WO2004036641A1 - 被検査体を温度制御するプローブ装置及びプローブ検査方法 - Google Patents
被検査体を温度制御するプローブ装置及びプローブ検査方法 Download PDFInfo
- Publication number
- WO2004036641A1 WO2004036641A1 PCT/JP2003/009457 JP0309457W WO2004036641A1 WO 2004036641 A1 WO2004036641 A1 WO 2004036641A1 JP 0309457 W JP0309457 W JP 0309457W WO 2004036641 A1 WO2004036641 A1 WO 2004036641A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- stage
- probe
- test
- test object
- temperature
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020047016932A KR100665407B1 (ko) | 2002-10-21 | 2003-07-25 | 피검사체를 온도 제어하는 프로브장치 및 프로브 검사방법 |
EP03808857A EP1557877A4 (en) | 2002-10-21 | 2003-07-25 | PROBE DEVICE CONTROLLING THE TEMPERATURE OF THE OBJECT TO BE INVESTIGATED, AND CIRCULAR SEARCH METHOD |
US10/869,932 US6992500B2 (en) | 2002-10-21 | 2004-06-18 | Prober and probe testing method for temperature-controlling object to be tested |
US11/206,003 US7332918B2 (en) | 2002-10-21 | 2005-08-18 | Prober and probe testing method for temperature-controlling object to be tested |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-305925 | 2002-10-21 | ||
JP2002305925A JP4659328B2 (ja) | 2002-10-21 | 2002-10-21 | 被検査体を温度制御するプローブ装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/869,932 Continuation US6992500B2 (en) | 2002-10-21 | 2004-06-18 | Prober and probe testing method for temperature-controlling object to be tested |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004036641A1 true WO2004036641A1 (ja) | 2004-04-29 |
Family
ID=32105190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/009457 WO2004036641A1 (ja) | 2002-10-21 | 2003-07-25 | 被検査体を温度制御するプローブ装置及びプローブ検査方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US6992500B2 (ja) |
EP (1) | EP1557877A4 (ja) |
JP (1) | JP4659328B2 (ja) |
KR (1) | KR100665407B1 (ja) |
CN (1) | CN1322568C (ja) |
TW (1) | TWI283451B (ja) |
WO (1) | WO2004036641A1 (ja) |
Families Citing this family (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE20114544U1 (de) * | 2000-12-04 | 2002-02-21 | Cascade Microtech Inc | Wafersonde |
WO2003100445A2 (en) * | 2002-05-23 | 2003-12-04 | Cascade Microtech, Inc. | Probe for testing a device under test |
JP4300003B2 (ja) * | 2002-08-07 | 2009-07-22 | 東京エレクトロン株式会社 | 載置台の駆動装置及びプローブ方法 |
JP4659328B2 (ja) * | 2002-10-21 | 2011-03-30 | 東京エレクトロン株式会社 | 被検査体を温度制御するプローブ装置 |
EP1604218A2 (en) * | 2003-03-14 | 2005-12-14 | Applied Precision, LLC | Method of mitigating effects of component deflection in a probe card analyzer |
US7057404B2 (en) * | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
KR100960496B1 (ko) * | 2003-10-31 | 2010-06-01 | 엘지디스플레이 주식회사 | 액정표시소자의 러빙방법 |
DE202004021093U1 (de) | 2003-12-24 | 2006-09-28 | Cascade Microtech, Inc., Beaverton | Aktiver Halbleiterscheibenmessfühler |
KR20070058522A (ko) | 2004-09-13 | 2007-06-08 | 캐스케이드 마이크로테크 인코포레이티드 | 양측 프루빙 구조 |
JP4613589B2 (ja) * | 2004-11-16 | 2011-01-19 | セイコーエプソン株式会社 | 半導体試験装置 |
JP2006284384A (ja) * | 2005-03-31 | 2006-10-19 | Fujitsu Ltd | 半導体装置の試験装置及び試験方法 |
KR100956472B1 (ko) | 2005-04-27 | 2010-05-07 | 에어 테스트 시스템즈 | 전자 장치들을 테스트하기 위한 장치 |
US20090045829A1 (en) * | 2005-08-04 | 2009-02-19 | Sumitomo Electric Industries, Ltd. | Wafer holder for wafer prober and wafer prober equipped with same |
JP4667158B2 (ja) * | 2005-08-09 | 2011-04-06 | パナソニック株式会社 | ウェーハレベルバーンイン方法 |
TWI405983B (zh) * | 2005-08-25 | 2013-08-21 | Nidec Read Corp | Substrate inspection device and substrate inspection method |
JP2007057444A (ja) * | 2005-08-25 | 2007-03-08 | Nidec-Read Corp | 基板検査装置、及び基板検査装置の温度維持機構 |
DE102006023968B4 (de) | 2005-12-29 | 2009-12-10 | Lg Display Co., Ltd. | Inspektionsvorrichtung für Flüssigkristallanzeigepaneel |
KR100768915B1 (ko) * | 2006-03-17 | 2007-10-23 | 양 전자시스템 주식회사 | 평판표시소자의 프로브 검사장치 |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7403028B2 (en) * | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
CN100395170C (zh) * | 2007-02-03 | 2008-06-18 | 中国电子科技集团公司第二研究所 | 升降平台 |
CN103295949B (zh) | 2007-04-05 | 2016-12-28 | 雅赫测试系统公司 | 测试微电子电路的方法、测试器设备及便携式组装 |
US7675306B2 (en) * | 2007-05-04 | 2010-03-09 | Qimonda Ag | Prober apparatus and operating method therefor |
JP2008281466A (ja) * | 2007-05-11 | 2008-11-20 | Toyota Motor Corp | 半導体検査装置 |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
JP4999615B2 (ja) * | 2007-08-31 | 2012-08-15 | 東京エレクトロン株式会社 | 検査装置及び検査方法 |
JP2009130114A (ja) * | 2007-11-22 | 2009-06-11 | Tokyo Electron Ltd | 検査装置 |
JP5221118B2 (ja) * | 2007-12-14 | 2013-06-26 | 東京エレクトロン株式会社 | 検査装置 |
US7800382B2 (en) | 2007-12-19 | 2010-09-21 | AEHR Test Ststems | System for testing an integrated circuit of a device and its method of use |
KR100941674B1 (ko) * | 2008-01-29 | 2010-02-12 | (주)테크윙 | 전자부품 검사 지원을 위한 핸들러용 캐리어보드이송시스템 및 전자부품 검사 지원을 위한 핸들러의 챔버내에서의 캐리어보드 이송방법 |
JP2009277953A (ja) * | 2008-05-16 | 2009-11-26 | Hitachi High-Technologies Corp | 測定方法および検査装置 |
KR101015600B1 (ko) * | 2008-12-19 | 2011-02-17 | 세크론 주식회사 | 프로브 스테이션용 스테이지 유닛 및 이를 포함하는 웨이퍼검사 장치 |
TW201029082A (en) * | 2009-01-16 | 2010-08-01 | Star Techn Inc | Probing apparatus with temperature-adjusting modules for testing semiconductor devices |
US9121901B2 (en) | 2009-02-12 | 2015-09-01 | Advantest Corporation | Semiconductor wafer test apparatus |
KR101011457B1 (ko) * | 2009-02-23 | 2011-01-28 | 양 전자시스템 주식회사 | 평판디스플레이 기판의 전기적 특성 시험을 위한 냉각 및 방습 장치 |
US8030957B2 (en) | 2009-03-25 | 2011-10-04 | Aehr Test Systems | System for testing an integrated circuit of a device and its method of use |
KR101090333B1 (ko) * | 2009-06-03 | 2011-12-07 | 주식회사 쎄믹스 | 척의 능동적 기울기 제어가 가능한 웨이퍼 프로브 스테이션 및 그 제어방법 |
JP5197505B2 (ja) * | 2009-06-19 | 2013-05-15 | 東京エレクトロン株式会社 | ウエハチャック用の温度センサ |
CN103088308B (zh) * | 2011-11-01 | 2016-07-13 | 无锡华润上华科技有限公司 | 除气腔内的温度监控装置 |
TWM436227U (en) * | 2012-03-23 | 2012-08-21 | Mpi Corp | Heating point testing appliances |
CN103852677A (zh) * | 2012-12-04 | 2014-06-11 | 天津市电力公司 | 一种电子产品中接触不良故障的快速诊断定位方法 |
KR102066155B1 (ko) | 2013-03-08 | 2020-01-14 | 삼성전자주식회사 | 프로빙 방법, 이를 수행하기 위한 프로브 카드 및 프로브 카드를 포함하는 프로빙 장치 |
US9417308B2 (en) | 2013-07-03 | 2016-08-16 | Stichting Continuiteit Beijert Engineering | Apparatus and method for inspecting pins on a probe card |
US9874602B2 (en) * | 2014-10-17 | 2018-01-23 | Nxp Usa, Inc. | Test board support platform for supporting a test board |
US10499461B2 (en) * | 2015-12-21 | 2019-12-03 | Intel Corporation | Thermal head with a thermal barrier for integrated circuit die processing |
JP6782103B2 (ja) * | 2016-06-21 | 2020-11-11 | 株式会社日本マイクロニクス | プローブカード、検査装置および検査方法 |
KR102619328B1 (ko) * | 2016-06-29 | 2024-01-02 | 세메스 주식회사 | 웨이퍼 검사 공정에서 척의 온도를 제어하는 방법 |
KR101917432B1 (ko) * | 2016-11-21 | 2018-11-09 | 세메스 주식회사 | 기판 지지 부재 및 이를 구비하는 프로브 스테이션 |
TWI617813B (zh) * | 2017-02-09 | 2018-03-11 | 矽品精密工業股份有限公司 | 檢測設備 |
CN114814522A (zh) | 2017-03-03 | 2022-07-29 | 雅赫测试系统公司 | 电子测试器 |
JP7078838B2 (ja) * | 2017-12-01 | 2022-06-01 | 東京エレクトロン株式会社 | プローバ |
JP7177324B2 (ja) * | 2018-01-19 | 2022-11-24 | セミックス インコーポレイテッド | ウェハプローバ |
JP7121953B2 (ja) * | 2018-02-22 | 2022-08-19 | 国立大学法人大阪大学 | 基板評価用チップ及び基板評価装置 |
JP7161854B2 (ja) * | 2018-03-05 | 2022-10-27 | 東京エレクトロン株式会社 | 検査装置 |
JP7042158B2 (ja) * | 2018-05-23 | 2022-03-25 | 東京エレクトロン株式会社 | 検査装置及び温度制御方法 |
CN109061476A (zh) * | 2018-06-02 | 2018-12-21 | 黄开荣 | 一种可充电电池生产检测设备及方法 |
DE102019005093A1 (de) * | 2019-07-22 | 2021-01-28 | Att Advanced Temperature Test Systems Gmbh | Verfahren zur temperatursteuerung bzw. -regelung eines chucks für einen wafer, eine temperiereinrichtung zum temperieren eines chucks sowie ein wafertestsystem zum testen eines wafers |
US11378619B2 (en) * | 2019-12-18 | 2022-07-05 | Formfactor, Inc. | Double-sided probe systems with thermal control systems and related methods |
CN113053774A (zh) * | 2019-12-27 | 2021-06-29 | 迪科特测试科技(苏州)有限公司 | 探测装置 |
KR102157070B1 (ko) * | 2020-03-03 | 2020-09-17 | 주식회사 프로이천 | 오토 프로브장치 |
CN111487521B (zh) * | 2020-04-29 | 2021-01-05 | 江苏七维测试技术有限公司 | 一种温度传感器液体环境晶圆级测试装置 |
WO2022076333A1 (en) | 2020-10-07 | 2022-04-14 | Aehr Test Systems | Electronics tester |
US11754619B2 (en) * | 2021-01-11 | 2023-09-12 | Star Technologies, Inc. | Probing apparatus with temperature-adjusting mechanism |
US11796589B1 (en) | 2022-10-21 | 2023-10-24 | AEM Holdings Ltd. | Thermal head for independent control of zones |
US11828795B1 (en) | 2022-10-21 | 2023-11-28 | AEM Holdings Ltd. | Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones |
US11828796B1 (en) | 2023-05-02 | 2023-11-28 | AEM Holdings Ltd. | Integrated heater and temperature measurement |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05136229A (ja) * | 1991-11-08 | 1993-06-01 | Fujitsu Ltd | バーンイン装置 |
JPH07221144A (ja) * | 1995-02-20 | 1995-08-18 | Tokyo Electron Ltd | プローブ装置 |
JP2000077488A (ja) * | 1998-08-31 | 2000-03-14 | Nec Kyushu Ltd | プローブ装置 |
US20020011854A1 (en) * | 1998-04-04 | 2002-01-31 | Motohiro Kuji | Probe device |
JP2002280430A (ja) * | 2001-03-19 | 2002-09-27 | Toshiba Electronic Engineering Corp | 温度測定方法およびそれを用いた試験方法ならびに半導体試験装置と特性予測方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2631010B1 (fr) * | 1988-05-06 | 1991-03-22 | Sagem | Dispositif de support et de regulation thermique d'une piece et appareillage de test de plaques de circuits semi-conducteurs incluant un tel dispositif |
KR0140034B1 (ko) * | 1993-12-16 | 1998-07-15 | 모리시다 요이치 | 반도체 웨이퍼 수납기, 반도체 웨이퍼의 검사용 집적회로 단자와 프로브 단자와의 접속방법 및 그 장치, 반도체 집적회로의 검사방법, 프로브카드 및 그 제조방법 |
JP3326317B2 (ja) * | 1995-12-05 | 2002-09-24 | 横河電機株式会社 | 電圧測定装置 |
JP3253002B2 (ja) | 1995-12-27 | 2002-02-04 | 東京エレクトロン株式会社 | 処理装置 |
JPH10135315A (ja) * | 1996-10-29 | 1998-05-22 | Tokyo Electron Ltd | 試料載置台の温度制御装置及び検査装置 |
TW480645B (en) * | 1997-02-24 | 2002-03-21 | Tokyo Electron Ltd | Method and apparatus for inspecting semiconductor integrated circuits, and contactor incorporated in the apparatus |
JPH10256325A (ja) * | 1997-03-07 | 1998-09-25 | Orion Mach Co Ltd | 半導体ウェーハの試験装置用温度調節プレート |
TW399279B (en) * | 1997-05-08 | 2000-07-21 | Tokyo Electron Limtied | Prober and probe method |
JPH118180A (ja) * | 1997-06-17 | 1999-01-12 | Sony Corp | ベーキング装置 |
US5966940A (en) * | 1997-11-18 | 1999-10-19 | Micro Component Technology, Inc. | Semiconductor thermal conditioning apparatus and method |
US6389225B1 (en) * | 1998-07-14 | 2002-05-14 | Delta Design, Inc. | Apparatus, method and system of liquid-based, wide range, fast response temperature control of electronic device |
JP2000183118A (ja) * | 1998-12-18 | 2000-06-30 | Hitachi Ltd | 半導体素子の検査装置および検査方法 |
US6583638B2 (en) * | 1999-01-26 | 2003-06-24 | Trio-Tech International | Temperature-controlled semiconductor wafer chuck system |
DE60010890T2 (de) * | 1999-07-15 | 2005-05-19 | Delta Design, Inc., Poway | Gerät und verfahren zur temperaturkontrolle von integrierten schaltungen während der prüfung |
ATE301917T1 (de) * | 1999-09-07 | 2005-08-15 | Ibiden Co Ltd | Keramisches heizelement |
JP2001210683A (ja) * | 2000-01-25 | 2001-08-03 | Tokyo Seimitsu Co Ltd | プローバのチャック機構 |
JP4490539B2 (ja) | 2000-02-15 | 2010-06-30 | 東京エレクトロン株式会社 | ウエハチャック及び半導体ウエハの検査方法 |
US6552561B2 (en) * | 2000-07-10 | 2003-04-22 | Temptronic Corporation | Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diode |
US6498504B2 (en) * | 2000-08-28 | 2002-12-24 | Nec Corporation | Wafer inspection device and wafer inspection method |
DE10059665C1 (de) * | 2000-12-01 | 2002-07-11 | Steag Hamatech Ag | Verfahren zum thermischen Behandeln von Substraten |
JP4659328B2 (ja) * | 2002-10-21 | 2011-03-30 | 東京エレクトロン株式会社 | 被検査体を温度制御するプローブ装置 |
-
2002
- 2002-10-21 JP JP2002305925A patent/JP4659328B2/ja not_active Expired - Lifetime
-
2003
- 2003-07-25 CN CNB038011395A patent/CN1322568C/zh not_active Expired - Lifetime
- 2003-07-25 KR KR1020047016932A patent/KR100665407B1/ko active IP Right Grant
- 2003-07-25 WO PCT/JP2003/009457 patent/WO2004036641A1/ja active Application Filing
- 2003-07-25 EP EP03808857A patent/EP1557877A4/en not_active Withdrawn
- 2003-08-14 TW TW092122403A patent/TWI283451B/zh not_active IP Right Cessation
-
2004
- 2004-06-18 US US10/869,932 patent/US6992500B2/en not_active Expired - Lifetime
-
2005
- 2005-08-18 US US11/206,003 patent/US7332918B2/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05136229A (ja) * | 1991-11-08 | 1993-06-01 | Fujitsu Ltd | バーンイン装置 |
JPH07221144A (ja) * | 1995-02-20 | 1995-08-18 | Tokyo Electron Ltd | プローブ装置 |
US20020011854A1 (en) * | 1998-04-04 | 2002-01-31 | Motohiro Kuji | Probe device |
JP2000077488A (ja) * | 1998-08-31 | 2000-03-14 | Nec Kyushu Ltd | プローブ装置 |
JP2002280430A (ja) * | 2001-03-19 | 2002-09-27 | Toshiba Electronic Engineering Corp | 温度測定方法およびそれを用いた試験方法ならびに半導体試験装置と特性予測方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1557877A4 * |
Also Published As
Publication number | Publication date |
---|---|
US20040227536A1 (en) | 2004-11-18 |
KR20040104587A (ko) | 2004-12-10 |
US20060033519A1 (en) | 2006-02-16 |
JP4659328B2 (ja) | 2011-03-30 |
CN1322568C (zh) | 2007-06-20 |
CN1565054A (zh) | 2005-01-12 |
TW200406862A (en) | 2004-05-01 |
EP1557877A1 (en) | 2005-07-27 |
KR100665407B1 (ko) | 2007-01-04 |
US6992500B2 (en) | 2006-01-31 |
TWI283451B (en) | 2007-07-01 |
EP1557877A4 (en) | 2010-04-07 |
US7332918B2 (en) | 2008-02-19 |
JP2004140296A (ja) | 2004-05-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2004036641A1 (ja) | 被検査体を温度制御するプローブ装置及びプローブ検査方法 | |
TWI285932B (en) | Electron beam test system with integrated substrate transfer module | |
JP5889581B2 (ja) | ウエハ検査装置 | |
JP5664938B2 (ja) | プローバ及びプローブ検査方法 | |
US8513962B2 (en) | Wafer tray and test apparatus | |
JP5904428B1 (ja) | プロービング装置及びプローブコンタクト方法 | |
KR20120110020A (ko) | 프로브 카드 검출 장치, 웨이퍼의 위치 정렬 장치 및 웨이퍼의 위치 정렬 방법 | |
JP6401113B2 (ja) | 電子部品ハンドリング装置及び電子部品試験装置 | |
JP4836684B2 (ja) | 検査ステージ及び検査装置 | |
US20090107250A1 (en) | Apparatus amd method for measuring chuck attachment force | |
KR20190103957A (ko) | 검사 시스템 | |
JP2015097292A (ja) | 位置決め固定装置 | |
CN113874693A (zh) | 载置台、检查装置和温度校正方法 | |
JP2020088204A (ja) | 検査装置、温度制御装置及び温度制御方法 | |
JP7257880B2 (ja) | 試験用ウエハおよび試験方法 | |
JP2010016053A (ja) | 被検査体の受け渡し機構 | |
JP4959669B2 (ja) | プローブ装置 | |
JP4566072B2 (ja) | 基板試験方法及び装置 | |
CN213186584U (zh) | 一种厚膜发热盘冷却装置 | |
CN219434914U (zh) | 晶圆预对位模组及晶圆测试装置 | |
EP1505636A2 (en) | Semiconductor substrate surface preparation using high temperature convection heating | |
WO2009101706A1 (ja) | マッチプレートベース部および本体部、電子部品ハンドリング装置、ならびにマッチプレート本体部およびテスト部ユニットの交換治具および交換方法 | |
JP5692621B1 (ja) | 測定装置及び測定方法 | |
JP2024043947A (ja) | 測温用基板の校正方法、基板測温システム及び測温用基板 | |
KR20010059483A (ko) | 웨이퍼 로딩장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 20038011395 Country of ref document: CN |
|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): CN KR SG US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10869932 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2003808857 Country of ref document: EP |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1020047016932 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 1020047016932 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 2003808857 Country of ref document: EP |