WO2004040949A1 - Printed circuit board for mobile telephones - Google Patents

Printed circuit board for mobile telephones Download PDF

Info

Publication number
WO2004040949A1
WO2004040949A1 PCT/DE2003/003617 DE0303617W WO2004040949A1 WO 2004040949 A1 WO2004040949 A1 WO 2004040949A1 DE 0303617 W DE0303617 W DE 0303617W WO 2004040949 A1 WO2004040949 A1 WO 2004040949A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
frame
mobile telephones
components
Prior art date
Application number
PCT/DE2003/003617
Other languages
German (de)
French (fr)
Inventor
Matthias Stockel
Rene Crain
Klaus Kroesen
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2004040949A1 publication Critical patent/WO2004040949A1/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The invention relates to a printed circuit board for mobile telephones, at least one face of which is provided with components that cover a large surface area and are connected to the printed circuit board by a positive fit or material union. At least one frame (2) that accommodates one such component (4) is connected in a fixed manner to the printed circuit board (1).

Description

Beschreibungdescription
Leiterplatte für MobiltelefonePCB for mobile phones
Die vorliegende Erfindung betrifft eine Leiterplatte für Mobiltelefone, welche mindestens auf einer Seite großflächige Bauelemente, die mit der Leiterplatte form- oder stoffschlüssig verbunden sind, aufweist.The present invention relates to a printed circuit board for mobile telephones, which has large-area components on at least one side, which are connected to the printed circuit board in a form-fitting or material-locking manner.
Leiterplatten dieser Art weisen die meisten Mobiltelefone auf, wobei normalerweise auf der einen Seite dieser Leiterplatten z. B. HF-Baugruppen angeordnet sind und auf der anderen Seite der Leiterplatte z. B. ein LCD-Modul oder Bestandteile der Tastatur angeordnet sind.Printed circuit boards of this type have most of the mobile phones. Normally, on one side of these printed circuit boards, e.g. B. RF modules are arranged and on the other side of the circuit board z. B. an LCD module or components of the keyboard are arranged.
Die stetige Reduzierung des Gerätevolumens bei zukünftigen Generationen von Mobiltelefonen führt unter anderem zum Einsatz von Leiterplatten mit einer geringeren Dicke und demzufolge zum Einsatz von Leiterplatten, welche eine verminderte mechanische Belastbarkeit aufweisen, bzw. bei denen es bei gleichbleibender Beanspruchung zu einer erhöhten Durchbiegung kommt.The steady reduction in device volume in future generations of mobile phones leads, among other things, to the use of printed circuit boards with a smaller thickness and, consequently, to the use of printed circuit boards which have a reduced mechanical load capacity or which, with constant load, result in increased deflection.
Wenn auf der Seite der Leiterplatte, auf welcher die HF- Baugruppen angeordnet sind, Schirmrahmen vorgesehen sind, welche sich über die ganze Fläche der Leiterplatte erstrecken, sorgen diese Schirmrahmen für eine gewisse Stabilität der Leiterplatte, so dass keine zusätzlichen Maßnahmen zur Stabilisierung erforderlich sind.If screen frames are provided on the side of the circuit board on which the RF modules are arranged, which extend over the entire area of the circuit board, these screen frames ensure a certain stability of the circuit board, so that no additional measures for stabilization are required.
In letzter Zeit ist man aber in einigen Fällen dazu übergegangen, keine sich über die ganze Fläche der Leiterplatte erstreckende Schirmrahmen, welche in einzelne Abschnitte unterteilt sind, zu verwenden, sondern es werden einzelne Baugruppen mit separaten Schirmrahmen versehen werden. Diese Schirmrahmen erstrecken sich nur jeweils über kleine Flächen der Leiterplattenseite und nicht untereinander verbunden sind. In diesem Falle ist keine gleichbleibende Stabilität der Leiterplatte mehr gegeben.In recent times, however, there has been a move in some cases not to use shield frames which extend over the entire surface of the printed circuit board and which are divided into individual sections, but instead individual assemblies will be provided with separate shield frames. These screen frames only extend over small areas of the printed circuit board side and are not interconnected are. In this case, the circuit board is no longer stable.
In diesen Fällen ist bereits vorgeschlagen worden, dass im Bereich der großflächigen Bauelemente in den Seitenbereichen der Leiterplatte Versteifungen vorgesehen werden. Durch die vorgesehene partielle Versteifung der Leiterplatte in den kritischen Bereichen, d. h. in der direkten Umgebung der gefährdeten Komponenten, wird eine Durchbiegung der Leiterplatte stark reduziert und so ein unbeabsichtigtes Ablösen dieser großflächigen Bauelemente verhindert. Diese Lösung führt aber wieder zu einem größeren Raumbedarf, was bei einer Miniaturisierung nachteilig sein kann.In these cases, it has already been proposed that stiffeners are provided in the area of the large components in the side areas of the printed circuit board. The intended partial stiffening of the circuit board in the critical areas, i. H. In the direct vicinity of the endangered components, bending of the printed circuit board is greatly reduced, thus preventing unintentional detachment of these large components. However, this solution again leads to a larger space requirement, which can be disadvantageous in the case of miniaturization.
Aufgabe der vorliegenden Erfindung ist es, eine Leiterplatte der eingangs genannten Art anzugeben, welche auch bei einer geringen Leiterplattendicke eine sichere form- oder stoffschlüssige Verbindung großflächiger Bauelemente mit der Leiterplatte gewährleistet.The object of the present invention is to provide a printed circuit board of the type mentioned at the outset which, even with a low printed circuit board thickness, ensures a secure positive or integral connection of large components to the printed circuit board.
Diese Aufgabe wird bei der eingangsgenannten Leiterplatte dadurch gelöst, dass mindestens ein ein großflächiges Bauelement aufnehmender Rahmen fest mit der Leiterplatte verbunden ist.This object is achieved in the circuit board mentioned at the outset in that at least one frame receiving a large-area component is firmly connected to the circuit board.
Der Vorteil der erfindungsgemäßen Lösung besteht darin, dass ein und dasselbe Bauelement, der Rahmen, sowohl zur Versteifung der Leiterplatte als auch zur Aufnahme des großflächigen Bauelements dient, was gegenüber herkömmlichen Lösungen zu einem geringeren Raumbedarf führt.The advantage of the solution according to the invention is that one and the same component, the frame, serves both to stiffen the printed circuit board and to accommodate the large-area component, which leads to a smaller space requirement compared to conventional solutions.
Weitere zweckmäßige Ausgestaltungen der erfindungsgemäßen Leiterplatte ergeben sich aus den Unteransprüchen sowie aus der nachfolgenden Beschreibung eines Ausführungsbeispiels anhand der beigefügten Zeichnung. In der Zeichnung zeigenFurther expedient refinements of the printed circuit board according to the invention result from the subclaims and from the following description of an exemplary embodiment with reference to the attached drawing. Show in the drawing
Figur 1 eine perspektivische Darstellung einer erfindungsgemäßen Leiterplatte mit einem fest darauf angebrachten Rahmen,FIG. 1 shows a perspective view of a printed circuit board according to the invention with a frame firmly attached to it
Figur 2 eine Explosionsdarstellung der in Figur 1 dargestellten Leiterplatte und eines großflächigen Bauelements, undFigure 2 is an exploded view of the circuit board shown in Figure 1 and a large component, and
Figur 3 eine Darstellung der in Figur dargestellten Leiterplatte mit einem darauf befestigten großflächigen Bauelement.Figure 3 is an illustration of the circuit board shown in Figure with a large component attached to it.
Figur 1 zeigt eine Leiterplatte 1 mit einem erfindungsgemäß darauf angebrachten Rahmen 2. Bei dem Rahmen 2 zur Aufnahme eines großflächigen Bauelementes kann es sich zum Beispiel um eine Displayhalterung handeln. Dieser Rahmen, beziehungsweise diese Displayhalterung 2 kann auf der Leiterplatte 1 aufgelötet sein.FIG. 1 shows a printed circuit board 1 with a frame 2 mounted thereon according to the invention. The frame 2 for receiving a large-area component can be, for example, a display holder. This frame or this display holder 2 can be soldered onto the circuit board 1.
Dabei ist diese Displayhalterung 2 derart ausgebildet, dass die sich in Längsrichtung der Leiterplatte 1 erstreckenden Seitenteile ein L-förmiges Profil aufweisen, wodurch ein Durchbiegen der Leiterplatte zuverlässig verhindert werden kann.This display holder 2 is designed such that the side parts extending in the longitudinal direction of the printed circuit board 1 have an L-shaped profile, as a result of which bending of the printed circuit board can be reliably prevented.
Die Displayhalterung 2 dient also einmal zur Stabilisierung der Leiterplatte und sie dient gleichzeitig auch zur Aufnahme eines großflächigen Bauelementes, bei dem dargestellten Ausführungsbeispiel zur Aufnahme eines Displaymoduls 4.The display holder 2 thus serves once to stabilize the circuit board and at the same time also serves to accommodate a large-area component, in the exemplary embodiment shown for accommodating a display module 4.
Dabei ist die Displayhalterung 2 und das Displaymodul 4 so ausgebildet, dass die beiden Teile miteinander verrastet werden können. Dazu sind in der Displayhalterung 2 Aussparungen 3 und an dem Displaymodul 4 Schnapphaken 5 vorgesehen. The display holder 2 and the display module 4 are designed such that the two parts can be locked together. For this purpose, 2 recesses 3 are provided in the display holder and 4 snap hooks 5 on the display module.

Claims

Patentansprüche claims
1. Leiterplatte für Mobiltelefone, welche mindestens auf einer Seite großflächige Bauelemente, die mit der Leiterplatte form- oder stoffschlüssig verbunden sind, aufweist, dadurch gekennzeichnet, dass mindestens ein ein großflächiges Bauelement (4) aufnehmender Rahmen (2) fest mit der Leiterplatte (1) verbunden ist.1. Printed circuit board for mobile telephones, which has at least on one side large-area components that are positively or materially connected to the printed circuit board, characterized in that at least one frame (2) receiving a large-area component (4) is fixed to the printed circuit board (1 ) connected is.
2. Leiterplatte nach Anspruch 1, dadurch gekennzeichnet, dass der Rahmen (2) auf' der Leiterplatte (1) aufgelötet ist.2. Printed circuit board according to claim 1, characterized in that the frame (2) on the ' circuit board (1) is soldered.
3.. Leiterplatte nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass mindestens die äußeren in Längsrichtung der Leiterplatte (1) verlaufenden Seitenteile des Rahmens (2) ein L-förmiges Profil aufweisen.3 .. Printed circuit board according to claim 1 or 2, characterized in that at least the outer in the longitudinal direction of the circuit board (1) extending side parts of the frame (2) have an L-shaped profile.
4. Leiterplatte nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Rahmen als Display- Halterung für ein Display-Modul dient, wobei die Display- Halterung und das Display-Modul so ausgebildet sind, dass sie miteinander verrastbar sind. 4. Printed circuit board according to one of the preceding claims, characterized in that the frame serves as a display holder for a display module, the display holder and the display module being designed such that they can be locked together.
PCT/DE2003/003617 2002-10-31 2003-10-30 Printed circuit board for mobile telephones WO2004040949A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10250907.7 2002-10-31
DE2002150907 DE10250907A1 (en) 2002-10-31 2002-10-31 PCB for mobile phones

Publications (1)

Publication Number Publication Date
WO2004040949A1 true WO2004040949A1 (en) 2004-05-13

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ID=32185294

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Application Number Title Priority Date Filing Date
PCT/DE2003/003617 WO2004040949A1 (en) 2002-10-31 2003-10-30 Printed circuit board for mobile telephones

Country Status (2)

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DE (1) DE10250907A1 (en)
WO (1) WO2004040949A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1691593A1 (en) * 2005-02-11 2006-08-16 Research In Motion Limited Frame for a device mounted above a printed circuit board in an electronic device
US7362585B2 (en) 2005-02-11 2008-04-22 Research In Motion Limited Frame for a device mounted above a printed circuit board in an electronic device
EP1746809A3 (en) * 2005-07-19 2012-08-08 LG Electronics Inc. Display module and portable terminal having the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010028164B4 (en) * 2010-04-23 2022-05-05 BSH Hausgeräte GmbH Operating device for a household appliance

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JPH03173198A (en) * 1989-11-30 1991-07-26 Matsushita Electric Ind Co Ltd Remote control transmitter
US5157723A (en) * 1991-02-21 1992-10-20 Northern Telecom Limited Mounts for articles
DE4405578A1 (en) * 1994-02-22 1995-08-24 Vdo Schindling Electronic building block
JPH11153782A (en) * 1997-11-19 1999-06-08 Matsushita Electric Ind Co Ltd Liquid crystal display device and assembly method thereof
EP1054549A2 (en) * 1999-05-19 2000-11-22 DeTeWe - Deutsche Telephonwerke Aktiengesellschaft & Co. Arrangement for mounting and fastening an optical display device in a telecommunication apparatus
US6248957B1 (en) * 1998-08-10 2001-06-19 Fujitsu Limited Printed-circuit board reinforcing member and a system board device having the printed-circuit board reinforcing member
EP1217807A1 (en) * 2000-12-19 2002-06-26 Telefonaktiebolaget L M Ericsson (Publ) A printed circuit board ( PCB) unit

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DE20009217U1 (en) * 2000-05-22 2000-08-24 Lu Ping Chang Battery pack for cell phones

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03173198A (en) * 1989-11-30 1991-07-26 Matsushita Electric Ind Co Ltd Remote control transmitter
US5157723A (en) * 1991-02-21 1992-10-20 Northern Telecom Limited Mounts for articles
DE4405578A1 (en) * 1994-02-22 1995-08-24 Vdo Schindling Electronic building block
JPH11153782A (en) * 1997-11-19 1999-06-08 Matsushita Electric Ind Co Ltd Liquid crystal display device and assembly method thereof
US6248957B1 (en) * 1998-08-10 2001-06-19 Fujitsu Limited Printed-circuit board reinforcing member and a system board device having the printed-circuit board reinforcing member
EP1054549A2 (en) * 1999-05-19 2000-11-22 DeTeWe - Deutsche Telephonwerke Aktiengesellschaft & Co. Arrangement for mounting and fastening an optical display device in a telecommunication apparatus
EP1217807A1 (en) * 2000-12-19 2002-06-26 Telefonaktiebolaget L M Ericsson (Publ) A printed circuit board ( PCB) unit

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Title
PATENT ABSTRACTS OF JAPAN vol. 015, no. 417 (E - 1125) 23 October 1991 (1991-10-23) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 11 30 September 1999 (1999-09-30) *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1691593A1 (en) * 2005-02-11 2006-08-16 Research In Motion Limited Frame for a device mounted above a printed circuit board in an electronic device
US7362585B2 (en) 2005-02-11 2008-04-22 Research In Motion Limited Frame for a device mounted above a printed circuit board in an electronic device
US8233282B2 (en) 2005-02-11 2012-07-31 Research In Motion Limited Frame for a device mounted above a printed circuit board in an electronic device
US8824152B2 (en) 2005-02-11 2014-09-02 Blackberry Limited Cover for a frame for a device mounted above a printed circuit board in an electronic device
US9052870B2 (en) 2005-02-11 2015-06-09 Blackberry Limited System and frame for mounting a device above a printed circuit board in an electronic device
EP1746809A3 (en) * 2005-07-19 2012-08-08 LG Electronics Inc. Display module and portable terminal having the same

Also Published As

Publication number Publication date
DE10250907A1 (en) 2004-06-03

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