state lamp and bulb |
US8632196B2 (en) | 2010-03-03 | 2014-01-21 | Cree, Inc. | LED lamp incorporating remote phosphor and diffuser with heat dissipation features |
US8931933B2 (en) * | 2010-03-03 | 2015-01-13 | Cree, Inc. | LED lamp with active cooling element |
US8562161B2 (en) | 2010-03-03 | 2013-10-22 | Cree, Inc. | LED based pedestal-type lighting structure |
PL2542826T3 (pl) * | 2010-03-03 | 2020-03-31 | Philips Lighting Holding B.V. | Lampa elektryczna zawierająca odbłyśnik do przekazywania ciepła ze źródła światła |
US8882284B2 (en) | 2010-03-03 | 2014-11-11 | Cree, Inc. | LED lamp or bulb with remote phosphor and diffuser configuration with enhanced scattering properties |
US9310030B2 (en) | 2010-03-03 | 2016-04-12 | Cree, Inc. | Non-uniform diffuser to scatter light into uniform emission pattern |
US9500325B2 (en) * | 2010-03-03 | 2016-11-22 | Cree, Inc. | LED lamp incorporating remote phosphor with heat dissipation features |
US9275979B2 (en) | 2010-03-03 | 2016-03-01 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
US9316361B2 (en) | 2010-03-03 | 2016-04-19 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration |
US20110227102A1 (en) * | 2010-03-03 | 2011-09-22 | Cree, Inc. | High efficacy led lamp with remote phosphor and diffuser configuration |
US9057511B2 (en) | 2010-03-03 | 2015-06-16 | Cree, Inc. | High efficiency solid state lamp and bulb |
US10359151B2 (en) | 2010-03-03 | 2019-07-23 | Ideal Industries Lighting Llc | Solid state lamp with thermal spreading elements and light directing optics |
US9024517B2 (en) | 2010-03-03 | 2015-05-05 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration utilizing red emitters |
US9625105B2 (en) * | 2010-03-03 | 2017-04-18 | Cree, Inc. | LED lamp with active cooling element |
IT1398867B1 (it) * | 2010-03-17 | 2013-03-21 | Gangi Di | Metodo per la fabbricazione di un corpo alettato di supporto per led di potenza |
CA2794512A1 (en) | 2010-03-26 | 2011-09-29 | David L. Simon | Led light tube with dual sided light distribution |
US8540401B2 (en) | 2010-03-26 | 2013-09-24 | Ilumisys, Inc. | LED bulb with internal heat dissipating structures |
EP2553320A4 (en) | 2010-03-26 | 2014-06-18 | Ilumisys Inc | LED LAMP COMPRISING A THERMOELECTRIC GENERATOR |
US8820971B2 (en) | 2010-03-31 | 2014-09-02 | Cree, Inc. | Decorative and functional light-emitting device lighting fixtures |
US8454202B2 (en) * | 2010-03-31 | 2013-06-04 | Cree, Inc. | Decorative and functional light-emitting device lighting fixtures |
US8602611B2 (en) | 2010-03-31 | 2013-12-10 | Cree, Inc. | Decorative and functional light-emitting device lighting fixtures |
US8297798B1 (en) | 2010-04-16 | 2012-10-30 | Cooper Technologies Company | LED lighting fixture |
JP5496757B2 (ja) * | 2010-04-16 | 2014-05-21 | 交和電気産業株式会社 | 照明装置 |
CN102235588A (zh) * | 2010-04-20 | 2011-11-09 | 太盟光电科技股份有限公司 | 可替换灯芯的发光二极管灯泡结构 |
KR101648810B1 (ko) * | 2010-04-23 | 2016-08-31 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법, 발광 소자 패키지, 조명 시스템 |
US8461748B1 (en) * | 2010-04-29 | 2013-06-11 | Lights Of America, Inc. | LED lamp |
CN101846256A (zh) * | 2010-05-04 | 2010-09-29 | 蔡州 | Led光源 |
US8125126B2 (en) | 2010-05-07 | 2012-02-28 | Industrial Technology Research Institute | Multi-facet light emitting lamp |
CA2740825C (en) | 2010-05-23 | 2014-03-18 | Rab Lighting, Inc. | Led housing with heat transfer sink |
KR101103674B1 (ko) | 2010-06-01 | 2012-01-11 | 엘지이노텍 주식회사 | 발광 소자 |
KR101859149B1 (ko) | 2011-04-14 | 2018-05-17 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
US8227961B2 (en) | 2010-06-04 | 2012-07-24 | Cree, Inc. | Lighting device with reverse tapered heatsink |
US8596821B2 (en) | 2010-06-08 | 2013-12-03 | Cree, Inc. | LED light bulbs |
JP4602477B1 (ja) * | 2010-06-16 | 2010-12-22 | 隆泰 佐藤 | 照明装置 |
US8454193B2 (en) | 2010-07-08 | 2013-06-04 | Ilumisys, Inc. | Independent modules for LED fluorescent light tube replacement |
WO2012009260A2 (en) | 2010-07-12 | 2012-01-19 | Altair Engineering, Inc. | Circuit board mount for led light tube |
US8288782B2 (en) | 2010-07-14 | 2012-10-16 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Backlight module and light-emitting source package structure thereof |
CN101943356B (zh) * | 2010-07-14 | 2013-03-13 | 深圳市华星光电技术有限公司 | 背光模块及其发光源封装构造 |
TWI403663B (zh) * | 2010-07-20 | 2013-08-01 | Foxsemicon Integrated Tech Inc | Led發光裝置 |
US9827439B2 (en) | 2010-07-23 | 2017-11-28 | Biological Illumination, Llc | System for dynamically adjusting circadian rhythm responsive to scheduled events and associated methods |
US8686641B2 (en) | 2011-12-05 | 2014-04-01 | Biological Illumination, Llc | Tunable LED lamp for producing biologically-adjusted light |
US9024536B2 (en) | 2011-12-05 | 2015-05-05 | Biological Illumination, Llc | Tunable LED lamp for producing biologically-adjusted light and associated methods |
US9681522B2 (en) | 2012-05-06 | 2017-06-13 | Lighting Science Group Corporation | Adaptive light system and associated methods |
US8743023B2 (en) | 2010-07-23 | 2014-06-03 | Biological Illumination, Llc | System for generating non-homogenous biologically-adjusted light and associated methods |
US8253336B2 (en) | 2010-07-23 | 2012-08-28 | Biological Illumination, Llc | LED lamp for producing biologically-corrected light |
US8760370B2 (en) | 2011-05-15 | 2014-06-24 | Lighting Science Group Corporation | System for generating non-homogenous light and associated methods |
US8841864B2 (en) | 2011-12-05 | 2014-09-23 | Biological Illumination, Llc | Tunable LED lamp for producing biologically-adjusted light |
US8324808B2 (en) * | 2010-07-23 | 2012-12-04 | Biological Illumination, Llc | LED lamp for producing biologically-corrected light |
US9532423B2 (en) | 2010-07-23 | 2016-12-27 | Lighting Science Group Corporation | System and methods for operating a lighting device |
US10451251B2 (en) | 2010-08-02 | 2019-10-22 | Ideal Industries Lighting, LLC | Solid state lamp with light directing optics and diffuser |
CN103261785A (zh) * | 2010-08-04 | 2013-08-21 | 迪斯普拉斯有限责任公司 | 发光装置 |
TWI467115B (zh) | 2010-08-06 | 2015-01-01 | Ind Tech Res Inst | 具高散熱效能之光源裝置 |
WO2012019319A1 (zh) * | 2010-08-10 | 2012-02-16 | 浙江迈勒斯照明有限公司 | 一种以大功率led为光源的照明灯具模块及led灯 |
TW201207310A (en) * | 2010-08-13 | 2012-02-16 | Foxsemicon Integrated Tech Inc | LED lamp and method for manufacturing a heat sink of the LED lamp |
KR101273724B1 (ko) * | 2010-08-18 | 2013-06-12 | 삼성전기주식회사 | 방열 기판 및 그 제조 방법, 그리고 상기 방열 기판을 구비하는 발광소자 패키지 |
CA2810658C (en) † | 2010-09-08 | 2015-02-10 | Zhejiang Ledison Optoelectronics Co., Ltd. | Led light bulb and led light-emitting strip being capable of emitting 4.pi. light |
US9546765B2 (en) | 2010-10-05 | 2017-01-17 | Intematix Corporation | Diffuser component having scattering particles |
CN101975376B (zh) * | 2010-10-08 | 2012-07-11 | 深圳市华星光电技术有限公司 | 背光模块的发光源散热构造 |
KR20120037803A (ko) * | 2010-10-12 | 2012-04-20 | 소닉스자펜 주식회사 | 착탈식 결합이 가능한 엘이디 조명등 |
US8523394B2 (en) | 2010-10-29 | 2013-09-03 | Ilumisys, Inc. | Mechanisms for reducing risk of shock during installation of light tube |
US8401231B2 (en) | 2010-11-09 | 2013-03-19 | Biological Illumination, Llc | Sustainable outdoor lighting system for use in environmentally photo-sensitive area |
JP2012104445A (ja) * | 2010-11-12 | 2012-05-31 | Iina:Kk | Ledランプ構造体 |
US8870415B2 (en) | 2010-12-09 | 2014-10-28 | Ilumisys, Inc. | LED fluorescent tube replacement light with reduced shock hazard |
CN102544303A (zh) * | 2010-12-21 | 2012-07-04 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
CN102022656B (zh) * | 2010-12-25 | 2013-08-21 | 鸿富锦精密工业(深圳)有限公司 | Led照明灯具 |
RU2559808C2 (ru) | 2010-12-30 | 2015-08-10 | Элюмиген Ллк | Осветительное устройство (варианты) |
US8757836B2 (en) | 2011-01-13 | 2014-06-24 | GE Lighting Solutions, LLC | Omnidirectional LED based solid state lamp |
KR20120086394A (ko) | 2011-01-26 | 2012-08-03 | 이정훈 | 발광 다이오드 모듈 및 조명 장치 |
US9068701B2 (en) | 2012-01-26 | 2015-06-30 | Cree, Inc. | Lamp structure with remote LED light source |
US9234655B2 (en) | 2011-02-07 | 2016-01-12 | Cree, Inc. | Lamp with remote LED light source and heat dissipating elements |
US11251164B2 (en) | 2011-02-16 | 2022-02-15 | Creeled, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
WO2012128076A1 (ja) * | 2011-03-18 | 2012-09-27 | シャープ株式会社 | 照明装置、表示装置、及びテレビ受信装置 |
US8803412B2 (en) * | 2011-03-18 | 2014-08-12 | Abl Ip Holding Llc | Semiconductor lamp |
US8272766B2 (en) | 2011-03-18 | 2012-09-25 | Abl Ip Holding Llc | Semiconductor lamp with thermal handling system |
US8461752B2 (en) * | 2011-03-18 | 2013-06-11 | Abl Ip Holding Llc | White light lamp using semiconductor light emitter(s) and remotely deployed phosphor(s) |
JP5759781B2 (ja) * | 2011-03-31 | 2015-08-05 | ローム株式会社 | Led電球 |
JP2014512079A (ja) * | 2011-04-04 | 2014-05-19 | セラムテック ゲゼルシャフト ミット ベシュレンクテル ハフツング | 発光手段としてのledとガラス又はプラスチック製ランプシェードとを備えたledランプ |
CN102767702B (zh) * | 2011-05-03 | 2014-09-10 | 深圳市裕富照明有限公司 | Led导热柱球泡灯 |
TWI397653B (zh) * | 2011-05-09 | 2013-06-01 | Sunonwealth Electr Mach Ind Co | 具散熱功能之發光模組 |
US9173269B2 (en) | 2011-05-15 | 2015-10-27 | Lighting Science Group Corporation | Lighting system for accentuating regions of a layer and associated methods |
US8901850B2 (en) | 2012-05-06 | 2014-12-02 | Lighting Science Group Corporation | Adaptive anti-glare light system and associated methods |
US8754832B2 (en) | 2011-05-15 | 2014-06-17 | Lighting Science Group Corporation | Lighting system for accenting regions of a layer and associated methods |
US8704432B2 (en) | 2011-05-25 | 2014-04-22 | Seoul Semiconductor Co., Ltd. | LED lamp |
WO2012170869A1 (en) | 2011-06-09 | 2012-12-13 | Elumigen Llc | Solid state lighting device using heat channels in a housing |
US10243121B2 (en) | 2011-06-24 | 2019-03-26 | Cree, Inc. | High voltage monolithic LED chip with improved reliability |
WO2013003627A1 (en) * | 2011-06-28 | 2013-01-03 | Cree, Inc. | Compact high efficiency remote led module |
US9072171B2 (en) | 2011-08-24 | 2015-06-30 | Ilumisys, Inc. | Circuit board mount for LED light |
KR101326518B1 (ko) * | 2011-09-02 | 2013-11-07 | 엘지이노텍 주식회사 | 조명 장치 |
JP5690692B2 (ja) * | 2011-09-21 | 2015-03-25 | 日立アプライアンス株式会社 | 電球型照明装置 |
US8591069B2 (en) | 2011-09-21 | 2013-11-26 | Switch Bulb Company, Inc. | LED light bulb with controlled color distribution using quantum dots |
TWI441362B (zh) * | 2011-10-05 | 2014-06-11 | Delta Electronics Inc | 發光模組及其發光裝置 |
CN103075715A (zh) * | 2011-10-26 | 2013-05-01 | 上舜照明(中国)有限公司 | 一种led灯壳及其在led灯具中的应用 |
CN102410483B (zh) * | 2011-11-14 | 2013-06-12 | 黎昌兴 | 适用于车船照明灯具led光源 |
JP2013105711A (ja) * | 2011-11-16 | 2013-05-30 | Toshiba Lighting & Technology Corp | 照明器具 |
US9913341B2 (en) | 2011-12-05 | 2018-03-06 | Biological Illumination, Llc | LED lamp for producing biologically-adjusted light including a cyan LED |
US8963450B2 (en) | 2011-12-05 | 2015-02-24 | Biological Illumination, Llc | Adaptable biologically-adjusted indirect lighting device and associated methods |
DE102011087709B4 (de) | 2011-12-05 | 2022-03-03 | Ledvance Gmbh | Halbleiteranordnung und verfahren zum fertigen einer halbleiteranordnung |
US9289574B2 (en) | 2011-12-05 | 2016-03-22 | Biological Illumination, Llc | Three-channel tuned LED lamp for producing biologically-adjusted light |
US8866414B2 (en) | 2011-12-05 | 2014-10-21 | Biological Illumination, Llc | Tunable LED lamp for producing biologically-adjusted light |
US9220202B2 (en) | 2011-12-05 | 2015-12-29 | Biological Illumination, Llc | Lighting system to control the circadian rhythm of agricultural products and associated methods |
US9200756B2 (en) * | 2011-12-12 | 2015-12-01 | Lg Innotek Co., Ltd. | Lighting device |
CN102494283A (zh) * | 2011-12-16 | 2012-06-13 | 德清新明辉电光源有限公司 | Led冰箱灯 |
US8929077B2 (en) * | 2012-01-02 | 2015-01-06 | Tem Products Inc. | Thermal connector |
WO2013109160A1 (ru) * | 2012-01-20 | 2013-07-25 | Общество с ограниченной ответственностью "ДиС ПЛЮС" | Светодиодное осветительное устройство |
WO2013115439A1 (ko) * | 2012-02-02 | 2013-08-08 | 주식회사 포스코엘이디 | 히트싱크 및 이를 포함하는 엘이디 조명장치 |
US9184518B2 (en) | 2012-03-02 | 2015-11-10 | Ilumisys, Inc. | Electrical connector header for an LED-based light |
JP5155463B2 (ja) * | 2012-03-05 | 2013-03-06 | シャープ株式会社 | 照明装置 |
KR101190281B1 (ko) * | 2012-03-07 | 2012-10-12 | 가부시키가이샤 타카이코포레이션 | Led 램프 모듈의 방열기판구조체 및 그 제조방법 |
KR101247380B1 (ko) * | 2012-03-09 | 2013-03-26 | 서울반도체 주식회사 | 발광 다이오드 |
US9166133B2 (en) * | 2012-03-15 | 2015-10-20 | Panasonic Intellectual Property Management Co., Ltd. | Substrate for LED, LED module, and LED bulb |
US9488359B2 (en) | 2012-03-26 | 2016-11-08 | Cree, Inc. | Passive phase change radiators for LED lamps and fixtures |
US9234638B2 (en) | 2012-04-13 | 2016-01-12 | Cree, Inc. | LED lamp with thermally conductive enclosure |
US9951909B2 (en) | 2012-04-13 | 2018-04-24 | Cree, Inc. | LED lamp |
JP2012178588A (ja) * | 2012-04-25 | 2012-09-13 | Nec Lighting Ltd | 発光モジュールおよび照明装置 |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
US9402294B2 (en) | 2012-05-08 | 2016-07-26 | Lighting Science Group Corporation | Self-calibrating multi-directional security luminaire and associated methods |
US9006987B2 (en) | 2012-05-07 | 2015-04-14 | Lighting Science Group, Inc. | Wall-mountable luminaire and associated systems and methods |
US8680457B2 (en) | 2012-05-07 | 2014-03-25 | Lighting Science Group Corporation | Motion detection system and associated methods having at least one LED of second set of LEDs to vary its voltage |
CN102720964A (zh) * | 2012-05-31 | 2012-10-10 | 郭允飞 | 一种改进的led灯 |
JP5376265B2 (ja) * | 2012-06-15 | 2013-12-25 | 東芝ライテック株式会社 | Led電球及び照明器具 |
DE102012211143A1 (de) * | 2012-06-28 | 2014-01-23 | Osram Gmbh | Träger für elektrisches bauelement mit wärmeleitkörper |
US9163794B2 (en) | 2012-07-06 | 2015-10-20 | Ilumisys, Inc. | Power supply assembly for LED-based light tube |
US9271367B2 (en) | 2012-07-09 | 2016-02-23 | Ilumisys, Inc. | System and method for controlling operation of an LED-based light |
TWM443324U (en) | 2012-07-13 | 2012-12-11 | Shun-An Liao | Power supply devices of low temperature led lighting |
US8765500B2 (en) * | 2012-08-24 | 2014-07-01 | Tsmc Solid State Lighting Ltd. | Method and apparatus for fabricating phosphor-coated LED dies |
JP2014075429A (ja) * | 2012-10-03 | 2014-04-24 | Sharp Corp | 発光装置および発光装置へのヒートシンク取付方法 |
GB2506625A (en) * | 2012-10-04 | 2014-04-09 | Bae Systems Plc | LCD backlight display |
US9174067B2 (en) | 2012-10-15 | 2015-11-03 | Biological Illumination, Llc | System for treating light treatable conditions and associated methods |
CN104718634A (zh) * | 2012-10-19 | 2015-06-17 | 夏普株式会社 | 发光装置以及发光装置向散热器安装的安装构造 |
KR101349294B1 (ko) * | 2012-10-31 | 2014-01-13 | 주식회사 넥스트원 | 발광다이오드 모듈 및 조명기구 |
DE102012220264A1 (de) * | 2012-11-07 | 2014-05-08 | Osram Gmbh | Leuchtmittel mit optoelektronischem Bauelement |
CN103811629A (zh) * | 2012-11-11 | 2014-05-21 | 顾仁法 | 一种led光学模组与散热器的连接结构 |
CN103035818A (zh) * | 2012-11-26 | 2013-04-10 | 上海威廉照明电气有限公司 | 垂直结构型发光二极管用支架和垂直结构型发光二极管 |
WO2014098931A1 (en) * | 2012-12-21 | 2014-06-26 | Cree, Inc. | Led lamp |
US20140185269A1 (en) | 2012-12-28 | 2014-07-03 | Intermatix Corporation | Solid-state lamps utilizing photoluminescence wavelength conversion components |
JP2014164057A (ja) * | 2013-02-25 | 2014-09-08 | Mitsubishi Electric Corp | 映像表示装置 |
US9347655B2 (en) | 2013-03-11 | 2016-05-24 | Lighting Science Group Corporation | Rotatable lighting device |
WO2014151927A1 (en) | 2013-03-14 | 2014-09-25 | Ipg Photonics Corporation | Universal fiber optic connector |
US9188312B2 (en) * | 2013-03-14 | 2015-11-17 | GE Lighting Solutions, LLC | Optical system for a directional lamp |
US9285084B2 (en) | 2013-03-14 | 2016-03-15 | Ilumisys, Inc. | Diffusers for LED-based lights |
USD748296S1 (en) | 2013-03-14 | 2016-01-26 | Cree, Inc. | LED lamp |
US9052093B2 (en) | 2013-03-14 | 2015-06-09 | Cree, Inc. | LED lamp and heat sink |
US20140268731A1 (en) | 2013-03-15 | 2014-09-18 | Lighting Science Group Corpporation | Low bay lighting system and associated methods |
US9468365B2 (en) * | 2013-03-15 | 2016-10-18 | Sanovas, Inc. | Compact light source |
TWI627371B (zh) | 2013-03-15 | 2018-06-21 | 英特曼帝克司公司 | 光致發光波長轉換組件 |
CN103307482A (zh) * | 2013-03-25 | 2013-09-18 | 国家电网公司 | 一种变电站厂区照明灯具 |
TWI549322B (zh) * | 2013-04-10 | 2016-09-11 | 映瑞光電科技(上海)有限公司 | 一種結合磊晶結構與封裝基板爲一體之整合式led元件及其製作方法 |
TW201505217A (zh) * | 2013-07-23 | 2015-02-01 | Lextar Electronics Corp | 發光二極體封裝結構與發光二極體燈泡 |
US9267650B2 (en) | 2013-10-09 | 2016-02-23 | Ilumisys, Inc. | Lens for an LED-based light |
WO2015112437A1 (en) | 2014-01-22 | 2015-07-30 | Ilumisys, Inc. | Led-based light with addressed leds |
US9360188B2 (en) | 2014-02-20 | 2016-06-07 | Cree, Inc. | Remote phosphor element filled with transparent material and method for forming multisection optical elements |
DE102014204968A1 (de) * | 2014-03-18 | 2015-09-24 | Siemens Aktiengesellschaft | Signalgeber zur Abgabe eines Lichtsignals |
US9510400B2 (en) | 2014-05-13 | 2016-11-29 | Ilumisys, Inc. | User input systems for an LED-based light |
KR20170013344A (ko) * | 2014-05-30 | 2017-02-06 | 코닌클리케 필립스 엔.브이. | 자동차 조명 응용예에 대한 광학 렌즈 패키지 |
US9829179B2 (en) | 2014-06-26 | 2017-11-28 | Phillip Walesa | Parabolic quadrant LED light fixture |
US9651219B2 (en) | 2014-08-20 | 2017-05-16 | Elumigen Llc | Light bulb assembly having internal redirection element for improved directional light distribution |
TWM491783U (zh) * | 2014-08-21 | 2014-12-11 | Habemit Internat Co Ltd | Led燈具之電子元件固定結構 |
CZ2014761A3 (cs) * | 2014-11-06 | 2016-01-06 | Varroc Lighting Systems, s.r.o. | Světelný zdroj |
US20170328550A1 (en) * | 2014-11-12 | 2017-11-16 | Katsuro Tsukamoto | Heat dissipation structure and illumination device |
US10718474B1 (en) | 2014-11-20 | 2020-07-21 | The Light Source, Inc. | Lighting fixture with closely-packed LED components |
JP2015179847A (ja) * | 2015-04-06 | 2015-10-08 | 有限会社エリート貿易 | Led光源の反射及び放熱構造 |
KR101545115B1 (ko) | 2015-04-29 | 2015-08-17 | (주)코리아반도체조명 | 방열기능을 개선 시킨 엘이디 조명용 인쇄회로기판 |
US10161568B2 (en) | 2015-06-01 | 2018-12-25 | Ilumisys, Inc. | LED-based light with canted outer walls |
CN105006515B (zh) * | 2015-06-04 | 2018-01-19 | 佛山市南海区联合广东新光源产业创新中心 | 一种led芯片散热结构 |
US9970649B2 (en) | 2015-07-24 | 2018-05-15 | Fluence Bioengineering | Systems and methods for a heat sink |
CN106468398A (zh) * | 2015-08-19 | 2017-03-01 | 点量科技股份有限公司 | 具有前置式散热装置的发光二极管灯具 |
US9939596B2 (en) * | 2015-10-29 | 2018-04-10 | Samsung Electronics Co., Ltd. | Optical integrated circuit package |
WO2017095181A1 (ko) | 2015-12-02 | 2017-06-08 | 주식회사 아모센스 | 엘이디 조명 장치 |
CN105402610B (zh) * | 2015-12-14 | 2019-04-09 | 江门市中亚光电有限公司 | 一种瓦楞灯 |
CN105674225B (zh) * | 2016-03-07 | 2019-12-17 | 江苏师范大学 | 一种透明陶瓷荧光管内壁封装蓝光芯片的白光led光源 |
CN105762143A (zh) * | 2016-03-07 | 2016-07-13 | 江苏师范大学 | 一种基于透明陶瓷荧光管的高功率白光led光源 |
TWI582340B (zh) * | 2016-05-13 | 2017-05-11 | 綠點高新科技股份有限公司 | 照明裝置 |
CN106098898A (zh) * | 2016-06-28 | 2016-11-09 | 储世昌 | 一种led贴片封装结构 |
EP3534060B1 (en) * | 2016-10-25 | 2022-07-06 | KYOCERA Corporation | Light emitting element mounting substrate, light emitting device, and light emitting module |
RU180144U1 (ru) * | 2017-01-09 | 2018-06-06 | Евгений Михайлович Силкин | Светодиодная лампа направленного света |
IT201700009942A1 (it) * | 2017-01-30 | 2018-07-30 | Alberici S P A | Lampada led e metodo per realizzarla |
RU173701U1 (ru) * | 2017-02-16 | 2017-09-06 | Андрей Владимирович Кащеев | Светодиодный светильник |
US10679924B2 (en) | 2018-03-05 | 2020-06-09 | Win Semiconductors Corp. | Semiconductor device with antenna integrated |
DE102018105731A1 (de) | 2018-03-13 | 2019-09-19 | Infineon Technologies Ag | Vernetztes thermoplastisches Dielektrium für Chip-Package |
CN110600600B (zh) * | 2019-08-29 | 2020-09-01 | 深圳市芯联电股份有限公司 | 一种led防水封装结构及封装工艺 |
WO2023042746A1 (ja) * | 2021-09-16 | 2023-03-23 | 旭化成株式会社 | 紫外線照射装置およびその製造方法 |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2038790U (zh) * | 1988-02-01 | 1989-06-07 | 徐业林 | 健身治疗仪 |
US5331512A (en) * | 1992-04-16 | 1994-07-19 | Orton Kevin R | Surface-mount LED |
JPH08314395A (ja) * | 1995-05-23 | 1996-11-29 | Rohm Co Ltd | チップタイプ発光装置 |
CN2256561Y (zh) * | 1996-05-27 | 1997-06-18 | 上海南北机械电气工程有限公司 | 全集光超高光效led光阵面光源信号器 |
JPH1187780A (ja) * | 1997-09-04 | 1999-03-30 | Sharp Corp | 発光装置 |
JPH11121808A (ja) * | 1997-10-15 | 1999-04-30 | Idec Izumi Corp | Led表示用デバイス |
CN2335265Y (zh) * | 1997-12-15 | 1999-08-25 | 周万顺 | 发光二极管基座 |
JP2000022222A (ja) * | 1998-07-07 | 2000-01-21 | Stanley Electric Co Ltd | 発光ダイオード |
CN2386535Y (zh) * | 1999-07-23 | 2000-07-05 | 亿光电子工业股份有限公司 | 发光二极管封装装置 |
WO2000055914A1 (en) | 1999-03-15 | 2000-09-21 | Gentex Corporation | Semiconductor radiation emitter package |
JP2000269551A (ja) * | 1999-03-18 | 2000-09-29 | Rohm Co Ltd | チップ型発光装置 |
JP2000277811A (ja) * | 1999-03-24 | 2000-10-06 | Stanley Electric Co Ltd | 面光源用ランプハウス |
CN2442335Y (zh) * | 2000-03-20 | 2001-08-08 | 深圳市招延交科实业有限公司 | Led交通信号灯 |
CN2444117Y (zh) * | 2000-08-08 | 2001-08-22 | 深圳市赛为实业有限公司 | 发光二极管单色灯泡 |
CN2462225Y (zh) * | 2000-12-26 | 2001-11-28 | 张忱 | 带反光腔的发光二极管灯泡 |
Family Cites Families (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5524721Y2 (zh) * | 1972-10-19 | 1980-06-13 | ||
US3946416A (en) * | 1973-04-24 | 1976-03-23 | The United States Of America As Represented By The Secretary Of The Army | Low impedance diode mounting structure and housing |
US3936686A (en) * | 1973-05-07 | 1976-02-03 | Moore Donald W | Reflector lamp cooling and containing assemblies |
CN85104012B (zh) | 1985-05-22 | 1987-12-02 | 复旦大学 | 具有金属反射腔的半导体平面发光器件 |
JPH058689Y2 (zh) * | 1986-11-25 | 1993-03-04 | ||
US4885668A (en) * | 1988-06-17 | 1989-12-05 | Mag Instrument, Inc. | Heat shield |
JPH02136333U (zh) * | 1989-04-20 | 1990-11-14 | ||
JPH02138455U (zh) * | 1989-04-21 | 1990-11-19 | ||
JPH03245586A (ja) * | 1990-02-23 | 1991-11-01 | Nec Corp | 光送信回路 |
JPH05162386A (ja) * | 1991-12-17 | 1993-06-29 | Hitachi Cable Ltd | Ledアレイヘッド |
US5534718A (en) * | 1993-04-12 | 1996-07-09 | Hsi-Huang Lin | LED package structure of LED display |
JP3296623B2 (ja) * | 1993-05-11 | 2002-07-02 | 三洋電機株式会社 | 光プリントヘッド |
US5632551A (en) * | 1994-07-18 | 1997-05-27 | Grote Industries, Inc. | LED vehicle lamp assembly |
JPH08116096A (ja) * | 1994-10-14 | 1996-05-07 | Hamamatsu Photonics Kk | 発光装置 |
US5833355A (en) * | 1996-12-06 | 1998-11-10 | Dialight Corporation | Led illuminated lamp assembly |
US5785418A (en) * | 1996-06-27 | 1998-07-28 | Hochstein; Peter A. | Thermally protected LED array |
US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
US6441943B1 (en) * | 1997-04-02 | 2002-08-27 | Gentex Corporation | Indicators and illuminators using a semiconductor radiation emitter package |
AU9178398A (en) * | 1997-09-25 | 1999-04-12 | University Of Bristol, The | Optical irradiation device |
CN2305752Y (zh) | 1997-10-17 | 1999-01-27 | 中国科学院武汉物理与数学研究所 | 无电极低压荧光灯 |
US6160710A (en) * | 1998-04-03 | 2000-12-12 | Ericsson Inc. | Capacitive mounting arrangement for securing an integrated circuit package to a heat sink |
US5959316A (en) | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
EP1047903B1 (en) * | 1998-09-17 | 2007-06-27 | Koninklijke Philips Electronics N.V. | Led lamp |
US6351069B1 (en) * | 1999-02-18 | 2002-02-26 | Lumileds Lighting, U.S., Llc | Red-deficiency-compensating phosphor LED |
JP3447604B2 (ja) | 1999-02-25 | 2003-09-16 | 株式会社シチズン電子 | 表面実装型発光ダイオード及びその製造方法 |
US6367949B1 (en) | 1999-08-04 | 2002-04-09 | 911 Emergency Products, Inc. | Par 36 LED utility lamp |
KR100304762B1 (ko) | 1999-08-28 | 2001-11-01 | 박기점 | 전구형 엘이디 교통신호등 |
US6504301B1 (en) * | 1999-09-03 | 2003-01-07 | Lumileds Lighting, U.S., Llc | Non-incandescent lightbulb package using light emitting diodes |
JP4078002B2 (ja) * | 1999-10-18 | 2008-04-23 | 常盤電業株式会社 | 発光体及び信号灯 |
JP2001160312A (ja) * | 1999-12-01 | 2001-06-12 | Mitsubishi Electric Corp | 面照明装置 |
JP2001189494A (ja) * | 1999-12-28 | 2001-07-10 | Iwasaki Electric Co Ltd | 発光ダイオード |
JP2001217466A (ja) * | 2000-02-03 | 2001-08-10 | Toyoda Gosei Co Ltd | 反射型発光装置 |
US6492725B1 (en) * | 2000-02-04 | 2002-12-10 | Lumileds Lighting, U.S., Llc | Concentrically leaded power semiconductor device package |
US6318886B1 (en) * | 2000-02-11 | 2001-11-20 | Whelen Engineering Company | High flux led assembly |
US6793371B2 (en) * | 2000-03-09 | 2004-09-21 | Mongo Light Co. Inc. | LED lamp assembly |
US6517218B2 (en) | 2000-03-31 | 2003-02-11 | Relume Corporation | LED integrated heat sink |
GB2361581A (en) * | 2000-04-20 | 2001-10-24 | Lite On Electronics Inc | A light emitting diode device |
GB0015898D0 (en) * | 2000-06-28 | 2000-08-23 | Oxley Dev Co Ltd | Light |
CN2445438Y (zh) * | 2000-08-21 | 2001-08-29 | 杨志远 | 闪灯式发光二极管结构 |
US6476549B2 (en) | 2000-10-26 | 2002-11-05 | Mu-Chin Yu | Light emitting diode with improved heat dissipation |
US20020105001A1 (en) * | 2001-02-07 | 2002-08-08 | Strelchun Thomas Francis | Optical to electrical interconnect structure |
JP4045781B2 (ja) * | 2001-08-28 | 2008-02-13 | 松下電工株式会社 | 発光装置 |
BR0212241A (pt) * | 2001-08-31 | 2004-10-05 | Cool Options Inc | Refletor de lâmpada termicamente condutivo, e, método de formação do mesmo |
US6682211B2 (en) * | 2001-09-28 | 2004-01-27 | Osram Sylvania Inc. | Replaceable LED lamp capsule |
TW533750B (en) * | 2001-11-11 | 2003-05-21 | Solidlite Corp | LED lamp |
US6871993B2 (en) * | 2002-07-01 | 2005-03-29 | Accu-Sort Systems, Inc. | Integrating LED illumination system for machine vision systems |
US7282841B2 (en) * | 2004-11-01 | 2007-10-16 | Chia Mao Li | Lamp assembly with LED light sources including threaded heat conduction base |
-
2002
- 2002-12-30 US US10/500,315 patent/US7497596B2/en not_active Expired - Fee Related
- 2002-12-30 EP EP02790249A patent/EP1467414A4/en not_active Withdrawn
- 2002-12-30 KR KR1020047010358A patent/KR100991830B1/ko not_active IP Right Cessation
- 2002-12-30 AU AU2002367196A patent/AU2002367196A1/en not_active Abandoned
- 2002-12-30 JP JP2003557050A patent/JP2005513815A/ja active Pending
- 2002-12-30 KR KR1020097019925A patent/KR20090115810A/ko not_active Application Discontinuation
- 2002-12-30 WO PCT/CN2002/000930 patent/WO2003056636A1/zh active Application Filing
- 2002-12-30 CN CNB028261275A patent/CN100373638C/zh not_active Expired - Fee Related
- 2002-12-30 KR KR1020097019923A patent/KR100991827B1/ko not_active IP Right Cessation
- 2002-12-30 KR KR1020097019924A patent/KR100991829B1/ko not_active IP Right Cessation
-
2006
- 2006-05-10 US US11/430,914 patent/US7347589B2/en not_active Expired - Fee Related
-
2008
- 2008-11-06 US US12/265,911 patent/US7736027B2/en not_active Expired - Fee Related
-
2009
- 2009-10-20 JP JP2009241098A patent/JP2010050472A/ja active Pending
- 2009-10-20 JP JP2009241101A patent/JP2010050473A/ja active Pending
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2038790U (zh) * | 1988-02-01 | 1989-06-07 | 徐业林 | 健身治疗仪 |
US5331512A (en) * | 1992-04-16 | 1994-07-19 | Orton Kevin R | Surface-mount LED |
JPH08314395A (ja) * | 1995-05-23 | 1996-11-29 | Rohm Co Ltd | チップタイプ発光装置 |
CN2256561Y (zh) * | 1996-05-27 | 1997-06-18 | 上海南北机械电气工程有限公司 | 全集光超高光效led光阵面光源信号器 |
JPH1187780A (ja) * | 1997-09-04 | 1999-03-30 | Sharp Corp | 発光装置 |
JPH11121808A (ja) * | 1997-10-15 | 1999-04-30 | Idec Izumi Corp | Led表示用デバイス |
CN2335265Y (zh) * | 1997-12-15 | 1999-08-25 | 周万顺 | 发光二极管基座 |
JP2000022222A (ja) * | 1998-07-07 | 2000-01-21 | Stanley Electric Co Ltd | 発光ダイオード |
WO2000055914A1 (en) | 1999-03-15 | 2000-09-21 | Gentex Corporation | Semiconductor radiation emitter package |
JP2000269551A (ja) * | 1999-03-18 | 2000-09-29 | Rohm Co Ltd | チップ型発光装置 |
JP2000277811A (ja) * | 1999-03-24 | 2000-10-06 | Stanley Electric Co Ltd | 面光源用ランプハウス |
CN2386535Y (zh) * | 1999-07-23 | 2000-07-05 | 亿光电子工业股份有限公司 | 发光二极管封装装置 |
CN2442335Y (zh) * | 2000-03-20 | 2001-08-08 | 深圳市招延交科实业有限公司 | Led交通信号灯 |
CN2444117Y (zh) * | 2000-08-08 | 2001-08-22 | 深圳市赛为实业有限公司 | 发光二极管单色灯泡 |
CN2462225Y (zh) * | 2000-12-26 | 2001-11-28 | 张忱 | 带反光腔的发光二极管灯泡 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1467414A4 * |
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Also Published As
Publication number | Publication date |
---|---|
KR20090119916A (ko) | 2009-11-20 |
US20090059595A1 (en) | 2009-03-05 |
US7497596B2 (en) | 2009-03-03 |
CN100373638C (zh) | 2008-03-05 |
AU2002367196A1 (en) | 2003-07-15 |
US20050068776A1 (en) | 2005-03-31 |
US7347589B2 (en) | 2008-03-25 |
JP2010050473A (ja) | 2010-03-04 |
EP1467414A4 (en) | 2007-07-11 |
US7736027B2 (en) | 2010-06-15 |
KR20040093686A (ko) | 2004-11-08 |
KR20090115810A (ko) | 2009-11-06 |
JP2005513815A (ja) | 2005-05-12 |
KR100991830B1 (ko) | 2010-11-04 |
EP1467414A1 (en) | 2004-10-13 |
KR100991827B1 (ko) | 2010-11-10 |
JP2010050472A (ja) | 2010-03-04 |
CN1608326A (zh) | 2005-04-20 |
US20060198147A1 (en) | 2006-09-07 |
KR100991829B1 (ko) | 2010-11-04 |
KR20090115878A (ko) | 2009-11-09 |
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