WO2003067711A3 - High speed differential signal edge card connector circuit board layouts - Google Patents

High speed differential signal edge card connector circuit board layouts Download PDF

Info

Publication number
WO2003067711A3
WO2003067711A3 PCT/US2002/032404 US0232404W WO03067711A3 WO 2003067711 A3 WO2003067711 A3 WO 2003067711A3 US 0232404 W US0232404 W US 0232404W WO 03067711 A3 WO03067711 A3 WO 03067711A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
differential signal
high speed
speed differential
card connector
Prior art date
Application number
PCT/US2002/032404
Other languages
French (fr)
Other versions
WO2003067711B1 (en
WO2003067711A2 (en
Inventor
James L Mcgrath
James P Capadona
Daniel B Mcgowan
Augusto P Panella
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Priority to AU2002365917A priority Critical patent/AU2002365917A1/en
Priority to EP02806761A priority patent/EP1470744A2/en
Priority to JP2003566942A priority patent/JP4021853B2/en
Publication of WO2003067711A2 publication Critical patent/WO2003067711A2/en
Publication of WO2003067711A3 publication Critical patent/WO2003067711A3/en
Publication of WO2003067711B1 publication Critical patent/WO2003067711B1/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581Shield structure
    • H01R13/6585Shielding material individually surrounding or interposed between mutually spaced contacts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/093Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/0949Pad close to a hole, not surrounding the hole
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969Apertured conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709Staggered pads, lands or terminals; Parallel conductors in different planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727Varying width along a single conductor; Conductors or pads having different widths

Abstract

Circuit boards to which such high speed differential signal connectors are mounted are disclosed and they have a particular pattern of termination traces, commonly taking the form of plated vias extending through the circuit board. These vias are arranged in a triangular pattern and the ground reference plane of the circuit board is provided with voids, one void being associated and encompassing a pair of the differential signal vias of a single terminal triplet. This reduces the capacitance of the signal vias and thereby increases the impedance of the circuit board within the launch area to lessen impedance discontinuities in the connector-circuit board interface.
PCT/US2002/032404 2001-10-10 2002-10-09 High speed differential signal edge card connector circuit board layouts WO2003067711A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2002365917A AU2002365917A1 (en) 2001-10-10 2002-10-09 High speed differential signal edge card connector circuit board layouts
EP02806761A EP1470744A2 (en) 2001-10-10 2002-10-09 High speed differential signal edge card connector circuit board layouts
JP2003566942A JP4021853B2 (en) 2001-10-10 2002-10-09 Circuit board layout of high-speed differential signal edge card connector

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32822301P 2001-10-10 2001-10-10
US60/328,223 2001-10-10

Publications (3)

Publication Number Publication Date
WO2003067711A2 WO2003067711A2 (en) 2003-08-14
WO2003067711A3 true WO2003067711A3 (en) 2004-02-05
WO2003067711B1 WO2003067711B1 (en) 2004-04-08

Family

ID=27734218

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/032404 WO2003067711A2 (en) 2001-10-10 2002-10-09 High speed differential signal edge card connector circuit board layouts

Country Status (6)

Country Link
US (1) US6767252B2 (en)
EP (1) EP1470744A2 (en)
JP (2) JP4021853B2 (en)
CN (2) CN1305354C (en)
AU (1) AU2002365917A1 (en)
WO (1) WO2003067711A2 (en)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7039417B2 (en) * 2003-09-25 2006-05-02 Lenovo Pte Ltd Apparatus, system, and method for mitigating access point data rate degradation
US7047628B2 (en) * 2003-01-31 2006-05-23 Brocade Communications Systems, Inc. Impedance matching of differential pair signal traces on printed wiring boards
JP4316908B2 (en) * 2003-03-20 2009-08-19 タイコエレクトロニクスアンプ株式会社 Electrical connector
JP4082604B2 (en) * 2003-04-09 2008-04-30 矢崎総業株式会社 connector
KR100574940B1 (en) * 2003-04-15 2006-04-28 삼성전자주식회사 Module including taps with different height and pitch
TW576505U (en) * 2003-05-07 2004-02-11 Hon Hai Prec Ind Co Ltd Testing device for slots of motherboards
US7513779B2 (en) 2003-06-04 2009-04-07 Hewlett-Packard Development Company, L.P. Connector having a bypass capacitor and method for reducing the impedance and length of a return-signal path
US7230506B2 (en) * 2003-10-09 2007-06-12 Synopsys, Inc. Crosstalk reduction for a system of differential line pairs
JP2005149770A (en) * 2003-11-11 2005-06-09 Japan Aviation Electronics Industry Ltd Connector
WO2005081596A2 (en) * 2004-02-13 2005-09-01 Molex Incorporated Preferential ground and via exit structures for printed circuit boards
US20050201065A1 (en) * 2004-02-13 2005-09-15 Regnier Kent E. Preferential ground and via exit structures for printed circuit boards
EP1841298A3 (en) * 2004-02-13 2008-05-07 Molex Incorporated Plated vias exit structure for printed circuit board
US20060046534A1 (en) * 2004-09-01 2006-03-02 Ati Technologies, Inc. Video expansion card
US7388158B2 (en) * 2004-09-17 2008-06-17 Terdyne, Inc. Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies
WO2006047425A2 (en) * 2004-10-25 2006-05-04 Intrado, Inc. System and method for unilateral verification of caller location information
EP1810552A1 (en) 2004-10-29 2007-07-25 Molex Incorporated Printed circuit board for high-speed electrical connectors
DE102004060782B3 (en) * 2004-12-17 2006-03-09 Harting Electronics Gmbh & Co. Kg Screened, high-pole printed circuit board connector for transferring signals from one printed circuit board to another, has metallic housing in which disk-shaped segments are arranged and electrical contacts arranged within segments
WO2006091595A1 (en) * 2005-02-22 2006-08-31 Molex Incorporated Differential signal connector with wafer-style construction
DE202005009919U1 (en) * 2005-06-24 2005-09-01 Harting Electronics Gmbh & Co. Kg Connector for use with electronic circuit board has series of contact modules that have screening contacts
CN100574552C (en) * 2005-08-12 2009-12-23 鸿富锦精密工业(深圳)有限公司 Printed circuit board (PCB)
JP4917784B2 (en) * 2005-09-26 2012-04-18 富士通コンポーネント株式会社 connector
US7262974B2 (en) * 2005-10-28 2007-08-28 Cisco Technology, Inc. Techniques for alleviating the need for DC blocking capacitors in high-speed differential signal pairs
US7347701B2 (en) * 2006-05-17 2008-03-25 Intel Corporation Differential I/O spline for inexpensive breakout and excellent signal quality
JP4963051B2 (en) * 2006-09-15 2012-06-27 株式会社ソニー・コンピュータエンタテインメント Signal transmission cable connector
US7609125B2 (en) * 2006-10-13 2009-10-27 Avago Technologies Enterprise IP (Singapore) Pte. Ltd. System, device and method for reducing cross-talk in differential signal conductor pairs
CN101282614A (en) * 2007-04-04 2008-10-08 鸿富锦精密工业(深圳)有限公司 Printed circuit board with improved via hole
JP5034095B2 (en) * 2007-07-13 2012-09-26 株式会社リコー Printed wiring board and electronic device
CN101384129B (en) * 2007-09-06 2010-06-09 鸿富锦精密工业(深圳)有限公司 Printed circuit board
JP4611362B2 (en) * 2007-11-07 2011-01-12 モレックス インコーポレイテド Differential signal connector having wafer type structure
US20090211785A1 (en) * 2008-02-21 2009-08-27 Lovskog J Thomas Printed circuit board with edge markings
CN102292875B (en) * 2008-02-26 2014-04-30 莫列斯公司 Impedance controlled electrical connector
JP2009224564A (en) * 2008-03-17 2009-10-01 Panasonic Corp Wiring board, electronic device using the same and incorrect connection detector therefor
JP2009266427A (en) * 2008-04-22 2009-11-12 Mitsubishi Electric Corp Substrate connection structure
US7892025B2 (en) * 2008-07-18 2011-02-22 Tyco Electronics Corporation Sealed connector assembly
US20110165783A1 (en) * 2008-09-30 2011-07-07 Mark S Tracy Dual Card Connector
US7708603B1 (en) * 2009-01-12 2010-05-04 Hon Hai Precision Ind. Co., Ltd. Electrical connector with improved crosstalk features
US9277649B2 (en) 2009-02-26 2016-03-01 Fci Americas Technology Llc Cross talk reduction for high-speed electrical connectors
US8232480B2 (en) * 2010-02-09 2012-07-31 Altera Corporation Interconnect pattern for high performance interfaces
US8083526B2 (en) * 2010-02-12 2011-12-27 Tyco Electronics Corporation Socket connector with ground shields between adjacent signal contacts
CN102300400A (en) * 2010-06-25 2011-12-28 智原科技股份有限公司 Circuit board structure with low capacitance
US8328565B2 (en) * 2010-07-23 2012-12-11 Tyco Electronics Corporation Transceiver assembly having an improved receptacle connector
US8747164B2 (en) * 2011-03-01 2014-06-10 Tyco Electronics Corporation Card edge connector
US9198280B2 (en) * 2011-09-07 2015-11-24 Samtec, Inc. Via structure for transmitting differential signals
JP2013172036A (en) * 2012-02-21 2013-09-02 Fujitsu Ltd Multilayer wiring board and electronic apparatus
CN105594066B (en) * 2013-08-07 2019-10-18 莫列斯有限公司 Connector
WO2015038149A1 (en) * 2013-09-13 2015-03-19 Intel Corporation Land grid array socket for electro-optical modules
US10153238B2 (en) * 2014-08-20 2018-12-11 Samsung Display Co., Ltd. Electrical channel including pattern voids
CA2974830C (en) 2015-02-06 2023-06-27 Masimo Corporation Fold flex circuit for lnop
EP3254339A1 (en) * 2015-02-06 2017-12-13 Masimo Corporation Connector assembly with pogo pins for use with medical sensors
CN106980158A (en) * 2016-01-19 2017-07-25 青岛海信宽带多媒体技术有限公司 A kind of optical module
US10231325B1 (en) 2016-12-20 2019-03-12 Juniper Networks, Inc. Placement of vias in printed circuit board circuits
CN206864652U (en) * 2017-04-24 2018-01-09 番禺得意精密电子工业有限公司 Arrangements of electric connection
CN109980400B (en) * 2017-12-28 2021-07-23 泰科电子(上海)有限公司 Connector with a locking member
CN109982504B (en) * 2017-12-28 2021-06-25 泰科电子(上海)有限公司 Circuit board and board card
US10477672B2 (en) 2018-01-29 2019-11-12 Hewlett Packard Enterprise Development Lp Single ended vias with shared voids
CN108966497B (en) * 2018-07-09 2020-10-20 苏州浪潮智能科技有限公司 Design method of layout at golden finger of board card and server board card
US10314162B1 (en) * 2018-07-13 2019-06-04 Mellanox Technologies, Ltd. Apparatuses and methods for improved network connections
JP6714892B1 (en) * 2018-09-04 2020-07-01 住友電気工業株式会社 Relay board, differential transmission wire with relay board, and cable with connector
CN109119787B (en) * 2018-09-18 2024-02-06 昆山全方位电子科技有限公司 Electric connector
CN109994852A (en) * 2019-03-26 2019-07-09 富士康(昆山)电脑接插件有限公司 Electronic card coupler
CN111769395B (en) * 2020-07-24 2022-02-01 东莞立讯技术有限公司 Terminal structure and electric connector
US20210153351A1 (en) * 2020-12-18 2021-05-20 Intel Corporation Hybrid pitch through hole connector
US20230345626A1 (en) * 2022-04-21 2023-10-26 Dell Products L.P. Resetting different pair skew of printed circuit board traces

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0158876A2 (en) * 1984-04-03 1985-10-23 SYSTEM KONTAKT Gesellschaft für elektronische Bauelemente mbH Multilayer printed circuit board produced in multilayer- or piling technique
US4993972A (en) * 1990-02-07 1991-02-19 Lin Yu C Multi-purpose PC board connector
US5359767A (en) * 1993-08-26 1994-11-01 International Business Machines Corporation Method of making multilayered circuit board
US5659951A (en) * 1996-04-15 1997-08-26 International Business Machines Corporation Method for making printed circuit board with flush surface lands
EP0859433A2 (en) * 1992-06-17 1998-08-19 Molex Incorporated Impedance and inductance control in electrical connectors and including reduced crosstalk
EP0869705A1 (en) * 1997-04-04 1998-10-07 Matsushita Electric Industrial Co., Ltd. Method of manufacturing multilayer printed wiring board
EP0959535A1 (en) * 1998-05-21 1999-11-24 Molex Incorporated High-speed edge connector
US6350134B1 (en) * 2000-07-25 2002-02-26 Tyco Electronics Corporation Electrical connector having triad contact groups arranged in an alternating inverted sequence
US6419502B1 (en) * 2001-03-14 2002-07-16 Hon Hai Precision Ind. Co., Ltd. Electrical connector assembly with improved contact arrangement
US6433286B1 (en) * 2000-09-29 2002-08-13 Intel Corporation Method of making higher impedance traces on a low impedance circuit board
EP1239552A1 (en) * 2001-03-05 2002-09-11 Japan Aviation Electronics Industry, Limited Connector having signal contacts and ground contacts in a specific arrangement

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3399372A (en) * 1966-04-15 1968-08-27 Ibm High density connector package
US3671813A (en) * 1970-12-10 1972-06-20 Texas Instruments Inc Panel board system and components thereof with connector and integrated circuit device
JPS5696474A (en) * 1979-12-28 1981-08-04 Sumitomo Electric Industries Connector
US4846734A (en) * 1988-01-22 1989-07-11 Burndy Corporation Vertical edge card connectors
US4869672A (en) * 1989-04-17 1989-09-26 Amp Incorporated Dual purpose card edge connector
EP0379176B1 (en) * 1989-01-19 1995-03-15 Burndy Corporation Card edge connector
US5051099A (en) * 1990-01-10 1991-09-24 Amp Incorporated High speed card edge connector
US5425658A (en) * 1993-10-29 1995-06-20 Bundy Corporation Card edge connector with reduced contact pitch
US5734559A (en) * 1996-03-29 1998-03-31 Intel Corporation Staggered bond finger design for fine pitch integrated circuit packages
US5904581A (en) * 1996-07-17 1999-05-18 Minnesota Mining And Manufacturing Company Electrical interconnection system and device
US5993259A (en) * 1997-02-07 1999-11-30 Teradyne, Inc. High speed, high density electrical connector
US5865631A (en) * 1997-04-10 1999-02-02 International Business Machines Corporation Method for reducing shorts on a printed circuit board edge connector
SG79261A1 (en) * 1998-07-22 2001-03-20 Molex Inc High performance card edge connector
US6590466B2 (en) * 1998-08-31 2003-07-08 Advanced Flexible Circuit Co., Ltd. Circuit board having shielding planes with varied void opening patterns for controlling the impedance and the transmission time of differential transmission lines
US6394822B1 (en) * 1998-11-24 2002-05-28 Teradyne, Inc. Electrical connector
JP3616874B2 (en) * 1999-07-16 2005-02-02 モレックス インコーポレーテッド Connector with adjusted impedance
US6280209B1 (en) * 1999-07-16 2001-08-28 Molex Incorporated Connector with improved performance characteristics
TW456619U (en) * 1999-07-16 2001-09-21 Molex Inc Impedance-tuned termination assembly and connectors incorporating same
US6454605B1 (en) * 1999-07-16 2002-09-24 Molex Incorporated Impedance-tuned termination assembly and connectors incorporating same
US6464537B1 (en) * 1999-12-29 2002-10-15 Berg Technology, Inc. High speed card edge connectors
US6234807B1 (en) * 2000-01-24 2001-05-22 International Business Machines Corporation Circuit board connector edge with straddle pattern tab design for impedance-controlled connections
US6452379B1 (en) * 2000-10-20 2002-09-17 Teradyne, Inc. Methods and apparatus for connecting to a signal launch
US6589061B1 (en) * 2002-03-07 2003-07-08 Hon Hai Precision Ind. Co., Ltd. Printed circuit board for straddle mount electrical connector and method for pasting the same

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0158876A2 (en) * 1984-04-03 1985-10-23 SYSTEM KONTAKT Gesellschaft für elektronische Bauelemente mbH Multilayer printed circuit board produced in multilayer- or piling technique
US4993972A (en) * 1990-02-07 1991-02-19 Lin Yu C Multi-purpose PC board connector
EP0859433A2 (en) * 1992-06-17 1998-08-19 Molex Incorporated Impedance and inductance control in electrical connectors and including reduced crosstalk
US5359767A (en) * 1993-08-26 1994-11-01 International Business Machines Corporation Method of making multilayered circuit board
US5659951A (en) * 1996-04-15 1997-08-26 International Business Machines Corporation Method for making printed circuit board with flush surface lands
EP0869705A1 (en) * 1997-04-04 1998-10-07 Matsushita Electric Industrial Co., Ltd. Method of manufacturing multilayer printed wiring board
EP0959535A1 (en) * 1998-05-21 1999-11-24 Molex Incorporated High-speed edge connector
US6350134B1 (en) * 2000-07-25 2002-02-26 Tyco Electronics Corporation Electrical connector having triad contact groups arranged in an alternating inverted sequence
US6433286B1 (en) * 2000-09-29 2002-08-13 Intel Corporation Method of making higher impedance traces on a low impedance circuit board
EP1239552A1 (en) * 2001-03-05 2002-09-11 Japan Aviation Electronics Industry, Limited Connector having signal contacts and ground contacts in a specific arrangement
US6419502B1 (en) * 2001-03-14 2002-07-16 Hon Hai Precision Ind. Co., Ltd. Electrical connector assembly with improved contact arrangement

Also Published As

Publication number Publication date
CN1305354C (en) 2007-03-14
CN1870853B (en) 2012-01-18
EP1470744A2 (en) 2004-10-27
JP2005517303A (en) 2005-06-09
AU2002365917A8 (en) 2003-09-02
CN1568640A (en) 2005-01-19
US6767252B2 (en) 2004-07-27
CN1870853A (en) 2006-11-29
AU2002365917A1 (en) 2003-09-02
WO2003067711B1 (en) 2004-04-08
JP2008022018A (en) 2008-01-31
US20030123236A1 (en) 2003-07-03
JP4567038B2 (en) 2010-10-20
JP4021853B2 (en) 2007-12-12
WO2003067711A2 (en) 2003-08-14

Similar Documents

Publication Publication Date Title
WO2003067711A3 (en) High speed differential signal edge card connector circuit board layouts
USRE48230E1 (en) High speed bypass cable assembly
WO2004062037A3 (en) Connector and printed circuit board for reducing cross-talk
US7540744B1 (en) Shared hole orthogonal footprint with backdrilled vias
WO2006110526A3 (en) Orthogonal backplane connector
WO2004025773A3 (en) Coaxial elastomeric connector system
DE60014385D1 (en) IMPEDANCE-MATCHED CONNECTOR
WO2005081595A3 (en) Preferential assymmetrical via positioning for printed circuit boards
US20130077268A1 (en) Circuit board with air hole
AU1930000A (en) Printed circuit board and method for fabricating such board
WO2005004288A3 (en) High speed, high density electrical connector
WO2005022699A3 (en) Board-to-board electrical connector assembly
US6024587A (en) High speed circuit interconnection apparatus
WO2002101883A3 (en) High-density, impedance tuned connector
EP1168481A3 (en) High frequency signal switching unit
EP1079466A3 (en) Board connection structure, electronic device with board connection structure and connector used therein
WO2001084575A8 (en) Printed circuit variable impedance transmission line antenna
WO2006058311A3 (en) High-frequency, high-signal-density, surface-mount technology footprint definitions
CN101567495A (en) Circuit board connection structure
US5309121A (en) Signal transfer line having a din connector
JP2002134868A (en) High-speed circuit board interconnection
WO2003017414A3 (en) Surface mounted broadside directional coupler
KR100945283B1 (en) Printed Circuit board
WO2003003757A3 (en) Splitter assembly with high density backplane board
US6137061A (en) Reduction of parasitic through hole via capacitance in multilayer printed circuit boards

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LU MC NL PT SE SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
B Later publication of amended claims

Effective date: 20040203

WWE Wipo information: entry into national phase

Ref document number: 2003566942

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 20028201612

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 2002806761

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2002806761

Country of ref document: EP