WO2003106927A3 - Passive temperature compensation technique for mems devices - Google Patents

Passive temperature compensation technique for mems devices Download PDF

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Publication number
WO2003106927A3
WO2003106927A3 PCT/US2003/013308 US0313308W WO03106927A3 WO 2003106927 A3 WO2003106927 A3 WO 2003106927A3 US 0313308 W US0313308 W US 0313308W WO 03106927 A3 WO03106927 A3 WO 03106927A3
Authority
WO
WIPO (PCT)
Prior art keywords
temperature compensation
compensation technique
passive temperature
mems devices
diode
Prior art date
Application number
PCT/US2003/013308
Other languages
French (fr)
Other versions
WO2003106927A2 (en
Inventor
William Platt
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Priority to AU2003267956A priority Critical patent/AU2003267956B2/en
Priority to CA002484323A priority patent/CA2484323A1/en
Priority to JP2004513700A priority patent/JP2005524856A/en
Priority to EP03748903A priority patent/EP1499855A2/en
Publication of WO2003106927A2 publication Critical patent/WO2003106927A2/en
Publication of WO2003106927A3 publication Critical patent/WO2003106927A3/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis

Abstract

A MEMS sensor using a passive temperature compensation technique may provide an uncompensated sense output. Additionally, a circuit coupled to the MEMS sensor may include a diode having a voltage drop. A compensated sense output may be formed by combining the uncompensated sense output with a diode output that is proportional to the voltage drop across the diode.
PCT/US2003/013308 2002-04-30 2003-04-29 Passive temperature compensation technique for mems devices WO2003106927A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2003267956A AU2003267956B2 (en) 2002-04-30 2003-04-29 Passive temperature compensation techqnique for MEMS devices
CA002484323A CA2484323A1 (en) 2002-04-30 2003-04-29 Passive temperature compensation technique for mems devices
JP2004513700A JP2005524856A (en) 2002-04-30 2003-04-29 Passive temperature compensation for MEMS sensors
EP03748903A EP1499855A2 (en) 2002-04-30 2003-04-29 Passive temperature compensation technique for mems devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/135,538 2002-04-30
US10/135,538 US6959583B2 (en) 2002-04-30 2002-04-30 Passive temperature compensation technique for MEMS devices

Publications (2)

Publication Number Publication Date
WO2003106927A2 WO2003106927A2 (en) 2003-12-24
WO2003106927A3 true WO2003106927A3 (en) 2004-02-26

Family

ID=29249474

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/013308 WO2003106927A2 (en) 2002-04-30 2003-04-29 Passive temperature compensation technique for mems devices

Country Status (6)

Country Link
US (1) US6959583B2 (en)
EP (1) EP1499855A2 (en)
JP (1) JP2005524856A (en)
AU (1) AU2003267956B2 (en)
CA (1) CA2484323A1 (en)
WO (1) WO2003106927A2 (en)

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DE60319770T2 (en) * 2002-05-29 2009-04-23 Imec Vzw, Interuniversitair Microelectronica Centrum Vzw Apparatus and method for determining the performance of micromachines or microelectromechanical components
US7253615B2 (en) 2004-05-05 2007-08-07 General Electric Company Microelectromechanical system sensor and method for using
US7307540B2 (en) * 2004-06-08 2007-12-11 General Electric Company Systems, apparatus, and methods having a mechanical logic function in a microelectromechanical system sensor
EP1640726B1 (en) 2004-09-22 2009-09-09 STMicroelectronics S.r.l. Micro-electromechanical structure with self-compensation of the thermal drifts caused by thermomechanical stress
EP1645847B1 (en) 2004-10-08 2014-07-02 STMicroelectronics Srl Temperature compensated micro-electromechanical device and method of temperature compensation in a micro-electromechanical device
GB0423780D0 (en) * 2004-10-26 2004-12-01 Trade & Industry Sec Dep For Lateral calibration device
CN100397041C (en) * 2004-11-12 2008-06-25 中国科学院上海微系统与信息技术研究所 Piezoresistive micro mechanical gyro with micro beam straight pull and vertical compression structure and fabricating method thereof
US7308827B2 (en) * 2005-03-02 2007-12-18 United States Of America As Represented By The Secretary Of The Army Integrated gyroscope and temperature sensor
US7258010B2 (en) * 2005-03-09 2007-08-21 Honeywell International Inc. MEMS device with thinned comb fingers
US7302848B2 (en) * 2005-03-10 2007-12-04 The Charles Stark Draper Laboratory, Inc. Force compensated comb drive
US7210337B1 (en) * 2005-10-17 2007-05-01 Honeywell International Inc. MEMS sensor package leak test
JP5006268B2 (en) * 2008-06-10 2012-08-22 日本電信電話株式会社 Sensor node chip, sensor node system, and receiver
US8187902B2 (en) 2008-07-09 2012-05-29 The Charles Stark Draper Laboratory, Inc. High performance sensors and methods for forming the same
US8640552B2 (en) 2011-09-06 2014-02-04 Honeywell International Inc. MEMS airflow sensor die incorporating additional circuitry on the die
CN103207848B (en) * 2013-03-07 2016-01-06 中国兵器工业集团第二一四研究所苏州研发中心 A kind of communication means being applicable to MEMS gyro coefficient and loading
RU2554624C1 (en) * 2014-02-12 2015-06-27 Акционерное общество "Концерн "Центральный научно-исследовательский институт "Электроприбор" Method of measurement of physical non-electrical quantity
CN105093239B (en) * 2015-08-21 2017-07-28 西安空间无线电技术研究所 A kind of Time Delay of Systems error calibration method based on temperature-compensating
CN106370173B (en) * 2016-08-17 2019-05-24 中国船舶重工集团公司第七0七研究所 A kind of modeling of lasergyro model of temperature compensation and verification method
US11186479B2 (en) 2019-08-21 2021-11-30 Invensense, Inc. Systems and methods for operating a MEMS device based on sensed temperature gradients
US11174153B2 (en) 2019-08-21 2021-11-16 Invensense, Inc. Package level thermal gradient sensing
US11073531B2 (en) 2019-08-21 2021-07-27 Invensense, Inc. Vertical thermal gradient compensation in a z-axis MEMS accelerometer
DE102019217333A1 (en) * 2019-11-11 2021-05-12 Robert Bosch Gmbh Method for determining at least one temperature compensation parameter to compensate for temperature influences on the measured values of a sensor system

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EP0661521A1 (en) * 1993-12-28 1995-07-05 Murata Manufacturing Co., Ltd. Oscillation circuit
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Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5349855A (en) * 1992-04-07 1994-09-27 The Charles Stark Draper Laboratory, Inc. Comb drive micromechanical tuning fork gyro
EP0661521A1 (en) * 1993-12-28 1995-07-05 Murata Manufacturing Co., Ltd. Oscillation circuit
EP0675340A1 (en) * 1994-03-30 1995-10-04 Murata Manufacturing Co., Ltd. Vibrating gyroscope detecting system
US5895851A (en) * 1994-11-17 1999-04-20 Nippondenso Co., Ltd. Semiconductor yaw rate sensor with a vibrating movable section with vertical and horizontal displacement detection
US6251698B1 (en) * 1997-05-23 2001-06-26 Sextant Avionique Method for making a machined silicon micro-sensor
US5920012A (en) * 1998-06-16 1999-07-06 Boeing North American Micromechanical inertial sensor
WO2001027026A1 (en) * 1999-10-08 2001-04-19 Hahn-Schickard Gesellschaft Für Angewandte Forschung E.V. Electromechanical component and method for producing said component

Also Published As

Publication number Publication date
JP2005524856A (en) 2005-08-18
AU2003267956B2 (en) 2006-04-27
AU2003267956A1 (en) 2003-12-31
CA2484323A1 (en) 2003-12-24
US20030200785A1 (en) 2003-10-30
WO2003106927A2 (en) 2003-12-24
EP1499855A2 (en) 2005-01-26
US6959583B2 (en) 2005-11-01

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