WO2003067711B1 - High speed differential signal edge card connector circuit board layouts - Google Patents

High speed differential signal edge card connector circuit board layouts

Info

Publication number
WO2003067711B1
WO2003067711B1 PCT/US2002/032404 US0232404W WO03067711B1 WO 2003067711 B1 WO2003067711 B1 WO 2003067711B1 US 0232404 W US0232404 W US 0232404W WO 03067711 B1 WO03067711 B1 WO 03067711B1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
differential signal
circuit board
connector
terminal
Prior art date
Application number
PCT/US2002/032404
Other languages
French (fr)
Other versions
WO2003067711A2 (en
WO2003067711A3 (en
Inventor
James L Mcgrath
James P Capadona
Daniel B Mcgowan
Augusto P Panella
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Priority to AU2002365917A priority Critical patent/AU2002365917A1/en
Priority to JP2003566942A priority patent/JP4021853B2/en
Priority to EP02806761A priority patent/EP1470744A2/en
Publication of WO2003067711A2 publication Critical patent/WO2003067711A2/en
Publication of WO2003067711A3 publication Critical patent/WO2003067711A3/en
Publication of WO2003067711B1 publication Critical patent/WO2003067711B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths

Abstract

Circuit boards to which such high speed differential signal connectors are mounted are disclosed and they have a particular pattern of termination traces, commonly taking the form of plated vias extending through the circuit board. These vias are arranged in a triangular pattern and the ground reference plane of the circuit board is provided with voids, one void being associated and encompassing a pair of the differential signal vias of a single terminal triplet. This reduces the capacitance of the signal vias and thereby increases the impedance of the circuit board within the launch area to lessen impedance discontinuities in the connector-circuit board interface.

Claims

AMENDED CLAIMS[Received by the International Bureau on 03 February 2004 (03.02.04): original claims 1-16 replaced by amended claims 1-29 (6 pages)]Claims:
1. A circuit board (90) having an area of controlled impedance defined in a mating area that mates with a differential signal edge card connector (62), the edge card connector (62) including a plurality of conductive pins (64,65) extending therefrom for mating with conductive traces on the circuit board (90), the connector conductive pins (64, 65) being arranged in distinct sets of three conductive pins, each set including a pair of differential signal conductive pins (64) and a ground conductive pin (65) associated with the pair of differential signal conductive pins (64), the three conductive pins (64, 65) cooperatively defining a triplet of mating pins, said circuit board (90) comprising a pair of differential signal conductive traces (93 a) and a single ground conductive trace (93b) associated therewith, the ground and differential signal conductive traces (93 a, 93b) cooperatively defining a triplet of conductive traces for mating with a triplet of mating pins of said connector (62), characterised in that: said differential signal conductive traces (93 a) are spaced apart from each other in a first direction and said single ground conductive trace (93b) of said trace triplet are spaced apart from said differential signal pair of conductive traces (93a) in a second direction, different from said first direction and angularly offset therefrom, such that said differential signal pair and ground conductive traces (93 a, 93b) lie in a triangular arrangement with said traces lying at respective vertices of an imaginary triangle.
2. The circuit board of claim 1, wherein said conductive traces (93 a, 93b) include conductive vias extending through said circuit board (90).
3. The circuit board of claim 1, further including a conductive reference plane (96) spaced apart from said conductive traces (93 a, 93b), said reference plane (96) including at least one opening (99) formed therein, the reference plane one opening (99) being aligned with said differential signal pair of conductive traces (93a, 93b) such said differential signal pair of conductive traces (93a, 93b) of said trace triplet are encompassed within a perimeter of said opening (96).
4. The circuit board of claim 3, wherein said reference plane opening (99) is a circular opening.
5. The circuit board of claim 3, wherein said reference plane opening (99) is a non-circular opening.
6. The circuit board of claim 3, wherein said ground conductive trace (93b) is connected to said reference plane (96).
7. The circuit board of claim 1 , further including a plurality of circuit board trace triplets (93 a, 93b) arranged longitudinally in a position on opposite sides of an imaginary center line C of the pattern of circuit board traces.
8. The circuit board of claim 7, further including a conductive reference plane (96) associated within said circuit board (90), the conductive reference plane (96) including a plurality of non-conductive openings (99) formed therein, each of the non-conductive openings (99) being associated and aligned with one of said circuit board triplets such that said differential signal pair of conductive traces (93a, 93b) lie within a perimeter of an associated one of said non-conductive openings (99).
9. The circuit board of claim 8, wherein each of said conductive traces (93a, 93b) includes a plated via extending through said circuit board (90), and said ground via contacts said reference plane (96).
10. The circuit board of claim 8, wherein each of said non-conductive openings (99) has a circular configuration.
11. A contact pad arrangement for an edge card (40) used in high speed signal applications, the edge card (40) supporting a plurality of distinct differential signal circuits and ground circuits, said edge card (40) further including an insertion edge (42) for inserting said edge card (40) into a connector, said circuits terminating in respective differential signal and ground contact pads (44), characterised in that: said contact pads (44) being arranged in triplets disposed proximate to said insertion edge (42), each of the contact pad triplets including a pair of differential signal contact pads (44a) and a single ground contact pad (44b), the ground contact pad (44b) of each contact pad triplet being interposed between said differential signal contact pads
19 (44a), said contact pads (44) of each of said contact pad triplet being spaced apart from each other a first distance (P) and said contact pad triplets being spaced apart from other of said contact pad triplets a second distance (2P) that is greater than said first distance (P), so as to reduce capacitive coupling between differential signal contact pads (44a) of adjacent contact pad triplets.
12. The edge card of claim 11, wherein for each contact pad triplets, said ground contact pad (44b) is spaced apart from said its two associated differential signal contact pads (44a) a third distance, the third distance extending at angle to said first and second distances.
13. A circuit board (90) having an area of controlled impedance defined in a mating area that mates with a differential signal edge card connector (62), the edge card connector (62) including a plurality of conductive pins (64, 65) extending therefrom for mating with conductive traces on the circuit board (90), the connector conductive pins (64, 65) being arranged in distinct sets of three conductive pins, each set including a pair of differential signal conductive pins (64) and a ground conductive pin (65) associated with the pair of differential signal conductive pins (64), the three conductive pins (64, 65) cooperatively defining a triplet of mating pins, said circuit board (90) further including a pair of differential signal conductive vias (93 a) and a single ground via (93b) formed in the circuit board (90), the ground and differential signal conductive vias (93a, 93b) cooperatively defining a triplet of conductive vias (93) for mating with a triplet of mating pins (64, 65) of said connector, characterised in that: said differential signal conductive vias (93 a) are spaced apart from each other in a first direction and said single ground conductive via (93b) of said via triplet are spaced apart from said differential signal pair of conductive vias (93 a) in a second direction that is different from said first direction, said circuit board (90) further including a conductive reference plane (96) spaced apart from a surface of said circuit board, the reference plane (96) including at least one non-conductive opening (99) formed therein, the reference plane one non-conductive opening (99) being aligned with said differential signal pair of conductive vias (93 a) such said differential signal pair of conductive vias (93 a) of said trace triplet are encompassed within a perimeter of said opening (99).
14. The circuit board of claim 13, wherein each of said vias (93) is plated with a conductive
20 material and extends through said circuit board (90), and said ground via (93b) contacts said reference plane (96).
15. The circuit board of claim 13, wherein said non-conductive opening (99) has a circular configuration.
16. The circuit board of claim 13, wherein said non-conductive opening (99) has a circular configuration.
17. An edge card connector (62, 70) for connecting differential circuits on an edge card to corresponding differential signal circuits on a circuit board, the edge card (30) having two opposing surfaces and an insertion edge (32) and a plurality of conductive traces disposed on at least one of the two opposing surfaces, the connector comprising: an insulative housing (63, 71) having a body portion extending between two opposed ends of the housing (63, 71), said housing (63, 71) including a card-receiving slot (66) extending longitudinally through the housing body portion, the card-receiving slot (66) being sized to receive at least the edge card insertion edge (32), and a plurality of conductive terminals (64, 65) supported by said housing body portion, the terminals (64, 65) having contact portions (57) for contacting the edge card conductive traces when said edge card (30) is inserted into said card-receiving slot (66), the terminals (64, 65) being arranged in said housing (62, 71) in distinct triplets of terminals, characterised in that: each of the terminal triplets includes a pair of differential signal terminals and an associated ground terminal, said terminals of said terminal triplets being spaced apart from each other at a given pitch (P) and said terminal triplets being spaced apart from each other a distance greater than the pitch (P) between individual terminals of said terminal triplets, so as to reduce capacitive coupling between differential signal terminals of adjacent terminal triplets.
18. The connector of claim 17, wherein said terminal triplets are spaced apart from each other a distance (2P) that is a multiple of said pitch (P).
19. The connector of claiml7, wherein said terminal triplets are spaced apart from each
21 other a distance (2P) that is approximately equal to twice said pitch (P).
20. The connector of claim 17, wherein for each of said terminal triplets, said associated ground terminal is interposed between said pair of differential signal terminals.
21. The connector of claim 17, wherein each of said temiinals (64, 65) includes a tail portion (51) for terminating to a circuit board, a contact portion (57) for contacting an opposing conductive trace of said edge card (30) and a body portion (50) interconnecting the terminal contact and tail portions (51, 57) together.
22. The connector of claim 21, wherein said differential signal terminal tail portions are spaced apart from each other in a longitudinal direction and are further spaced apart from said associated ground tenninal tail portion in a transverse direction.
23. The connector of claim 22, wherein an imaginary line drawn through said associated ground terminal tail portion transversely to said card-receiving slot passes between said differential signal terminal tail portions.
24. The connector of claim 17, wherein said housing body portion includes a plurality of terminal-receiving cavities (69, 72) and each of said terminals (64, 65) is received within a single cavity.
25. The connector of claim 24, wherein said housing body portion includes at least one empty terminal-receiving cavity (N) interposed between each of said terminal triplets.
26. The connector of claim 24, wherein the terminal-receiving cavities (72) are arranged in distinct sets of three in said housing body portion, and each set of three cavities (72) are spaced apart from each other a distance greater than any distance separating two adjacent terminals in any of said terminal sets.
27. The connector of claim 24, wherein said terminal-receiving cavities (69, 72) are arranged on both sides of said card-receiving slot (66).
22
28. The connector of claim 17, wherem said terminal triplets are arranged on both sides of said card-receiving slot (66).
29. The connector of claim 21 , wherein said terminal contact portion of said ground terminal of each terminal triplet is disposed at an elevation different than the differential signal contact portions of said terminal triplet.
23
PCT/US2002/032404 2001-10-10 2002-10-09 High speed differential signal edge card connector circuit board layouts WO2003067711A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2002365917A AU2002365917A1 (en) 2001-10-10 2002-10-09 High speed differential signal edge card connector circuit board layouts
JP2003566942A JP4021853B2 (en) 2001-10-10 2002-10-09 Circuit board layout of high-speed differential signal edge card connector
EP02806761A EP1470744A2 (en) 2001-10-10 2002-10-09 High speed differential signal edge card connector circuit board layouts

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32822301P 2001-10-10 2001-10-10
US60/328,223 2001-10-10

Publications (3)

Publication Number Publication Date
WO2003067711A2 WO2003067711A2 (en) 2003-08-14
WO2003067711A3 WO2003067711A3 (en) 2004-02-05
WO2003067711B1 true WO2003067711B1 (en) 2004-04-08

Family

ID=27734218

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/032404 WO2003067711A2 (en) 2001-10-10 2002-10-09 High speed differential signal edge card connector circuit board layouts

Country Status (6)

Country Link
US (1) US6767252B2 (en)
EP (1) EP1470744A2 (en)
JP (2) JP4021853B2 (en)
CN (2) CN1305354C (en)
AU (1) AU2002365917A1 (en)
WO (1) WO2003067711A2 (en)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7039417B2 (en) * 2003-09-25 2006-05-02 Lenovo Pte Ltd Apparatus, system, and method for mitigating access point data rate degradation
US7047628B2 (en) * 2003-01-31 2006-05-23 Brocade Communications Systems, Inc. Impedance matching of differential pair signal traces on printed wiring boards
JP4316908B2 (en) * 2003-03-20 2009-08-19 タイコエレクトロニクスアンプ株式会社 Electrical connector
JP4082604B2 (en) * 2003-04-09 2008-04-30 矢崎総業株式会社 connector
KR100574940B1 (en) * 2003-04-15 2006-04-28 삼성전자주식회사 Module including taps with different height and pitch
TW576505U (en) * 2003-05-07 2004-02-11 Hon Hai Prec Ind Co Ltd Testing device for slots of motherboards
US7513779B2 (en) * 2003-06-04 2009-04-07 Hewlett-Packard Development Company, L.P. Connector having a bypass capacitor and method for reducing the impedance and length of a return-signal path
US7230506B2 (en) * 2003-10-09 2007-06-12 Synopsys, Inc. Crosstalk reduction for a system of differential line pairs
JP2005149770A (en) * 2003-11-11 2005-06-09 Japan Aviation Electronics Industry Ltd Connector
EP1841298A3 (en) * 2004-02-13 2008-05-07 Molex Incorporated Plated vias exit structure for printed circuit board
US20050201065A1 (en) * 2004-02-13 2005-09-15 Regnier Kent E. Preferential ground and via exit structures for printed circuit boards
EP1721496A2 (en) * 2004-02-13 2006-11-15 Molex Incorporated Preferential ground and via exit structures for printed circuit boards
US20060046534A1 (en) * 2004-09-01 2006-03-02 Ati Technologies, Inc. Video expansion card
US7388158B2 (en) * 2004-09-17 2008-06-17 Terdyne, Inc. Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies
WO2006047425A2 (en) * 2004-10-25 2006-05-04 Intrado, Inc. System and method for unilateral verification of caller location information
EP1810552A1 (en) 2004-10-29 2007-07-25 Molex Incorporated Printed circuit board for high-speed electrical connectors
DE102004060782B3 (en) * 2004-12-17 2006-03-09 Harting Electronics Gmbh & Co. Kg Screened, high-pole printed circuit board connector for transferring signals from one printed circuit board to another, has metallic housing in which disk-shaped segments are arranged and electrical contacts arranged within segments
WO2006091595A1 (en) * 2005-02-22 2006-08-31 Molex Incorporated Differential signal connector with wafer-style construction
DE202005009919U1 (en) * 2005-06-24 2005-09-01 Harting Electronics Gmbh & Co. Kg Connector for use with electronic circuit board has series of contact modules that have screening contacts
CN100574552C (en) * 2005-08-12 2009-12-23 鸿富锦精密工业（深圳）有限公司 Printed circuit board (PCB)
JP4917784B2 (en) * 2005-09-26 2012-04-18 富士通コンポーネント株式会社 connector
US7262974B2 (en) * 2005-10-28 2007-08-28 Cisco Technology, Inc. Techniques for alleviating the need for DC blocking capacitors in high-speed differential signal pairs
US7347701B2 (en) * 2006-05-17 2008-03-25 Intel Corporation Differential I/O spline for inexpensive breakout and excellent signal quality
JP4963051B2 (en) * 2006-09-15 2012-06-27 株式会社ソニー・コンピュータエンタテインメント Signal transmission cable connector
US7609125B2 (en) * 2006-10-13 2009-10-27 Avago Technologies Enterprise IP (Singapore) Pte. Ltd. System, device and method for reducing cross-talk in differential signal conductor pairs
CN101282614A (en) * 2007-04-04 2008-10-08 鸿富锦精密工业（深圳）有限公司 Printed circuit board with improved via hole
JP5034095B2 (en) * 2007-07-13 2012-09-26 株式会社リコー Printed wiring board and electronic device
CN101384129B (en) * 2007-09-06 2010-06-09 鸿富锦精密工业（深圳）有限公司 Printed circuit board
JP4611362B2 (en) * 2007-11-07 2011-01-12 モレックス インコーポレイテド Differential signal connector having wafer type structure
US20090211785A1 (en) * 2008-02-21 2009-08-27 Lovskog J Thomas Printed circuit board with edge markings
CN102292875B (en) * 2008-02-26 2014-04-30 莫列斯公司 Impedance controlled electrical connector
JP2009224564A (en) * 2008-03-17 2009-10-01 Panasonic Corp Wiring board, electronic device using the same and incorrect connection detector therefor
JP2009266427A (en) * 2008-04-22 2009-11-12 Mitsubishi Electric Corp Substrate connection structure
US7892025B2 (en) * 2008-07-18 2011-02-22 Tyco Electronics Corporation Sealed connector assembly
WO2010039125A1 (en) * 2008-09-30 2010-04-08 Hewlett-Packard Development Company, L.P. Dual card connector
US7708603B1 (en) * 2009-01-12 2010-05-04 Hon Hai Precision Ind. Co., Ltd. Electrical connector with improved crosstalk features
US9277649B2 (en) * 2009-02-26 2016-03-01 Fci Americas Technology Llc Cross talk reduction for high-speed electrical connectors
US8232480B2 (en) * 2010-02-09 2012-07-31 Altera Corporation Interconnect pattern for high performance interfaces
US8083526B2 (en) * 2010-02-12 2011-12-27 Tyco Electronics Corporation Socket connector with ground shields between adjacent signal contacts
CN102300400A (en) * 2010-06-25 2011-12-28 智原科技股份有限公司 Circuit board structure with low capacitance
US8328565B2 (en) * 2010-07-23 2012-12-11 Tyco Electronics Corporation Transceiver assembly having an improved receptacle connector
US8747164B2 (en) * 2011-03-01 2014-06-10 Tyco Electronics Corporation Card edge connector
CN103828496B (en) * 2011-09-07 2017-04-26 申泰公司 Via structure for transmitting differential signals
JP2013172036A (en) * 2012-02-21 2013-09-02 Fujitsu Ltd Multilayer wiring board and electronic apparatus
TWI558008B (en) * 2013-08-07 2016-11-11 Molex Inc Connector
CN105492949B (en) * 2013-09-13 2018-05-29 英特尔公司 Fall formula grid array socket for electro-optical module
US10153238B2 (en) * 2014-08-20 2018-12-11 Samsung Display Co., Ltd. Electrical channel including pattern voids
KR20230170116A (en) 2015-02-06 2023-12-18 마시모 코오퍼레이션 Fold flex circuit for optical probes
US10205291B2 (en) * 2015-02-06 2019-02-12 Masimo Corporation Pogo pin connector
CN106980158A (en) 2016-01-19 2017-07-25 青岛海信宽带多媒体技术有限公司 A kind of optical module
US10231325B1 (en) 2016-12-20 2019-03-12 Juniper Networks, Inc. Placement of vias in printed circuit board circuits
CN206864652U (en) * 2017-04-24 2018-01-09 番禺得意精密电子工业有限公司 Arrangements of electric connection
CN109980400B (en) * 2017-12-28 2021-07-23 泰科电子(上海)有限公司 Connector with a locking member
CN109982504B (en) * 2017-12-28 2021-06-25 泰科电子(上海)有限公司 Circuit board and board card
US10477672B2 (en) 2018-01-29 2019-11-12 Hewlett Packard Enterprise Development Lp Single ended vias with shared voids
CN108966497B (en) * 2018-07-09 2020-10-20 苏州浪潮智能科技有限公司 Design method of layout at golden finger of board card and server board card
US10314162B1 (en) * 2018-07-13 2019-06-04 Mellanox Technologies, Ltd. Apparatuses and methods for improved network connections
WO2020049890A1 (en) * 2018-09-04 2020-03-12 住友電気工業株式会社 Relay substrate, differential transmission electric-cable with relay substrate, and connector-equipped cable
CN109119787B (en) * 2018-09-18 2024-02-06 昆山全方位电子科技有限公司 Electric connector
CN109994852A (en) * 2019-03-26 2019-07-09 富士康(昆山)电脑接插件有限公司 Electronic card coupler
CN111769395B (en) * 2020-07-24 2022-02-01 东莞立讯技术有限公司 Terminal structure and electric connector
US20210153351A1 (en) * 2020-12-18 2021-05-20 Intel Corporation Hybrid pitch through hole connector
US20230345626A1 (en) * 2022-04-21 2023-10-26 Dell Products L.P. Resetting different pair skew of printed circuit board traces

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3399372A (en) 1966-04-15 1968-08-27 Ibm High density connector package
US3671813A (en) 1970-12-10 1972-06-20 Texas Instruments Inc Panel board system and components thereof with connector and integrated circuit device
JPS5696474A (en) 1979-12-28 1981-08-04 Sumitomo Electric Industries Connector
DE3412290A1 (en) 1984-04-03 1985-10-03 System Kontakt Gesellschaft für elektronische Bauelemente mbH, 7107 Bad Friedrichshall MULTI-LAYER PCB IN MULTILAYER OR STACK TECHNOLOGY
US4846734A (en) 1988-01-22 1989-07-11 Burndy Corporation Vertical edge card connectors
US4869672A (en) 1989-04-17 1989-09-26 Amp Incorporated Dual purpose card edge connector
EP0379176B1 (en) 1989-01-19 1995-03-15 Burndy Corporation Card edge connector
US5051099A (en) * 1990-01-10 1991-09-24 Amp Incorporated High speed card edge connector
US4993972A (en) * 1990-02-07 1991-02-19 Lin Yu C Multi-purpose PC board connector
US5259768A (en) 1992-03-24 1993-11-09 Molex Incorporated Impedance and inductance control in electrical connectors and including reduced crosstalk
US5359767A (en) * 1993-08-26 1994-11-01 International Business Machines Corporation Method of making multilayered circuit board
US5425658A (en) 1993-10-29 1995-06-20 Bundy Corporation Card edge connector with reduced contact pitch
US5734559A (en) 1996-03-29 1998-03-31 Intel Corporation Staggered bond finger design for fine pitch integrated circuit packages
US5659951A (en) * 1996-04-15 1997-08-26 International Business Machines Corporation Method for making printed circuit board with flush surface lands
US6135781A (en) 1996-07-17 2000-10-24 Minnesota Mining And Manufacturing Company Electrical interconnection system and device
US5993259A (en) 1997-02-07 1999-11-30 Teradyne, Inc. High speed, high density electrical connector
JP3324437B2 (en) 1997-04-04 2002-09-17 松下電器産業株式会社 Manufacturing method of multilayer printed wiring board
US5865631A (en) 1997-04-10 1999-02-02 International Business Machines Corporation Method for reducing shorts on a printed circuit board edge connector
US6099328A (en) 1998-05-21 2000-08-08 Molex Incorporated High-speed edge connector
SG79261A1 (en) * 1998-07-22 2001-03-20 Molex Inc High performance card edge connector
US6372996B2 (en) 1998-08-31 2002-04-16 Advanced Flexible Circuits Co., Ltd. Circuit board having shielding planes with varied void opening patterns for controlling the impedance and the transmission time
US6394822B1 (en) 1998-11-24 2002-05-28 Teradyne, Inc. Electrical connector
US6454605B1 (en) 1999-07-16 2002-09-24 Molex Incorporated Impedance-tuned termination assembly and connectors incorporating same
TW456619U (en) 1999-07-16 2001-09-21 Molex Inc Impedance-tuned termination assembly and connectors incorporating same
DE60014385T2 (en) * 1999-07-16 2006-02-23 Molex Inc., Lisle IMPEDANCE-CONNECTED CONNECTOR
US6280209B1 (en) 1999-07-16 2001-08-28 Molex Incorporated Connector with improved performance characteristics
US6464537B1 (en) * 1999-12-29 2002-10-15 Berg Technology, Inc. High speed card edge connectors
US6234807B1 (en) 2000-01-24 2001-05-22 International Business Machines Corporation Circuit board connector edge with straddle pattern tab design for impedance-controlled connections
US6350134B1 (en) * 2000-07-25 2002-02-26 Tyco Electronics Corporation Electrical connector having triad contact groups arranged in an alternating inverted sequence
US6433286B1 (en) 2000-09-29 2002-08-13 Intel Corporation Method of making higher impedance traces on a low impedance circuit board
US6452379B1 (en) 2000-10-20 2002-09-17 Teradyne, Inc. Methods and apparatus for connecting to a signal launch
JP3564555B2 (en) * 2001-03-05 2004-09-15 日本航空電子工業株式会社 High-speed differential signal transmission connector
US6419502B1 (en) * 2001-03-14 2002-07-16 Hon Hai Precision Ind. Co., Ltd. Electrical connector assembly with improved contact arrangement
US6589061B1 (en) 2002-03-07 2003-07-08 Hon Hai Precision Ind. Co., Ltd. Printed circuit board for straddle mount electrical connector and method for pasting the same

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WO2003067711A2 (en) 2003-08-14
AU2002365917A1 (en) 2003-09-02
JP4021853B2 (en) 2007-12-12
US6767252B2 (en) 2004-07-27
CN1870853B (en) 2012-01-18
CN1870853A (en) 2006-11-29
CN1305354C (en) 2007-03-14
CN1568640A (en) 2005-01-19
JP2008022018A (en) 2008-01-31
JP4567038B2 (en) 2010-10-20
WO2003067711A3 (en) 2004-02-05
AU2002365917A8 (en) 2003-09-02
EP1470744A2 (en) 2004-10-27
US20030123236A1 (en) 2003-07-03

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