WO2003068671A3 - Verfahren zur herstellung einer sensor- oder aktuatoranordnung sowie sensor- oder aktuatoranordnung - Google Patents

Verfahren zur herstellung einer sensor- oder aktuatoranordnung sowie sensor- oder aktuatoranordnung Download PDF

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Publication number
WO2003068671A3
WO2003068671A3 PCT/EP2003/001222 EP0301222W WO03068671A3 WO 2003068671 A3 WO2003068671 A3 WO 2003068671A3 EP 0301222 W EP0301222 W EP 0301222W WO 03068671 A3 WO03068671 A3 WO 03068671A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
actuator arrangement
actuator
chip
producing
Prior art date
Application number
PCT/EP2003/001222
Other languages
English (en)
French (fr)
Other versions
WO2003068671A2 (de
Inventor
Markus Rogalla
Ingo Freund
Mirko Lehmann
Original Assignee
Micronas Gmbh
Markus Rogalla
Ingo Freund
Mirko Lehmann
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronas Gmbh, Markus Rogalla, Ingo Freund, Mirko Lehmann filed Critical Micronas Gmbh
Priority to AU2003208812A priority Critical patent/AU2003208812A1/en
Priority to IL16354503A priority patent/IL163545A0/xx
Priority to JP2003567815A priority patent/JP2005518525A/ja
Priority to US10/504,738 priority patent/US7592195B2/en
Priority to EP03706452A priority patent/EP1474357A2/de
Priority to KR10-2004-7012681A priority patent/KR20040089636A/ko
Publication of WO2003068671A2 publication Critical patent/WO2003068671A2/de
Publication of WO2003068671A3 publication Critical patent/WO2003068671A3/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)

Abstract

Um bei einer Sensor- oder Aktuatoranordnung, bei der auf oder in einem Chip (C) mindestens ein Sensor (S1) oder ein Aktuator vorgesehen ist, einerseits sowohl den Chip (C) als auch dessen elektrische Kontakte sicher vor der Umwelt zu schützen, ande­rerseits aber den Sensor (Sl) oder Aktuator für Messungen von Parametern einer Flüssigkeit oder eines Gases einsetzen zu können, ist der Chip (C) mit dem Sensor (S1) mit einer Schutzabdeckung (A1) bedeckt. Es ist mindestens ein Kanal (K1) zu einem Sensor (S1) oder Aktuator vorgesehen, der zumindest teilweise lateral zur Oberfläche der Chips (C) geführt ist. Vorzugsweise mündet der Kanal (K1) von einer Seite der Anordnung zum Sensor (S1).
PCT/EP2003/001222 2002-02-16 2003-02-07 Verfahren zur herstellung einer sensor- oder aktuatoranordnung sowie sensor- oder aktuatoranordnung WO2003068671A2 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AU2003208812A AU2003208812A1 (en) 2002-02-16 2003-02-07 Method for producing a sensor or actuator arrangement, and corresponding sensor or actuator arrangement
IL16354503A IL163545A0 (en) 2002-02-16 2003-02-07 Method for producing a sensor or actuator arrangement, and corresponding sensor or actuator arrangement
JP2003567815A JP2005518525A (ja) 2002-02-16 2003-02-07 センサーまたはアクチュエータ配列の製造方法ならびにセンサーまたはアクチュエータ配列
US10/504,738 US7592195B2 (en) 2002-02-16 2003-02-07 Method for producing a sensor or actuator arrangement, and corresponding sensor or actuator arrangement
EP03706452A EP1474357A2 (de) 2002-02-16 2003-02-07 Verfahren zur herstellung einer sensor-oder aktuatoranordnung sowie sensor - oder aktuatoranordnung
KR10-2004-7012681A KR20040089636A (ko) 2002-02-16 2003-02-07 센서 또는 액츄에이터 장치의 제조 방법과 센서 또는액츄에이터 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10206464A DE10206464A1 (de) 2002-02-16 2002-02-16 Verfahren zur Herstellung einer Sensor- oder Aktuatoranordnung sowie Sensor- oder Aktuatoranordnung
DE10206464.4 2002-02-16

Publications (2)

Publication Number Publication Date
WO2003068671A2 WO2003068671A2 (de) 2003-08-21
WO2003068671A3 true WO2003068671A3 (de) 2003-12-24

Family

ID=27635024

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2003/001222 WO2003068671A2 (de) 2002-02-16 2003-02-07 Verfahren zur herstellung einer sensor- oder aktuatoranordnung sowie sensor- oder aktuatoranordnung

Country Status (8)

Country Link
US (1) US7592195B2 (de)
EP (1) EP1474357A2 (de)
JP (1) JP2005518525A (de)
KR (1) KR20040089636A (de)
AU (1) AU2003208812A1 (de)
DE (1) DE10206464A1 (de)
IL (1) IL163545A0 (de)
WO (1) WO2003068671A2 (de)

Families Citing this family (10)

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DE102005026528B4 (de) * 2005-06-08 2019-08-22 Infineon Technologies Ag Halbleiterbauteil mit mindestens einem Medienkanal und Verfahren zur Herstellung von Halbleiterbauteilen jeweils mit mindestens einem Medienkanal
EP1772731A3 (de) * 2005-10-07 2007-08-08 Micronas GmbH Integrierte Sensoranordnung
DE102007057903B4 (de) * 2007-11-29 2010-07-08 Continental Automotive Gmbh Sensormodul und Verfahren zur Herstellung des Sensormoduls
NL2003340C2 (en) * 2009-08-10 2011-02-14 Univ Delft Tech Method of manufacturing a micro unit and micro unit for use in a microscope.
JP5969950B2 (ja) * 2012-04-20 2016-08-17 富士フイルム株式会社 放射線画像検出装置及び放射線撮影システム
US9324984B2 (en) * 2013-02-01 2016-04-26 GM Global Technology Operations LLC Direct formation of a separator with a protective edge on an electrode
KR101707002B1 (ko) * 2015-03-04 2017-02-15 숭실대학교산학협력단 복합 감지형 센서 및 제조방법
US10056590B2 (en) 2016-08-31 2018-08-21 GM Global Technology Operations LLC Methods of making separators for lithium ion batteries
EP3301072B1 (de) * 2016-09-30 2024-02-21 Sciosense B.V. Halbleiterbauelement und verfahren zur herstellung des halbleiterbauelements
US10680222B2 (en) 2017-12-19 2020-06-09 GM Global Technology Operations LLC Method of making thermally-stable composite separators for lithium batteries

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EP0488947A1 (de) * 1990-11-26 1992-06-03 Ciba-Geigy Ag Detektorzelle
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WO1995025275A1 (de) * 1994-03-12 1995-09-21 Meinhard Knoll Miniaturisierte durchflussmesskammer mit integrierten chemo- und/oder biosensorelementen
WO1998050154A1 (en) * 1997-05-08 1998-11-12 University Of Minnesota Integrated microchip genetic testing system
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DE4106721A1 (de) * 1991-03-02 1992-09-10 Ant Nachrichtentech Anordnung zur ankopplung von lichtwellenleiterenden an empfangselemente
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EP0545284A1 (de) * 1991-11-29 1993-06-09 Canon Kabushiki Kaisha Messvorrichtung und Messsystem für Proben
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Also Published As

Publication number Publication date
AU2003208812A1 (en) 2003-09-04
DE10206464A1 (de) 2003-08-28
JP2005518525A (ja) 2005-06-23
KR20040089636A (ko) 2004-10-21
EP1474357A2 (de) 2004-11-10
US7592195B2 (en) 2009-09-22
US20050155411A1 (en) 2005-07-21
WO2003068671A2 (de) 2003-08-21
IL163545A0 (en) 2005-12-18

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