WO2003089872A3 - Improved simultaneous multi-spot inspection and imaging - Google Patents

Improved simultaneous multi-spot inspection and imaging Download PDF

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Publication number
WO2003089872A3
WO2003089872A3 PCT/US2003/012070 US0312070W WO03089872A3 WO 2003089872 A3 WO2003089872 A3 WO 2003089872A3 US 0312070 W US0312070 W US 0312070W WO 03089872 A3 WO03089872 A3 WO 03089872A3
Authority
WO
WIPO (PCT)
Prior art keywords
array
imaging
objective
spot
spot inspection
Prior art date
Application number
PCT/US2003/012070
Other languages
French (fr)
Other versions
WO2003089872A2 (en
WO2003089872A9 (en
Inventor
Mehdi Vaez-Iravani
Larry Miller
Original Assignee
Kla Tencor Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/125,906 external-priority patent/US20040042001A1/en
Application filed by Kla Tencor Tech Corp filed Critical Kla Tencor Tech Corp
Priority to AU2003234134A priority Critical patent/AU2003234134A1/en
Publication of WO2003089872A2 publication Critical patent/WO2003089872A2/en
Publication of WO2003089872A3 publication Critical patent/WO2003089872A3/en
Publication of WO2003089872A9 publication Critical patent/WO2003089872A9/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95623Inspecting patterns on the surface of objects using a spatial filtering method
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features

Abstract

A multi-spot inspection system employs an objective (30) for focusing an array of radiation beams (24) to a surface of an object (28) and a second objective (32) having a large numerical aperture for collecting scattered radiation (64) from the array of illuminated spots. The scattered radiation from each illuminated spot is focused to a corresponding optical fiber channel (34) so that information about a scattering may be conveyed to a corresponding detector in a remote detector array (36) for processing. For patterned surface inspection, a cross-shaped filter (90) is rotated along with the surface to reduce the effects of diffraction by Manhattan geometry. A spatial filter (92) in the shape of an annular aperture may also be employed to reduce scattering from patterns such as arrays on the surface.
PCT/US2003/012070 2002-04-18 2003-04-18 Improved simultaneous multi-spot inspection and imaging WO2003089872A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003234134A AU2003234134A1 (en) 2002-04-18 2003-04-18 Improved simultaneous multi-spot inspection and imaging

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/125,906 US20040042001A1 (en) 2002-04-18 2002-04-18 Simultaneous multi-spot inspection and imaging
US10/125,906 2002-04-18
US42657702P 2002-11-15 2002-11-15
US60/426,577 2002-11-15

Publications (3)

Publication Number Publication Date
WO2003089872A2 WO2003089872A2 (en) 2003-10-30
WO2003089872A3 true WO2003089872A3 (en) 2004-10-21
WO2003089872A9 WO2003089872A9 (en) 2004-12-23

Family

ID=29254001

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/012070 WO2003089872A2 (en) 2002-04-18 2003-04-18 Improved simultaneous multi-spot inspection and imaging

Country Status (3)

Country Link
US (3) US7130039B2 (en)
AU (1) AU2003234134A1 (en)
WO (1) WO2003089872A2 (en)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7130039B2 (en) * 2002-04-18 2006-10-31 Kla-Tencor Technologies Corporation Simultaneous multi-spot inspection and imaging
US20040042001A1 (en) 2002-04-18 2004-03-04 Kla-Tencor Technologies Corporation Simultaneous multi-spot inspection and imaging
US20070258085A1 (en) * 2006-05-02 2007-11-08 Robbins Michael D Substrate illumination and inspection system
US7489393B2 (en) * 2005-03-02 2009-02-10 Kla-Tencor Technologies Corporation Enhanced simultaneous multi-spot inspection and imaging
US7728965B2 (en) * 2005-06-06 2010-06-01 Kla-Tencor Technologies Corp. Systems and methods for inspecting an edge of a specimen
US9068917B1 (en) * 2006-03-14 2015-06-30 Kla-Tencor Technologies Corp. Systems and methods for inspection of a specimen
US20090122304A1 (en) * 2006-05-02 2009-05-14 Accretech Usa, Inc. Apparatus and Method for Wafer Edge Exclusion Measurement
US7508504B2 (en) * 2006-05-02 2009-03-24 Accretech Usa, Inc. Automatic wafer edge inspection and review system
US20090116727A1 (en) * 2006-05-02 2009-05-07 Accretech Usa, Inc. Apparatus and Method for Wafer Edge Defects Detection
US8090194B2 (en) 2006-11-21 2012-01-03 Mantis Vision Ltd. 3D geometric modeling and motion capture using both single and dual imaging
CA2670214A1 (en) * 2006-11-21 2008-05-29 Mantisvision Ltd. 3d geometric modeling and 3d video content creation
US7940384B2 (en) * 2006-12-15 2011-05-10 Kla-Tencor Corp. Systems and methods for blocking specular reflection and suppressing modulation from periodic features on a specimen
US7746459B2 (en) * 2007-08-10 2010-06-29 Kla-Tencor Technologies Corp. Systems configured to inspect a wafer
JP4797005B2 (en) * 2007-09-11 2011-10-19 株式会社日立ハイテクノロジーズ Surface inspection method and surface inspection apparatus
US8194301B2 (en) * 2008-03-04 2012-06-05 Kla-Tencor Corporation Multi-spot scanning system and method
JP5022959B2 (en) * 2008-03-24 2012-09-12 株式会社日立製作所 Defect inspection system using catadioptric objective lens
WO2009121628A2 (en) * 2008-04-04 2009-10-08 Nanda Technologies Gmbh Optical inspection system and method
US7623229B1 (en) * 2008-10-07 2009-11-24 Kla-Tencor Corporation Systems and methods for inspecting wafers
JP2010161216A (en) * 2009-01-08 2010-07-22 Toshiba Corp Pattern inspection device and method
JP5525336B2 (en) * 2010-06-08 2014-06-18 株式会社日立ハイテクノロジーズ Defect inspection method and defect inspection apparatus
DE102010030435A1 (en) * 2010-06-23 2011-12-29 Carl Zeiss Smt Gmbh metrology system
EP2652776B1 (en) * 2010-12-16 2019-08-07 KLA-Tencor Corporation Wafer inspection
US9702983B2 (en) * 2011-05-03 2017-07-11 Applied Materials Israel, Ltd. Multi-spot collection optics
US9279774B2 (en) * 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
US8873596B2 (en) 2011-07-22 2014-10-28 Kla-Tencor Corporation Laser with high quality, stable output beam, and long life high conversion efficiency non-linear crystal
US8755044B2 (en) * 2011-08-15 2014-06-17 Kla-Tencor Corporation Large particle detection for multi-spot surface scanning inspection systems
US9250178B2 (en) 2011-10-07 2016-02-02 Kla-Tencor Corporation Passivation of nonlinear optical crystals
US10197501B2 (en) 2011-12-12 2019-02-05 Kla-Tencor Corporation Electron-bombarded charge-coupled device and inspection systems using EBCCD detectors
US8614790B2 (en) 2011-12-12 2013-12-24 Applied Materials Israel, Ltd. Optical system and method for inspection of patterned samples
JP5874398B2 (en) 2012-01-05 2016-03-02 オムロン株式会社 Inspection area setting method for image inspection apparatus
US9496425B2 (en) 2012-04-10 2016-11-15 Kla-Tencor Corporation Back-illuminated sensor with boron layer
US8736831B2 (en) 2012-05-15 2014-05-27 Kla-Tencor Corp. Substrate inspection
US9601299B2 (en) 2012-08-03 2017-03-21 Kla-Tencor Corporation Photocathode including silicon substrate with boron layer
JP5451832B2 (en) * 2012-08-21 2014-03-26 株式会社ニューフレアテクノロジー Pattern inspection device
US9255891B2 (en) * 2012-11-20 2016-02-09 Kla-Tencor Corporation Inspection beam shaping for improved detection sensitivity
US9426400B2 (en) 2012-12-10 2016-08-23 Kla-Tencor Corporation Method and apparatus for high speed acquisition of moving images using pulsed illumination
US9182358B2 (en) * 2013-03-15 2015-11-10 Kla-Tencor Corporation Multi-spot defect inspection system
US9395340B2 (en) 2013-03-15 2016-07-19 Kla-Tencor Corporation Interleaved acousto-optical device scanning for suppression of optical crosstalk
US9478402B2 (en) 2013-04-01 2016-10-25 Kla-Tencor Corporation Photomultiplier tube, image sensor, and an inspection system using a PMT or image sensor
US9904181B2 (en) 2013-07-03 2018-02-27 Asml Netherlands B.V. Inspection apparatus and method, lithographic apparatus, lithographic processing cell and device manufacturing method
WO2015021411A1 (en) * 2013-08-09 2015-02-12 Kla-Tencor Corporation Multi-spot illumination for improved detection sensitivity
US9681051B2 (en) * 2013-08-19 2017-06-13 Massachusetts Institute Of Technology Method and apparatus for motion coded imaging
US9885691B1 (en) 2013-10-08 2018-02-06 Nanometronix LLC Nanoindenter ultrasonic probe tip and force control
US9347890B2 (en) 2013-12-19 2016-05-24 Kla-Tencor Corporation Low-noise sensor and an inspection system using a low-noise sensor
US9748294B2 (en) 2014-01-10 2017-08-29 Hamamatsu Photonics K.K. Anti-reflection layer for back-illuminated sensor
US9546962B2 (en) * 2014-02-12 2017-01-17 Kla-Tencor Corporation Multi-spot scanning collection optics
US9410901B2 (en) 2014-03-17 2016-08-09 Kla-Tencor Corporation Image sensor, an inspection system and a method of inspecting an article
US9921395B1 (en) 2015-06-09 2018-03-20 J.A. Woollam Co., Inc. Beam focusing and beam collecting optics with wavelength dependent filter element adjustment of beam area
US10018815B1 (en) 2014-06-06 2018-07-10 J.A. Woolam Co., Inc. Beam focusing and reflective optics
US9442016B2 (en) 2014-06-06 2016-09-13 J.A. Woollam Co., Inc Reflective focusing optics
US10338362B1 (en) 2014-06-06 2019-07-02 J.A. Woollam Co., Inc. Beam focusing and reflecting optics with enhanced detector system
US9885671B2 (en) 2014-06-09 2018-02-06 Kla-Tencor Corporation Miniaturized imaging apparatus for wafer edge
US9645097B2 (en) 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
US9767986B2 (en) 2014-08-29 2017-09-19 Kla-Tencor Corporation Scanning electron microscope and methods of inspecting and reviewing samples
US9419407B2 (en) 2014-09-25 2016-08-16 Kla-Tencor Corporation Laser assembly and inspection system using monolithic bandwidth narrowing apparatus
US9860466B2 (en) 2015-05-14 2018-01-02 Kla-Tencor Corporation Sensor with electrically controllable aperture for inspection and metrology systems
WO2016187139A1 (en) * 2015-05-20 2016-11-24 Kla-Tencor Corporation System and method for imaging a sample with an illumination source modified by a spatial selective wavelength filter
US10616987B2 (en) 2015-08-28 2020-04-07 Kla-Tencor Corporation System and method for imaging a sample with an illumination source modified by a spatial selective wavelength filter
US10748730B2 (en) 2015-05-21 2020-08-18 Kla-Tencor Corporation Photocathode including field emitter array on a silicon substrate with boron layer
CN105043982A (en) * 2015-07-02 2015-11-11 武汉中导光电设备有限公司 Automatic optical detection system
US10462391B2 (en) 2015-08-14 2019-10-29 Kla-Tencor Corporation Dark-field inspection using a low-noise sensor
US10778925B2 (en) 2016-04-06 2020-09-15 Kla-Tencor Corporation Multiple column per channel CCD sensor architecture for inspection and metrology
US10313622B2 (en) 2016-04-06 2019-06-04 Kla-Tencor Corporation Dual-column-parallel CCD sensor and inspection systems using a sensor
US10324045B2 (en) 2016-08-05 2019-06-18 Kla-Tencor Corporation Surface defect inspection with large particle monitoring and laser power control
US10082470B2 (en) 2016-09-27 2018-09-25 Kla-Tencor Corporation Defect marking for semiconductor wafer inspection
US10887580B2 (en) 2016-10-07 2021-01-05 Kla-Tencor Corporation Three-dimensional imaging for semiconductor wafer inspection
KR20180042649A (en) * 2016-10-18 2018-04-26 삼성전자주식회사 Inspection appartus of semiconductor device and driving method of the same
US11047806B2 (en) 2016-11-30 2021-06-29 Kla-Tencor Corporation Defect discovery and recipe optimization for inspection of three-dimensional semiconductor structures
US10551320B2 (en) 2017-01-30 2020-02-04 Kla-Tencor Corporation Activation of wafer particle defects for spectroscopic composition analysis
US10236222B2 (en) 2017-02-08 2019-03-19 Kla-Tencor Corporation System and method for measuring substrate and film thickness distribution
EP3385685A1 (en) * 2017-04-06 2018-10-10 ASML Netherlands B.V. Radiation receiving system
US10422984B2 (en) 2017-05-12 2019-09-24 Applied Materials, Inc. Flexible mode scanning optical microscopy and inspection system
US11114489B2 (en) 2018-06-18 2021-09-07 Kla-Tencor Corporation Back-illuminated sensor and a method of manufacturing a sensor
US10943760B2 (en) 2018-10-12 2021-03-09 Kla Corporation Electron gun and electron microscope
US11114491B2 (en) 2018-12-12 2021-09-07 Kla Corporation Back-illuminated sensor and a method of manufacturing a sensor
US11379967B2 (en) 2019-01-18 2022-07-05 Kla Corporation Methods and systems for inspection of semiconductor structures with automatically generated defect features
US11703460B2 (en) 2019-07-09 2023-07-18 Kla Corporation Methods and systems for optical surface defect material characterization
US11848350B2 (en) 2020-04-08 2023-12-19 Kla Corporation Back-illuminated sensor and a method of manufacturing a sensor using a silicon on insulator wafer
WO2021259646A1 (en) * 2020-06-24 2021-12-30 Asml Netherlands B.V. Monolithic particle inspection device
US11835546B1 (en) 2021-08-04 2023-12-05 Nanometronix LLC Characterization of nanoindented and scratch induced accoustic events
US11346857B1 (en) 2021-08-04 2022-05-31 Nanometronix LLC Characterization of nanoindentation induced acoustic events

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4464050A (en) * 1981-02-07 1984-08-07 Olympus Optical Co., Ltd. Apparatus for detecting optically defects
US5274434A (en) * 1990-04-02 1993-12-28 Hitachi, Ltd. Method and apparatus for inspecting foreign particles on real time basis in semiconductor mass production line
US5528360A (en) * 1991-09-20 1996-06-18 Canon Kabushiki Kaisha Surface-condition inspection apparatus
US6208411B1 (en) * 1998-09-28 2001-03-27 Kla-Tencor Corporation Massively parallel inspection and imaging system
US6369886B2 (en) * 1996-08-23 2002-04-09 Asahi Kogaku Kogyo Kabushiki Kaisha Pattern reading apparatus

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4247203A (en) * 1978-04-03 1981-01-27 Kla Instrument Corporation Automatic photomask inspection system and apparatus
US4579455A (en) * 1983-05-09 1986-04-01 Kla Instruments Corporation Photomask inspection apparatus and method with improved defect detection
US4629319A (en) * 1984-02-14 1986-12-16 Diffracto Ltd. Panel surface flaw inspection
JPS6333834A (en) * 1986-07-28 1988-02-13 Canon Inc Surface state inspecting apparatus
DE3637477A1 (en) 1986-11-04 1988-05-11 Wacker Chemitronic METHOD AND DEVICE FOR DETERMINING THE QUALITY OF SURFACES, IN PARTICULAR OF SEMICONDUCTOR DISC
JPS63314963A (en) * 1987-06-18 1988-12-22 Fuji Photo Film Co Ltd Original illuminator
US4898471A (en) * 1987-06-18 1990-02-06 Tencor Instruments Particle detection on patterned wafers and the like
US5206699A (en) * 1988-05-06 1993-04-27 Gersan Establishment Sensing a narrow frequency band of radiation and gemstones
JPH076923B2 (en) * 1990-11-09 1995-01-30 三菱電機株式会社 Spatial frequency filter, method of manufacturing the spatial frequency filter, and pattern defect inspection apparatus
US5192856A (en) * 1990-11-19 1993-03-09 An Con Genetics, Inc. Auto focusing bar code reader
US5463459A (en) * 1991-04-02 1995-10-31 Hitachi, Ltd. Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process
US5479259A (en) * 1991-05-20 1995-12-26 Hitachi, Ltd. Method and apparatus for detecting photoacoustic signal
US5251010A (en) * 1991-06-07 1993-10-05 Glasstech, Inc. Optical roller wave gauge
JP3239517B2 (en) * 1992-06-17 2001-12-17 株式会社デンソー Manufacturing method of filtration element
JP3253177B2 (en) * 1993-06-15 2002-02-04 キヤノン株式会社 Surface condition inspection device
US5883710A (en) * 1994-12-08 1999-03-16 Kla-Tencor Corporation Scanning system for inspecting anomalies on surfaces
US5576831A (en) * 1994-06-20 1996-11-19 Tencor Instruments Wafer alignment sensor
US5864394A (en) * 1994-06-20 1999-01-26 Kla-Tencor Corporation Surface inspection system
US5530550A (en) * 1994-12-21 1996-06-25 Tencor Instruments Optical wafer positioning system
JP3140664B2 (en) 1995-06-30 2001-03-05 松下電器産業株式会社 Foreign matter inspection method and apparatus
US5644393A (en) * 1995-10-19 1997-07-01 Hitachi Electronics Engineering Co., Ltd. Extraneous substance inspection method and apparatus
US5737074A (en) * 1995-12-05 1998-04-07 New Creation Co., Ltd. Surface inspection method and apparatus
US5798829A (en) * 1996-03-05 1998-08-25 Kla-Tencor Corporation Single laser bright field and dark field system for detecting anomalies of a sample
AU3376597A (en) * 1996-06-04 1998-01-05 Tencor Instruments Optical scanning system for surface inspection
US5719840A (en) * 1996-12-30 1998-02-17 Phase Metrics Optical sensor with an elliptical illumination spot
US5965896A (en) * 1997-02-26 1999-10-12 Marton & Associates, Inc. Apparatus and method for scratch wear testing of thin films
US6608676B1 (en) * 1997-08-01 2003-08-19 Kla-Tencor Corporation System for detecting anomalies and/or features of a surface
US5917797A (en) * 1997-08-15 1999-06-29 Zen Research Nv Multi-beam optical pickup assembly and methods using a compact two-dimensional arrangement of beams
US6236454B1 (en) * 1997-12-15 2001-05-22 Applied Materials, Inc. Multiple beam scanner for an inspection system
US6369888B1 (en) * 1999-11-17 2002-04-09 Applied Materials, Inc. Method and apparatus for article inspection including speckle reduction
US6643007B2 (en) * 2000-07-12 2003-11-04 Tuan Le Apparatus for optical inspection of a working surface having a dynamic reflective spatial attenuator
US6538730B2 (en) * 2001-04-06 2003-03-25 Kla-Tencor Technologies Corporation Defect detection system
JP3210654B1 (en) * 2001-05-02 2001-09-17 レーザーテック株式会社 Optical scanning device and defect detection device
US7088443B2 (en) * 2002-02-11 2006-08-08 Kla-Tencor Technologies Corporation System for detecting anomalies and/or features of a surface
US7130039B2 (en) 2002-04-18 2006-10-31 Kla-Tencor Technologies Corporation Simultaneous multi-spot inspection and imaging
US6781686B2 (en) * 2002-06-19 2004-08-24 The Boeing Company Femtosecond optical surface imaging
US6861660B2 (en) * 2002-07-29 2005-03-01 Applied Materials, Inc. Process and assembly for non-destructive surface inspection

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4464050A (en) * 1981-02-07 1984-08-07 Olympus Optical Co., Ltd. Apparatus for detecting optically defects
US5274434A (en) * 1990-04-02 1993-12-28 Hitachi, Ltd. Method and apparatus for inspecting foreign particles on real time basis in semiconductor mass production line
US5528360A (en) * 1991-09-20 1996-06-18 Canon Kabushiki Kaisha Surface-condition inspection apparatus
US6369886B2 (en) * 1996-08-23 2002-04-09 Asahi Kogaku Kogyo Kabushiki Kaisha Pattern reading apparatus
US6208411B1 (en) * 1998-09-28 2001-03-27 Kla-Tencor Corporation Massively parallel inspection and imaging system

Also Published As

Publication number Publication date
US20030210392A1 (en) 2003-11-13
WO2003089872A2 (en) 2003-10-30
US20070153265A1 (en) 2007-07-05
US7130039B2 (en) 2006-10-31
US20090161096A1 (en) 2009-06-25
US7492451B2 (en) 2009-02-17
AU2003234134A1 (en) 2003-11-03
US8817248B2 (en) 2014-08-26
AU2003234134A8 (en) 2003-11-03
WO2003089872A9 (en) 2004-12-23

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