WO2003085697A3 - Solder-bearing articles and method of retaining a solder mass thereon - Google Patents
Solder-bearing articles and method of retaining a solder mass thereon Download PDFInfo
- Publication number
- WO2003085697A3 WO2003085697A3 PCT/US2003/010149 US0310149W WO03085697A3 WO 2003085697 A3 WO2003085697 A3 WO 2003085697A3 US 0310149 W US0310149 W US 0310149W WO 03085697 A3 WO03085697 A3 WO 03085697A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solder
- mass
- retaining
- length
- solder mass
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1302—Disposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16104—Disposition relative to the bonding area, e.g. bond pad
- H01L2224/16105—Disposition relative to the bonding area, e.g. bond pad the bump connector connecting bonding areas being not aligned with respect to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16153—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
- H01L2224/16155—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being non-metallic, e.g. being an insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1084—Notched leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0405—Solder foil, tape or wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10392500T DE10392500B4 (en) | 2002-04-01 | 2003-04-01 | Solder-carrying component and method for holding a solder mass thereon |
US10/509,200 US7189083B2 (en) | 2002-04-01 | 2003-04-01 | Method of retaining a solder mass on an article |
GB0422073A GB2402644B (en) | 2002-04-01 | 2003-04-01 | Solder-bearing articles and method of retaining a solder mass thereon |
AU2003226213A AU2003226213A1 (en) | 2002-04-01 | 2003-04-01 | Solder-bearing articles and method of retaining a solder mass thereon |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36941302P | 2002-04-01 | 2002-04-01 | |
US60/369,413 | 2002-04-01 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2003085697A2 WO2003085697A2 (en) | 2003-10-16 |
WO2003085697A3 true WO2003085697A3 (en) | 2004-06-10 |
WO2003085697A9 WO2003085697A9 (en) | 2004-12-02 |
Family
ID=28791949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/010149 WO2003085697A2 (en) | 2002-04-01 | 2003-04-01 | Solder-bearing articles and method of retaining a solder mass thereon |
Country Status (6)
Country | Link |
---|---|
US (1) | US7189083B2 (en) |
CN (1) | CN1328824C (en) |
AU (1) | AU2003226213A1 (en) |
DE (1) | DE10392500B4 (en) |
GB (1) | GB2402644B (en) |
WO (1) | WO2003085697A2 (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7338299B1 (en) * | 2003-08-06 | 2008-03-04 | Foxconn Advanced Technology Inc. | Surface mounted electronic component |
WO2006032035A1 (en) * | 2004-09-15 | 2006-03-23 | Molex Incorporated | Method of attaching a solder element to a contact and the contact assembly formed thereby |
US7385144B2 (en) * | 2005-11-17 | 2008-06-10 | Harris Corporation | Method and apparatus for electrically connecting printed circuit boards or other panels |
JP4828361B2 (en) * | 2006-09-15 | 2011-11-30 | 株式会社フジクラ | Method for preventing solder from rising onto electrical contact and electrical contact using the method |
US20100173507A1 (en) * | 2009-01-07 | 2010-07-08 | Samtec, Inc. | Electrical connector having multiple ground planes |
US20100186997A1 (en) * | 2009-01-29 | 2010-07-29 | Samtec Inc. | Crimped solder on a flexible circuit board |
US7837522B1 (en) | 2009-11-12 | 2010-11-23 | Samtec, Inc. | Electrical contacts with solder members and methods of attaching solder members to electrical contacts |
EP2339894A1 (en) | 2009-12-22 | 2011-06-29 | Saint-Gobain Glass France | Pane with electric connection element |
US8113411B2 (en) * | 2010-03-30 | 2012-02-14 | Flextronics Ap, Llc | Universal radio frequency shield removal |
USD680545S1 (en) * | 2011-11-15 | 2013-04-23 | Connectblue Ab | Module |
USD668658S1 (en) * | 2011-11-15 | 2012-10-09 | Connectblue Ab | Module |
USD668659S1 (en) * | 2011-11-15 | 2012-10-09 | Connectblue Ab | Module |
USD680119S1 (en) * | 2011-11-15 | 2013-04-16 | Connectblue Ab | Module |
USD692896S1 (en) * | 2011-11-15 | 2013-11-05 | Connectblue Ab | Module |
USD689053S1 (en) * | 2011-11-15 | 2013-09-03 | Connectblue Ab | Module |
US9126279B2 (en) * | 2013-09-30 | 2015-09-08 | General Electric Company | Brazing method |
JP2015106663A (en) * | 2013-11-29 | 2015-06-08 | 住友電工デバイス・イノベーション株式会社 | Wiring board connection method and wiring board mounting structure |
WO2017142741A1 (en) * | 2016-02-19 | 2017-08-24 | Alpha Assembly Solutions Inc. | Rf shield with selectively integrated solder |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5688150A (en) * | 1995-08-08 | 1997-11-18 | North American Specialties Corporation | Solder bearing lead |
US5709574A (en) * | 1996-08-30 | 1998-01-20 | Autosplice Systems Inc. | Surface-mountable socket connector |
US6261136B1 (en) * | 1999-04-30 | 2001-07-17 | Die Tech, Inc. | Edge clip terminal |
US6461188B2 (en) * | 2000-06-02 | 2002-10-08 | Saint-Gobain Glass France | Solderable electrical connection element with a solder deposit |
US6494754B2 (en) * | 1995-11-03 | 2002-12-17 | North American Specialties | Solder-holding clips for applying solder to connectors or the like |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3320658A (en) * | 1964-06-26 | 1967-05-23 | Ibm | Method of making electrical connectors and connections |
US3744129A (en) * | 1972-02-09 | 1973-07-10 | Rogers Corp | Method of forming a bus bar |
US4712721A (en) * | 1986-03-17 | 1987-12-15 | Raychem Corp. | Solder delivery systems |
JP2500462B2 (en) * | 1993-07-22 | 1996-05-29 | 日本電気株式会社 | Inspection connector and manufacturing method thereof |
JPH0785635A (en) * | 1993-09-14 | 1995-03-31 | Toshiba Corp | Assemblage of carriage assembly |
GB2283863A (en) * | 1993-11-16 | 1995-05-17 | Ibm | Direct chip attach module |
ATE167978T1 (en) * | 1994-03-15 | 1998-07-15 | Mayer Heinrich | WEBBING FOR PROVIDING SOLDER DEPOSITS FOR SOLDERING COMPONENTS ON A CIRCUIT BOARD |
US5673846A (en) * | 1995-08-24 | 1997-10-07 | International Business Machines Corporation | Solder anchor decal and method |
JP3145331B2 (en) * | 1996-04-26 | 2001-03-12 | 日本特殊陶業株式会社 | Relay board, method of manufacturing the same, structure including substrate, relay board, and mounting board, connection body of substrate and relay board, and method of manufacturing connection body of relay board and mounting board |
JP2000124588A (en) * | 1998-10-19 | 2000-04-28 | Alps Electric Co Ltd | Electronic circuit unit and manufacture of it |
JP3664001B2 (en) * | 1999-10-25 | 2005-06-22 | 株式会社村田製作所 | Method for manufacturing module substrate |
JP3636030B2 (en) * | 2000-04-26 | 2005-04-06 | 株式会社村田製作所 | Method for manufacturing module substrate |
US7341176B2 (en) * | 2002-11-26 | 2008-03-11 | Volvo Aero Corporation | Method of tying two or more components together |
US7043830B2 (en) * | 2003-02-20 | 2006-05-16 | Micron Technology, Inc. | Method of forming conductive bumps |
-
2003
- 2003-04-01 GB GB0422073A patent/GB2402644B/en not_active Expired - Fee Related
- 2003-04-01 AU AU2003226213A patent/AU2003226213A1/en not_active Abandoned
- 2003-04-01 WO PCT/US2003/010149 patent/WO2003085697A2/en not_active Application Discontinuation
- 2003-04-01 DE DE10392500T patent/DE10392500B4/en not_active Expired - Fee Related
- 2003-04-01 US US10/509,200 patent/US7189083B2/en not_active Expired - Lifetime
- 2003-04-01 CN CNB038096013A patent/CN1328824C/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5688150A (en) * | 1995-08-08 | 1997-11-18 | North American Specialties Corporation | Solder bearing lead |
US6494754B2 (en) * | 1995-11-03 | 2002-12-17 | North American Specialties | Solder-holding clips for applying solder to connectors or the like |
US5709574A (en) * | 1996-08-30 | 1998-01-20 | Autosplice Systems Inc. | Surface-mountable socket connector |
US6261136B1 (en) * | 1999-04-30 | 2001-07-17 | Die Tech, Inc. | Edge clip terminal |
US6461188B2 (en) * | 2000-06-02 | 2002-10-08 | Saint-Gobain Glass France | Solderable electrical connection element with a solder deposit |
Also Published As
Publication number | Publication date |
---|---|
GB2402644A (en) | 2004-12-15 |
DE10392500T5 (en) | 2005-05-12 |
GB2402644B (en) | 2005-04-20 |
US7189083B2 (en) | 2007-03-13 |
CN1650476A (en) | 2005-08-03 |
CN1328824C (en) | 2007-07-25 |
AU2003226213A1 (en) | 2003-10-20 |
GB0422073D0 (en) | 2004-11-03 |
WO2003085697A9 (en) | 2004-12-02 |
AU2003226213A8 (en) | 2003-10-20 |
DE10392500B4 (en) | 2010-02-25 |
WO2003085697A2 (en) | 2003-10-16 |
US20060057902A1 (en) | 2006-03-16 |
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