WO2004032198A3 - Method for maintaining solder thickness in flipchip attach packaging processes - Google Patents
Method for maintaining solder thickness in flipchip attach packaging processes Download PDFInfo
- Publication number
- WO2004032198A3 WO2004032198A3 PCT/US2003/031270 US0331270W WO2004032198A3 WO 2004032198 A3 WO2004032198 A3 WO 2004032198A3 US 0331270 W US0331270 W US 0331270W WO 2004032198 A3 WO2004032198 A3 WO 2004032198A3
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- WO
- WIPO (PCT)
- Prior art keywords
- packaging
- solder thickness
- packaging processes
- solder
- die
- Prior art date
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- H01L2924/151—Die mounting substrate
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- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/183—Connection portion, e.g. seal
- H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10393441T DE10393441T5 (en) | 2002-10-03 | 2003-10-03 | A method of maintaining solder thickness in flip-chip mounting packaging |
AU2003283992A AU2003283992A1 (en) | 2002-10-03 | 2003-10-03 | Method for maintaining solder thickness in flipchip attach packaging processes |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41780002P | 2002-10-03 | 2002-10-03 | |
US60/417,800 | 2002-10-03 | ||
US10/678,010 US6943434B2 (en) | 2002-10-03 | 2003-10-02 | Method for maintaining solder thickness in flipchip attach packaging processes |
US10/678,010 | 2003-10-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004032198A2 WO2004032198A2 (en) | 2004-04-15 |
WO2004032198A3 true WO2004032198A3 (en) | 2005-01-27 |
Family
ID=32073475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/031270 WO2004032198A2 (en) | 2002-10-03 | 2003-10-03 | Method for maintaining solder thickness in flipchip attach packaging processes |
Country Status (5)
Country | Link |
---|---|
US (2) | US6943434B2 (en) |
AU (1) | AU2003283992A1 (en) |
DE (1) | DE10393441T5 (en) |
TW (1) | TWI320587B (en) |
WO (1) | WO2004032198A2 (en) |
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2003
- 2003-10-02 US US10/678,010 patent/US6943434B2/en not_active Expired - Lifetime
- 2003-10-03 DE DE10393441T patent/DE10393441T5/en not_active Withdrawn
- 2003-10-03 WO PCT/US2003/031270 patent/WO2004032198A2/en not_active Application Discontinuation
- 2003-10-03 TW TW092127427A patent/TWI320587B/en not_active IP Right Cessation
- 2003-10-03 AU AU2003283992A patent/AU2003283992A1/en not_active Abandoned
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2005
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Also Published As
Publication number | Publication date |
---|---|
TWI320587B (en) | 2010-02-11 |
TW200425355A (en) | 2004-11-16 |
AU2003283992A1 (en) | 2004-04-23 |
AU2003283992A8 (en) | 2004-04-23 |
US20050224940A1 (en) | 2005-10-13 |
WO2004032198A2 (en) | 2004-04-15 |
US20040130009A1 (en) | 2004-07-08 |
US6943434B2 (en) | 2005-09-13 |
DE10393441T5 (en) | 2005-09-08 |
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