WO2003101154A1 - A controllable light emitting diode - Google Patents

A controllable light emitting diode Download PDF

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Publication number
WO2003101154A1
WO2003101154A1 PCT/EP2003/005481 EP0305481W WO03101154A1 WO 2003101154 A1 WO2003101154 A1 WO 2003101154A1 EP 0305481 W EP0305481 W EP 0305481W WO 03101154 A1 WO03101154 A1 WO 03101154A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting diode
die
control
controller
Prior art date
Application number
PCT/EP2003/005481
Other languages
French (fr)
Inventor
Lee Robinson
Original Assignee
Roke Manor Research Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roke Manor Research Limited filed Critical Roke Manor Research Limited
Priority to EP03755131A priority Critical patent/EP1510109A1/en
Priority to AU2003242572A priority patent/AU2003242572A1/en
Publication of WO2003101154A1 publication Critical patent/WO2003101154A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • H05B47/175—Controlling the light source by remote control
    • H05B47/18—Controlling the light source by remote control via data-bus transmission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light

Abstract

A light emitting diode (1) is provided which includes a controller (4) encapsulated with a light emitting die (2). With suitable connections it is possible to program the LED to illuminate or switch off upon receipt of an addressed command. This simplifies the connections required to be provided to an array of LEDs.

Description

A CONTROLLABLE LIGHT EMITTING DIODE
This invention relates to a light emitting diode.
Light emitting diodes (LED) are solid-state devices which are used as light sources in displays. They are typically two lead devices which when driven by a suitable supply may be made to emit light. A problem occurs with the use of such LEDs when it is desired to selectively energise one or some of those in the display. In order to cater for selective energisation it is necessary to provide a multiplicity of connecting wires.
The present invention arose from a realisation by the inventor that it might be possible to overcome or at least alleviate some of the drawbacks of prior arrangements.
According to the invention there is provided a light emitting diode including a light emitting die and a controller for the die which controller being responsive to an address on a control line to selectively operate the light emitting die.
By operate it is meant to control an aspect of the LED's function which could include for example, on or off, an increase or decrease in intensity or a variation to the colour or wavelength of the radiation produced.
Specific embodiments of the light emitting diode will now be described by way of example only with reference to the drawings in which:
Figures 1 to 4 show longitudinal sections through different embodiments of the invention; and
Figure 5 shows a control signal structure. In the description of the embodiments like components are given the same reference numerals. As is shown in figure 1, a light emitting diode (led) 1 comprises a light emitting diode die 2 of AlInGaP material bonded to a metal cathode leg 3 (other materials may be used) , a CMOS control IC 4 wired to the die 2 by a connection 5 and metal legs 6. The components are encapsulated in an epoxy encapsulation compound 7 of standard type to produce a unitary component. The epoxy compound may be clear or coloured as required for the particular application.
The first embodiment shown in figure 1 has three metals legs 6 which protrude beyond the encapsulation. The first leg 6a is a ground connection to the led die 2. The second leg 6b is a data and clock connection to the control IC 4 and the third leg 6c is a power connection to the control IC 4. A further connection 8 to the control IC 4 is provided between the metal leg and the control IC 4. This further connection connects the control IC 4 to the ground to ensure that the control IC is provided with a complete power connection between supply and ground.
In the second embodiment two metal legs are provided. The first of these 6a is identical to that disclosed in the first embodiment. The second leg 6d is a connection to power, clock and data. The third embodiment shown in figure 3 has the same two-leg arrangement as the figure 2 embodiment. However, the controller IC 4 is mounted on the metal cathode underneath the led die 2. Thus in this embodiment there is a direct connection to the ground leg 6 a and a wire link 10 from the dower clock data leg 6d to the control IC 4.
The last embodiment is provided with four metal legs. The first leg 6a provides a connection to ground. The second leg providing a connection to data. The third leg 6f providing a connection to a clock and the fourth leg 6c providing a connection to power. The legs 6e, f and g are connected to the control IC4 and a power connection made to the led die 2 by wire link 5. In essence all the embodiments provide a led controller and a led die in one encapsulation.
The way in which the control IC 4 operates to control the LED will now be described. This description is applicable to all the embodiments.
The control IC includes a programmable memory area which in use holds a binary value of its address. The address is programmed during manufacture although it may also be possible to make it programmable at a later stage for example in use or during installation of the led into other equipment such as a display. In order to instruct the control IC and hence to affect the operation of the led die itself a data signal is applied to a data bus (not shown) to which the data leg is connected.
The data signal 50 is shown in figure 5 and comprises a number of fields. The first field 51 is a start field and the last field 52 is a stop field. These include a sequence to indicate that a message starts and ends to enable a control IC to identify the messages in a stream of such messages. The second field 53 is a destination address field. This field contains the address of the intended LED control IC. A number of further data fields 54 are provided which may include error checking information or other signalling data. The next significant field is an address update field 55. This field contains a new address to be used by the control IC if the following program set field 56 is set to 1. This enables the re-programming of each led if required. Field is the on-off field. If the contents of this field are a 1 then the control IC switches the LED die on. If zero the LED die is switched off.
The other data fields enable other control functions such as the setting of other led die properties. For example, it may be possible to thereby control the output intensity or the wavelength or colour of the light emitted.
The fourth embodiment is controlled in an asynchronous manner requiring the extra leg for the external clock to the control IC.

Claims

Claims
Claim 1. A light emitting diode including a light emitting die and a controller for the die which controller being responsive to an address on a control line to selectively operate the light emitting die.
Claim 2. A light emitting diode as claimed in claim 1 wherein the controller is provided as an integrated circuit.
Claim 3. A light emitting diode as claimed in claim 1 or claim 2 wherein the light emitting die is provided with legs to facilitate electrical connection.
Claim 4. A light emitting die as claimed in claim 3 wherein at least one of the legs provides in use a data connection.
Claim 5. A light emitting diode as claimed in anyone of claims 1 to 4 wherein the light emitting die is encapsulated.
Claim 6. A light emitting diode as claimed in claim 5 wherein the controller is encapsulated with the die.
Claim 7. A light emitting diode as claimed in any preceding claim wherein the legs provide a ground, a power, a clock and a data connection.
Claim 8. A light emitting diode substantially as hereinbefore described with reference to, and as illustrated by, figure 1 or figure 2 or figure 3 or figure 4.
PCT/EP2003/005481 2002-05-28 2003-05-22 A controllable light emitting diode WO2003101154A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP03755131A EP1510109A1 (en) 2002-05-28 2003-05-22 A controllable light emitting diode
AU2003242572A AU2003242572A1 (en) 2002-05-28 2003-05-22 A controllable light emitting diode

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0212251A GB2389229A (en) 2002-05-28 2002-05-28 A light emitting diode
GB0212251.3 2002-05-28

Publications (1)

Publication Number Publication Date
WO2003101154A1 true WO2003101154A1 (en) 2003-12-04

Family

ID=9937551

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2003/005481 WO2003101154A1 (en) 2002-05-28 2003-05-22 A controllable light emitting diode

Country Status (4)

Country Link
EP (1) EP1510109A1 (en)
AU (1) AU2003242572A1 (en)
GB (1) GB2389229A (en)
WO (1) WO2003101154A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007073408A1 (en) * 2005-12-21 2007-06-28 Sony Ericsson Mobile Communications Ab Led module with integrated controller

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5410328A (en) * 1994-03-28 1995-04-25 Trans-Lux Corporation Replaceable intelligent pixel module for large-scale LED displays
DE20018865U1 (en) * 2000-11-07 2001-02-01 Kegelbahntechnik Dortmund Gmbh Lighting system
US20010032985A1 (en) * 1999-12-22 2001-10-25 Bhat Jerome C. Multi-chip semiconductor LED assembly
US20020047628A1 (en) * 1997-08-26 2002-04-25 Frederick Morgan Methods and apparatus for controlling devices in a networked lighting system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3035944C2 (en) * 1980-09-24 1983-06-01 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Semiconductor optical display device
US5304812A (en) * 1990-11-21 1994-04-19 Sharp Kabushiki Kaisha Optoelectronic device, information apparatus and data transmission system using optoelectronic device for simplifying wirings and reducing size, and method of controlling the optoelectronic device
JP3297896B2 (en) * 1994-09-30 2002-07-02 タキロン株式会社 Data distributor for dot matrix type LED display device
JP3256488B2 (en) * 1998-05-11 2002-02-12 エヌオーケーイージーアンドジーオプトエレクトロニクス株式会社 Character display device
HU0000752D0 (en) * 2000-02-21 2000-04-28 Pixel element for three-dimensional screen
US7292209B2 (en) * 2000-08-07 2007-11-06 Rastar Corporation System and method of driving an array of optical elements

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5410328A (en) * 1994-03-28 1995-04-25 Trans-Lux Corporation Replaceable intelligent pixel module for large-scale LED displays
US20020047628A1 (en) * 1997-08-26 2002-04-25 Frederick Morgan Methods and apparatus for controlling devices in a networked lighting system
US20010032985A1 (en) * 1999-12-22 2001-10-25 Bhat Jerome C. Multi-chip semiconductor LED assembly
DE20018865U1 (en) * 2000-11-07 2001-02-01 Kegelbahntechnik Dortmund Gmbh Lighting system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007073408A1 (en) * 2005-12-21 2007-06-28 Sony Ericsson Mobile Communications Ab Led module with integrated controller

Also Published As

Publication number Publication date
GB0212251D0 (en) 2002-07-10
EP1510109A1 (en) 2005-03-02
AU2003242572A1 (en) 2003-12-12
GB2389229A (en) 2003-12-03

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