WO2004034068A3 - Contact structure and production method thereof and probe contact assembly using same - Google Patents

Contact structure and production method thereof and probe contact assembly using same Download PDF

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Publication number
WO2004034068A3
WO2004034068A3 PCT/US2003/032628 US0332628W WO2004034068A3 WO 2004034068 A3 WO2004034068 A3 WO 2004034068A3 US 0332628 W US0332628 W US 0332628W WO 2004034068 A3 WO2004034068 A3 WO 2004034068A3
Authority
WO
WIPO (PCT)
Prior art keywords
contact
contact structure
contactor
same
production method
Prior art date
Application number
PCT/US2003/032628
Other languages
French (fr)
Other versions
WO2004034068A2 (en
Inventor
Yu Zhou
David Yu
Original Assignee
Yu Zhou
David Yu
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yu Zhou, David Yu, Advantest Corp filed Critical Yu Zhou
Publication of WO2004034068A2 publication Critical patent/WO2004034068A2/en
Publication of WO2004034068A3 publication Critical patent/WO2004034068A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Abstract

A contact structure for establishing electrical connection with contact targets. The contact structure is formed of a contactor carrier (222) and a plurality of contactors attached to a contactor carrier. The contactors (230) are inserted in diagonal through holes on the contactor carrier (222) and attached to the contactor carrier (222) through adhesives. The contactor (230) has a top end having a flat top surface, a straight diagonal beam integral with the top end and configured by an upper beam portion and a lower beam portion, and a lower end at an end of the lower beam portion to contact with a contact target. A probe contact assembly using the contact structure is also disclosed which incorporates a flip chip bonding technology to interconnect the components therein.
PCT/US2003/032628 2002-10-10 2003-10-10 Contact structure and production method thereof and probe contact assembly using same WO2004034068A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41771602P 2002-10-10 2002-10-10
US60/417,716 2002-10-10

Publications (2)

Publication Number Publication Date
WO2004034068A2 WO2004034068A2 (en) 2004-04-22
WO2004034068A3 true WO2004034068A3 (en) 2005-03-17

Family

ID=32094069

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/032628 WO2004034068A2 (en) 2002-10-10 2003-10-10 Contact structure and production method thereof and probe contact assembly using same

Country Status (2)

Country Link
US (1) US6917102B2 (en)
WO (1) WO2004034068A2 (en)

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US7108546B2 (en) * 2001-06-20 2006-09-19 Formfactor, Inc. High density planar electrical interface
KR100443999B1 (en) * 2003-02-28 2004-08-21 주식회사 파이컴 Interconnector for Printed Circuit Board, method thereby and interconnector assembly having it
US7071715B2 (en) * 2004-01-16 2006-07-04 Formfactor, Inc. Probe card configuration for low mechanical flexural strength electrical routing substrates
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US7759949B2 (en) 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US7659739B2 (en) 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
KR100626570B1 (en) * 2004-12-24 2006-09-25 주식회사 파이컴 A probe card manufacturing method include sensing probe and the probe card, probe card inspection system
KR20080002793A (en) * 2005-03-01 2008-01-04 에스브이 프로브 피티이 엘티디 Probe card with stacked substrate
EP2569646A4 (en) * 2005-03-28 2014-01-22 Texas Instruments Inc Resilient probes for electrical testing
JP4564434B2 (en) * 2005-09-30 2010-10-20 Ｏｋｉセミコンダクタ株式会社 Semiconductor device and manufacturing method of semiconductor device
US7649367B2 (en) 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7456640B2 (en) * 2006-02-16 2008-11-25 International Business Machines Corporation Structure for coupling probes of probe device to corresponding electrical contacts on product substrate
US7312617B2 (en) * 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
JP2007303826A (en) * 2006-05-08 2007-11-22 Tokyo Electron Ltd Probe
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US7786740B2 (en) 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US7642793B2 (en) * 2006-11-22 2010-01-05 Taiwan Semiconductor Manufacturing Company, Ltd. Ultra-fine pitch probe card structure
US7696766B2 (en) * 2007-01-31 2010-04-13 Taiwan Semiconductor Manufacturing Company, Ltd. Ultra-fine pitch probe card structure
KR100855302B1 (en) * 2007-02-16 2008-08-29 주식회사 파이컴 Probe card and method of bonding a connector
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US7733102B2 (en) * 2007-07-10 2010-06-08 Taiwan Semiconductor Manufacturing Company, Ltd. Ultra-fine area array pitch probe card
CN101316014B (en) * 2007-10-17 2012-02-01 番禺得意精密电子工业有限公司 Electric connection device and assembly method thereof
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US7936177B2 (en) * 2008-03-07 2011-05-03 Formfactor, Inc. Providing an electrically conductive wall structure adjacent a contact structure of an electronic device
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
KR101004911B1 (en) * 2008-08-12 2010-12-28 삼성전기주식회사 Fabrication method of micro electro-mechanical component
US8643394B2 (en) * 2010-04-16 2014-02-04 Taiwan Semiconductor Manufacturing Company, Ltd. Non-reflow probe card structure
US8274798B2 (en) * 2010-07-28 2012-09-25 Unimicron Technology Corp. Carrier substrate and method for making the same
KR101278713B1 (en) * 2011-03-08 2013-06-25 (주)엠투엔 Probe card and method of manufacture
US9651578B2 (en) * 2011-04-21 2017-05-16 Mpi Corporation Assembly method of direct-docking probing device
US9239147B2 (en) 2012-11-07 2016-01-19 Omnivision Technologies, Inc. Apparatus and method for obtaining uniform light source
US9494617B2 (en) 2012-11-07 2016-11-15 Omnivision Technologies, Inc. Image sensor testing probe card
TWI509254B (en) * 2013-03-06 2015-11-21 Omnivision Tech Inc Image sensor testing probe card and method of making the same
TWM463903U (en) * 2013-05-15 2013-10-21 Star Techn Inc Test assembly
TWI506282B (en) * 2013-08-08 2015-11-01 Mjc Probe Inc Probe card
US20150061719A1 (en) * 2013-09-05 2015-03-05 Soulbrain Eng Co., Ltd. Vertical probe card for micro-bump probing
CN103855049B (en) * 2014-03-27 2016-08-17 上海华力微电子有限公司 A kind of intelligent probe card pin pressure control system and control method
US9812804B2 (en) * 2014-03-27 2017-11-07 Intel Corporation Pogo-pins for high speed signaling
KR20160149905A (en) * 2015-06-19 2016-12-28 에스케이하이닉스 주식회사 Semiconductor package with sliding interconnection structure
KR101718717B1 (en) * 2015-08-11 2017-04-04 (주)다원넥스뷰 Probe Bonding Device and Probe Bonding Method Using the Same
US10096958B2 (en) * 2015-09-24 2018-10-09 Spire Manufacturing Inc. Interface apparatus for semiconductor testing and method of manufacturing same
CN106935524B (en) * 2015-12-24 2020-04-21 台湾积体电路制造股份有限公司 Probe card, wafer test system and wafer test method
TWI632376B (en) * 2016-05-31 2018-08-11 巨擘科技股份有限公司 Probe card device
US10877069B2 (en) * 2016-07-28 2020-12-29 Nidec-Read Corporation Inspection jig, substrate inspection device, and method for manufacturing inspection jig
JP7075725B2 (en) * 2017-05-30 2022-05-26 株式会社日本マイクロニクス Electrical connection device
WO2019168496A1 (en) * 2018-02-27 2019-09-06 Hewlett-Packard Development Company, L.P. Data carrier adapters
JP2021117085A (en) * 2020-01-24 2021-08-10 ミネベアミツミ株式会社 Probe, measurement device, and measurement method

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US6676438B2 (en) * 2000-02-14 2004-01-13 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
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US6690186B2 (en) * 1994-07-07 2004-02-10 Tessera, Inc. Methods and structures for electronic probing arrays
US5779451A (en) * 1995-06-05 1998-07-14 Hatton; Gregory John Power efficient multi-stage twin screw pump
US6690185B1 (en) * 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
US6736665B2 (en) * 1998-11-30 2004-05-18 Advantest Corp. Contact structure production method
US6750136B2 (en) * 1998-11-30 2004-06-15 Advantest Corp. Contact structure production method
US6676438B2 (en) * 2000-02-14 2004-01-13 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
US6561819B1 (en) * 2001-12-26 2003-05-13 Hon Hai Precision Ind. Co., Ltd. Terminals of socket connector
US6653724B1 (en) * 2002-05-06 2003-11-25 Samsung Electro-Mechanics Co., Ltd. Chip on board package for optical mice and lens cover for the same

Also Published As

Publication number Publication date
WO2004034068A2 (en) 2004-04-22
US6917102B2 (en) 2005-07-12
US20040124519A1 (en) 2004-07-01

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