WO2004017439A3 - Elektronisches bauteil mit vorwiegend organischen funktionsmaterialien und herstellungsverfahren dazu - Google Patents

Elektronisches bauteil mit vorwiegend organischen funktionsmaterialien und herstellungsverfahren dazu Download PDF

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Publication number
WO2004017439A3
WO2004017439A3 PCT/DE2003/002303 DE0302303W WO2004017439A3 WO 2004017439 A3 WO2004017439 A3 WO 2004017439A3 DE 0302303 W DE0302303 W DE 0302303W WO 2004017439 A3 WO2004017439 A3 WO 2004017439A3
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WO
WIPO (PCT)
Prior art keywords
electronic component
organic functional
functional materials
production
predominantly organic
Prior art date
Application number
PCT/DE2003/002303
Other languages
English (en)
French (fr)
Other versions
WO2004017439A2 (de
Inventor
Adolf Bernds
Wolfgang Clemens
Alexander Friedrich Knobloch
Original Assignee
Siemens Ag
Adolf Bernds
Wolfgang Clemens
Alexander Friedrich Knobloch
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Adolf Bernds, Wolfgang Clemens, Alexander Friedrich Knobloch filed Critical Siemens Ag
Priority to EP03787642A priority Critical patent/EP1525630A2/de
Priority to US10/523,216 priority patent/US8044517B2/en
Publication of WO2004017439A2 publication Critical patent/WO2004017439A2/de
Publication of WO2004017439A3 publication Critical patent/WO2004017439A3/de

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • H10K19/80—Interconnections, e.g. terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof

Abstract

Die Erfindung betrifft ein Elektronisches Bauteil aus vorwiegend organischen Funktionsmaterialien mit verbesserter Durchkontaktierung. Die Durchkontaktierung wird vorliegend vor Aufbringung der isolierenden Schicht als freistehende Erhebung gebildet.
PCT/DE2003/002303 2002-07-29 2003-07-09 Elektronisches bauteil mit vorwiegend organischen funktionsmaterialien und herstellungsverfahren dazu WO2004017439A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP03787642A EP1525630A2 (de) 2002-07-29 2003-07-09 Elektronisches bauteil mit vorwiegend organischen funktionsmaterialien und herstellungsverfahren dazu
US10/523,216 US8044517B2 (en) 2002-07-29 2003-07-09 Electronic component comprising predominantly organic functional materials and a method for the production thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10234646.1 2002-07-29
DE10234646 2002-07-29

Publications (2)

Publication Number Publication Date
WO2004017439A2 WO2004017439A2 (de) 2004-02-26
WO2004017439A3 true WO2004017439A3 (de) 2004-06-10

Family

ID=31724053

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/002303 WO2004017439A2 (de) 2002-07-29 2003-07-09 Elektronisches bauteil mit vorwiegend organischen funktionsmaterialien und herstellungsverfahren dazu

Country Status (3)

Country Link
US (1) US8044517B2 (de)
EP (1) EP1525630A2 (de)
WO (1) WO2004017439A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10043204A1 (de) * 2000-09-01 2002-04-04 Siemens Ag Organischer Feld-Effekt-Transistor, Verfahren zur Strukturierung eines OFETs und integrierte Schaltung
US7224280B2 (en) 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
US6940408B2 (en) 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
US9306105B2 (en) * 2013-07-31 2016-04-05 First Solar Malaysia Sdn. Bhd. Finger structures protruding from absorber layer for improved solar cell back contact

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5480839A (en) * 1993-01-15 1996-01-02 Kabushiki Kaisha Toshiba Semiconductor device manufacturing method
WO2001047044A2 (en) * 1999-12-21 2001-06-28 Plastic Logic Limited Forming interconnects
US6340822B1 (en) * 1999-10-05 2002-01-22 Agere Systems Guardian Corp. Article comprising vertically nano-interconnected circuit devices and method for making the same
US20020025391A1 (en) * 1989-05-26 2002-02-28 Marie Angelopoulos Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
WO2002095805A2 (en) * 2001-05-23 2002-11-28 Plastic Logic Limited Laser parrering of devices

Family Cites Families (190)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US542678A (en) * 1895-07-16 Wheel
US541957A (en) * 1895-07-02 Nose-piece for eyeglasses
US59987A (en) * 1866-11-27 Henry a
US130042A (en) * 1872-07-30 Improvement in devices for propelling vessels
US541956A (en) * 1895-07-02 Joseph benfield
US56839A (en) * 1866-07-31 Improvement in corn-planters
US534448A (en) * 1895-02-19 Speed-pulley
US18911A (en) * 1857-12-22 Glass knob for doors
US523216A (en) * 1894-07-17 Logging system
US535449A (en) * 1895-03-12 ltjnken
US541815A (en) * 1895-06-25 Building-block
US112576A (en) * 1871-03-14 Improvement in needles and holders for sewing-machines
US68392A (en) * 1867-09-03 James p
US543561A (en) * 1895-07-30 Heating-stove
US533756A (en) * 1895-02-05 Corn-harvester
US523487A (en) * 1894-07-24 Ore-roasting furnace
US344926A (en) * 1886-07-06 Stevens
US2176A (en) * 1841-07-16 Improvement in the manufacture of indelible writing-ink
US195644A (en) * 1877-09-25 Improvement in motors for operating crosscut-saws
US542679A (en) * 1895-07-16 Coin-controlled telephone
US170897A (en) * 1875-12-07 Improvement in feeding-belts and partitions for corn-shellers
GB723598A (en) 1951-09-07 1955-02-09 Philips Nv Improvements in or relating to methods of producing electrically conductive mouldings from plastics
US3512052A (en) 1968-01-11 1970-05-12 Gen Motors Corp Metal-insulator-semiconductor voltage variable capacitor with controlled resistivity dielectric
US3769096A (en) 1971-03-12 1973-10-30 Bell Telephone Labor Inc Pyroelectric devices
JPS543594B2 (de) 1973-10-12 1979-02-24
JPS54101176A (en) 1978-01-26 1979-08-09 Shinetsu Polymer Co Contact member for push switch
US4442019A (en) 1978-05-26 1984-04-10 Marks Alvin M Electroordered dipole suspension
DE2932075C2 (de) * 1979-08-08 1986-04-10 Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid Friktionsfalschdraller
JPS5641938U (de) 1979-09-10 1981-04-17
US4340657A (en) 1980-02-19 1982-07-20 Polychrome Corporation Novel radiation-sensitive articles
EP0108650A3 (de) 1982-11-09 1986-02-12 Zytrex Corporation Programmierbarer MOS-Transistor
DE3321071A1 (de) 1983-06-10 1984-12-13 Basf Ag Druckschalter
DE3338597A1 (de) 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPS60117769A (ja) 1983-11-30 1985-06-25 Fujitsu Ltd 半導体メモリ装置
US4996584A (en) * 1985-01-31 1991-02-26 Gould, Inc. Thin-film electrical connections for integrated circuits
JPS61258453A (ja) * 1985-05-13 1986-11-15 Toshiba Corp 半導体装置の製造方法
DE3768112D1 (de) 1986-03-03 1991-04-04 Toshiba Kawasaki Kk Strahlungsdetektor.
DE3751376T2 (de) 1986-10-13 1995-11-16 Canon Kk Schaltungselement.
JP2728412B2 (ja) 1987-12-25 1998-03-18 株式会社日立製作所 半導体装置
GB2215307B (en) 1988-03-04 1991-10-09 Unisys Corp Electronic component transportation container
KR900702481A (ko) 1988-06-21 1990-12-07 원본미기재 휴대용 전자 토큰 제조방법
US5364735A (en) 1988-07-01 1994-11-15 Sony Corporation Multiple layer optical record medium with protective layers and method for producing same
US4937119A (en) 1988-12-15 1990-06-26 Hoechst Celanese Corp. Textured organic optical data storage media and methods of preparation
US5892244A (en) 1989-01-10 1999-04-06 Mitsubishi Denki Kabushiki Kaisha Field effect transistor including πconjugate polymer and liquid crystal display including the field effect transistor
EP0418504B1 (de) 1989-07-25 1995-04-05 Matsushita Electric Industrial Co., Ltd. Speicherbauelement aus organischem Halbleiter mit einer MISFET-Struktur und sein Kontrollverfahren
US5206525A (en) 1989-12-27 1993-04-27 Nippon Petrochemicals Co., Ltd. Electric element capable of controlling the electric conductivity of π-conjugated macromolecular materials
FI91573C (sv) 1990-01-04 1994-07-11 Neste Oy Sätt att framställa elektroniska och elektro-optiska komponenter och kretsar
JP2969184B2 (ja) 1990-04-09 1999-11-02 カシオ計算機株式会社 薄膜トランジスタメモリ
JPH0710030B2 (ja) * 1990-05-18 1995-02-01 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 多層配線基板の製造方法
FR2664430B1 (fr) 1990-07-04 1992-09-18 Centre Nat Rech Scient Transistor a effet de champ en couche mince de structure mis, dont l'isolant et le semiconducteur sont realises en materiaux organiques.
US5128746A (en) * 1990-09-27 1992-07-07 Motorola, Inc. Adhesive and encapsulant material with fluxing properties
JPH04279046A (ja) * 1991-01-11 1992-10-05 Fuji Xerox Co Ltd 多層配線の形成方法
FR2673041A1 (fr) 1991-02-19 1992-08-21 Gemplus Card Int Procede de fabrication de micromodules de circuit integre et micromodule correspondant.
EP0501456A3 (de) 1991-02-26 1992-09-09 Sony Corporation Mit eine optischen Plattenantrieb ausgerüsteter Videospielcomputer
US5408109A (en) 1991-02-27 1995-04-18 The Regents Of The University Of California Visible light emitting diodes fabricated from soluble semiconducting polymers
US5332315A (en) 1991-04-27 1994-07-26 Gec Avery Limited Apparatus and sensor unit for monitoring changes in a physical quantity with time
JP3224829B2 (ja) 1991-08-15 2001-11-05 株式会社東芝 有機電界効果型素子
JPH0580530A (ja) 1991-09-24 1993-04-02 Hitachi Ltd 薄膜パターン製造方法
US5173835A (en) 1991-10-15 1992-12-22 Motorola, Inc. Voltage variable capacitor
US5486851A (en) 1991-10-30 1996-01-23 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Illumination device using a pulsed laser source a Schlieren optical system and a matrix addressable surface light modulator for producing images with undifracted light
JP2709223B2 (ja) 1992-01-30 1998-02-04 三菱電機株式会社 非接触形携帯記憶装置
DE4243832A1 (de) 1992-12-23 1994-06-30 Daimler Benz Ag Tastsensoranordnung
CA2109687A1 (en) * 1993-01-26 1995-05-23 Walter Schmidt Method for the through plating of conductor foils
FR2701117B1 (fr) 1993-02-04 1995-03-10 Asulab Sa Système de mesures électrochimiques à capteur multizones, et son application au dosage du glucose.
EP0615256B1 (de) 1993-03-09 1998-09-23 Koninklijke Philips Electronics N.V. Herstellungsverfahren eines Musters von einem elektrisch leitfähigen Polymer auf einer Substratoberfläche und Metallisierung eines solchen Musters
US5427841A (en) * 1993-03-09 1995-06-27 U.S. Philips Corporation Laminated structure of a metal layer on a conductive polymer layer and method of manufacturing such a structure
US5567550A (en) 1993-03-25 1996-10-22 Texas Instruments Incorporated Method of making a mask for making integrated circuits
JPH0722669A (ja) 1993-07-01 1995-01-24 Mitsubishi Electric Corp 可塑性機能素子
EP0722563A4 (de) 1993-08-24 1998-03-04 Metrika Lab Inc Neues elektronisches einweg-assaygerät
JP3460863B2 (ja) 1993-09-17 2003-10-27 三菱電機株式会社 半導体装置の製造方法
FR2710413B1 (fr) 1993-09-21 1995-11-03 Asulab Sa Dispositif de mesure pour capteurs amovibles.
US5556706A (en) 1993-10-06 1996-09-17 Matsushita Electric Industrial Co., Ltd. Conductive layered product and method of manufacturing the same
IL111151A (en) 1994-10-03 1998-09-24 News Datacom Ltd Secure access systems
JP4392057B2 (ja) 1994-05-16 2009-12-24 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 有機半導体物質を有する半導体装置
US5684884A (en) 1994-05-31 1997-11-04 Hitachi Metals, Ltd. Piezoelectric loudspeaker and a method for manufacturing the same
JP3246189B2 (ja) 1994-06-28 2002-01-15 株式会社日立製作所 半導体表示装置
US5574291A (en) 1994-12-09 1996-11-12 Lucent Technologies Inc. Article comprising a thin film transistor with low conductivity organic layer
US5630986A (en) 1995-01-13 1997-05-20 Bayer Corporation Dispensing instrument for fluid monitoring sensors
JP3068430B2 (ja) 1995-04-25 2000-07-24 富山日本電気株式会社 固体電解コンデンサ及びその製造方法
US5652645A (en) 1995-07-24 1997-07-29 Anvik Corporation High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates
JP3313547B2 (ja) * 1995-08-30 2002-08-12 沖電気工業株式会社 チップサイズパッケージの製造方法
US5625199A (en) 1996-01-16 1997-04-29 Lucent Technologies Inc. Article comprising complementary circuit with inorganic n-channel and organic p-channel thin film transistors
US6326640B1 (en) 1996-01-29 2001-12-04 Motorola, Inc. Organic thin film transistor with enhanced carrier mobility
GB2310493B (en) 1996-02-26 2000-08-02 Unilever Plc Determination of the characteristics of fluid
DE19629656A1 (de) 1996-07-23 1998-01-29 Boehringer Mannheim Gmbh Diagnostischer Testträger mit mehrschichtigem Testfeld und Verfahren zur Bestimmung von Analyt mit dessen Hilfe
JP2870497B2 (ja) * 1996-08-01 1999-03-17 日本電気株式会社 半導体素子の実装方法
US6103992A (en) * 1996-11-08 2000-08-15 W. L. Gore & Associates, Inc. Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias
US5946551A (en) 1997-03-25 1999-08-31 Dimitrakopoulos; Christos Dimitrios Fabrication of thin film effect transistor comprising an organic semiconductor and chemical solution deposited metal oxide gate dielectric
US6344662B1 (en) 1997-03-25 2002-02-05 International Business Machines Corporation Thin-film field-effect transistor with organic-inorganic hybrid semiconductor requiring low operating voltages
KR100248392B1 (ko) 1997-05-15 2000-09-01 정선종 유기물전계효과트랜지스터와결합된유기물능동구동전기발광소자및그소자의제작방법
EP0968537B1 (de) 1997-08-22 2012-05-02 Creator Technology B.V. Feld-effekt-transistor, der im wesentlichen aus organischen materialien besteht
EP0966758B1 (de) * 1997-08-22 2015-08-26 Creator Technology B.V. Verfahren zur herstellung einer senkrechten verbindung zwischen dünnfilmbauelementen der mikroelektronik
DE02079791T1 (de) 1997-09-11 2004-04-15 Precision Dynamics Corp., San Fernando RF-ID Etikett mit einem integriertem Schaltkreis aus organischen Materialen
TW345720B (en) * 1997-10-08 1998-11-21 Winbond Electronics Corp Self-aligned via structure and process for producing the same
US6251513B1 (en) 1997-11-08 2001-06-26 Littlefuse, Inc. Polymer composites for overvoltage protection
JPH11142810A (ja) 1997-11-12 1999-05-28 Nintendo Co Ltd 携帯型情報処理装置
JP2001510670A (ja) 1997-12-05 2001-07-31 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 識別トランスポンダ
US5997817A (en) 1997-12-05 1999-12-07 Roche Diagnostics Corporation Electrochemical biosensor test strip
US5998805A (en) 1997-12-11 1999-12-07 Motorola, Inc. Active matrix OED array with improved OED cathode
DE19757542A1 (de) * 1997-12-23 1999-06-24 Bayer Ag Siebdruckpaste zur Herstellung elektrisch leitfähiger Beschichtungen
US6083104A (en) 1998-01-16 2000-07-04 Silverlit Toys (U.S.A.), Inc. Programmable toy with an independent game cartridge
EP1051745B1 (de) 1998-01-28 2007-11-07 Thin Film Electronics ASA Methode zur herstellung zwei- oder dreidimensionaler elektrisch leitender oder halbleitender strukturen, eine löschmethode derselben und ein generator/modulator eines elektrischen feldes zum gebrauch in der herstellungsmethode
US6087196A (en) 1998-01-30 2000-07-11 The Trustees Of Princeton University Fabrication of organic semiconductor devices using ink jet printing
US6045977A (en) 1998-02-19 2000-04-04 Lucent Technologies Inc. Process for patterning conductive polyaniline films
DE19816860A1 (de) 1998-03-06 1999-11-18 Deutsche Telekom Ag Chipkarte, insbesondere Guthabenkarte
US6033202A (en) 1998-03-27 2000-03-07 Lucent Technologies Inc. Mold for non - photolithographic fabrication of microstructures
GB9808061D0 (en) 1998-04-16 1998-06-17 Cambridge Display Tech Ltd Polymer devices
GB9808806D0 (en) 1998-04-24 1998-06-24 Cambridge Display Tech Ltd Selective deposition of polymer films
TW410478B (en) 1998-05-29 2000-11-01 Lucent Technologies Inc Thin-film transistor monolithically integrated with an organic light-emitting diode
US5967048A (en) 1998-06-12 1999-10-19 Howard A. Fromson Method and apparatus for the multiple imaging of a continuous web
KR100282393B1 (ko) 1998-06-17 2001-02-15 구자홍 유기이엘(el)디스플레이소자제조방법
DE19836174C2 (de) 1998-08-10 2000-10-12 Illig Maschinenbau Adolf Heizung zum Erwärmen von thermoplastischen Kunststoffplatten und Verfahren zum Einstellen der Temperatur dieser Heizung
US6215130B1 (en) 1998-08-20 2001-04-10 Lucent Technologies Inc. Thin film transistors
US6330464B1 (en) 1998-08-26 2001-12-11 Sensors For Medicine & Science Optical-based sensing devices
JP4493741B2 (ja) 1998-09-04 2010-06-30 株式会社半導体エネルギー研究所 半導体装置の作製方法
EP1154471B1 (de) * 1998-09-30 2008-07-16 Ibiden Co., Ltd. Halbleiter-chip mit höckerartigen elektroden
DE19851703A1 (de) 1998-10-30 2000-05-04 Inst Halbleiterphysik Gmbh Verfahren zur Herstellung von elektronischen Strukturen
US6384804B1 (en) 1998-11-25 2002-05-07 Lucent Techonologies Inc. Display comprising organic smart pixels
US6506438B2 (en) 1998-12-15 2003-01-14 E Ink Corporation Method for printing of transistor arrays on plastic substrates
US6321571B1 (en) 1998-12-21 2001-11-27 Corning Incorporated Method of making glass structures for flat panel displays
US6114088A (en) 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
JP3137186B2 (ja) * 1999-02-05 2001-02-19 インターナショナル・ビジネス・マシーンズ・コーポレ−ション 層間接続構造体、多層配線基板およびそれらの形成方法
GB2347013A (en) 1999-02-16 2000-08-23 Sharp Kk Charge-transport structures
AU5646800A (en) 1999-03-02 2000-09-21 Helix Biopharma Corporation Card-based biosensor device
US6180956B1 (en) 1999-03-03 2001-01-30 International Business Machine Corp. Thin film transistors with organic-inorganic hybrid materials as semiconducting channels
US6207472B1 (en) 1999-03-09 2001-03-27 International Business Machines Corporation Low temperature thin film transistor fabrication
CN1310930A (zh) 1999-03-29 2001-08-29 精工爱普生株式会社 组合物及膜的制造方法以及功能元件及其制造方法
US6498114B1 (en) 1999-04-09 2002-12-24 E Ink Corporation Method for forming a patterned semiconductor film
US6072716A (en) 1999-04-14 2000-06-06 Massachusetts Institute Of Technology Memory structures and methods of making same
FR2793089B3 (fr) 1999-04-28 2001-06-08 Rene Liger Transpondeur a antenne integree
DE19919448A1 (de) 1999-04-29 2000-11-02 Miele & Cie Kühlgerät und Verfahren zur Verkeimungsindikation
DE19921024C2 (de) 1999-05-06 2001-03-08 Wolfgang Eichelmann Videospielanlage
US6383664B2 (en) 1999-05-11 2002-05-07 The Dow Chemical Company Electroluminescent or photocell device having protective packaging
EP1052594A1 (de) 1999-05-14 2000-11-15 Sokymat S.A. Transponder und Spritzgussteil sowie Verfahren zu ihrer Herstellung
TW556357B (en) 1999-06-28 2003-10-01 Semiconductor Energy Lab Method of manufacturing an electro-optical device
JP2001085272A (ja) 1999-07-14 2001-03-30 Matsushita Electric Ind Co Ltd 可変容量コンデンサ
DE19933757A1 (de) 1999-07-19 2001-01-25 Giesecke & Devrient Gmbh Chipkarte mit integrierter Batterie
DE19935527A1 (de) 1999-07-28 2001-02-08 Giesecke & Devrient Gmbh Aktive Folie für Chipkarten mit Display
DE19937262A1 (de) 1999-08-06 2001-03-01 Siemens Ag Anordnung mit Transistor-Funktion
US6593690B1 (en) 1999-09-03 2003-07-15 3M Innovative Properties Company Large area organic electronic devices having conducting polymer buffer layers and methods of making same
US6517995B1 (en) 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
CN1376100A (zh) 1999-09-28 2002-10-23 住友重机械工业株式会社 激光钻孔的加工方法及其加工装置
WO2001027998A1 (en) 1999-10-11 2001-04-19 Koninklijke Philips Electronics N.V. Integrated circuit
WO2001033649A1 (en) * 1999-11-02 2001-05-10 Koninklijke Philips Electronics N.V. Method of producing vertical interconnects between thin film microelectronic devices and products comprising such vertical interconnects
US6335539B1 (en) 1999-11-05 2002-01-01 International Business Machines Corporation Method for improving performance of organic semiconductors in bottom electrode structure
US6284562B1 (en) 1999-11-17 2001-09-04 Agere Systems Guardian Corp. Thin film transistors
EP1103916A1 (de) 1999-11-24 2001-05-30 Infineon Technologies AG Chipkarte
US6136702A (en) 1999-11-29 2000-10-24 Lucent Technologies Inc. Thin film transistors
US6621098B1 (en) 1999-11-29 2003-09-16 The Penn State Research Foundation Thin-film transistor and methods of manufacturing and incorporating a semiconducting organic material
US6197663B1 (en) 1999-12-07 2001-03-06 Lucent Technologies Inc. Process for fabricating integrated circuit devices having thin film transistors
KR100940110B1 (ko) * 1999-12-21 2010-02-02 플라스틱 로직 리미티드 잉크젯으로 제조되는 집적회로 및 전자 디바이스 제조 방법
US6706159B2 (en) 2000-03-02 2004-03-16 Diabetes Diagnostics Combined lancet and electrochemical analyte-testing apparatus
JP3732378B2 (ja) * 2000-03-03 2006-01-05 新光電気工業株式会社 半導体装置の製造方法
DE10012204A1 (de) 2000-03-13 2001-09-20 Siemens Ag Einrichtung zum Kennzeichnen von Stückgut
EP1134694A1 (de) 2000-03-16 2001-09-19 Infineon Technologies AG Dokument mit integrierter elektronischer Schaltung
MXPA02009666A (es) 2000-03-28 2004-07-30 Inverness Medical Technology I Procedimiento continuo para fabricacion de sensor electroquimico desechable..
US6709806B2 (en) * 2000-03-31 2004-03-23 Kabushiki Kaisha Toshiba Method of forming composite member
US6329226B1 (en) 2000-06-01 2001-12-11 Agere Systems Guardian Corp. Method for fabricating a thin-film transistor
DE10033112C2 (de) 2000-07-07 2002-11-14 Siemens Ag Verfahren zur Herstellung und Strukturierung organischer Feldeffekt-Transistoren (OFET), hiernach gefertigter OFET und seine Verwendung
JP3951091B2 (ja) * 2000-08-04 2007-08-01 セイコーエプソン株式会社 半導体装置の製造方法
WO2002015264A2 (de) 2000-08-18 2002-02-21 Siemens Aktiengesellschaft Verkapseltes organisch-elektronisches bauteil, verfahren zu seiner herstellung und seine verwendung
DE10120687A1 (de) 2001-04-27 2002-10-31 Siemens Ag Verkapseltes organisch-elektronisches Bauteil, Verfahren zu seiner Herstellung und seine Verwendung
US6403460B1 (en) * 2000-08-22 2002-06-11 Charles W. C. Lin Method of making a semiconductor chip assembly
JP2002068324A (ja) 2000-08-30 2002-03-08 Nippon Sanso Corp 断熱容器
DE10043204A1 (de) 2000-09-01 2002-04-04 Siemens Ag Organischer Feld-Effekt-Transistor, Verfahren zur Strukturierung eines OFETs und integrierte Schaltung
DE10045192A1 (de) 2000-09-13 2002-04-04 Siemens Ag Organischer Datenspeicher, RFID-Tag mit organischem Datenspeicher, Verwendung eines organischen Datenspeichers
DE10047171A1 (de) 2000-09-22 2002-04-18 Siemens Ag Elektrode und/oder Leiterbahn für organische Bauelemente und Herstellungverfahren dazu
GB2367788A (en) * 2000-10-16 2002-04-17 Seiko Epson Corp Etching using an ink jet print head
KR20020036916A (ko) 2000-11-11 2002-05-17 주승기 실리콘 박막의 결정화 방법 및 이에 의해 제조된 반도체소자
DE10058559A1 (de) 2000-11-24 2002-05-29 Interactiva Biotechnologie Gmb System zur Abwicklung eines Warentransfers und Warenvorrats-Behälter
KR100390522B1 (ko) 2000-12-01 2003-07-07 피티플러스(주) 결정질 실리콘 활성층을 포함하는 박막트랜지스터 제조 방법
DE10061297C2 (de) 2000-12-08 2003-05-28 Siemens Ag Verfahren zur Sturkturierung eines OFETs
US6884313B2 (en) * 2001-01-08 2005-04-26 Fujitsu Limited Method and system for joining and an ultra-high density interconnect
DE10105914C1 (de) 2001-02-09 2002-10-10 Siemens Ag Organischer Feldeffekt-Transistor mit fotostrukturiertem Gate-Dielektrikum und ein Verfahren zu dessen Erzeugung
US6767807B2 (en) 2001-03-02 2004-07-27 Fuji Photo Film Co., Ltd. Method for producing organic thin film device and transfer material used therein
DE10117663B4 (de) 2001-04-09 2004-09-02 Samsung SDI Co., Ltd., Suwon Verfahren zur Herstellung von Matrixanordnungen auf Basis verschiedenartiger organischer leitfähiger Materialien
US20020170897A1 (en) 2001-05-21 2002-11-21 Hall Frank L. Methods for preparing ball grid array substrates via use of a laser
US6870180B2 (en) 2001-06-08 2005-03-22 Lucent Technologies Inc. Organic polarizable gate transistor apparatus and method
JP2003089259A (ja) 2001-09-18 2003-03-25 Hitachi Ltd パターン形成方法およびパターン形成装置
US7351660B2 (en) 2001-09-28 2008-04-01 Hrl Laboratories, Llc Process for producing high performance interconnects
US6617609B2 (en) * 2001-11-05 2003-09-09 3M Innovative Properties Company Organic thin film transistor with siloxane polymer interface
JP4045143B2 (ja) * 2002-02-18 2008-02-13 テセラ・インターコネクト・マテリアルズ，インコーポレイテッド 配線膜間接続用部材の製造方法及び多層配線基板の製造方法
US6946332B2 (en) 2002-03-15 2005-09-20 Lucent Technologies Inc. Forming nanoscale patterned thin film metal layers
US7060633B2 (en) * 2002-03-29 2006-06-13 Texas Instruments Incorporated Planarization for integrated circuits
DE10219905B4 (de) 2002-05-03 2011-06-22 OSRAM Opto Semiconductors GmbH, 93055 Optoelektronisches Bauelement mit organischen funktionellen Schichten und zwei Trägern sowie Verfahren zur Herstellung eines solchen optoelektronischen Bauelements
JP3542350B2 (ja) * 2002-05-31 2004-07-14 沖電気工業株式会社 半導体装置及びその製造方法
US6812509B2 (en) 2002-06-28 2004-11-02 Palo Alto Research Center Inc. Organic ferroelectric memory cells
US6870183B2 (en) 2002-11-04 2005-03-22 Advanced Micro Devices, Inc. Stacked organic memory devices and methods of operating and fabricating
JP2006505927A (ja) 2002-11-05 2006-02-16 ポリアイシー ゲーエムベーハー ウント コー、 カーゲー 高分解能の構造を有する有機電子要素およびそれを製造する方法
ATE354182T1 (de) 2002-11-19 2007-03-15 Polyic Gmbh & Co Kg Organische elektronische schaltung mit stukturierter halbleitender funktionsschicht und herstellungsverfahren dazu

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020025391A1 (en) * 1989-05-26 2002-02-28 Marie Angelopoulos Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
US5480839A (en) * 1993-01-15 1996-01-02 Kabushiki Kaisha Toshiba Semiconductor device manufacturing method
US6340822B1 (en) * 1999-10-05 2002-01-22 Agere Systems Guardian Corp. Article comprising vertically nano-interconnected circuit devices and method for making the same
WO2001047044A2 (en) * 1999-12-21 2001-06-28 Plastic Logic Limited Forming interconnects
WO2002095805A2 (en) * 2001-05-23 2002-11-28 Plastic Logic Limited Laser parrering of devices

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DE LEEUW D M ET AL: "Polymeric integrated circuits and light-emitting diodes", ELECTRON DEVICES MEETING, 1997. TECHNICAL DIGEST., INTERNATIONAL WASHINGTON, DC, USA 7-10 DEC. 1997, NEW YORK, NY, USA,IEEE, US, 7 December 1997 (1997-12-07), pages 331 - 336, XP010265518, ISBN: 0-7803-4100-7 *

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