WO2004013375A1 - Installation pour le traitement sous vide de substrats - Google Patents
Installation pour le traitement sous vide de substrats Download PDFInfo
- Publication number
- WO2004013375A1 WO2004013375A1 PCT/FR2003/002320 FR0302320W WO2004013375A1 WO 2004013375 A1 WO2004013375 A1 WO 2004013375A1 FR 0302320 W FR0302320 W FR 0302320W WO 2004013375 A1 WO2004013375 A1 WO 2004013375A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- chamber
- transfer
- installation according
- another
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Abstract
Description
Claims
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003269048A AU2003269048A1 (en) | 2002-08-01 | 2003-07-23 | Installation for the vacuum treatment of substrates |
MXPA05001279A MXPA05001279A (es) | 2002-08-01 | 2003-07-23 | Instalacion para el tratamiento a vacio de sustratos. |
CA2493988A CA2493988C (fr) | 2002-08-01 | 2003-07-23 | Installation pour le traitement sous vide notamment de substrats |
EP03750835.5A EP1525335B1 (fr) | 2002-08-01 | 2003-07-23 | Installation pour le traitement sous vide de substrats |
ES03750835.5T ES2601388T3 (es) | 2002-08-01 | 2003-07-23 | Instalación para el tratamiento en vacío de sustratos |
BRPI0313125A BRPI0313125B1 (pt) | 2002-08-01 | 2003-07-23 | instalação para o tratamento, a vácuo, de substratos |
JP2004525465A JP4652051B2 (ja) | 2002-08-01 | 2003-07-23 | 基板の真空処理装置 |
US11/044,253 US7886686B2 (en) | 2002-08-01 | 2005-01-27 | Installation for the vacuum treatment in particular of substrates |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR02/09955 | 2002-08-01 | ||
FR0209955A FR2843129B1 (fr) | 2002-08-01 | 2002-08-01 | Installation pour le traitement sous vide notamment de substrats |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/044,253 Continuation US7886686B2 (en) | 2002-08-01 | 2005-01-27 | Installation for the vacuum treatment in particular of substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004013375A1 true WO2004013375A1 (fr) | 2004-02-12 |
Family
ID=30129697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2003/002320 WO2004013375A1 (fr) | 2002-08-01 | 2003-07-23 | Installation pour le traitement sous vide de substrats |
Country Status (12)
Country | Link |
---|---|
US (1) | US7886686B2 (fr) |
EP (1) | EP1525335B1 (fr) |
JP (1) | JP4652051B2 (fr) |
CN (1) | CN100439560C (fr) |
AU (1) | AU2003269048A1 (fr) |
BR (1) | BRPI0313125B1 (fr) |
CA (1) | CA2493988C (fr) |
ES (1) | ES2601388T3 (fr) |
FR (1) | FR2843129B1 (fr) |
MX (1) | MXPA05001279A (fr) |
PL (1) | PL374645A1 (fr) |
WO (1) | WO2004013375A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1956111A1 (fr) * | 2007-02-09 | 2008-08-13 | Applied Materials, Inc. | Dispositif de transport dans une installation destinée au traitement de substrats |
US7837796B2 (en) | 2007-02-02 | 2010-11-23 | Applied Materials, Inc. | Process chamber, inline coating installation and method for treating a substrate |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070111367A1 (en) * | 2005-10-19 | 2007-05-17 | Basol Bulent M | Method and apparatus for converting precursor layers into photovoltaic absorbers |
CN101139699A (zh) * | 2007-08-07 | 2008-03-12 | 北京实力源科技开发有限责任公司 | 一种量产真空镀膜系统结构及其工件传输系统 |
DE102007058052B4 (de) * | 2007-11-30 | 2013-12-05 | Von Ardenne Anlagentechnik Gmbh | Vakuumbeschichtungsanlage |
FR2940321B1 (fr) * | 2008-12-19 | 2011-12-23 | Carewave Shielding Technologies | Machine de depot sous vide,sur un substrat,de materiaux en couches minces,par pulverisation cathodique. |
WO2012012394A1 (fr) * | 2010-07-23 | 2012-01-26 | First Solar, Inc | Système de dépôt en ligne |
DE102010056123B3 (de) * | 2010-12-21 | 2012-04-26 | Ekra Automatisierungssysteme Gmbh | Drucktischanordnung, Verfahren zum Betreiben einer Drucktischanordnung |
CN102185024B (zh) * | 2011-04-01 | 2013-05-15 | 湘潭大学 | 一种处理制备cigs太阳能电池吸收层的硒化炉及制备方法 |
US9915475B2 (en) * | 2011-04-12 | 2018-03-13 | Jiaxiong Wang | Assembled reactor for fabrications of thin film solar cell absorbers through roll-to-roll processes |
DE102011114593B4 (de) * | 2011-09-30 | 2016-11-03 | Manz Ag | Transporteinrichtung zum Transportieren mehrerer Substrate in den Bereich einer Substrat-Behandlungseinrichtung sowie eine derart ausgestaltete Vakuumbehandlungseinrichtung |
CN102605343A (zh) * | 2011-12-20 | 2012-07-25 | 汉能科技有限公司 | 一种lpcvd工艺中的冷却腔传输系统 |
CN103205720B (zh) * | 2012-01-17 | 2015-12-16 | 上海北玻镀膜技术工业有限公司 | 传动缝隙模块及应用其的连续溅射镀膜设备 |
WO2013116215A1 (fr) * | 2012-01-31 | 2013-08-08 | First Solar, Inc. | Procédé et système intégrés de dépôt par transport de vapeur |
DE102012100927A1 (de) * | 2012-02-06 | 2013-08-08 | Roth & Rau Ag | Prozessmodul |
JP2015061049A (ja) * | 2013-09-20 | 2015-03-30 | 日本電産リード株式会社 | 処理対象物搬送システム、及び基板検査システム |
CN103531508B (zh) * | 2013-10-17 | 2016-05-18 | 深圳市华星光电技术有限公司 | 基板运输设备及运输方法 |
JP6285305B2 (ja) * | 2014-07-22 | 2018-02-28 | 住友化学株式会社 | 半導体製造装置及び半導体の製造方法 |
CN108231651B (zh) * | 2017-12-26 | 2020-02-21 | 厦门市三安光电科技有限公司 | 微元件转移装置和转移方法 |
CN109609923B (zh) * | 2019-01-11 | 2023-08-25 | 广东谛思纳为新材料科技有限公司 | 一种便于拉链扣电离子镀铂加工的自动化装置 |
US10923374B1 (en) * | 2019-07-23 | 2021-02-16 | Applied Materials, Inc. | Walking beam chamber |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6328863A (ja) * | 1986-07-22 | 1988-02-06 | Ulvac Corp | 真空処理装置 |
EP0657563A2 (fr) * | 1993-12-07 | 1995-06-14 | Leybold Aktiengesellschaft | Appareil de revêtement sous vide |
US6315879B1 (en) * | 1995-08-07 | 2001-11-13 | United Module Corporation | Modular deposition system having batch processing and serial thin film deposition |
US20010050224A1 (en) * | 1992-10-28 | 2001-12-13 | Hitachi, Ltd. | Magnetic film forming system |
JP2002203883A (ja) * | 2000-12-27 | 2002-07-19 | Shibaura Mechatronics Corp | 多層膜の形成装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3973665A (en) * | 1975-03-07 | 1976-08-10 | Gca Corporation | Article delivery and transport apparatus for evacuated processing equipment |
JPS58197262A (ja) * | 1982-05-13 | 1983-11-16 | Canon Inc | 量産型真空成膜装置及び真空成膜法 |
JPH06105742B2 (ja) * | 1983-11-28 | 1994-12-21 | 株式会社日立製作所 | 真空処理方法及び装置 |
FR2583774B1 (fr) * | 1985-06-25 | 1992-08-14 | Stein Heurtey | Installation de traitements thermochimiques a temperatures et atmospheres differentes, notamment pour l'industrie automobile |
JP2759028B2 (ja) * | 1992-10-28 | 1998-05-28 | 株式会社日立製作所 | 磁性膜形成装置およびインライン成膜装置 |
US6290824B1 (en) * | 1992-10-28 | 2001-09-18 | Hitachi, Ltd. | Magnetic film forming system |
US5730801A (en) * | 1994-08-23 | 1998-03-24 | Applied Materials, Inc. | Compartnetalized substrate processing chamber |
US6053687A (en) * | 1997-09-05 | 2000-04-25 | Applied Materials, Inc. | Cost effective modular-linear wafer processing |
-
2002
- 2002-08-01 FR FR0209955A patent/FR2843129B1/fr not_active Expired - Lifetime
-
2003
- 2003-07-23 JP JP2004525465A patent/JP4652051B2/ja not_active Expired - Lifetime
- 2003-07-23 CA CA2493988A patent/CA2493988C/fr not_active Expired - Lifetime
- 2003-07-23 BR BRPI0313125A patent/BRPI0313125B1/pt active IP Right Grant
- 2003-07-23 PL PL03374645A patent/PL374645A1/xx not_active Application Discontinuation
- 2003-07-23 AU AU2003269048A patent/AU2003269048A1/en not_active Abandoned
- 2003-07-23 EP EP03750835.5A patent/EP1525335B1/fr not_active Expired - Lifetime
- 2003-07-23 MX MXPA05001279A patent/MXPA05001279A/es active IP Right Grant
- 2003-07-23 CN CNB038219824A patent/CN100439560C/zh not_active Expired - Lifetime
- 2003-07-23 WO PCT/FR2003/002320 patent/WO2004013375A1/fr active Application Filing
- 2003-07-23 ES ES03750835.5T patent/ES2601388T3/es not_active Expired - Lifetime
-
2005
- 2005-01-27 US US11/044,253 patent/US7886686B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6328863A (ja) * | 1986-07-22 | 1988-02-06 | Ulvac Corp | 真空処理装置 |
US20010050224A1 (en) * | 1992-10-28 | 2001-12-13 | Hitachi, Ltd. | Magnetic film forming system |
EP0657563A2 (fr) * | 1993-12-07 | 1995-06-14 | Leybold Aktiengesellschaft | Appareil de revêtement sous vide |
US6315879B1 (en) * | 1995-08-07 | 2001-11-13 | United Module Corporation | Modular deposition system having batch processing and serial thin film deposition |
JP2002203883A (ja) * | 2000-12-27 | 2002-07-19 | Shibaura Mechatronics Corp | 多層膜の形成装置 |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 012, no. 237 (C - 509) 6 July 1988 (1988-07-06) * |
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 11 6 November 2002 (2002-11-06) * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7837796B2 (en) | 2007-02-02 | 2010-11-23 | Applied Materials, Inc. | Process chamber, inline coating installation and method for treating a substrate |
EP1956111A1 (fr) * | 2007-02-09 | 2008-08-13 | Applied Materials, Inc. | Dispositif de transport dans une installation destinée au traitement de substrats |
Also Published As
Publication number | Publication date |
---|---|
CN100439560C (zh) | 2008-12-03 |
AU2003269048A1 (en) | 2004-02-23 |
US20050145335A1 (en) | 2005-07-07 |
CA2493988A1 (fr) | 2004-02-12 |
FR2843129B1 (fr) | 2006-01-06 |
JP2006509905A (ja) | 2006-03-23 |
CN1681962A (zh) | 2005-10-12 |
BRPI0313125B1 (pt) | 2017-02-21 |
MXPA05001279A (es) | 2005-09-08 |
FR2843129A1 (fr) | 2004-02-06 |
CA2493988C (fr) | 2011-01-11 |
JP4652051B2 (ja) | 2011-03-16 |
EP1525335A1 (fr) | 2005-04-27 |
US7886686B2 (en) | 2011-02-15 |
PL374645A1 (en) | 2005-10-31 |
ES2601388T3 (es) | 2017-02-15 |
EP1525335B1 (fr) | 2016-10-12 |
BR0313125A (pt) | 2005-07-05 |
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