WO2003096777A3 - Adapter for surface mount devices to through hole applications - Google Patents

Adapter for surface mount devices to through hole applications Download PDF

Info

Publication number
WO2003096777A3
WO2003096777A3 PCT/US2003/015324 US0315324W WO03096777A3 WO 2003096777 A3 WO2003096777 A3 WO 2003096777A3 US 0315324 W US0315324 W US 0315324W WO 03096777 A3 WO03096777 A3 WO 03096777A3
Authority
WO
WIPO (PCT)
Prior art keywords
plated
holes
board
output signal
input
Prior art date
Application number
PCT/US2003/015324
Other languages
French (fr)
Other versions
WO2003096777A2 (en
Inventor
Richard A Olzak
Tehmosp Khan
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Priority to AU2003230404A priority Critical patent/AU2003230404A1/en
Publication of WO2003096777A2 publication Critical patent/WO2003096777A2/en
Publication of WO2003096777A3 publication Critical patent/WO2003096777A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10075—Non-printed oscillator
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

An electrical adapter formed on a printed wiring board having opposing primary and secondary sides and at least one printed circuit having a plurality of solder pads arranged to interconnect with input/output signal pins of a surface mount technology (SMT) device and a plurality of plated vias arranged to interconnect with input/output signal pins of one or more discrete electrical components; one or more plated through holes extending between the primary and secondary sides of the board and electrically coupled to the printed circuit, the plated through holes being positioned in a pattern structured to match plated through holes in a parent circuit board; and a plurality of input/output signal interconnect pins mechanically and electrically coupled to the plated holes and extending a distance beyond the secondary side of the board.
PCT/US2003/015324 2002-05-09 2003-05-08 Adapter for surface mount devices to through hole applications WO2003096777A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003230404A AU2003230404A1 (en) 2002-05-09 2003-05-08 Adapter for surface mount devices to through hole applications

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37972202P 2002-05-09 2002-05-09
US60/379,722 2002-05-09

Publications (2)

Publication Number Publication Date
WO2003096777A2 WO2003096777A2 (en) 2003-11-20
WO2003096777A3 true WO2003096777A3 (en) 2004-01-15

Family

ID=29420555

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/015324 WO2003096777A2 (en) 2002-05-09 2003-05-08 Adapter for surface mount devices to through hole applications

Country Status (3)

Country Link
US (1) US6796807B2 (en)
AU (1) AU2003230404A1 (en)
WO (1) WO2003096777A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8444436B1 (en) * 2004-07-01 2013-05-21 Amphenol Corporation Midplane especially applicable to an orthogonal architecture electronic system
WO2006074239A2 (en) * 2005-01-05 2006-07-13 Xtremedata, Inc. Systems and methods for providing co-processors to computing systems
US20120190247A1 (en) 2011-01-20 2012-07-26 Earl Anthony Daughtry Two-Piece Connector Assembly
US20130196539A1 (en) * 2012-01-12 2013-08-01 John Mezzalingua Associates, Inc. Electronics Packaging Assembly with Dielectric Cover
US8902605B2 (en) 2012-06-13 2014-12-02 International Business Machines Corporation Adapter for plated through hole mounting of surface mount component
WO2022266376A1 (en) * 2021-06-17 2022-12-22 Nubis Communications, Inc. Communication systems having pluggable modules

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5036431A (en) * 1988-03-03 1991-07-30 Ibiden Co., Ltd. Package for surface mounted components
US5625944A (en) * 1992-12-30 1997-05-06 Interconnect Systems, Inc. Methods for interconnecting integrated circuits
US5758413A (en) * 1995-09-25 1998-06-02 International Business Machines Corporation Method of manufacturing a multiple layer circuit board die carrier with fine dimension stacked vias
US6046911A (en) * 1994-03-07 2000-04-04 International Business Machines Corporation Dual substrate package assembly having dielectric member engaging contacts at only three locations

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3865454A (en) * 1973-07-18 1975-02-11 Loral Corp Adapter for high density connectors
US5438481A (en) * 1987-11-17 1995-08-01 Advanced Interconnections Corporation Molded-in lead frames
US4872844A (en) * 1988-07-08 1989-10-10 Amp Incorporated Component-carrying adapter for chip carrier socket
US5410452A (en) * 1994-02-18 1995-04-25 Aries Electronics, Inc. Printed circuit board electrical adaptor pin
US5564932A (en) * 1994-11-14 1996-10-15 Castleman; Mark-Andrew B. Customizeable interconnect device for stacking electrical components of varying configuration
US5590029A (en) * 1995-01-12 1996-12-31 Dell Usa, L.P. Circuit board SMT device mounting apparatus
US5850693A (en) * 1995-01-31 1998-12-22 Berg Technology, Inc. Method of manufacturing an array of surface mount contacts

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5036431A (en) * 1988-03-03 1991-07-30 Ibiden Co., Ltd. Package for surface mounted components
US5625944A (en) * 1992-12-30 1997-05-06 Interconnect Systems, Inc. Methods for interconnecting integrated circuits
US6046911A (en) * 1994-03-07 2000-04-04 International Business Machines Corporation Dual substrate package assembly having dielectric member engaging contacts at only three locations
US5758413A (en) * 1995-09-25 1998-06-02 International Business Machines Corporation Method of manufacturing a multiple layer circuit board die carrier with fine dimension stacked vias

Also Published As

Publication number Publication date
US20030211759A1 (en) 2003-11-13
WO2003096777A2 (en) 2003-11-20
AU2003230404A8 (en) 2003-11-11
AU2003230404A1 (en) 2003-11-11
US6796807B2 (en) 2004-09-28

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