WO2004038070A3 - Pulse reverse electrolysis of acidic copper electroplating solutions - Google Patents

Pulse reverse electrolysis of acidic copper electroplating solutions Download PDF

Info

Publication number
WO2004038070A3
WO2004038070A3 PCT/US2003/024498 US0324498W WO2004038070A3 WO 2004038070 A3 WO2004038070 A3 WO 2004038070A3 US 0324498 W US0324498 W US 0324498W WO 2004038070 A3 WO2004038070 A3 WO 2004038070A3
Authority
WO
WIPO (PCT)
Prior art keywords
reverse electrolysis
pulse reverse
copper electroplating
acidic copper
electroplating solutions
Prior art date
Application number
PCT/US2003/024498
Other languages
French (fr)
Other versions
WO2004038070A2 (en
Inventor
Roderick D Herdman
Michael R Crary
Ernest Long
Original Assignee
Macdermid Acumen Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Acumen Inc filed Critical Macdermid Acumen Inc
Priority to AU2003265370A priority Critical patent/AU2003265370A1/en
Publication of WO2004038070A2 publication Critical patent/WO2004038070A2/en
Publication of WO2004038070A3 publication Critical patent/WO2004038070A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Abstract

Pulse reverse electrolysis of acid copper solutions is used for applying copper to decorative articles, such as aluminium alloy automotive wheels and plastic parts for automotive use. The benefits include an improved thickness distribution of the copper electrodeposited on the plated article, reduced metal waste, reduced plating times and increased production capacity.
PCT/US2003/024498 2002-10-21 2003-08-06 Pulse reverse electrolysis of acidic copper electroplating solutions WO2004038070A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003265370A AU2003265370A1 (en) 2002-10-21 2003-08-06 Pulse reverse electrolysis of acidic copper electroplating solutions

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/274,634 US20040074775A1 (en) 2002-10-21 2002-10-21 Pulse reverse electrolysis of acidic copper electroplating solutions
US10/274,634 2002-10-21

Publications (2)

Publication Number Publication Date
WO2004038070A2 WO2004038070A2 (en) 2004-05-06
WO2004038070A3 true WO2004038070A3 (en) 2004-07-01

Family

ID=32093089

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/024498 WO2004038070A2 (en) 2002-10-21 2003-08-06 Pulse reverse electrolysis of acidic copper electroplating solutions

Country Status (4)

Country Link
US (1) US20040074775A1 (en)
AU (1) AU2003265370A1 (en)
TW (1) TWI261075B (en)
WO (1) WO2004038070A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7105082B2 (en) * 2003-02-27 2006-09-12 Novellus Systems, Inc. Composition and method for electrodeposition of metal on a work piece
US20050284766A1 (en) * 2004-06-25 2005-12-29 Herdman Roderick D Pulse reverse electrolysis of acidic copper electroplating solutions
EP1712660A1 (en) 2005-04-12 2006-10-18 Enthone Inc. Insoluble anode
US20080283404A1 (en) * 2007-05-14 2008-11-20 Nec Electronics Corporation Method of manufacturing semiconductor device to decrease defect number of plating film
US7905994B2 (en) * 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
US20090188553A1 (en) * 2008-01-25 2009-07-30 Emat Technology, Llc Methods of fabricating solar-cell structures and resulting solar-cell structures
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
EP2568063A1 (en) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Low internal stress copper electroplating method
DE102012206800B3 (en) 2012-04-25 2013-09-05 Atotech Deutschland Gmbh Method and apparatus for the electrolytic deposition of a deposition metal on a workpiece
CN103334135A (en) * 2013-06-19 2013-10-02 西北工业大学 Preparation method of ultra-fine grain copper wire
CN103668370A (en) * 2013-12-19 2014-03-26 潮州市连思科技发展有限公司 Method for pulse plating of disk
CN103911635B (en) * 2014-03-21 2016-02-24 复旦大学 A kind of copper electroplating solution
CN106757193B (en) * 2016-11-24 2018-07-13 中国地质大学（武汉） A kind of method without cyanogen acid bright copper plating of leaf

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5972192A (en) * 1997-07-23 1999-10-26 Advanced Micro Devices, Inc. Pulse electroplating copper or copper alloys
US20020036144A1 (en) * 2000-09-27 2002-03-28 Lee Sun-Jung Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming copper interconnect of semiconductor device using the same
US20030085133A1 (en) * 2001-07-26 2003-05-08 Electroplating Engineers Of Japan Limited (Japanese Corporation) Copper plating solution for embedding fine wiring, and copper plating method using the same
US6610192B1 (en) * 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2558090A (en) * 1947-12-11 1951-06-26 Westinghouse Electric Corp Periodic reverse current electroplating apparatus
US2700019A (en) * 1951-07-05 1955-01-18 Westinghouse Electric Corp Acid copper plating
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3682788A (en) * 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating
US3956078A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US4673469A (en) * 1984-06-08 1987-06-16 Mcgean-Rohco, Inc. Method of plating plastics
US20040011654A1 (en) * 2001-10-16 2004-01-22 Kenji Nakamura Method of copper plating small diameter hole

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5972192A (en) * 1997-07-23 1999-10-26 Advanced Micro Devices, Inc. Pulse electroplating copper or copper alloys
US20020036144A1 (en) * 2000-09-27 2002-03-28 Lee Sun-Jung Copper-plating elecrolyte containing polyvinylpyrrolidone and method for forming copper interconnect of semiconductor device using the same
US6610192B1 (en) * 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
US20030085133A1 (en) * 2001-07-26 2003-05-08 Electroplating Engineers Of Japan Limited (Japanese Corporation) Copper plating solution for embedding fine wiring, and copper plating method using the same

Also Published As

Publication number Publication date
AU2003265370A1 (en) 2004-05-13
AU2003265370A8 (en) 2004-05-13
TWI261075B (en) 2006-09-01
WO2004038070A2 (en) 2004-05-06
US20040074775A1 (en) 2004-04-22
TW200407467A (en) 2004-05-16

Similar Documents

Publication Publication Date Title
WO2004038070A3 (en) Pulse reverse electrolysis of acidic copper electroplating solutions
HK1075278A1 (en) Process for electroplating metallic and metal matrix composite foils
WO2002014583A3 (en) Electroplated aluminum parts and process of production
TW200736415A (en) Electroform, methods of making electroforms, and products made from electroforms
DE60144062D1 (en) HIGH-STRENGTH STEEL PLATE PLATED WITH MELT-LIQUID ZINC, WHICH HAS AN EXCELLENT COATING ADHESION AND IS SUITED TO PRESS FORMING, AND METHOD FOR THE PRODUCTION THEREOF
CA2346587A1 (en) Method of manufacturing an aluminum product
AU2002342468A1 (en) Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals
IL177414A0 (en) Method for producing a hard coating with high corrosion resistance on articles made of anodizable metals or alloys
AU1556297A (en) Aqueous solution for forming metal complexes, tin-silver alloy plating bath, and process for producing plated object using the plating bath
CN102224280B (en) Noble metal-containing layer sequence for decorative articles
EP1595969A4 (en) Steel sheet plated by hot dipping with alloyed zinc with excellent adhesion and process for producing the same
AU2003213340A1 (en) Magnesium or magnesium alloy article having electroconductive anodic oxidation coating on the surface thereof and method for production thereof
CN102133837B (en) Magnesium alloy appearance processing method
WO2009031841A3 (en) Method of coating metallic material
CN101555614B (en) Plastic surface galvanizing method
EP1132501A3 (en) Anodized cryogenically treated aluminum
WO2006011922A3 (en) Pulse reverse electrolysis of acidic copper electroplating solutions
WO2003023087A1 (en) Plated resin molding and process for producing the same
DE60206012D1 (en) Method of making a T-shaped electrode
EP1199384A3 (en) Plating Bath
SE8300416D0 (en) Zinc COBALT ALLOY PLATING
CN208980815U (en) A kind of coating structure of aluminum alloy die casting
CN101665945A (en) Method for plating film on surface of zinc alloy
AU2003217279A1 (en) Non-cyanide copper plating process for zinc and zinc alloys
CN102899695B (en) Without the electro-plating method of nickel alloy coating

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP