WO2003073251A3 - Power delivery to base of processor - Google Patents
Power delivery to base of processor Download PDFInfo
- Publication number
- WO2003073251A3 WO2003073251A3 PCT/US2003/006488 US0306488W WO03073251A3 WO 2003073251 A3 WO2003073251 A3 WO 2003073251A3 US 0306488 W US0306488 W US 0306488W WO 03073251 A3 WO03073251 A3 WO 03073251A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- processor
- circuit board
- voltage regulator
- base
- power delivery
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0262—Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10545—Related components mounted on both sides of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10704—Pin grid array [PGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10719—Land grid array [LGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003217883A AU2003217883A1 (en) | 2002-02-25 | 2003-02-25 | Power delivery to base of processor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US35954802P | 2002-02-25 | 2002-02-25 | |
US60/359,548 | 2002-02-25 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2003073251A2 WO2003073251A2 (en) | 2003-09-04 |
WO2003073251A3 true WO2003073251A3 (en) | 2004-04-15 |
WO2003073251A9 WO2003073251A9 (en) | 2004-06-10 |
Family
ID=27766105
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/006488 WO2003073251A2 (en) | 2002-02-25 | 2003-02-25 | Power delivery to base of processor |
PCT/US2003/006111 WO2003073250A2 (en) | 2002-02-25 | 2003-02-25 | Electrical connector equipped with filter |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/006111 WO2003073250A2 (en) | 2002-02-25 | 2003-02-25 | Electrical connector equipped with filter |
Country Status (3)
Country | Link |
---|---|
US (3) | US7095619B2 (en) |
AU (2) | AU2003213618A1 (en) |
WO (2) | WO2003073251A2 (en) |
Families Citing this family (66)
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US6888235B2 (en) * | 2001-09-26 | 2005-05-03 | Molex Incorporated | Power delivery system for integrated circuits utilizing discrete capacitors |
US6862184B2 (en) * | 2002-06-27 | 2005-03-01 | Intel Corporation | High performance microprocessor power delivery solution using flex connections |
US6853061B2 (en) * | 2002-10-18 | 2005-02-08 | Intel Corporation | Dual power supply method and apparatus |
US6992899B2 (en) * | 2003-03-21 | 2006-01-31 | Intel Corporation | Power delivery apparatus, systems, and methods |
US20050133901A1 (en) * | 2003-12-17 | 2005-06-23 | Texas Instruments Incorporated | System and method for delivering power to a semiconductor device |
US20050151273A1 (en) * | 2003-12-30 | 2005-07-14 | Arnold Richard W. | Semiconductor chip package |
US7209366B2 (en) * | 2004-03-19 | 2007-04-24 | Intel Corporation | Delivery regions for power, ground and I/O signal paths in an IC package |
US7183644B2 (en) * | 2004-04-26 | 2007-02-27 | Intel Corporation | Integrated circuit package with improved power signal connection |
US7378742B2 (en) * | 2004-10-27 | 2008-05-27 | Intel Corporation | Compliant interconnects for semiconductors and micromachines |
US7257004B2 (en) * | 2004-05-06 | 2007-08-14 | Tyco Electronics Corporation | Power delivery system for integrated circuits |
US7145782B2 (en) * | 2004-07-16 | 2006-12-05 | Intel Corporation | Reducing loadline impedance in a system |
DE102004038591A1 (en) * | 2004-08-06 | 2006-02-23 | Robert Bosch Gmbh | Interface module |
US7698576B2 (en) | 2004-09-30 | 2010-04-13 | Intel Corporation | CPU power delivery system |
US20060071650A1 (en) * | 2004-09-30 | 2006-04-06 | Narendra Siva G | CPU power delivery system |
US7247930B2 (en) | 2004-09-30 | 2007-07-24 | Intel Corporation | Power management integrated circuit |
US20160170456A9 (en) * | 2004-09-30 | 2016-06-16 | Intel Corporation | Power management integrated circuit |
US7336490B2 (en) * | 2004-11-24 | 2008-02-26 | Hewlett-Packard Development Company, L.P. | Multi-chip module with power system |
US7068515B2 (en) * | 2004-11-24 | 2006-06-27 | Hewlett-Packard Development Company, L.P. | Multi-chip module with stacked redundant power |
US7064955B2 (en) * | 2004-11-24 | 2006-06-20 | Hewlett-Packard Development Company, L.P. | Redundant power for processor circuit board |
US7280360B2 (en) * | 2005-01-28 | 2007-10-09 | Hewlett-Packard Development Company, L.P. | Socket adapted for compressive loading |
US7791889B2 (en) * | 2005-02-16 | 2010-09-07 | Hewlett-Packard Development Company, L.P. | Redundant power beneath circuit board |
US20060214654A1 (en) * | 2005-03-28 | 2006-09-28 | Trisco Technology Corp. | [conducting structure of a meter] |
US20070002549A1 (en) * | 2005-06-30 | 2007-01-04 | Brusso Patricia A | Electronic package connected to a substrate |
US7568115B2 (en) | 2005-09-28 | 2009-07-28 | Intel Corporation | Power delivery and power management of many-core processors |
DE102005062783A1 (en) * | 2005-12-28 | 2007-07-05 | Robert Bosch Gmbh | Electronic module for controlling electric motor, has upper substrate comprising smaller base surface than base body of lower substrate, and power component fastened to lower substrate at outer side of outer periphery of upper substrate |
US7778041B2 (en) * | 2006-06-28 | 2010-08-17 | Hon Hai Precision Ind. Co., Ltd. | Interconnection system between CPU and voltage regulator |
US20080017407A1 (en) * | 2006-07-24 | 2008-01-24 | Ibiden Co., Ltd. | Interposer and electronic device using the same |
US7361044B1 (en) * | 2006-12-14 | 2008-04-22 | Intel Corporation | Socket that engages a pin grid array |
US8018738B2 (en) * | 2008-06-02 | 2011-09-13 | Oracle America, Inc., | Voltage regulator attach for high current chip applications |
TWI363959B (en) * | 2008-06-13 | 2012-05-11 | Acer Inc | Motherboard with an additional voltage regulator module slot area and related electronic module |
US7637777B1 (en) | 2008-10-13 | 2009-12-29 | Tyco Electronics Corporation | Connector assembly having a noise-reducing contact pattern |
US7896698B2 (en) * | 2008-10-13 | 2011-03-01 | Tyco Electronics Corporation | Connector assembly having multiple contact arrangements |
US7867032B2 (en) * | 2008-10-13 | 2011-01-11 | Tyco Electronics Corporation | Connector assembly having signal and coaxial contacts |
US7736183B2 (en) * | 2008-10-13 | 2010-06-15 | Tyco Electronics Corporation | Connector assembly with variable stack heights having power and signal contacts |
US7740489B2 (en) * | 2008-10-13 | 2010-06-22 | Tyco Electronics Corporation | Connector assembly having a compressive coupling member |
US20100128447A1 (en) * | 2008-11-21 | 2010-05-27 | Tyco Electronics Corporation | Memory module having voltage regulator module |
US8248152B2 (en) | 2009-02-25 | 2012-08-21 | International Business Machines Corporation | Switched capacitor voltage converters |
US8174288B2 (en) | 2009-04-13 | 2012-05-08 | International Business Machines Corporation | Voltage conversion and integrated circuits with stacked voltage domains |
US8113851B2 (en) * | 2009-04-23 | 2012-02-14 | Tyco Electronics Corporation | Connector assemblies and systems including flexible circuits |
US7885069B2 (en) * | 2009-06-04 | 2011-02-08 | International Business Machines Corporation | Implementing adaptable three phase modular line filtering |
US8276002B2 (en) * | 2009-11-23 | 2012-09-25 | International Business Machines Corporation | Power delivery in a heterogeneous 3-D stacked apparatus |
US7918683B1 (en) | 2010-03-24 | 2011-04-05 | Tyco Electronics Corporation | Connector assemblies and daughter card assemblies configured to engage each other along a side interface |
US8629705B2 (en) | 2010-06-07 | 2014-01-14 | International Business Machines Corporation | Low voltage signaling |
US8572840B2 (en) * | 2010-09-30 | 2013-11-05 | International Business Machines Corporation | Method of attaching an electronic module power supply |
TWI433617B (en) * | 2010-11-08 | 2014-04-01 | Delta Electronics Inc | Circuit board |
US8716855B2 (en) * | 2010-11-10 | 2014-05-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit system with distributed power supply comprising interposer and voltage regulator module |
US8363406B2 (en) * | 2010-12-17 | 2013-01-29 | International Business Machines Corporation | Rotatable latch for compressing thermal interface material between a heat generating electrical component and a cooling electrical component |
US8982563B2 (en) * | 2011-06-28 | 2015-03-17 | Oracle International Corporation | Chip package to support high-frequency processors |
KR101169354B1 (en) | 2011-08-17 | 2012-07-30 | 테세라, 인코포레이티드 | Power boosting circuit for semiconductor packaging |
TWM429683U (en) * | 2012-01-06 | 2012-05-21 | Bothhand Entpr Inc | Packaging case of electronic device |
KR101745385B1 (en) | 2012-02-29 | 2017-06-09 | 테세라, 인코포레이티드 | Power boosting circuit for semiconductor packaging |
US9338918B2 (en) * | 2013-07-10 | 2016-05-10 | Samsung Electronics Co., Ltd. | Socket interposer and computer system using the socket interposer |
US10446335B2 (en) * | 2013-08-08 | 2019-10-15 | Zhuhai Access Semiconductor Co., Ltd. | Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor |
US9750158B2 (en) | 2014-05-02 | 2017-08-29 | Honeywell International Inc. | Reduced thermal transfer to Peltier cooled FETs |
JP6565576B2 (en) * | 2014-12-24 | 2019-08-28 | 富士通株式会社 | Power supply board |
US10331161B2 (en) * | 2014-12-24 | 2019-06-25 | Fujitsu Limited | Power supply board |
US10178763B2 (en) * | 2015-12-21 | 2019-01-08 | Intel Corporation | Warpage mitigation in printed circuit board assemblies |
US10880994B2 (en) | 2016-06-02 | 2020-12-29 | Intel Corporation | Top-side connector interface for processor packaging |
US11245329B2 (en) * | 2017-09-29 | 2022-02-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Power module |
US11508663B2 (en) * | 2018-02-02 | 2022-11-22 | Marvell Israel (M.I.S.L) Ltd. | PCB module on package |
WO2020000413A1 (en) * | 2018-06-29 | 2020-01-02 | Intel Corporation | Hybrid socket for higher thermal design point processor support |
US10225932B1 (en) * | 2018-08-27 | 2019-03-05 | Tactotek Oy | Interfacing arrangement, method for manufacturing an interfacing arrangement, and multilayer structure hosting an interfacing arrangement |
US10840216B2 (en) * | 2019-03-05 | 2020-11-17 | Cerebras Systems Inc. | Systems and methods for powering an integrated circuit having multiple interconnected die |
US11581292B2 (en) | 2019-06-10 | 2023-02-14 | Marvell Israel (M.I.S.L) Ltd. | IC package with top-side memory module |
US20230198177A1 (en) * | 2021-12-17 | 2023-06-22 | International Business Machines Corporation | Separable interface cable structure for high voltage under-module power input |
US20230335541A1 (en) * | 2022-04-13 | 2023-10-19 | Google Llc | Pluggable CPU Modules With Vertical Power |
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WO1989005570A1 (en) * | 1987-12-08 | 1989-06-15 | Rogers Corporation | Mounting substrate for leadless ceramic chip carrier |
US5481436A (en) * | 1992-12-30 | 1996-01-02 | Interconnect Systems, Inc. | Multi-level assemblies and methods for interconnecting integrated circuits |
US5721673A (en) * | 1995-10-05 | 1998-02-24 | Micron Electronics, Inc. | Socket for retaining multiple electronic packages |
US5734555A (en) * | 1994-03-30 | 1998-03-31 | Intel Corporation | Shared socket multi-chip module and/or piggyback pin grid array package |
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WO2001065344A2 (en) * | 2000-02-18 | 2001-09-07 | Incep Technologies, Inc. | Method and apparatus for providing power to a microprocessor with integrated thermal and emi management |
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-
2003
- 2003-02-25 US US10/383,028 patent/US7095619B2/en not_active Expired - Lifetime
- 2003-02-25 WO PCT/US2003/006488 patent/WO2003073251A2/en not_active Application Discontinuation
- 2003-02-25 AU AU2003213618A patent/AU2003213618A1/en not_active Abandoned
- 2003-02-25 US US10/375,940 patent/US6837719B2/en not_active Expired - Lifetime
- 2003-02-25 AU AU2003217883A patent/AU2003217883A1/en not_active Abandoned
- 2003-02-25 WO PCT/US2003/006111 patent/WO2003073250A2/en not_active Application Discontinuation
-
2006
- 2006-06-27 US US11/475,405 patent/US7298628B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989005570A1 (en) * | 1987-12-08 | 1989-06-15 | Rogers Corporation | Mounting substrate for leadless ceramic chip carrier |
US5481436A (en) * | 1992-12-30 | 1996-01-02 | Interconnect Systems, Inc. | Multi-level assemblies and methods for interconnecting integrated circuits |
US6046911A (en) * | 1994-03-07 | 2000-04-04 | International Business Machines Corporation | Dual substrate package assembly having dielectric member engaging contacts at only three locations |
US5734555A (en) * | 1994-03-30 | 1998-03-31 | Intel Corporation | Shared socket multi-chip module and/or piggyback pin grid array package |
US5721673A (en) * | 1995-10-05 | 1998-02-24 | Micron Electronics, Inc. | Socket for retaining multiple electronic packages |
WO2001065344A2 (en) * | 2000-02-18 | 2001-09-07 | Incep Technologies, Inc. | Method and apparatus for providing power to a microprocessor with integrated thermal and emi management |
Also Published As
Publication number | Publication date |
---|---|
AU2003213618A8 (en) | 2003-09-09 |
WO2003073250A3 (en) | 2004-02-19 |
US20060274513A1 (en) | 2006-12-07 |
AU2003217883A8 (en) | 2003-09-09 |
WO2003073250A2 (en) | 2003-09-04 |
US20030162442A1 (en) | 2003-08-28 |
WO2003073251A9 (en) | 2004-06-10 |
WO2003073250B1 (en) | 2004-04-01 |
US7095619B2 (en) | 2006-08-22 |
AU2003213618A1 (en) | 2003-09-09 |
AU2003217883A1 (en) | 2003-09-09 |
US6837719B2 (en) | 2005-01-04 |
US7298628B2 (en) | 2007-11-20 |
US20030198033A1 (en) | 2003-10-23 |
WO2003073251A2 (en) | 2003-09-04 |
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