WO2004033103B1 - High temperature, high strength, colorable materials for device processing systems - Google Patents

High temperature, high strength, colorable materials for device processing systems

Info

Publication number
WO2004033103B1
WO2004033103B1 PCT/US2003/032197 US0332197W WO2004033103B1 WO 2004033103 B1 WO2004033103 B1 WO 2004033103B1 US 0332197 W US0332197 W US 0332197W WO 2004033103 B1 WO2004033103 B1 WO 2004033103B1
Authority
WO
WIPO (PCT)
Prior art keywords
article
impart
needed
metal oxide
oxide
Prior art date
Application number
PCT/US2003/032197
Other languages
French (fr)
Other versions
WO2004033103A2 (en
WO2004033103A3 (en
WO2004033103A9 (en
Inventor
Charles W Extrand
Robert Bucha
Original Assignee
Entegris Inc
Charles W Extrand
Robert Bucha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc, Charles W Extrand, Robert Bucha filed Critical Entegris Inc
Priority to JP2004543684A priority Critical patent/JP2006507994A/en
Priority to EP03770728A priority patent/EP1556209A4/en
Priority to AU2003279239A priority patent/AU2003279239A1/en
Publication of WO2004033103A2 publication Critical patent/WO2004033103A2/en
Publication of WO2004033103A9 publication Critical patent/WO2004033103A9/en
Publication of WO2004033103A3 publication Critical patent/WO2004033103A3/en
Publication of WO2004033103B1 publication Critical patent/WO2004033103B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H01L21/6733—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]

Abstract

Electrostatic-discharge safe devices for processing electronic components, e.g., matrix trays, chip trays, and wafer carriers are disclosed that are made from a mixture of a high temperature, high strength polymer and at least one metal oxide, and optionally with at least one pigment. The use of the metal oxides as conductive materials advantageously allows for light-colored electrostatic-discharge safe materials to be made. Such materials may be colored with pigments without compromise of material performance specifications.

Claims

AMENDED CLAIMS [received by the International Bureau on 28 February 2005 (28.02.2005); original claims 1, 6-7, 9, 13, 15, 18, 24-27, 32-34 and 42-45 amended; original claims 16-17 and 35-36 cancelled; remaining claims unchanged (9 pages)]
1. An article for receiving electronic components, the article comprising: a structure comprising at least one electrostatic discharge-safe surface l'ι>r contacting and supporting an electronic component, wherein the surface comprises a mixture of at least one high temperature, high strength polymer and at least one m lal oxide doped or coated with another metal as needed to impart or enhance conductivity and being present in a concentration to provide an electrostatic discharge~&,;fe resistivity in the range of 103 to 10u ohms per square, wherein the surface has an L value of more than about 40, and wherein the article is a member of the grciip consisting of a disk processing cassette, matrix tray, wafer carrier and a chip tray.
2. The article of claim 1 wherein the surface comprises a bottom of a pocket
3. The article of claim 1 wherein the surface has an L value of more than at out
55.
4. The article of claim 1 wherein the surface has an value of more than a out
65.
5- The article of claim 1 wherein the polymer has a stiffness of at least about 1 GPa and a glass transition temperature or melting point higher than about 150° C.
6". The article of claim 1 wherein the metal oxide doped or coated with another metal as needed to impart or enhance conductivity is present at a concentration of abou'i 4-0% to about 75% by weight.
7. The article of claim 1 wherein the at least one metal oxide doped or co ted with another metal as needed to impart or enliance conductivity comprises a member cf the group consisting of aluminum borate, zinc oxide, basic magnesium sulfate, magnesium oxide, graphite, potassium titanate, magnesium borate, titanium diboride, tin oxide, calcium sulfate, and antimony doped tin oxide.
8. The article of claim 1 wherein the high temperature, high strength pc .ymer comprises a member of the group consisting of polyphenylene sulfide, polyetheπ ide, polyarylketones, polyetherketone, polyetheretherketone, polyetherketonet stone, polyethersulfone.
27
9. The article of claim I wherem the at least one metal oxide doped or coattd with another metal as needed to impart or enhance conductivity is present at a concentration of about 50% to about 60% by weight,
10. The article of claim 1 wherem at least a portion of the surface comprises, a bottom of a pocket, with the bottom being flatter than an average of about 0.03 inches },i:τ inch.
11. The article of claim 1 wherem at least a portion of the surface comprise, a bottom of a pocket, with the bottom being flatter than an average of about 0.015 inches er inch.
12. The article of claim 1 wherein the high temperature, high strength polyn.'er comprises a member of the group consisting of polyphenylene oxide, ionomer resin, nylo.\ 6 resin, nylon 6,6 resin, aromatic polyamide resin, polycarbonate, polyacetal, trimethylpeni;ι?ne resin, polysulfone, tetrafluoroethylene/perfluoroalkoxyethylene copolymer, high-temperaJiire amorphous resin, polyallylsulfone, liquid crystal polymer, polyvinylidene fluor.ie, ethylene/tetrafluoroethylene copolymer, tetrafluoroethyleπe/ hexafluoropropylene copolyner, and tetrafiuoroethylene/hexafluoropropylene/ perfluoroalkoxyethylene terpolymer.
13. The article of claim 1 wherem the at least one metal oxide doped or co : ted with another metal as needed to impart or enhance conductivity is disposed as a pluralit of particles-
14. The article of claim 13 wherein the wherein the particles comprise an isotiopic flow shape.
15. The article of claim 1 further comprising a pigment that_comprises a mcaber of the group consisting of titanium dioxide, iron oxide, chromiu oxide greens, iron blue, chrome green, aluminum sulfosilicate, cobalt aluminate, barium manganate, lead chromiates, cadmium suMdes and selenides,
16. Cancelled.
17. Cancelled.
18. A set of colored carriers for electronic component processing, th? set comprising:
29 at least two subsets of colored carriers wherein each colored carrier compris s an electrostatic discharge-safe surface, with each subset comprising a subset co τ distinct from the other subset colors, wherein the surfaces comprise a hij; , temperature, high strength polymer, a metal oxide doped or coated with another meliil as needed to impart or enhance conductivity and being present in a concentration lo provide an electrostatic discharge-safe resistivity in the range of 103 to 10w ohms p sr square, and a pigment contributing to the coloration of the subset color distinct fiτ>m the other subset colors, and wherem the carrier is a member of the group consisting of a disk processing cassette, a matrix tray, a chip tray, and a wafer carrier.
19. The sel of trays of claim IS wherein each subset of carriers corresponds a different model of carricr.
20. The set of trays of claim 18 wherein each subset of carriers corresponds lo a type of component in the carriers.
21. The set of claim 18 wherein the pockets are flatter than an average of about 0.03 inches per inch.
22. The set of claim 18 wherein the carriers comprise a plurality of pocliets, wherein the pockets are flatter than an average of about 0.015 inches per inch,
23. The set of claim 1 S wherein the surface has an L value of at least about 40
24. The set of claim 18 wherein the at least one metal oxide doped or coated Λrith another metal as needed to impart or enhance conductivity comprises a member of the g.roup consisting of aluminum borate, zinc oxide, basic magnesium sulfate, magnesium ID: tide- graphite, potassium titanate, magnesium borate, titanium diboride, tin oxide, calcium S fate, and antimony doped tin oxide,
25. The set of claim 18 wherein the at least one metal oxide doped or coated with another metal as needed to impart or enhance conductivity is present at a concent lation between 50 and 70 percent by weight.
26 The article of claim 18 wherein the pigment comprises a member of the group consisting of titanium dioxide, iron oxide, chromium oxide greens, iron blue, chrome ,ξreen, aluminum sulfosilicate, cobalt aluminate, barium manganate, lead chromates, cadmium sulfϊdes and selenides.
30
27. A method for processing electronic components, the method comprisir.> placing an electronic component on an electrostatic discharge-safe surface of a coloi -i carrier, with tire surface comprising a mixture of at least one high temperature, high strength polymer, at least one metal oxide doped or coated with another metal as needed to impart f>r enhance conductivity and being present in a concentration to provide an electrostatic discharge-safe resistivity in the range of 103 to lθ'4 ohms per square, and at least one pigment, wherein the surface has an value of more than about 40 and the carrier if a member of the group consisting of a disk processing cassette, a matrix tray, a wafer carrwr, and a chip tray.
31
28. The method of claim 27 wherein the at least one the high temperature, hijih strength polymer comprises a member of the group consisting of polyphenylene sulfiiføj, polyetherimide, polyarylketones, polyetherketone, polyetheretherketor s, polyetherketoneketone, polyethersulfone.
29. The method of claim 27 wherein the at least one metal oxide doped or coølud with another metal as needed to impart or enhance conductivity is present at a concentration is about 40% to about 75% by weight.
30. The method of claim 27 wherein the surface has a L value of at least about '-0.
31. The method of claim 27 wherein at least a portion of the surface is flatter X an an average of about 0,03 inches per inch.
32. The method of claim 27 wherein at least a portion of the at least one niistal oxide doped or coated with another metal as needed to impart or enhance conduct! "ity comprises a whisker.
33. The method of claim 27 wherein at least a portion of the at least one metal oxide doped or coaled with another metal as needed to impart or enhance conduct vity comprises a whisker.
34. The method of claim 27 wherein the at least one metal oxide doped or coated with another metal as needed to impart or enhance conductivity comprises particles that comprise an isotropic flow shape.
35. Cancelled.
36. Cancelled.
37. The method of claim, 27 wherein the colored tray is a matrix tray.
38. The method of claim 27 wherem the at least one pigment comprises a member of the group consisting of titanium dioxide, iron oxide, chromium oxide greens, iron bl'ju,
32 chrome green, aluminum sulfosilicate, cobalt aluminate, barium manganate, lead chromate, cadmium sulfides and selenides.
39. A method of producing an article for electronic processing, the method comprising: molding a carrier comprising an electrostatic discharge-safe surface that comprise ?; a high temperature, high strength polymer and a conductive filler, an L value of at least about 40, and a resistivity in the range of 103 to 1014 ohms per square, and wherem the carrier i- a member of the group consisting of a matrix tray and a chip tray.
40. The method of claim 39 wherein the polymer has a glass transition temperature or melting point higher than about 150° C and a stiffness of at least about 1 Gl'a.
41. The method of claim 39 wherem the conductive filler is a metal oxide present in a concentration of about 40% to about 75% by weight.
42. A carrier for receiving electronic components comprising: a carrier comprising at least one electrostatic discharge-safe surface for contacting and supporting an component, wherein the surface comprises a mixture of at least one -ligh temperature, high strength polymer and at least one metal oxide doped or coated with antither metal as needed to impart or enhance conductivity and being present in a concentratic l of more than about 40% by weight and providing an electrostatic discharge-safe resistivily in the range of 103 to 1014 ohms per square, wherein the surface has an L value of more, than about 40, wherein the carrier is a member of the group consisting of a matrix tray, chip tray, wafer carrier and a disk processing cassette.
43. The article of claim 42 wherein the at least one metal oxide doped or coated with another metal as needed to impart or enhance conductivity is present at a concent -ation of about 40% to about 75% by weight,
44. The article of claim 42 wherein the at least one metal oxide doped or coated with another metal as needed to impart or enhance conductivity is present at a conceni -ation of at least about 50% by weight.
45. The article of claim 42 wherein the at least one metal oxide doped or ;.oated with another metal as needed to impart or enhance conductivity comprises a member of the
33 group consisting of aluminum borate, zinc oxide, basic magnesium sulfate, magnesium oxid:, graphite, potassium titanate, magnesium borate, titanium diboride, tin oxide, calcium sulfal,ι, and antimony doped tin oxide.
46. The article of claim 42 wherein the polymer has a stiffness of at least abou I 1 GPa and a glass transition temperature or melting point higher than about 150° C.
47. The article of claim 42 further comprising a pigment.
48. The article of claim 47 wherein the pigment is a member of the grt ιρ consisting of titanium dioxides, iron oxides, and chromium oxide greens,
49. The article of claim 47 wherein the pigment is not an oxide,
50. The article of claim 42 wherein the high temperature, high strength potyπer comprises a member of the group consisting of polyphenylene sulfide, polyetherinude, polyarylketones, polyetherketone, polyetheretherketone, polyetherketonekei,<:ne, polyethersulfone.
51. The method of claim 42 wherein the at least one metal oxide comp 'ises particles that have an isorropic flow shape.
52. A method of producing an article for electronic processing, the meihod comprising: molding a carrier comprising an electrostatic discharge-safe surface that compriiies a high temperature, high strength polymer and a conductive filler, an L value of at least 'bout 40, and a resistivity in the range of 103 to 1014 ohms per square, and wherem the carrie * is a member of the group consisting of a wafer carrier and a disk processing cassette.
53. The method of claim 52 further comprising coloring the carrier with a pigment.
54. The method of claim 52 wherein the conductive filler comprises a met l oxide present at a concentration of about 40% to about 75% by weight.
55. The method of claim 54 wherein the metal oxide comprises particles that have an isotropic flow shape.
34
56. The method of claim 52 wherein the filler comprises particles that have Ϊ.J isotropic flow shape.
35
PCT/US2003/032197 2002-10-09 2003-10-09 High temperature, high strength, colorable materials for device processing systems WO2004033103A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004543684A JP2006507994A (en) 2002-10-09 2003-10-09 High temperature high strength colorable materials for device processing systems
EP03770728A EP1556209A4 (en) 2002-10-09 2003-10-09 High temperature, high strength, colorable materials for device processing systems
AU2003279239A AU2003279239A1 (en) 2002-10-09 2003-10-09 High temperature, high strength, colorable materials for device processing systems

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41715002P 2002-10-09 2002-10-09
US60/417,150 2002-10-09

Publications (4)

Publication Number Publication Date
WO2004033103A2 WO2004033103A2 (en) 2004-04-22
WO2004033103A9 WO2004033103A9 (en) 2004-11-25
WO2004033103A3 WO2004033103A3 (en) 2005-02-24
WO2004033103B1 true WO2004033103B1 (en) 2005-05-06

Family

ID=32093973

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/032197 WO2004033103A2 (en) 2002-10-09 2003-10-09 High temperature, high strength, colorable materials for device processing systems

Country Status (8)

Country Link
US (3) US20040126522A1 (en)
EP (1) EP1556209A4 (en)
JP (1) JP2006507994A (en)
KR (1) KR20050050122A (en)
CN (1) CN1942304A (en)
AU (1) AU2003279239A1 (en)
TW (1) TWI290118B (en)
WO (1) WO2004033103A2 (en)

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Also Published As

Publication number Publication date
WO2004033103A2 (en) 2004-04-22
CN1942304A (en) 2007-04-04
WO2004033103A3 (en) 2005-02-24
TW200415084A (en) 2004-08-16
WO2004033103A9 (en) 2004-11-25
JP2006507994A (en) 2006-03-09
EP1556209A2 (en) 2005-07-27
AU2003279239A8 (en) 2004-05-04
AU2003279239A1 (en) 2004-05-04
TWI290118B (en) 2007-11-21
US20070190276A1 (en) 2007-08-16
KR20050050122A (en) 2005-05-27
US20070178259A1 (en) 2007-08-02
US20040126522A1 (en) 2004-07-01
EP1556209A4 (en) 2009-07-01

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