WO2003092121A3 - Three dimensional, high speed back-panel interconnection system - Google Patents

Three dimensional, high speed back-panel interconnection system Download PDF

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Publication number
WO2003092121A3
WO2003092121A3 PCT/US2003/013072 US0313072W WO03092121A3 WO 2003092121 A3 WO2003092121 A3 WO 2003092121A3 US 0313072 W US0313072 W US 0313072W WO 03092121 A3 WO03092121 A3 WO 03092121A3
Authority
WO
WIPO (PCT)
Prior art keywords
bridge
panel
interconnection system
plane
interconnection
Prior art date
Application number
PCT/US2003/013072
Other languages
French (fr)
Other versions
WO2003092121A2 (en
Inventor
Timothy A Lemke
Original Assignee
Broadside Technology Llc
Timothy A Lemke
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Broadside Technology Llc, Timothy A Lemke filed Critical Broadside Technology Llc
Priority to AU2003234253A priority Critical patent/AU2003234253A1/en
Publication of WO2003092121A2 publication Critical patent/WO2003092121A2/en
Publication of WO2003092121A3 publication Critical patent/WO2003092121A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1439—Back panel mother boards
    • H05K7/1444—Complex or three-dimensional-arrangements; Stepped or dual mother boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections

Abstract

A back-panel interconnection system useful in telecommunication, data communication and essentially any processing equipment capable of communicating data at a rate of 10GB/s and beyond. Included are systems and methods for constructing an interconnection system using an independent interconnection element or bridge (1) that is used to interconnect the various elements of a system. The plane of the bridge (1) may be perpendicular to the plane of the back-panel (2). The plane of the bridge may have projections (3) that are at right angles to the long axis of the bridge and which projects through an opening (4) in the back-panel (2) and extend through to the other side. An assembly comprising a header (7) and the bridge is capable of being mated to a printed circuit board (11) or cable connector, thus establishing a direct high speed interconnection between two components of the back-panel interconnection system and eliminating problematic connector mounting holes.
PCT/US2003/013072 2002-04-25 2003-04-25 Three dimensional, high speed back-panel interconnection system WO2003092121A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003234253A AU2003234253A1 (en) 2002-04-25 2003-04-25 Three dimensional, high speed back-panel interconnection system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37615202P 2002-04-25 2002-04-25
US60/376,152 2002-04-25

Publications (2)

Publication Number Publication Date
WO2003092121A2 WO2003092121A2 (en) 2003-11-06
WO2003092121A3 true WO2003092121A3 (en) 2004-04-01

Family

ID=29270768

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/013072 WO2003092121A2 (en) 2002-04-25 2003-04-25 Three dimensional, high speed back-panel interconnection system

Country Status (2)

Country Link
AU (1) AU2003234253A1 (en)
WO (1) WO2003092121A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7654870B2 (en) 2008-02-11 2010-02-02 Z-Plane, Inc. Interconnection assembly for printed circuit boards
JP5426259B2 (en) * 2009-07-10 2014-02-26 アルプス電気株式会社 Steering module
US8827746B2 (en) 2011-08-01 2014-09-09 Z-Plane, Inc. Crosstalk reduction
US20230380099A1 (en) * 2022-05-17 2023-11-23 Microsoft Technology Licensing, Llc Systems with at least one multi-finger planar circuit board for interconnecting multiple chassis

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3963301A (en) * 1974-12-20 1976-06-15 Sperry Rand Corporation Mother-board interconnection system
US4558916A (en) * 1982-09-29 1985-12-17 Karl Hehl Multi-pin plug connection system for electronic control unit
US4835394A (en) * 1987-07-31 1989-05-30 General Electric Company Cable assembly for an electrical signal transmission system
US5008484A (en) * 1988-04-06 1991-04-16 Hans Wagener Assembly kit for a busbar system
US5245613A (en) * 1990-05-21 1993-09-14 Kabushiki Kaisha Toshiba Digital signal time-division multiplex apparatus
US6364713B1 (en) * 2000-05-23 2002-04-02 Hon Hai Precision Ind. Co., Ltd. Electrical connector adapter assembly

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3963301A (en) * 1974-12-20 1976-06-15 Sperry Rand Corporation Mother-board interconnection system
US4558916A (en) * 1982-09-29 1985-12-17 Karl Hehl Multi-pin plug connection system for electronic control unit
US4835394A (en) * 1987-07-31 1989-05-30 General Electric Company Cable assembly for an electrical signal transmission system
US5008484A (en) * 1988-04-06 1991-04-16 Hans Wagener Assembly kit for a busbar system
US5245613A (en) * 1990-05-21 1993-09-14 Kabushiki Kaisha Toshiba Digital signal time-division multiplex apparatus
US6364713B1 (en) * 2000-05-23 2002-04-02 Hon Hai Precision Ind. Co., Ltd. Electrical connector adapter assembly

Also Published As

Publication number Publication date
AU2003234253A1 (en) 2003-11-10
WO2003092121A2 (en) 2003-11-06
AU2003234253A8 (en) 2003-11-10

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