WO2003069263A3 - System for detecting anomalies and/or features of a surface - Google Patents

System for detecting anomalies and/or features of a surface Download PDF

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Publication number
WO2003069263A3
WO2003069263A3 PCT/US2003/004043 US0304043W WO03069263A3 WO 2003069263 A3 WO2003069263 A3 WO 2003069263A3 US 0304043 W US0304043 W US 0304043W WO 03069263 A3 WO03069263 A3 WO 03069263A3
Authority
WO
WIPO (PCT)
Prior art keywords
line
features
detecting anomalies
ccd
incidence
Prior art date
Application number
PCT/US2003/004043
Other languages
French (fr)
Other versions
WO2003069263A9 (en
WO2003069263A2 (en
Inventor
Mehdi Vaez-Iravani
Guoheng Zhao
Stanley E Stokowski
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Priority to JP2003568338A priority Critical patent/JP4473581B2/en
Publication of WO2003069263A2 publication Critical patent/WO2003069263A2/en
Publication of WO2003069263A3 publication Critical patent/WO2003069263A3/en
Publication of WO2003069263A9 publication Critical patent/WO2003069263A9/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95623—Inspecting patterns on the surface of objects using a spatial filtering method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/104—Mechano-optical scan, i.e. object and beam moving
    • G01N2201/1045—Spiral scan

Abstract

A cylindrical mirror or lens (12) is used to focus an input collimated beam of light onto a line (20) on the surface to be inspected, where the line is substantially in the plane of incidence of the focused beam. An image of the beam is projected onto an array of CCD (32) parallel to the line for detecting anomalies and/or features of the surface, where the array is outside the plane of incidence of the focused beam. For inspecting surface with a pattern thereon, the light from the surface is first passed through a spatial filter (106) before it is imaged onto the CCD. The spatial filter may be replaced by reflective strips that selectively reflects scattered radiation to the detector, where the reflective strips also shift in synchronism with the relative motion.
PCT/US2003/004043 2002-02-11 2003-02-11 System for detecting anomalies and/or features of a surface WO2003069263A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003568338A JP4473581B2 (en) 2002-02-11 2003-02-11 Method and apparatus for detecting surface anomalies with diffractive patterns

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US35650002P 2002-02-11 2002-02-11
US60/356,500 2002-02-11
US10/360,512 US7088443B2 (en) 2002-02-11 2003-02-06 System for detecting anomalies and/or features of a surface
US10/360,512 2003-02-06

Publications (3)

Publication Number Publication Date
WO2003069263A2 WO2003069263A2 (en) 2003-08-21
WO2003069263A3 true WO2003069263A3 (en) 2003-11-27
WO2003069263A9 WO2003069263A9 (en) 2004-03-04

Family

ID=27737542

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/004043 WO2003069263A2 (en) 2002-02-11 2003-02-11 System for detecting anomalies and/or features of a surface

Country Status (3)

Country Link
US (2) US7088443B2 (en)
JP (1) JP4473581B2 (en)
WO (1) WO2003069263A2 (en)

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US20090116727A1 (en) * 2006-05-02 2009-05-07 Accretech Usa, Inc. Apparatus and Method for Wafer Edge Defects Detection
US20090122304A1 (en) * 2006-05-02 2009-05-14 Accretech Usa, Inc. Apparatus and Method for Wafer Edge Exclusion Measurement
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US7433033B2 (en) * 2006-05-05 2008-10-07 Asml Netherlands B.V. Inspection method and apparatus using same
US7714997B2 (en) 2006-11-07 2010-05-11 Hitachi High-Technologies Corporation Apparatus for inspecting defects
JP5174697B2 (en) 2008-01-31 2013-04-03 株式会社日立ハイテクノロジーズ Defect inspection equipment
US7826049B2 (en) * 2008-02-11 2010-11-02 Applied Materials South East Asia Pte. Ltd. Inspection tools supporting multiple operating states for multiple detector arrangements
US7973921B2 (en) * 2008-06-25 2011-07-05 Applied Materials South East Asia Pte Ltd. Dynamic illumination in optical inspection systems
JP5237874B2 (en) 2009-04-24 2013-07-17 株式会社日立ハイテクノロジーズ Defect inspection method and defect inspection apparatus
KR101803109B1 (en) * 2009-07-22 2017-11-29 케이엘에이-텐코 코포레이션 Dark field inspection system with ring illumination
JP5417205B2 (en) * 2010-01-29 2014-02-12 株式会社日立ハイテクノロジーズ Defect inspection apparatus and defect inspection method
JP5571969B2 (en) 2010-02-10 2014-08-13 株式会社日立ハイテクノロジーズ Defect inspection method and apparatus
JP5637841B2 (en) 2010-12-27 2014-12-10 株式会社日立ハイテクノロジーズ Inspection device
US8873596B2 (en) 2011-07-22 2014-10-28 Kla-Tencor Corporation Laser with high quality, stable output beam, and long life high conversion efficiency non-linear crystal
US20130077086A1 (en) * 2011-09-23 2013-03-28 Kla-Tencor Corporation Solid-State Laser And Inspection System Using 193nm Laser
US9250178B2 (en) 2011-10-07 2016-02-02 Kla-Tencor Corporation Passivation of nonlinear optical crystals
US9042006B2 (en) 2012-09-11 2015-05-26 Kla-Tencor Corporation Solid state illumination source and inspection system
US8929406B2 (en) 2013-01-24 2015-01-06 Kla-Tencor Corporation 193NM laser and inspection system
US9529182B2 (en) 2013-02-13 2016-12-27 KLA—Tencor Corporation 193nm laser and inspection system
US9608399B2 (en) 2013-03-18 2017-03-28 Kla-Tencor Corporation 193 nm laser and an inspection system using a 193 nm laser
JP5760066B2 (en) * 2013-11-06 2015-08-05 株式会社日立ハイテクノロジーズ Defect inspection apparatus and defect inspection method
US9804101B2 (en) 2014-03-20 2017-10-31 Kla-Tencor Corporation System and method for reducing the bandwidth of a laser and an inspection system and method using a laser
US9419407B2 (en) 2014-09-25 2016-08-16 Kla-Tencor Corporation Laser assembly and inspection system using monolithic bandwidth narrowing apparatus
FR3026877B1 (en) * 2014-10-03 2018-01-05 Commissariat A L'energie Atomique Et Aux Energies Alternatives SENSOR OF DIGITAL OR PALMAIRE IMPRESSIONS
US9748729B2 (en) 2014-10-03 2017-08-29 Kla-Tencor Corporation 183NM laser and inspection system
JP6552230B2 (en) * 2015-03-18 2019-07-31 キヤノン株式会社 Measuring device
JP2017003331A (en) * 2015-06-05 2017-01-05 キヤノン株式会社 Measurement device for measuring a shape of a body to be measured, calculation device, and calculation method and program
WO2017163318A1 (en) * 2016-03-23 2017-09-28 株式会社 日立ハイテクノロジーズ Inspection device
US10739275B2 (en) * 2016-09-15 2020-08-11 Kla-Tencor Corporation Simultaneous multi-directional laser wafer inspection
US10175555B2 (en) 2017-01-03 2019-01-08 KLA—Tencor Corporation 183 nm CW laser and inspection system

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US4898471A (en) * 1987-06-18 1990-02-06 Tencor Instruments Particle detection on patterned wafers and the like
US5530550A (en) * 1994-12-21 1996-06-25 Tencor Instruments Optical wafer positioning system
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Also Published As

Publication number Publication date
WO2003069263A9 (en) 2004-03-04
WO2003069263A2 (en) 2003-08-21
JP4473581B2 (en) 2010-06-02
JP2005517906A (en) 2005-06-16
US20060038984A9 (en) 2006-02-23
US20040156042A1 (en) 2004-08-12
US7088443B2 (en) 2006-08-08
US20060256327A1 (en) 2006-11-16

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