WO2004041454A3 - Substrate processing apparatus and method - Google Patents
Substrate processing apparatus and method Download PDFInfo
- Publication number
- WO2004041454A3 WO2004041454A3 PCT/US2003/034758 US0334758W WO2004041454A3 WO 2004041454 A3 WO2004041454 A3 WO 2004041454A3 US 0334758 W US0334758 W US 0334758W WO 2004041454 A3 WO2004041454 A3 WO 2004041454A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- steam
- processing apparatus
- substrate processing
- substrate
- stream
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2230/00—Other cleaning aspects applicable to all B08B range
- B08B2230/01—Cleaning with steam
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003286823A AU2003286823A1 (en) | 2002-10-31 | 2003-10-30 | Substrate processing apparatus and method |
KR1020117020428A KR101252967B1 (en) | 2002-10-31 | 2003-10-30 | Substrate processing apparatus and method |
KR1020057007746A KR101094679B1 (en) | 2002-10-31 | 2003-10-30 | Substrate processing apparatus and method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-318875 | 2002-10-31 | ||
JP2002318875A JP4105931B2 (en) | 2002-10-31 | 2002-10-31 | Object processing apparatus and method |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004041454A2 WO2004041454A2 (en) | 2004-05-21 |
WO2004041454A3 true WO2004041454A3 (en) | 2004-07-22 |
Family
ID=32310348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/034758 WO2004041454A2 (en) | 2002-10-31 | 2003-10-30 | Substrate processing apparatus and method |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4105931B2 (en) |
KR (2) | KR101094679B1 (en) |
AU (1) | AU2003286823A1 (en) |
TW (1) | TWI248109B (en) |
WO (1) | WO2004041454A2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004046802B3 (en) * | 2004-09-27 | 2006-04-27 | Mafac Ernst Schwarz Gmbh & Co. Kg Maschinenfabrik | Treatment device and method for the cleaning and / or drying treatment of workpieces |
JP2006128238A (en) * | 2004-10-27 | 2006-05-18 | Aqua Science Kk | Object treatment device and object treatment method |
JP2007173277A (en) | 2005-12-19 | 2007-07-05 | Fujitsu Ltd | Spin cleaning device and wafer cleaning method |
JP4813430B2 (en) * | 2007-07-12 | 2011-11-09 | 東京エレクトロン株式会社 | Substrate cleaning apparatus, substrate cleaning method, and recording medium |
US8360817B2 (en) | 2009-04-01 | 2013-01-29 | Ebara Corporation | Polishing apparatus and polishing method |
JP5634381B2 (en) * | 2011-11-01 | 2014-12-03 | 東京エレクトロン株式会社 | Substrate cleaning method, substrate cleaning apparatus, and computer-readable storage medium |
CN103700610B (en) * | 2013-12-31 | 2017-01-25 | 北京七星华创电子股份有限公司 | Device and method for improving wafer etching uniformity |
CN104793385B (en) * | 2015-04-23 | 2018-01-19 | 京东方科技集团股份有限公司 | Stripping means, display base plate and the display device of ultra-thin substrate |
CN110000141A (en) * | 2019-04-22 | 2019-07-12 | 中信戴卡股份有限公司 | A kind of mold automatic flushing device that cleaning solution recycles |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5051136A (en) * | 1989-02-02 | 1991-09-24 | Nokia Mobile Phones Ltd. | Procedure for washing circuit boards and means for use in said procedure |
US5269878A (en) * | 1992-12-10 | 1993-12-14 | Vlsi Technology, Inc. | Metal patterning with dechlorinization in integrated circuit manufacture |
US5651832A (en) * | 1992-11-03 | 1997-07-29 | Valmet Corporation | Method for cleaning rolls |
US5964952A (en) * | 1994-10-04 | 1999-10-12 | Kunze-Concewitz; Horst | Method of cleaning surfaces with water and steam |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3320640B2 (en) * | 1997-07-23 | 2002-09-03 | 東京エレクトロン株式会社 | Cleaning equipment |
JPH11307492A (en) * | 1998-04-20 | 1999-11-05 | Tokyo Electron Ltd | Substrate cleaning device |
TW505822B (en) * | 1999-06-09 | 2002-10-11 | Tokyo Electron Ltd | Developing method and developing apparatus |
US6634806B2 (en) * | 2000-03-13 | 2003-10-21 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
-
2002
- 2002-10-31 JP JP2002318875A patent/JP4105931B2/en not_active Expired - Fee Related
-
2003
- 2003-10-30 KR KR1020057007746A patent/KR101094679B1/en not_active IP Right Cessation
- 2003-10-30 KR KR1020117020428A patent/KR101252967B1/en not_active IP Right Cessation
- 2003-10-30 AU AU2003286823A patent/AU2003286823A1/en not_active Abandoned
- 2003-10-30 WO PCT/US2003/034758 patent/WO2004041454A2/en active Application Filing
- 2003-10-31 TW TW092130509A patent/TWI248109B/en not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5051136A (en) * | 1989-02-02 | 1991-09-24 | Nokia Mobile Phones Ltd. | Procedure for washing circuit boards and means for use in said procedure |
US5651832A (en) * | 1992-11-03 | 1997-07-29 | Valmet Corporation | Method for cleaning rolls |
US5269878A (en) * | 1992-12-10 | 1993-12-14 | Vlsi Technology, Inc. | Metal patterning with dechlorinization in integrated circuit manufacture |
US5964952A (en) * | 1994-10-04 | 1999-10-12 | Kunze-Concewitz; Horst | Method of cleaning surfaces with water and steam |
Also Published As
Publication number | Publication date |
---|---|
KR20050065668A (en) | 2005-06-29 |
JP2004153172A (en) | 2004-05-27 |
TWI248109B (en) | 2006-01-21 |
KR101252967B1 (en) | 2013-04-15 |
KR101094679B1 (en) | 2011-12-20 |
WO2004041454A2 (en) | 2004-05-21 |
AU2003286823A1 (en) | 2004-06-07 |
TW200425223A (en) | 2004-11-16 |
JP4105931B2 (en) | 2008-06-25 |
KR20110105405A (en) | 2011-09-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY163666A (en) | Apparatus and method for processing a substrate | |
WO2004028699A3 (en) | Advanced coating apparatus and method | |
EP1005064A3 (en) | Apparatus for wet etching the edge of a semiconductor wafer | |
EP1801851A3 (en) | Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces | |
WO2002013236A3 (en) | Method and apparatus for removing unwanted substance from semiconductor wafer | |
WO2007100644A3 (en) | Method and apparatus for using flex circuit technology to create a reference electrode channel | |
TW367540B (en) | Photoresist coating apparatus and method thereby | |
EP0747217A3 (en) | Method and means for cleaning a cylinder of a rotary printing press | |
WO2000066189A3 (en) | Medical device coating method and coated devices | |
WO2004041454A3 (en) | Substrate processing apparatus and method | |
MY128723A (en) | Spattering apparatus | |
WO2002026011A3 (en) | Component suction device, component mounting apparatus and component mounting method | |
CA2586020A1 (en) | Rotary atomizing head and rotary atomizing coating machine | |
AU2002302356A1 (en) | Method of lift-off microstructuring deposition material on a substrate, substrates obtainable by the method, and use thereof | |
EP1338344A3 (en) | A method and system for coating | |
EP1118390A3 (en) | Coating method and coating apparatus | |
WO2006003242A3 (en) | Method and apparatus for coating a substrate and printed matter | |
WO2004091809A3 (en) | Kinetic spray application of coatings onto covered materials | |
EP0977242A3 (en) | Sample processing apparatus and method | |
WO2002028640A3 (en) | Substrate processing apparatus having pressed together supply rolls | |
TW200517786A (en) | Mask blanks and method of producing the same | |
AU1879799A (en) | Method for coating a press or transfer belt and a corresponding coated belt | |
TW200640698A (en) | Roll brushing apparatus, inkjet head cleaning system including the same and method of using thereof | |
AU2003218793A1 (en) | Device for targeted application of deposition material to a substrate | |
DE59902901D1 (en) | Method and device for actively suppressing contact vibrations on roller assemblies |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1020057007746 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 1020057007746 Country of ref document: KR |
|
122 | Ep: pct application non-entry in european phase |