WO2003066740A1 - Composition de resine - Google Patents
Composition de resine Download PDFInfo
- Publication number
- WO2003066740A1 WO2003066740A1 PCT/JP2003/001089 JP0301089W WO03066740A1 WO 2003066740 A1 WO2003066740 A1 WO 2003066740A1 JP 0301089 W JP0301089 W JP 0301089W WO 03066740 A1 WO03066740 A1 WO 03066740A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- resin
- expansion coefficient
- linear expansion
- temperature
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 176
- 229920005989 resin Polymers 0.000 claims abstract description 160
- 239000011347 resin Substances 0.000 claims abstract description 160
- 239000000463 material Substances 0.000 claims abstract description 53
- 230000009477 glass transition Effects 0.000 claims abstract description 41
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 38
- 150000002484 inorganic compounds Chemical class 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000011889 copper foil Substances 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 93
- 238000000034 method Methods 0.000 claims description 70
- 239000010410 layer Substances 0.000 claims description 54
- 230000003287 optical effect Effects 0.000 claims description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 32
- 238000010521 absorption reaction Methods 0.000 claims description 29
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 28
- 239000000203 mixture Substances 0.000 claims description 28
- 229920001955 polyphenylene ether Polymers 0.000 claims description 25
- 230000008859 change Effects 0.000 claims description 19
- 239000011229 interlayer Substances 0.000 claims description 17
- 230000006872 improvement Effects 0.000 claims description 13
- 238000005259 measurement Methods 0.000 claims description 13
- 239000000377 silicon dioxide Substances 0.000 claims description 13
- 239000009719 polyimide resin Substances 0.000 claims description 10
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 9
- 229920002530 polyetherether ketone Polymers 0.000 claims description 9
- 229920005990 polystyrene resin Polymers 0.000 claims description 8
- 239000013032 Hydrocarbon resin Substances 0.000 claims description 7
- 229920006270 hydrocarbon resin Polymers 0.000 claims description 7
- 229920006259 thermoplastic polyimide Polymers 0.000 claims description 7
- 239000004697 Polyetherimide Substances 0.000 claims description 6
- 125000002723 alicyclic group Chemical group 0.000 claims description 6
- 229920003055 poly(ester-imide) Polymers 0.000 claims description 6
- 229920001601 polyetherimide Polymers 0.000 claims description 6
- 238000002441 X-ray diffraction Methods 0.000 claims description 4
- 230000008961 swelling Effects 0.000 claims description 4
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims description 3
- 229910052901 montmorillonite Inorganic materials 0.000 claims description 3
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 3
- 230000004580 weight loss Effects 0.000 claims description 3
- 125000005210 alkyl ammonium group Chemical group 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 230000004048 modification Effects 0.000 claims 2
- 238000012986 modification Methods 0.000 claims 2
- 244000062645 predators Species 0.000 claims 1
- -1 diphenylene ether Chemical compound 0.000 description 42
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 41
- 230000000052 comparative effect Effects 0.000 description 33
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 26
- 239000000126 substance Substances 0.000 description 25
- 239000004594 Masterbatch (MB) Substances 0.000 description 24
- 238000004519 manufacturing process Methods 0.000 description 21
- 229910052757 nitrogen Inorganic materials 0.000 description 21
- 230000000704 physical effect Effects 0.000 description 21
- 229920001721 polyimide Polymers 0.000 description 20
- 239000013078 crystal Substances 0.000 description 19
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical class CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 18
- 230000000694 effects Effects 0.000 description 18
- 230000008569 process Effects 0.000 description 18
- 239000000243 solution Substances 0.000 description 18
- 238000004891 communication Methods 0.000 description 17
- 239000008188 pellet Substances 0.000 description 17
- 238000007385 chemical modification Methods 0.000 description 16
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- 125000000524 functional group Chemical group 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 15
- 239000002904 solvent Substances 0.000 description 15
- 238000002156 mixing Methods 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 13
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical class CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 12
- 229920001971 elastomer Polymers 0.000 description 12
- 239000004642 Polyimide Substances 0.000 description 11
- 239000004927 clay Substances 0.000 description 11
- 229910000831 Steel Inorganic materials 0.000 description 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 10
- 239000004088 foaming agent Substances 0.000 description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 10
- 239000010959 steel Substances 0.000 description 10
- 239000003063 flame retardant Substances 0.000 description 9
- 239000002861 polymer material Substances 0.000 description 9
- 238000005253 cladding Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 238000004898 kneading Methods 0.000 description 8
- 229920005575 poly(amic acid) Polymers 0.000 description 8
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 7
- 239000004744 fabric Substances 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 7
- 229920006122 polyamide resin Polymers 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000005060 rubber Substances 0.000 description 7
- 150000003863 ammonium salts Chemical class 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- 238000002485 combustion reaction Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 150000004760 silicates Chemical class 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 239000000806 elastomer Substances 0.000 description 5
- 239000012776 electronic material Substances 0.000 description 5
- 239000006260 foam Substances 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910000000 metal hydroxide Inorganic materials 0.000 description 5
- 150000004692 metal hydroxides Chemical class 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000005341 cation exchange Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 229920001519 homopolymer Polymers 0.000 description 4
- 230000003993 interaction Effects 0.000 description 4
- 150000007974 melamines Chemical class 0.000 description 4
- 150000004714 phosphonium salts Chemical group 0.000 description 4
- 230000000979 retarding effect Effects 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000006467 substitution reaction Methods 0.000 description 4
- 239000012756 surface treatment agent Substances 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 229920002725 thermoplastic elastomer Polymers 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 3
- KRUCABBEJFQKBD-UHFFFAOYSA-N 1-decyl-2,3-dimethylimidazol-3-ium Chemical compound CCCCCCCCCCN1C=C[N+](C)=C1C KRUCABBEJFQKBD-UHFFFAOYSA-N 0.000 description 3
- WCXGOVYROJJXHA-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WCXGOVYROJJXHA-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229920000459 Nitrile rubber Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000000129 anionic group Chemical group 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- 239000003093 cationic surfactant Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000012792 core layer Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000001114 myogenic effect Effects 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920006324 polyoxymethylene Polymers 0.000 description 3
- 229920001289 polyvinyl ether Polymers 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 2,3,6-Trimethylphenol Chemical compound CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 2
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 2
- KUKRLSJNTMLPPK-UHFFFAOYSA-N 4,7,7-trimethylbicyclo[2.2.1]hept-2-ene Chemical compound C1CC2(C)C=CC1C2(C)C KUKRLSJNTMLPPK-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- GLVKGYRREXOCIB-UHFFFAOYSA-N Bornylene Natural products CC1CCC(C(C)(C)C)C=C1 GLVKGYRREXOCIB-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical class CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical class CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- HEFNNWSXXWATRW-UHFFFAOYSA-N Ibuprofen Chemical compound CC(C)CC1=CC=C(C(C)C(O)=O)C=C1 HEFNNWSXXWATRW-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 229930195725 Mannitol Natural products 0.000 description 2
- XZABJQPBFQPEBU-UHFFFAOYSA-N NNC1=CC=C(OC2=CC(=CC=C2)OC2=CC=C(C=C2)NN)C=C1 Chemical compound NNC1=CC=C(OC2=CC(=CC=C2)OC2=CC=C(C=C2)NN)C=C1 XZABJQPBFQPEBU-UHFFFAOYSA-N 0.000 description 2
- 239000004693 Polybenzimidazole Substances 0.000 description 2
- 229920000265 Polyparaphenylene Polymers 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 125000003827 glycol group Chemical group 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000002648 laminated material Substances 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 239000000594 mannitol Substances 0.000 description 2
- 235000010355 mannitol Nutrition 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 238000005453 pelletization Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920002480 polybenzimidazole Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 238000004736 wide-angle X-ray diffraction Methods 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- VMJNTFXCTXAXTC-UHFFFAOYSA-N 2,2-difluoro-1,3-benzodioxole-5-carbonitrile Chemical group C1=C(C#N)C=C2OC(F)(F)OC2=C1 VMJNTFXCTXAXTC-UHFFFAOYSA-N 0.000 description 1
- SURCGQGDUADKBL-UHFFFAOYSA-N 2-(2-hydroxyethylamino)-5-nitrobenzo[de]isoquinoline-1,3-dione Chemical compound [O-][N+](=O)C1=CC(C(N(NCCO)C2=O)=O)=C3C2=CC=CC3=C1 SURCGQGDUADKBL-UHFFFAOYSA-N 0.000 description 1
- HSTOKWSFWGCZMH-UHFFFAOYSA-N 3,3'-diaminobenzidine Chemical compound C1=C(N)C(N)=CC=C1C1=CC=C(N)C(N)=C1 HSTOKWSFWGCZMH-UHFFFAOYSA-N 0.000 description 1
- DOUQGNSJQSNGDU-UHFFFAOYSA-N 3-[4-(3-aminophenoxy)-4-phenylcyclohexa-1,5-dien-1-yl]oxyaniline Chemical group NC=1C=C(OC2=CCC(C=C2)(C2=CC=CC=C2)OC2=CC(=CC=C2)N)C=CC1 DOUQGNSJQSNGDU-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- GLISOBUNKGBQCL-UHFFFAOYSA-N 3-[ethoxy(dimethyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(C)CCCN GLISOBUNKGBQCL-UHFFFAOYSA-N 0.000 description 1
- MCLXOMWIZZCOCA-UHFFFAOYSA-N 3-[methoxy(dimethyl)silyl]propan-1-amine Chemical compound CO[Si](C)(C)CCCN MCLXOMWIZZCOCA-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- YRIYXMAKROEVBQ-UHFFFAOYSA-N 5,5-dimethylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C)(C)CC1C=C2 YRIYXMAKROEVBQ-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- IPEMCIBPDYCJLO-UHFFFAOYSA-N 5-[(3,5,5,8,8-pentamethyl-6,7-dihydronaphthalen-2-yl)methyl]-n-(2,4,6-trimethoxyphenyl)furan-2-carboxamide Chemical compound COC1=CC(OC)=CC(OC)=C1NC(=O)C(O1)=CC=C1CC1=CC(C(CCC2(C)C)(C)C)=C2C=C1C IPEMCIBPDYCJLO-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- 239000004254 Ammonium phosphate Substances 0.000 description 1
- 101000878595 Arabidopsis thaliana Squalene synthase 1 Proteins 0.000 description 1
- HIBWGGKDGCBPTA-UHFFFAOYSA-N C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 Chemical compound C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 HIBWGGKDGCBPTA-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 235000019687 Lamb Nutrition 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- JREMHFSNYKJOBO-UHFFFAOYSA-L O.O.O[Ca]O Chemical compound O.O.O[Ca]O JREMHFSNYKJOBO-UHFFFAOYSA-L 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BCKXLBQYZLBQEK-KVVVOXFISA-M Sodium oleate Chemical compound [Na+].CCCCCCCC\C=C/CCCCCCCC([O-])=O BCKXLBQYZLBQEK-KVVVOXFISA-M 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric Acid Chemical compound [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000003172 aldehyde group Chemical group 0.000 description 1
- 125000001118 alkylidene group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- VCNTUJWBXWAWEJ-UHFFFAOYSA-J aluminum;sodium;dicarbonate Chemical compound [Na+].[Al+3].[O-]C([O-])=O.[O-]C([O-])=O VCNTUJWBXWAWEJ-UHFFFAOYSA-J 0.000 description 1
- HPTYUNKZVDYXLP-UHFFFAOYSA-N aluminum;trihydroxy(trihydroxysilyloxy)silane;hydrate Chemical compound O.[Al].[Al].O[Si](O)(O)O[Si](O)(O)O HPTYUNKZVDYXLP-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 1
- 235000019289 ammonium phosphates Nutrition 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 235000015278 beef Nutrition 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- XFWJKVMFIVXPKK-UHFFFAOYSA-N calcium;oxido(oxo)alumane Chemical compound [Ca+2].[O-][Al]=O.[O-][Al]=O XFWJKVMFIVXPKK-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229940125898 compound 5 Drugs 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 229910001647 dawsonite Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- NDMVEPBCXVVMEN-UHFFFAOYSA-N dibenzyl(dioctadecyl)azanium Chemical class C=1C=CC=CC=1C[N+](CCCCCCCCCCCCCCCCCC)(CCCCCCCCCCCCCCCCCC)CC1=CC=CC=C1 NDMVEPBCXVVMEN-UHFFFAOYSA-N 0.000 description 1
- FAMDLVPKRRDPQV-UHFFFAOYSA-N dibenzyl(dioctadecyl)phosphanium Chemical class C=1C=CC=CC=1C[P+](CCCCCCCCCCCCCCCCCC)(CCCCCCCCCCCCCCCCCC)CC1=CC=CC=C1 FAMDLVPKRRDPQV-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- OGQYPPBGSLZBEG-UHFFFAOYSA-N dimethyl(dioctadecyl)azanium Chemical class CCCCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCCCC OGQYPPBGSLZBEG-UHFFFAOYSA-N 0.000 description 1
- JKODDBUWSNWKJZ-UHFFFAOYSA-N dimethyl(dioctadecyl)phosphanium Chemical class CCCCCCCCCCCCCCCCCC[P+](C)(C)CCCCCCCCCCCCCCCCCC JKODDBUWSNWKJZ-UHFFFAOYSA-N 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- MIQYOHNNWUEBSP-UHFFFAOYSA-N dodecyl(trimethyl)phosphanium Chemical class CCCCCCCCCCCC[P+](C)(C)C MIQYOHNNWUEBSP-UHFFFAOYSA-N 0.000 description 1
- VICYBMUVWHJEFT-UHFFFAOYSA-N dodecyltrimethylammonium ion Chemical class CCCCCCCCCCCC[N+](C)(C)C VICYBMUVWHJEFT-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 229910052621 halloysite Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 229910052595 hematite Inorganic materials 0.000 description 1
- 239000011019 hematite Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000005606 hygroscopic expansion Effects 0.000 description 1
- 150000004693 imidazolium salts Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- LIKBJVNGSGBSGK-UHFFFAOYSA-N iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Fe+3].[Fe+3] LIKBJVNGSGBSGK-UHFFFAOYSA-N 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- AZFQCTBZOPUVOW-UHFFFAOYSA-N methyl(triphenyl)phosphanium Chemical class C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(C)C1=CC=CC=C1 AZFQCTBZOPUVOW-UHFFFAOYSA-N 0.000 description 1
- 229920013638 modified polyphenyl ether Polymers 0.000 description 1
- 230000003020 moisturizing effect Effects 0.000 description 1
- 210000004165 myocardium Anatomy 0.000 description 1
- DSWNRHCOGVRDOE-UHFFFAOYSA-N n,n-dimethylmethanimidamide Chemical compound CN(C)C=N DSWNRHCOGVRDOE-UHFFFAOYSA-N 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 229910000273 nontronite Inorganic materials 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- OPELHVMIPOFPPB-UHFFFAOYSA-N pentacyclo[8.6.0.03,8.011,13.014,16]hexadec-1-ene Chemical compound C1CCCC2CC(C3CC3C3C4C3)C4=CC21 OPELHVMIPOFPPB-UHFFFAOYSA-N 0.000 description 1
- RVGVIBJIGRMJQY-UHFFFAOYSA-N pentacyclo[8.6.0.03,8.011,13.014,16]hexadeca-1,3-diene Chemical compound C1CCC2CC(C3CC3C3C4C3)C4=CC2=C1 RVGVIBJIGRMJQY-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006124 polyolefin elastomer Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Chemical group 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- JWHOQZUREKYPBY-UHFFFAOYSA-N rubonic acid Natural products CC1(C)CCC2(CCC3(C)C(=CCC4C5(C)CCC(=O)C(C)(C)C5CC(=O)C34C)C2C1)C(=O)O JWHOQZUREKYPBY-UHFFFAOYSA-N 0.000 description 1
- 229910000275 saponite Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052604 silicate mineral Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910021647 smectite Inorganic materials 0.000 description 1
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- JNMRHUJNCSQMMB-UHFFFAOYSA-N sulfathiazole Chemical class C1=CC(N)=CC=C1S(=O)(=O)NC1=NC=CS1 JNMRHUJNCSQMMB-UHFFFAOYSA-N 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000002522 swelling effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000003760 tallow Substances 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920006230 thermoplastic polyester resin Polymers 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- IKANSXQHJXBNIN-UHFFFAOYSA-N trimethyl(octadecyl)phosphanium Chemical class CCCCCCCCCCCCCCCCCC[P+](C)(C)C IKANSXQHJXBNIN-UHFFFAOYSA-N 0.000 description 1
- ZNEOHLHCKGUAEB-UHFFFAOYSA-N trimethylphenylammonium Chemical compound C[N+](C)(C)C1=CC=CC=C1 ZNEOHLHCKGUAEB-UHFFFAOYSA-N 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020047012181A KR100704321B1 (ko) | 2002-02-06 | 2003-02-04 | 수지 조성물 |
EP03737473A EP1473328B1 (en) | 2002-02-06 | 2003-02-04 | Resin composition |
DE60336980T DE60336980D1 (de) | 2002-02-06 | 2003-02-04 | Harzzusammensetzung |
US10/503,491 US7754803B2 (en) | 2002-02-06 | 2003-02-04 | Resin composition |
CNB038072483A CN100372892C (zh) | 2002-02-06 | 2003-02-04 | 树脂组合物 |
CA002474693A CA2474693A1 (en) | 2002-02-06 | 2003-02-04 | Resin composition and products containing the same |
AU2003244465A AU2003244465A1 (en) | 2002-02-06 | 2003-02-04 | Resin composition |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-029783 | 2002-02-06 | ||
JP2002029783 | 2002-02-06 | ||
JP2002139090 | 2002-05-14 | ||
JP2002-139090 | 2002-05-14 | ||
JP2002158210 | 2002-05-30 | ||
JP2002-158210 | 2002-05-30 | ||
JP2002-287005 | 2002-09-30 | ||
JP2002287005 | 2002-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003066740A1 true WO2003066740A1 (fr) | 2003-08-14 |
Family
ID=27739272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/001089 WO2003066740A1 (fr) | 2002-02-06 | 2003-02-04 | Composition de resine |
Country Status (9)
Country | Link |
---|---|
US (1) | US7754803B2 (ja) |
EP (1) | EP1473328B1 (ja) |
KR (1) | KR100704321B1 (ja) |
CN (1) | CN100372892C (ja) |
AU (1) | AU2003244465A1 (ja) |
CA (1) | CA2474693A1 (ja) |
DE (1) | DE60336980D1 (ja) |
TW (1) | TWI303647B (ja) |
WO (1) | WO2003066740A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005054345A1 (ja) * | 2003-12-05 | 2005-06-16 | Sumitomo Bakelite Co., Ltd. | フィルム状配線基板の生産工程用テープ |
US7709085B2 (en) | 2003-12-08 | 2010-05-04 | Sekisui Chemical Co., Ltd. | Thermosetting resin composition, resin sheet and resin sheet for insulated substrate |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1894342A (zh) * | 2003-12-15 | 2007-01-10 | 积水化学工业株式会社 | 热塑性树脂组合物、基板用材料及基板用膜 |
SG119379A1 (en) * | 2004-08-06 | 2006-02-28 | Nippon Catalytic Chem Ind | Resin composition method of its composition and cured formulation |
US7888419B2 (en) * | 2005-09-02 | 2011-02-15 | Naturalnano, Inc. | Polymeric composite including nanoparticle filler |
JP4763496B2 (ja) * | 2006-03-30 | 2011-08-31 | 株式会社巴川製紙所 | 薄膜およびそれを用いた薄膜積層体 |
US8163830B2 (en) * | 2006-03-31 | 2012-04-24 | Intel Corporation | Nanoclays in polymer compositions, articles containing same, processes of making same, and systems containing same |
DE112007000823T5 (de) * | 2006-04-05 | 2009-02-05 | Japan Matex Co., Ltd., Sennan-shi | Graphit-Ton-Verbundmaterial, Verfahren zum Herstellen desselben, Dichtung oder Packung, welche das Verbundmaterial umfasst und eine Tondispersion, die für das Verbundmaterial verwendet wird |
US7915332B2 (en) | 2006-06-26 | 2011-03-29 | Sabic Innovative Plastics Ip B.V. | Compositions and methods for polymer composites |
US7928154B2 (en) | 2006-06-26 | 2011-04-19 | Sabic Innovative Plastics Ip B.V. | Methods of preparing polymer-organoclay composites and articles derived therefrom |
US20070299188A1 (en) * | 2006-06-26 | 2007-12-27 | Chan Kwok P | Compositions and methods for polymer composites |
WO2008002890A2 (en) * | 2006-06-26 | 2008-01-03 | Sabic Innovative Plastics Ip B.V. | Compositions and methods for polymer composites |
WO2008002869A2 (en) * | 2006-06-26 | 2008-01-03 | Sabic Innovative Plastics Ip B.V. | Compositions and methods for polymer composites |
US8545975B2 (en) | 2006-06-26 | 2013-10-01 | Sabic Innovative Plastics Ip B.V. | Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof |
US7928155B2 (en) | 2006-06-26 | 2011-04-19 | Sabic Innovative Plastics Ip B.V. | Compositions and methods for polymer composites |
WO2008002867A2 (en) * | 2006-06-26 | 2008-01-03 | Sabic Innovative Plastics Ip B.V. | Compositions and methods for polymer composites |
US9161440B2 (en) | 2006-06-26 | 2015-10-13 | Sabic Global Technologies B.V. | Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof |
US20070299187A1 (en) * | 2006-06-26 | 2007-12-27 | Chan Kwok P | Compositions and methods for polymer composites |
US8568867B2 (en) | 2006-06-26 | 2013-10-29 | Sabic Innovative Plastics Ip B.V. | Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof |
US8124678B2 (en) | 2006-11-27 | 2012-02-28 | Naturalnano, Inc. | Nanocomposite master batch composition and method of manufacture |
US8648132B2 (en) * | 2007-02-07 | 2014-02-11 | Naturalnano, Inc. | Nanocomposite method of manufacture |
US20080249221A1 (en) * | 2007-04-06 | 2008-10-09 | Naturalnano Research, Inc. | Polymeric adhesive including nanoparticle filler |
JP2008266455A (ja) * | 2007-04-20 | 2008-11-06 | Nitto Denko Corp | 層状珪酸塩を含む熱剥離型粘着シート及び該シートを使用する電子部品の製造方法 |
US20080286547A1 (en) * | 2007-05-18 | 2008-11-20 | Hubbard Michael A | Polypropylene films with enhanced moisture barrier properties, process for making and composition thereof |
US20090326133A1 (en) * | 2007-05-23 | 2009-12-31 | Naturalnano Research, Inc. | Fire and flame retardant polymer composites |
US20090092800A1 (en) * | 2007-10-08 | 2009-04-09 | Samsung Electronics Co., Ltd. | Composition for preparing modified polyimide/clay nanocomposites and preparation method of modified polymide/clay nanocomposites using the same |
JP2009161742A (ja) * | 2007-12-14 | 2009-07-23 | Sony Chemical & Information Device Corp | 光半導体パッケージ封止樹脂材料 |
WO2009078341A1 (ja) * | 2007-12-17 | 2009-06-25 | Hitachi Chemical Company, Ltd. | 光導波路及びその製造方法 |
EP2672003B1 (en) * | 2008-08-15 | 2016-07-27 | Otis Elevator Company | Elevator load bearing member with a polymer jacket having a flame retardant in the polymer jacket material |
TWI383950B (zh) | 2009-04-22 | 2013-02-01 | Ind Tech Res Inst | 奈米點狀材料的形成方法 |
CN102555323B (zh) * | 2010-12-31 | 2015-01-21 | 财团法人工业技术研究院 | 具有导电膜层的基板组合及其制造方法 |
WO2013030714A1 (en) * | 2011-08-29 | 2013-03-07 | Koninklijke Philips Electronics N.V. | A flexible lighting assembly, a luminaire, and a method of manufacturing a flexible layer |
CN105602247B (zh) | 2012-01-20 | 2018-05-08 | 旭化成株式会社 | 树脂组合物、层积体、多层印刷线路板和多层柔性线路板及其制造方法 |
WO2014172903A1 (en) * | 2013-04-26 | 2014-10-30 | The Procter & Gamble Company | A glossy container |
US10822499B2 (en) * | 2014-10-10 | 2020-11-03 | Sabic Global Technologies B.V. | Polyetherimide varnish compositions, methods of manufacture, and articles prepared therefrom |
WO2016080346A1 (ja) | 2014-11-18 | 2016-05-26 | 日立化成株式会社 | 半導体装置及びその製造方法、並びに可撓性樹脂層形成用樹脂組成物 |
WO2017090440A1 (ja) * | 2015-11-24 | 2017-06-01 | リンテック株式会社 | 回路部材接続用樹脂シート |
US11161966B2 (en) | 2016-01-18 | 2021-11-02 | The Procter And Gamble Company | Article with visual effects |
JP6631834B2 (ja) * | 2016-01-26 | 2020-01-15 | パナソニックIpマネジメント株式会社 | 金属張積層板、樹脂付き金属部材、及び配線板 |
CN106398115A (zh) * | 2016-08-27 | 2017-02-15 | 安徽天瞳智能科技有限公司 | 一种热稳定性好线路板基材用环氧树脂组合物 |
US10982060B2 (en) | 2018-02-13 | 2021-04-20 | International Business Machines Corporation | Glass-free dielectric layers for printed circuit boards |
CN108437593A (zh) * | 2018-04-16 | 2018-08-24 | 常州中英科技股份有限公司 | 一种低成本的热塑型聚烯烃基覆铜板 |
JP6966783B2 (ja) * | 2018-11-08 | 2021-11-17 | 北川工業株式会社 | 難燃性低硬度材 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1993004117A1 (en) * | 1991-08-12 | 1993-03-04 | Allied-Signal Inc. | Melt process formation of polymer nanocomposite of exfoliated layered material |
JPH11349709A (ja) * | 1998-04-09 | 1999-12-21 | Kanegafuchi Chem Ind Co Ltd | ポリイミド系フィルム |
WO2000034378A1 (en) | 1998-12-07 | 2000-06-15 | Eastman Chemical Company | Polymer/clay nanocomposite and process for making same |
CN1258690A (zh) | 2000-01-05 | 2000-07-05 | 浙江大学 | 超低热膨胀系数的聚酰亚胺/粘土纳米复合膜的制备方法 |
WO2001063984A1 (en) | 2000-02-22 | 2001-08-30 | Ppg Industries Ohio, Inc. | Electronic supports and methods and apparatus for forming apertures in electronic supports |
JP2001323167A (ja) * | 2000-05-11 | 2001-11-20 | Sumitomo Chem Co Ltd | 樹脂組成物及びそれからなるシート |
TW464668B (en) | 1997-07-17 | 2001-11-21 | Guang-Hua Wei | A precursor suitable for preparing polyimide and clay nanocomposite material |
JP2001329180A (ja) * | 2000-05-24 | 2001-11-27 | Natl Inst Of Advanced Industrial Science & Technology Meti | ヘテロ凝集体 |
WO2002016479A1 (fr) * | 2000-08-25 | 2002-02-28 | Sekisui Chemical Co., Ltd. | Produit moule en forme de feuille |
WO2002046312A1 (fr) * | 2000-12-08 | 2002-06-13 | Sekisui Chemical Co., Ltd. | Materiau de substrats isolants, stratifie pour carte a circuit imprime, feuille de cuivre avec resine, stratifie a revetement de cuivre, film polyimide, film pour tab, et preimpregne |
JP2002302583A (ja) * | 2001-04-06 | 2002-10-18 | Sekisui Chem Co Ltd | 粘弾性組成物及び制振材 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4877484A (en) | 1985-03-25 | 1989-10-31 | Armstrong World Industries, Inc. | Flocced 2:1 layered silicates and water-resistant articles made therefrom |
JPH0730253B2 (ja) | 1987-03-09 | 1995-04-05 | 株式会社豊田中央研究所 | 複合材料及びその製造方法 |
DE3806548C2 (de) * | 1987-03-04 | 1996-10-02 | Toyoda Chuo Kenkyusho Kk | Verbundmaterial und Verfahren zu dessen Herstellung |
JPH0778089B2 (ja) * | 1987-03-26 | 1995-08-23 | 株式会社豊田中央研究所 | 複合材料の製造方法 |
JP3237757B2 (ja) | 1989-12-28 | 2001-12-10 | 呉羽化学工業株式会社 | 電子部品封止用樹脂組成物および封止電子部品 |
US5548034A (en) | 1992-07-31 | 1996-08-20 | International Business Machines Corporation | Modified dicyanate ester resins having enhanced fracture toughness |
JP4090512B2 (ja) | 1997-04-08 | 2008-05-28 | 日本オプネクスト株式会社 | 光モジュール |
JP3741537B2 (ja) | 1998-05-18 | 2006-02-01 | 大日本インキ化学工業株式会社 | 顔料組成物および印刷インキ |
JP3739600B2 (ja) | 1999-07-06 | 2006-01-25 | 太陽インキ製造株式会社 | 液状熱硬化性樹脂組成物及びそれを用いたプリント配線板の永久穴埋め方法 |
US6610770B1 (en) * | 1999-10-04 | 2003-08-26 | Elementis Specialties, Inc. | Organoclay/polymer compositions with flame retardant properties |
WO2001081471A1 (fr) * | 2000-04-25 | 2001-11-01 | Asahi Kasei Kabushiki Kaisha | Composition de resine |
JP2002363387A (ja) | 2001-06-13 | 2002-12-18 | Nippon Paint Co Ltd | プリント配線基板穴埋め用樹脂組成物 |
JP2002363386A (ja) | 2001-06-13 | 2002-12-18 | Nippon Paint Co Ltd | プリント配線基板穴埋め用樹脂組成物 |
JP3854931B2 (ja) | 2002-02-06 | 2006-12-06 | 積水化学工業株式会社 | 樹脂組成物 |
-
2003
- 2003-02-04 CA CA002474693A patent/CA2474693A1/en not_active Abandoned
- 2003-02-04 US US10/503,491 patent/US7754803B2/en not_active Expired - Fee Related
- 2003-02-04 AU AU2003244465A patent/AU2003244465A1/en not_active Abandoned
- 2003-02-04 EP EP03737473A patent/EP1473328B1/en not_active Expired - Fee Related
- 2003-02-04 KR KR1020047012181A patent/KR100704321B1/ko not_active IP Right Cessation
- 2003-02-04 DE DE60336980T patent/DE60336980D1/de not_active Expired - Lifetime
- 2003-02-04 CN CNB038072483A patent/CN100372892C/zh not_active Expired - Fee Related
- 2003-02-04 WO PCT/JP2003/001089 patent/WO2003066740A1/ja active Application Filing
- 2003-02-06 TW TW092102374A patent/TWI303647B/zh not_active IP Right Cessation
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1993004117A1 (en) * | 1991-08-12 | 1993-03-04 | Allied-Signal Inc. | Melt process formation of polymer nanocomposite of exfoliated layered material |
TW464668B (en) | 1997-07-17 | 2001-11-21 | Guang-Hua Wei | A precursor suitable for preparing polyimide and clay nanocomposite material |
JPH11349709A (ja) * | 1998-04-09 | 1999-12-21 | Kanegafuchi Chem Ind Co Ltd | ポリイミド系フィルム |
WO2000034378A1 (en) | 1998-12-07 | 2000-06-15 | Eastman Chemical Company | Polymer/clay nanocomposite and process for making same |
CN1258690A (zh) | 2000-01-05 | 2000-07-05 | 浙江大学 | 超低热膨胀系数的聚酰亚胺/粘土纳米复合膜的制备方法 |
WO2001063984A1 (en) | 2000-02-22 | 2001-08-30 | Ppg Industries Ohio, Inc. | Electronic supports and methods and apparatus for forming apertures in electronic supports |
JP2001323167A (ja) * | 2000-05-11 | 2001-11-20 | Sumitomo Chem Co Ltd | 樹脂組成物及びそれからなるシート |
JP2001329180A (ja) * | 2000-05-24 | 2001-11-27 | Natl Inst Of Advanced Industrial Science & Technology Meti | ヘテロ凝集体 |
WO2002016479A1 (fr) * | 2000-08-25 | 2002-02-28 | Sekisui Chemical Co., Ltd. | Produit moule en forme de feuille |
WO2002046312A1 (fr) * | 2000-12-08 | 2002-06-13 | Sekisui Chemical Co., Ltd. | Materiau de substrats isolants, stratifie pour carte a circuit imprime, feuille de cuivre avec resine, stratifie a revetement de cuivre, film polyimide, film pour tab, et preimpregne |
JP2002302583A (ja) * | 2001-04-06 | 2002-10-18 | Sekisui Chem Co Ltd | 粘弾性組成物及び制振材 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1473328A4 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005054345A1 (ja) * | 2003-12-05 | 2005-06-16 | Sumitomo Bakelite Co., Ltd. | フィルム状配線基板の生産工程用テープ |
US7709085B2 (en) | 2003-12-08 | 2010-05-04 | Sekisui Chemical Co., Ltd. | Thermosetting resin composition, resin sheet and resin sheet for insulated substrate |
Also Published As
Publication number | Publication date |
---|---|
EP1473328A4 (en) | 2006-07-05 |
CN1643070A (zh) | 2005-07-20 |
US20050165151A1 (en) | 2005-07-28 |
KR20040077946A (ko) | 2004-09-07 |
CA2474693A1 (en) | 2003-08-14 |
CN100372892C (zh) | 2008-03-05 |
EP1473328B1 (en) | 2011-05-04 |
TW200302852A (en) | 2003-08-16 |
KR100704321B1 (ko) | 2007-04-10 |
TWI303647B (en) | 2008-12-01 |
EP1473328A1 (en) | 2004-11-03 |
DE60336980D1 (de) | 2011-06-16 |
AU2003244465A1 (en) | 2003-09-02 |
US7754803B2 (en) | 2010-07-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2003066740A1 (fr) | Composition de resine | |
KR100851799B1 (ko) | 절연 기판용 물질, 인쇄 보드, 적층물, 수지가 있는 구리호일, 구리를 씌운 적층물, 폴리이미드 필름, tab 용필름 및 프리프레그 | |
WO2003066741A1 (fr) | Composition de resine | |
JP3863771B2 (ja) | 絶縁基板用材料、プリント基板、積層板、樹脂付き銅箔、銅張積層板、ポリイミドフィルム、tab用フィルム及びプリプレグ | |
KR20120012782A (ko) | 열경화성 수지 조성물, 및 이를 이용한 프리프레그, 지지체 부착 절연 필름, 적층판 및 인쇄 배선판 | |
JP2007297597A (ja) | 有利な熱膨張特性を有するアラミド充填ポリイミド、およびこれに関連する方法 | |
CN111801376B (zh) | 树脂组合物、包含其的预浸料、包含其的层合板、包括其的涂覆有树脂的金属箔 | |
JP4167909B2 (ja) | 樹脂組成物 | |
JP2002069270A (ja) | 難燃性非ハロゲンエポキシ樹脂組成物及びその用途 | |
JP5010124B2 (ja) | 熱可塑性樹脂組成物、シート、樹脂付き銅箔、プリント基板及びプリプレグ | |
JP2003313435A (ja) | 絶縁基板用材料、積層板、プリント基板、樹脂付き銅箔、銅張積層板、ポリイミドフィルム、tab用フィルム及びプリプレグ | |
JP2004176031A (ja) | 樹脂組成物 | |
JP2005133055A (ja) | 樹脂組成物、基板用材料及び基板用フィルム | |
JP2012236920A (ja) | 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及びプリント配線板 | |
JP4220794B2 (ja) | 絶縁基板用材料、プリント基板、積層板、樹脂付き銅箔、銅張積層板、ポリイミドフィルム、tab用フィルム及びプリプレグ | |
JP2004244510A (ja) | 樹脂組成物、樹脂シート、配線基板及びコーティング剤 | |
JP2004051935A (ja) | 樹脂組成物 | |
JP2006312745A (ja) | 樹脂組成物 | |
JP4268456B2 (ja) | 樹脂基板材料 | |
JP3927516B2 (ja) | 樹脂シート | |
JP2003292802A (ja) | 樹脂ワニス組成物、樹脂シート及び樹脂被覆層 | |
JP4327406B2 (ja) | 樹脂組成物 | |
JP2004269853A (ja) | 樹脂組成物及び樹脂シート | |
JP2004051972A (ja) | 樹脂シート | |
JP2005171207A (ja) | 樹脂シート |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AU CA CN KR US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT SE SI SK TR |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2003244465 Country of ref document: AU Ref document number: 2474693 Country of ref document: CA |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2003737473 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10503491 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020047012181 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 20038072483 Country of ref document: CN |
|
WWP | Wipo information: published in national office |
Ref document number: 2003737473 Country of ref document: EP |