WO2003093524A3 - Apparatus and method for regulating the electrical power applied to a substrate during immersion - Google Patents
Apparatus and method for regulating the electrical power applied to a substrate during immersion Download PDFInfo
- Publication number
- WO2003093524A3 WO2003093524A3 PCT/US2003/013111 US0313111W WO03093524A3 WO 2003093524 A3 WO2003093524 A3 WO 2003093524A3 US 0313111 W US0313111 W US 0313111W WO 03093524 A3 WO03093524 A3 WO 03093524A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate during
- regulating
- electrical power
- power applied
- during immersion
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Abstract
A method and apparatus for providing a uniform current density across an immersed surface of a substrate during an immersion process. The method includes the steps of determining a time varying area of an immersed portion of the substrate during the immersion process, and supplying a time varying current to the substrate during the immersion process, wherein the time varying current is proportional to the time varying area and is configured to provide a constant current density to the immersed portion of the substrate.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/135,546 US6911136B2 (en) | 2002-04-29 | 2002-04-29 | Method for regulating the electrical power applied to a substrate during an immersion process |
US10/135,546 | 2002-04-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003093524A2 WO2003093524A2 (en) | 2003-11-13 |
WO2003093524A3 true WO2003093524A3 (en) | 2004-03-18 |
Family
ID=29249478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/013111 WO2003093524A2 (en) | 2002-04-29 | 2003-04-28 | Apparatus and method for regulating the electrical power applied to a substrate during immersion |
Country Status (3)
Country | Link |
---|---|
US (1) | US6911136B2 (en) |
TW (1) | TWI270582B (en) |
WO (1) | WO2003093524A2 (en) |
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US8308931B2 (en) * | 2006-08-16 | 2012-11-13 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US8475636B2 (en) | 2008-11-07 | 2013-07-02 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US20070039827A1 (en) * | 2003-12-09 | 2007-02-22 | Acm Reasearch, Inc. | Measuring alignment between a wafer chuck and polishing/plating receptacle |
US8623193B1 (en) | 2004-06-16 | 2014-01-07 | Novellus Systems, Inc. | Method of electroplating using a high resistance ionic current source |
US20060237319A1 (en) * | 2005-04-22 | 2006-10-26 | Akira Furuya | Planting process and manufacturing process for semiconductor device thereby, and plating apparatus |
US9822461B2 (en) | 2006-08-16 | 2017-11-21 | Novellus Systems, Inc. | Dynamic current distribution control apparatus and method for wafer electroplating |
US11225727B2 (en) | 2008-11-07 | 2022-01-18 | Lam Research Corporation | Control of current density in an electroplating apparatus |
US10011917B2 (en) | 2008-11-07 | 2018-07-03 | Lam Research Corporation | Control of current density in an electroplating apparatus |
US8262871B1 (en) | 2008-12-19 | 2012-09-11 | Novellus Systems, Inc. | Plating method and apparatus with multiple internally irrigated chambers |
US9385035B2 (en) * | 2010-05-24 | 2016-07-05 | Novellus Systems, Inc. | Current ramping and current pulsing entry of substrates for electroplating |
US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
US8795480B2 (en) | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
TWI550139B (en) | 2011-04-04 | 2016-09-21 | 諾菲勒斯系統公司 | Electroplating apparatus for tailored uniformity profile |
US9028666B2 (en) | 2011-05-17 | 2015-05-12 | Novellus Systems, Inc. | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath |
US9909228B2 (en) | 2012-11-27 | 2018-03-06 | Lam Research Corporation | Method and apparatus for dynamic current distribution control during electroplating |
US9670588B2 (en) | 2013-05-01 | 2017-06-06 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
US9449808B2 (en) | 2013-05-29 | 2016-09-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
US9752248B2 (en) | 2014-12-19 | 2017-09-05 | Lam Research Corporation | Methods and apparatuses for dynamically tunable wafer-edge electroplating |
US9567685B2 (en) | 2015-01-22 | 2017-02-14 | Lam Research Corporation | Apparatus and method for dynamic control of plated uniformity with the use of remote electric current |
US9816194B2 (en) | 2015-03-19 | 2017-11-14 | Lam Research Corporation | Control of electrolyte flow dynamics for uniform electroplating |
US10014170B2 (en) | 2015-05-14 | 2018-07-03 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
US9988733B2 (en) | 2015-06-09 | 2018-06-05 | Lam Research Corporation | Apparatus and method for modulating azimuthal uniformity in electroplating |
US10023969B2 (en) | 2016-05-24 | 2018-07-17 | Applied Materials, Inc. | Plating power supply with headroom control and ethercat interface |
US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
JP7079224B2 (en) * | 2019-06-14 | 2022-06-01 | 株式会社荏原製作所 | Non-volatile storage medium for storing plating methods, plating equipment, and programs |
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-
2002
- 2002-04-29 US US10/135,546 patent/US6911136B2/en not_active Expired - Lifetime
-
2003
- 2003-04-28 WO PCT/US2003/013111 patent/WO2003093524A2/en not_active Application Discontinuation
- 2003-04-29 TW TW092110081A patent/TWI270582B/en not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5256369A (en) * | 1975-11-05 | 1977-05-09 | Nippon Electric Co | Device for plating printed circuit substrate |
US4129480A (en) * | 1976-12-24 | 1978-12-12 | Eric Robert | Method and apparatus for determining the immersed surface area of one of the electrodes of an electro-chemical bath |
US6258220B1 (en) * | 1998-11-30 | 2001-07-10 | Applied Materials, Inc. | Electro-chemical deposition system |
EP1160846A2 (en) * | 2000-05-02 | 2001-12-05 | Applied Materials, Inc. | Method of application of electrical biasing to enhance metal deposition |
Non-Patent Citations (1)
Title |
---|
DATABASE WPI Section Ch Week 198335, Derwent World Patents Index; Class L03, AN 1983-750986, XP002258114 * |
Also Published As
Publication number | Publication date |
---|---|
WO2003093524A2 (en) | 2003-11-13 |
US6911136B2 (en) | 2005-06-28 |
TWI270582B (en) | 2007-01-11 |
US20030201166A1 (en) | 2003-10-30 |
TW200404106A (en) | 2004-03-16 |
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