WO2004008163A3 - Assembly for connecting a test device to an object to be tested - Google Patents

Assembly for connecting a test device to an object to be tested Download PDF

Info

Publication number
WO2004008163A3
WO2004008163A3 PCT/US2003/022125 US0322125W WO2004008163A3 WO 2004008163 A3 WO2004008163 A3 WO 2004008163A3 US 0322125 W US0322125 W US 0322125W WO 2004008163 A3 WO2004008163 A3 WO 2004008163A3
Authority
WO
WIPO (PCT)
Prior art keywords
assembly
contactor
clamping
test component
tested
Prior art date
Application number
PCT/US2003/022125
Other languages
French (fr)
Other versions
WO2004008163A2 (en
Inventor
Donald P Ii Richmond
Jovan Jovanovic
Frank O Uher
Original Assignee
Aehr Test Systems
Donald P Ii Richmond
Jovan Jovanovic
Frank O Uher
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/197,104 external-priority patent/US6867608B2/en
Priority claimed from US10/197,133 external-priority patent/US6853209B1/en
Application filed by Aehr Test Systems, Donald P Ii Richmond, Jovan Jovanovic, Frank O Uher filed Critical Aehr Test Systems
Priority to EP03764698A priority Critical patent/EP1523685A2/en
Priority to AU2003249276A priority patent/AU2003249276A1/en
Priority to JP2004521866A priority patent/JP2005533254A/en
Publication of WO2004008163A2 publication Critical patent/WO2004008163A2/en
Publication of WO2004008163A3 publication Critical patent/WO2004008163A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

Abstract

In one embodiment, the invention provides a test assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component. The assembly comprises a contactor assembly to interconnect with the test component, a probe assembly to mechanically support the contactor assembly and electrically connected the contactor assembly to the testing machine, and a clamping mechanism comprising a first clamping member and a second clamping member, the clamping members being urged together to exert a clamping force to deform contactor bumps of an electrical connection between the probe assembly and the contactor assembly.
PCT/US2003/022125 2002-07-16 2003-07-15 Assembly for connecting a test device to an object to be tested WO2004008163A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP03764698A EP1523685A2 (en) 2002-07-16 2003-07-15 Assembly for connecting a test device to an object to be tested
AU2003249276A AU2003249276A1 (en) 2002-07-16 2003-07-15 Assembly for connecting a test device to an object to be tested
JP2004521866A JP2005533254A (en) 2002-07-16 2003-07-15 Assembly for electrically connecting a device under test to a test machine for testing an electrical circuit on the device under test

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/197,104 US6867608B2 (en) 2002-07-16 2002-07-16 Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component
US10/197,133 2002-07-16
US10/197,104 2002-07-16
US10/197,133 US6853209B1 (en) 2002-07-16 2002-07-16 Contactor assembly for testing electrical circuits

Publications (2)

Publication Number Publication Date
WO2004008163A2 WO2004008163A2 (en) 2004-01-22
WO2004008163A3 true WO2004008163A3 (en) 2004-06-10

Family

ID=30117843

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/022125 WO2004008163A2 (en) 2002-07-16 2003-07-15 Assembly for connecting a test device to an object to be tested

Country Status (6)

Country Link
EP (1) EP1523685A2 (en)
JP (1) JP2005533254A (en)
KR (1) KR20050029215A (en)
CN (1) CN100523826C (en)
AU (1) AU2003249276A1 (en)
WO (1) WO2004008163A2 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100956472B1 (en) 2005-04-27 2010-05-07 에어 테스트 시스템즈 Appratus for testing electronic devices
CN101051067B (en) * 2006-04-03 2010-08-11 航天科工防御技术研究试验中心 Comprehensive detection control device design method for electric connector
MY152599A (en) 2007-02-14 2014-10-31 Eles Semiconductor Equipment S P A Test of electronic devices at package level using test boards without sockets
EP1959265A1 (en) 2007-02-16 2008-08-20 Eles Semiconductor Equipment S.P.A. Testing integrated circuits on a wafer with a cartridge leaving exposed a surface thereof
US7557594B2 (en) * 2007-08-14 2009-07-07 Electro Scientific Industries, Inc. Automated contact alignment tool
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
CN101545926B (en) * 2008-03-25 2011-05-11 旺矽科技股份有限公司 Probe testing device
DE102009012021B4 (en) * 2009-03-10 2011-02-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Measuring device for the electrical measurement of a measurement structure that can be electrically contacted on one side of a measurement side
TWI440412B (en) * 2011-12-28 2014-06-01 Princo Corp Package method of thin multi-layer substrate
CN103808969A (en) * 2012-11-08 2014-05-21 富泰华工业（深圳）有限公司 Tool for bearing to-be-tested electronic device
CN103808979A (en) * 2012-11-08 2014-05-21 富泰华工业（深圳）有限公司 Tool for bearing to-be-tested electronic device
CN105548859A (en) * 2015-12-09 2016-05-04 上海精密计量测试研究所 Testing equipment and method for environment testing
CN106200239B (en) * 2016-09-14 2019-03-15 海信集团有限公司 Ray machine lighting system
US10782316B2 (en) * 2017-01-09 2020-09-22 Delta Design, Inc. Socket side thermal system
CN114814522A (en) 2017-03-03 2022-07-29 雅赫测试系统公司 Electronic tester
WO2022076333A1 (en) 2020-10-07 2022-04-14 Aehr Test Systems Electronics tester
WO2023278632A1 (en) 2021-06-30 2023-01-05 Delta Design, Inc. Temperature control system including contactor assembly

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5313157A (en) * 1990-10-31 1994-05-17 Hughes Aircraft Company Probe for jesting an electrical circuit chip
EP0639777A1 (en) * 1993-08-21 1995-02-22 Hewlett-Packard Company Inspecting electrical components using a probe
US6137297A (en) * 1999-01-06 2000-10-24 Vertest Systemsn Corp. Electronic test probe interface assembly and method of manufacture
US6292007B1 (en) * 1997-05-19 2001-09-18 Si Diamond Technology Inc. Probe head assembly
US20020075025A1 (en) * 1999-06-30 2002-06-20 Masahiro Tanaka Semiconductor testing tool

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5313157A (en) * 1990-10-31 1994-05-17 Hughes Aircraft Company Probe for jesting an electrical circuit chip
EP0639777A1 (en) * 1993-08-21 1995-02-22 Hewlett-Packard Company Inspecting electrical components using a probe
US6292007B1 (en) * 1997-05-19 2001-09-18 Si Diamond Technology Inc. Probe head assembly
US6137297A (en) * 1999-01-06 2000-10-24 Vertest Systemsn Corp. Electronic test probe interface assembly and method of manufacture
US20020075025A1 (en) * 1999-06-30 2002-06-20 Masahiro Tanaka Semiconductor testing tool

Also Published As

Publication number Publication date
AU2003249276A1 (en) 2004-02-02
JP2005533254A (en) 2005-11-04
CN100523826C (en) 2009-08-05
CN1668929A (en) 2005-09-14
KR20050029215A (en) 2005-03-24
EP1523685A2 (en) 2005-04-20
WO2004008163A2 (en) 2004-01-22
AU2003249276A8 (en) 2004-02-02

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