WO2004042302A3 - Channeled flat plate fin heat exchange system, device and method - Google Patents

Channeled flat plate fin heat exchange system, device and method Download PDF

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Publication number
WO2004042302A3
WO2004042302A3 PCT/US2003/035432 US0335432W WO2004042302A3 WO 2004042302 A3 WO2004042302 A3 WO 2004042302A3 US 0335432 W US0335432 W US 0335432W WO 2004042302 A3 WO2004042302 A3 WO 2004042302A3
Authority
WO
WIPO (PCT)
Prior art keywords
fluid
heat exchange
heat
channeled
plates
Prior art date
Application number
PCT/US2003/035432
Other languages
French (fr)
Other versions
WO2004042302A2 (en
Inventor
Girish Upadhya
Richard Herms
Peng Zhou
Goodson E Kenneth
Original Assignee
Cooligy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy Inc filed Critical Cooligy Inc
Priority to JP2005502282A priority Critical patent/JP2006511787A/en
Priority to DE10393583T priority patent/DE10393583T5/en
Priority to AU2003291347A priority patent/AU2003291347A1/en
Publication of WO2004042302A2 publication Critical patent/WO2004042302A2/en
Publication of WO2004042302A3 publication Critical patent/WO2004042302A3/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B17/00Pumps characterised by combination with, or adaptation to, specific driving engines or motors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B19/00Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
    • F04B19/006Micropumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00Heat exchange conduits
    • F28F2210/10Particular layout, e.g. for uniform temperature distribution
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A device, method, and system for a fluid cooled channeled heat exchange device is disclosed. The fluid cooled channeled heat exchange device utilizes fluid circulated through a channel heat exchanger for high heat dissipation and transfer area per unit volume. The device comprises a highly thermally conductive material, preferably with less than 200 W/m-K. The preferred channel heat exchanger comprises two coupled flat plates (103 and 103´)and a plurality of fins (106) coupled to the flat plates. At least one of the plates preferably to receive flow of a fluid in a heated state. The fluid preferably carries heat from a heat source (such as a CPU, for example). Specially, at least one of the plates preferably comprises a plurality of condenser channels (104) configured to receive, to condense, and to cool the fluid in the heated state. The fluid in a cooler state is preferably carried from the device to the heat source, thereby cooling the heat source.
PCT/US2003/035432 2002-11-01 2003-10-31 Channeled flat plate fin heat exchange system, device and method WO2004042302A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005502282A JP2006511787A (en) 2002-11-01 2003-10-31 Channel flat fin heat exchange system, apparatus and method
DE10393583T DE10393583T5 (en) 2002-11-01 2003-10-31 Ribbed heat exchange system with channel flat plates, device and method
AU2003291347A AU2003291347A1 (en) 2002-11-01 2003-10-31 Channeled flat plate fin heat exchange system, device and method

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US42300902P 2002-11-01 2002-11-01
US60/423,009 2002-11-01
US44238303P 2003-01-24 2003-01-24
US60/442,383 2003-01-24
US45572903P 2003-03-17 2003-03-17
US60/455,729 2003-03-17

Publications (2)

Publication Number Publication Date
WO2004042302A2 WO2004042302A2 (en) 2004-05-21
WO2004042302A3 true WO2004042302A3 (en) 2005-05-12

Family

ID=32314871

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/US2003/034755 WO2004042305A2 (en) 2002-11-01 2003-10-30 Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange
PCT/US2003/035432 WO2004042302A2 (en) 2002-11-01 2003-10-31 Channeled flat plate fin heat exchange system, device and method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/US2003/034755 WO2004042305A2 (en) 2002-11-01 2003-10-30 Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange

Country Status (6)

Country Link
US (2) US7806168B2 (en)
JP (2) JP2006522463A (en)
AU (2) AU2003286821A1 (en)
DE (2) DE10393588T5 (en)
TW (2) TWI300466B (en)
WO (2) WO2004042305A2 (en)

Families Citing this family (148)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006522463A (en) 2002-11-01 2006-09-28 クーリギー インコーポレイテッド Optimal spreader system, apparatus and method for micro heat exchange cooled by fluid
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7044199B2 (en) * 2003-10-20 2006-05-16 Thermal Corp. Porous media cold plate
FR2864211B1 (en) * 2003-12-23 2007-01-12 Christian Muller THERMAL EXCHANGER HAVING MEANS FOR CONNECTING THERMAL HEATING AND COOLING ELEMENTS
US20050263273A1 (en) * 2004-05-26 2005-12-01 Crumly William R Electroformed microchannel cooler and methods of making same
TWM262755U (en) * 2004-05-28 2005-04-21 Wen-Chr Liau Heat sink module for slim electronic equipment
US20050269691A1 (en) * 2004-06-04 2005-12-08 Cooligy, Inc. Counter flow micro heat exchanger for optimal performance
US7616444B2 (en) * 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US7139172B2 (en) * 2004-07-01 2006-11-21 International Business Machines Corporation Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
US7234514B2 (en) 2004-08-02 2007-06-26 Asml Holding N.V. Methods and systems for compact, micro-channel laminar heat exchanging
US7204298B2 (en) 2004-11-24 2007-04-17 Lucent Technologies Inc. Techniques for microchannel cooling
US7117931B2 (en) * 2004-12-31 2006-10-10 Intel Corporation Systems for low cost liquid cooling
US20060157234A1 (en) * 2005-01-14 2006-07-20 Honeywell International Inc. Microchannel heat exchanger fabricated by wire electro-discharge machining
US20060175042A1 (en) * 2005-02-08 2006-08-10 Kuo Yung-Pin Heat dispensing device
DE102005014513B4 (en) * 2005-03-30 2011-05-12 Att Advanced Temperature Test Systems Gmbh Device and method for tempering a substrate, and method for producing the device
US7259965B2 (en) * 2005-04-07 2007-08-21 Intel Corporation Integrated circuit coolant microchannel assembly with targeted channel configuration
US20060254755A1 (en) * 2005-05-12 2006-11-16 Win-Haw Chen Radiation board
CA2620320C (en) * 2005-08-31 2014-01-28 Fmc Corporation Auto-oxidation production of hydrogen peroxide via hydrogenation in a microreactor
ES2380231T3 (en) * 2005-08-31 2012-05-09 Fmc Corporation Production by hydrogen peroxide autoxidation by oxidation of a microreactor
US20070114010A1 (en) * 2005-11-09 2007-05-24 Girish Upadhya Liquid cooling for backlit displays
US20070131659A1 (en) * 2005-12-09 2007-06-14 Durocher Kevin M Method of making an electronic device cooling system
US7342306B2 (en) * 2005-12-22 2008-03-11 International Business Machines Corporation High performance reworkable heatsink and packaging structure with solder release layer
US7331378B2 (en) * 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
US7913719B2 (en) * 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
JP2009527897A (en) 2006-02-16 2009-07-30 クーリギー インコーポレイテッド Cooling system
US8289710B2 (en) 2006-02-16 2012-10-16 Liebert Corporation Liquid cooling systems for server applications
DE102006008033A1 (en) * 2006-02-21 2007-09-06 Siemens Ag Österreich Heat sink with coolant flowing through the pipe
US7551439B2 (en) * 2006-03-28 2009-06-23 Delphi Technologies, Inc. Fluid cooled electronic assembly
WO2007120530A2 (en) 2006-03-30 2007-10-25 Cooligy, Inc. Integrated liquid to air conduction module
US7715194B2 (en) 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
CN100459839C (en) * 2006-05-10 2009-02-04 英业达股份有限公司 Support column with porous structure
JP4675283B2 (en) * 2006-06-14 2011-04-20 トヨタ自動車株式会社 Heat sink and cooler
CA2658515A1 (en) * 2006-07-21 2008-02-28 The Curators Of The University Of Missouri A cryopreservation device and method
DE102006045564A1 (en) 2006-09-25 2008-04-03 Behr Gmbh & Co. Kg Device for cooling electrical elements
DE102006050256A1 (en) * 2006-10-23 2008-04-30 Pahls, Hans-Helmut, Dipl.-Ing. Cooler i.e. water cooler, for e.g. electronic component i.e. computer, has chambers and nozzles directly arranged in base plate, where medium flows via chambers and nozzles such that heat energy is carried from core and center of cooler
AR065733A1 (en) * 2007-03-15 2009-06-24 Fmc Corp RECOVERY OF WATER HYDROGEN PEROXIDE IN THE PRODUCTION OF H2O2 BY SELECTION
TW200912621A (en) * 2007-08-07 2009-03-16 Cooligy Inc Method and apparatus for providing a supplemental cooling to server racks
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
US8746330B2 (en) 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
KR100910667B1 (en) * 2007-10-10 2009-08-05 한국생산기술연구원 Method For Making A Water Block For Water Cooling System
US7764494B2 (en) * 2007-11-20 2010-07-27 Basic Electronics, Inc. Liquid cooled module
US8479806B2 (en) * 2007-11-30 2013-07-09 University Of Hawaii Two-phase cross-connected micro-channel heat sink
US8238098B1 (en) * 2007-12-10 2012-08-07 Rivas Victor A Nano machined materials using femtosecond pulse laser technologies to enhanced thermal and optical properties for increased surface area to enhanced heat dissipation and emissivity and electromagnetic radiation
US9157687B2 (en) * 2007-12-28 2015-10-13 Qcip Holdings, Llc Heat pipes incorporating microchannel heat exchangers
US8345424B2 (en) * 2008-02-19 2013-01-01 Nec Corporation Optical interconnection device
US8250877B2 (en) * 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
JP2009239043A (en) * 2008-03-27 2009-10-15 Furukawa Electric Co Ltd:The Cooling device equipped with fine channel and method for manufacturing the same
US8604923B1 (en) 2008-07-16 2013-12-10 Victor Rivas Alvarez Telemetric health monitoring devices and system
US8299604B2 (en) * 2008-08-05 2012-10-30 Cooligy Inc. Bonded metal and ceramic plates for thermal management of optical and electronic devices
US8269341B2 (en) 2008-11-21 2012-09-18 Infineon Technologies Ag Cooling structures and methods
TWI544865B (en) * 2009-02-27 2016-08-01 凱斯系統公司 Microscale heat transfer systems, add-in cards incorporating same, and related methods
TW201036527A (en) * 2009-03-19 2010-10-01 Acbel Polytech Inc Large-area liquid-cooled heat-dissipation device
US20100314093A1 (en) * 2009-06-12 2010-12-16 Gamal Refai-Ahmed Variable heat exchanger
US20100326642A1 (en) * 2009-06-30 2010-12-30 Dino Scorziello Diamond modified heat exchangers, steam generators, condensers, radiators and feedwater heaters
US20100326627A1 (en) * 2009-06-30 2010-12-30 Schon Steven G Microelectronics cooling system
DE102009054186A1 (en) * 2009-11-23 2011-05-26 Behr Gmbh & Co. Kg System for a motor vehicle for heating and / or cooling a battery and a motor vehicle interior
JP5714836B2 (en) * 2010-04-17 2015-05-07 モレックス インコーポレイテドMolex Incorporated Heat transport unit, electronic board, electronic equipment
BR112012029534B8 (en) * 2010-05-23 2022-08-30 Forced Physics Llc EQUIPMENT AND METHOD OF HEAT EXCHANGE
CN101865620B (en) * 2010-06-07 2011-08-31 长春工程学院 Excitation coupling-type pulsating heat pipe heat exchanger
AU2011279239A1 (en) * 2010-07-13 2013-01-31 Inertech Ip Llc Systems and methods for cooling electronic equipment
US8077460B1 (en) 2010-07-19 2011-12-13 Toyota Motor Engineering & Manufacturing North America, Inc. Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same
US8659896B2 (en) 2010-09-13 2014-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules
US8199505B2 (en) 2010-09-13 2012-06-12 Toyota Motor Engineering & Manufacturing Norh America, Inc. Jet impingement heat exchanger apparatuses and power electronics modules
US20120090816A1 (en) * 2010-10-13 2012-04-19 William Marsh Rice University Systems and methods for heat transfer utilizing heat exchangers with carbon nanotubes
US8797741B2 (en) * 2010-10-21 2014-08-05 Raytheon Company Maintaining thermal uniformity in micro-channel cold plates with two-phase flows
TWI407072B (en) * 2010-11-12 2013-09-01 Asia Vital Components Co Ltd A heat exchanger with shunt structure
JP5955775B2 (en) * 2010-11-18 2016-07-20 日本碍子株式会社 Thermal conduction member
US9494370B2 (en) * 2010-12-09 2016-11-15 GeramTec GmbH Homogeneous liquid cooling of LED array
TW201228570A (en) * 2010-12-17 2012-07-01 Hon Hai Prec Ind Co Ltd Liquid heat dissipation device
US8427832B2 (en) 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
US8391008B2 (en) 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
US8482919B2 (en) 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US9279626B2 (en) * 2012-01-23 2016-03-08 Honeywell International Inc. Plate-fin heat exchanger with a porous blocker bar
US8736048B2 (en) * 2012-02-16 2014-05-27 International Business Machines Corporation Flexible heat sink with lateral compliance
WO2014004428A1 (en) * 2012-06-29 2014-01-03 Saint-Gobain Ceramics & Plastics. Inc. Low void fraction thermal storage articles and methods
WO2014031849A2 (en) * 2012-08-22 2014-02-27 Flex-N-Gate Advanced Product Development, Llc Micro-channel heat sink for led headlamp
US20140069614A1 (en) * 2012-09-13 2014-03-13 Asia Vital Components Co., Ltd. Heat dissipaion device and thermal module using same
DE102012217868A1 (en) * 2012-09-28 2014-04-03 Behr Gmbh & Co. Kg Heat exchanger
US9054361B2 (en) * 2012-11-20 2015-06-09 GM Global Technology Operations LLC Utilizing vacuum to pre-compress foam to enable cell insertion during HV battery module assembly
CN103017579B (en) * 2012-12-18 2014-10-08 中国科学院理化技术研究所 Plate-fin type heat exchanger with fluid being flowing back and forth in channel
US9460985B2 (en) 2013-01-04 2016-10-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses having a jet orifice surface with alternating vapor guide channels
US9484283B2 (en) 2013-01-04 2016-11-01 Toyota Motor Engineering & Manufacturing North America Inc. Modular jet impingement cooling apparatuses with exchangeable jet plates
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
TWI531795B (en) 2013-03-15 2016-05-01 水冷系統公司 Sensors, multiplexed communication techniques, and related systems
US8981556B2 (en) 2013-03-19 2015-03-17 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having non-uniform jet orifice sizes
JP6277598B2 (en) * 2013-04-30 2018-02-14 富士通株式会社 COOLING MODULE, LAMINATED SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, AND COOLING MODULE MANUFACTURING METHOD
US9247679B2 (en) 2013-05-24 2016-01-26 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement coolers and power electronics modules comprising the same
US9257365B2 (en) 2013-07-05 2016-02-09 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling assemblies and power electronics modules having multiple-porosity structures
US9803938B2 (en) 2013-07-05 2017-10-31 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling assemblies having porous three dimensional surfaces
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
CN103594430B (en) * 2013-10-25 2017-01-18 上海交通大学 Micro-channel radiator for dissipating heat of power electronic device
JP6818553B2 (en) * 2014-01-20 2021-01-20 ハルシオン バイオメディカル,インコーポレイテッド Separation and concentration of particles
EP3572758B1 (en) 2014-02-21 2023-04-05 Rolls-Royce Corporation Microchannel heat exchangers for gas turbine intercooling and condensing
US20150257249A1 (en) * 2014-03-08 2015-09-10 Gerald Ho Kim Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus Using The Same
US9437523B2 (en) * 2014-05-30 2016-09-06 Toyota Motor Engineering & Manufacturing North America, Inc. Two-sided jet impingement assemblies and power electronics modules comprising the same
US10867887B2 (en) * 2014-07-29 2020-12-15 Massachusetts Institute Of Technology Enhanced flow boiling heat transfer in microchannels with structured surfaces
JP6439326B2 (en) 2014-08-29 2018-12-19 株式会社Ihi Reactor
US10415597B2 (en) 2014-10-27 2019-09-17 Coolit Systems, Inc. Fluid heat exchange systems
CN204408824U (en) * 2014-12-18 2015-06-17 热流动力能源科技股份有限公司 Heat-exchange device
CN104576573A (en) * 2014-12-21 2015-04-29 北京工业大学 Micro-channel heat exchanger for drop-shaped pin fins
US10175005B2 (en) * 2015-03-30 2019-01-08 Infinera Corporation Low-cost nano-heat pipe
US9978926B2 (en) 2015-05-14 2018-05-22 The Hong Kong University Of Science And Technology Thermal radiation microsensor comprising thermoelectric micro pillars
CN106288893A (en) * 2015-06-03 2017-01-04 丹佛斯微通道换热器(嘉兴)有限公司 Heat exchanger system
US9713284B2 (en) 2015-07-15 2017-07-18 Hong Kong Applied Science And Technology Research Institute Co. Ltd. Locally enhanced direct liquid cooling system for high power applications
CN105118811B (en) * 2015-07-27 2018-10-23 电子科技大学 A kind of temperature equalization system to be radiated to multi-heat source device using soaking plate and microchannel
WO2017023254A1 (en) * 2015-07-31 2017-02-09 Hewlett Packard Enterprise Development Lp Heat exchangers
US9622380B1 (en) 2015-09-30 2017-04-11 Toyota Motor Engineering & Manufacturing North America, Inc. Two-phase jet impingement cooling devices and electronic device assemblies incorporating the same
US9953899B2 (en) 2015-09-30 2018-04-24 Microfabrica Inc. Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
US10727552B2 (en) * 2015-11-04 2020-07-28 Ford Global Technologies, Llc Heat exchanger plate for electrified vehicle battery packs
US10096537B1 (en) 2015-12-31 2018-10-09 Microfabrica Inc. Thermal management systems, methods for making, and methods for using
US10085362B2 (en) * 2016-09-30 2018-09-25 International Business Machines Corporation Cold plate device for a two-phase cooling system
CN106601703B (en) * 2016-10-27 2019-08-02 湖北工程学院 Using the micro-channel heat sink of secondary back refrigerating mode
JP6396533B1 (en) * 2017-04-26 2018-09-26 レノボ・シンガポール・プライベート・リミテッド Plate-type heat transport device, electronic apparatus, and plate-type heat transport device manufacturing method
US10757809B1 (en) 2017-11-13 2020-08-25 Telephonics Corporation Air-cooled heat exchanger and thermal arrangement for stacked electronics
US20190214329A1 (en) * 2018-01-11 2019-07-11 Asia Vital Components Co., Ltd. Liquid heat dissipation system
US20190212076A1 (en) * 2018-01-11 2019-07-11 Asia Vital Components Co., Ltd. Multi-outlet-inlet liquid-cooling heat dissipation structure
US20190212067A1 (en) * 2018-01-11 2019-07-11 Asia Vital Components Co., Ltd. Multi-outlet-inlet multilayered liquid-cooling heat dissipation structure
US20190215986A1 (en) * 2018-01-11 2019-07-11 Asia Vital Components Co., Ltd. Water-cooling radiator assembly
US20190215987A1 (en) * 2018-01-11 2019-07-11 Asia Vital Components Co., Ltd. Water-cooling radiator structure
US10921067B2 (en) * 2018-01-11 2021-02-16 Asia Vital Components Co., Ltd Water-cooling radiator structure with internal partition member
CN110034082B (en) * 2018-01-12 2021-01-01 创意电子股份有限公司 Electronic device with active heat dissipation
US10694640B2 (en) * 2018-01-30 2020-06-23 Quanta Computer Inc. Server water cooling modules prevent water leakage device
EP3564992B1 (en) 2018-05-02 2021-07-07 EKWB d.o.o. Fluid-based cooling device for cooling at least two distinct first heat-generating elements of a heat source assembly
CN109103156A (en) * 2018-08-10 2018-12-28 桂林电子科技大学 A kind of fractals microchannel heat sink
KR102195634B1 (en) * 2018-08-14 2020-12-28 인하대학교 산학협력단 Composite heat sink and cooling method of heated objects using the same
TWI672471B (en) * 2018-10-04 2019-09-21 財團法人金屬工業研究發展中心 Heat exchanger
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
EP3975243A4 (en) * 2019-05-21 2023-05-24 Tomoegawa Co., Ltd. Temperature control unit
SG10201904782SA (en) * 2019-05-27 2020-12-30 Aem Singapore Pte Ltd Cold plate and a method of manufacture thereof
US11818831B2 (en) 2019-09-24 2023-11-14 Borgwarner Inc. Notched baffled heat exchanger for circuit boards
US11255610B2 (en) * 2020-01-22 2022-02-22 Cooler Master Co., Ltd. Pulse loop heat exchanger and manufacturing method of the same
US11149937B2 (en) * 2020-01-30 2021-10-19 Toyota Motor Engineering & Manufacturing North America, Inc. Functionally graded manifold microchannel heat sinks
CN111479442B (en) * 2020-03-25 2022-03-29 中航光电科技股份有限公司 Array micro-jet and micro-channel composite cold plate
US11178789B2 (en) * 2020-03-31 2021-11-16 Advanced Energy Industries, Inc. Combination air-water cooling device
US11395443B2 (en) 2020-05-11 2022-07-19 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US20210404750A1 (en) * 2020-06-26 2021-12-30 Vacuum Process Engineering, Inc. Integrated hybrid compact fluid heat exchanger
US11731160B2 (en) * 2020-07-20 2023-08-22 Rivian Ip Holdings, Llc Systems and methods for managing sharp transitions for powder coating
US20220099389A1 (en) * 2020-09-25 2022-03-31 Abb Power Electronics Inc. Systems and methods for thermal management using matrix coldplates
AT524235B1 (en) * 2020-10-09 2022-04-15 Miba Sinter Austria Gmbh heat transport device
WO2022187158A1 (en) * 2021-03-02 2022-09-09 Frore Systems Inc. Mounting and use of piezoelectric cooling systems in devices
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
CN113651288B (en) * 2021-07-07 2023-10-20 北京大学 Method for preparing micro-channel structure with nano through holes on partition wall
US20230200009A1 (en) * 2021-12-22 2023-06-22 Baidu Usa Llc Two phase immersion system with local fluid accelerations
DE102022108277A1 (en) 2022-04-06 2023-10-12 Semikron Elektronik Gmbh & Co. Kg Housing, in particular for a power electronic assembly, and arrangement therewith

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2039593A (en) * 1935-06-20 1936-05-05 Theodore N Hubbuch Heat transfer coil
US4450472A (en) * 1981-03-02 1984-05-22 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
US4574876A (en) * 1981-05-11 1986-03-11 Extracorporeal Medical Specialties, Inc. Container with tapered walls for heating or cooling fluids
US5310440A (en) * 1990-04-27 1994-05-10 International Business Machines Corporation Convection transfer system
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US5978220A (en) * 1996-10-23 1999-11-02 Asea Brown Boveri Ag Liquid cooling device for a high-power semiconductor module
US6034872A (en) * 1997-07-16 2000-03-07 International Business Machines Corporation Cooling computer systems
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US6536516B2 (en) * 2000-12-21 2003-03-25 Long Manufacturing Ltd. Finned plate heat exchanger
US20030062149A1 (en) * 2001-09-28 2003-04-03 Goodson Kenneth E. Electroosmotic microchannel cooling system
US6606251B1 (en) * 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module

Family Cites Families (372)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US596062A (en) 1897-12-28 Device for preventing bursting of freezing pipes
US627012A (en) * 1899-06-13 Fourth to george e
US2273505A (en) 1942-02-17 Container
US3361195A (en) 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device
US3771219A (en) 1970-02-05 1973-11-13 Sharp Kk Method for manufacturing semiconductor device
US3654988A (en) * 1970-02-24 1972-04-11 American Standard Inc Freeze protection for outdoor cooler
DE2102254B2 (en) * 1971-01-19 1973-05-30 Robert Bosch Gmbh, 7000 Stuttgart COOLING DEVICE FOR POWER SEMICONDUCTOR COMPONENTS
US3800510A (en) 1972-05-09 1974-04-02 Celanese Corp Separating assembly
FR2216537B1 (en) 1973-02-06 1975-03-07 Gaz De France
US3852806A (en) 1973-05-02 1974-12-03 Gen Electric Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes
US3823572A (en) 1973-08-15 1974-07-16 American Air Filter Co Freeze protection device in heat pump system
US3929154A (en) 1974-07-29 1975-12-30 Frank E Goodwin Freeze protection apparatus
US3923426A (en) 1974-08-15 1975-12-02 Alza Corp Electroosmotic pump and fluid dispenser including same
US3904262A (en) 1974-09-27 1975-09-09 John M Cutchaw Connector for leadless integrated circuit packages
US4072188A (en) 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
DE2658720C3 (en) 1976-12-24 1982-01-28 Deutsche Forschungs- und Versuchsanstalt für Luft- und Raumfahrt e.V., 5300 Bonn Latent heat storage for holding a heat-storing medium
US4203448A (en) * 1977-08-19 1980-05-20 Biotronik Mess- Und Therapiegerate Gmbh & Co. Programmably variable voltage multiplier for implanted stimulator
US4312012A (en) * 1977-11-25 1982-01-19 International Business Machines Corp. Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant
US4203488A (en) 1978-03-01 1980-05-20 Aavid Engineering, Inc. Self-fastened heat sinks
US4194559A (en) * 1978-11-01 1980-03-25 Thermacore, Inc. Freeze accommodating heat pipe
US4235285A (en) 1979-10-29 1980-11-25 Aavid Engineering, Inc. Self-fastened heat sinks
US4296455A (en) 1979-11-23 1981-10-20 International Business Machines Corporation Slotted heat sinks for high powered air cooled modules
US4332291A (en) * 1979-12-21 1982-06-01 D. Mulock-Bentley And Associates (Proprietary) Limited Heat exchanger with slotted fin strips
US4248295A (en) * 1980-01-17 1981-02-03 Thermacore, Inc. Freezable heat pipe
US4345267A (en) 1980-03-31 1982-08-17 Amp Incorporated Active device substrate connector having a heat sink
US4573067A (en) * 1981-03-02 1986-02-25 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits
US4485429A (en) 1982-06-09 1984-11-27 Sperry Corporation Apparatus for cooling integrated circuit chips
US4494171A (en) * 1982-08-24 1985-01-15 Sundstrand Corporation Impingement cooling apparatus for heat liberating device
US4516632A (en) * 1982-08-31 1985-05-14 The United States Of America As Represented By The United States Deparment Of Energy Microchannel crossflow fluid heat exchanger and method for its fabrication
US4467861A (en) 1982-10-04 1984-08-28 Otdel Fiziko-Tekhnicheskikh Problem Energetiki Uralskogo Nauchnogo Tsentra Akademii Nauk Sssr Heat-transporting device
US4474172A (en) 1982-10-25 1984-10-02 Chevron Research Company Solar water heating panel
JPS59100394A (en) * 1982-12-01 1984-06-09 M C L:Kk Heat transfer device
GB8323065D0 (en) 1983-08-26 1983-09-28 Rca Corp Flux free photo-detector soldering
US4567505A (en) * 1983-10-27 1986-01-28 The Board Of Trustees Of The Leland Stanford Junior University Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
JPH0673364B2 (en) 1983-10-28 1994-09-14 株式会社日立製作所 Integrated circuit chip cooler
US4664181A (en) * 1984-03-05 1987-05-12 Thermo Electron Corporation Protection of heat pipes from freeze damage
US4561040A (en) 1984-07-12 1985-12-24 Ibm Corporation Cooling system for VLSI circuit chips
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
US4893174A (en) 1985-07-08 1990-01-09 Hitachi, Ltd. High density integration of semiconductor circuit
DE3679978D1 (en) 1985-12-13 1991-08-01 Hasler Ag Ascom METHOD AND DEVICE FOR DISCHARGING THE LOSS OF HEAT AT LEAST ONE ASSEMBLY OF ELECTRICAL ELEMENTS.
US4716494A (en) 1986-11-07 1987-12-29 Amp Incorporated Retention system for removable heat sink
US4868712A (en) 1987-02-04 1989-09-19 Woodman John K Three dimensional integrated circuit package
GB2204181B (en) 1987-04-27 1990-03-21 Thermalloy Inc Heat sink apparatus and method of manufacture
US4903761A (en) 1987-06-03 1990-02-27 Lockheed Missiles & Space Company, Inc. Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system
US5016138A (en) * 1987-10-27 1991-05-14 Woodman John K Three dimensional integrated circuit package
US4894709A (en) * 1988-03-09 1990-01-16 Massachusetts Institute Of Technology Forced-convection, liquid-cooled, microchannel heat sinks
JPH01256775A (en) 1988-04-04 1989-10-13 Mitsubishi Electric Corp Pod cooling device
US4896719A (en) * 1988-05-11 1990-01-30 Mcdonnell Douglas Corporation Isothermal panel and plenum
US4908112A (en) * 1988-06-16 1990-03-13 E. I. Du Pont De Nemours & Co. Silicon semiconductor wafer for analyzing micronic biological samples
US4884630A (en) 1988-07-14 1989-12-05 Microelectronics And Computer Technology Corporation End fed liquid heat exchanger for an electronic component
US4866570A (en) 1988-08-05 1989-09-12 Ncr Corporation Apparatus and method for cooling an electronic device
US4938280A (en) 1988-11-07 1990-07-03 Clark William E Liquid-cooled, flat plate heat exchanger
CA2002213C (en) * 1988-11-10 1999-03-30 Iwona Turlik High performance integrated circuit chip package and method of making same
US5058627A (en) 1989-04-10 1991-10-22 Brannen Wiley W Freeze protection system for water pipes
US5145001A (en) 1989-07-24 1992-09-08 Creare Inc. High heat flux compact heat exchanger having a permeable heat transfer element
US5009760A (en) * 1989-07-28 1991-04-23 Board Of Trustees Of The Leland Stanford Junior University System for measuring electrokinetic properties and for characterizing electrokinetic separations by monitoring current in electrophoresis
CH681168A5 (en) 1989-11-10 1993-01-29 Westonbridge Int Ltd Micro-pump for medicinal dosing
US4978638A (en) 1989-12-21 1990-12-18 International Business Machines Corporation Method for attaching heat sink to plastic packaged electronic component
US5083194A (en) 1990-01-16 1992-01-21 Cray Research, Inc. Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
US5179500A (en) 1990-02-27 1993-01-12 Grumman Aerospace Corporation Vapor chamber cooled electronic circuit card
DE4006152A1 (en) 1990-02-27 1991-08-29 Fraunhofer Ges Forschung MICROMINIATURIZED PUMP
US6054034A (en) 1990-02-28 2000-04-25 Aclara Biosciences, Inc. Acrylic microchannels and their use in electrophoretic applications
US6176962B1 (en) * 1990-02-28 2001-01-23 Aclara Biosciences, Inc. Methods for fabricating enclosed microchannel structures
US5858188A (en) 1990-02-28 1999-01-12 Aclara Biosciences, Inc. Acrylic microchannels and their use in electrophoretic applications
US5070040A (en) 1990-03-09 1991-12-03 University Of Colorado Foundation, Inc. Method and apparatus for semiconductor circuit chip cooling
US5016090A (en) * 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
US5096388A (en) * 1990-03-22 1992-03-17 The Charles Stark Draper Laboratory, Inc. Microfabricated pump
US5043797A (en) 1990-04-03 1991-08-27 General Electric Company Cooling header connection for a thyristor stack
JPH07114250B2 (en) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション Heat transfer system
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5161089A (en) 1990-06-04 1992-11-03 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
US5203401A (en) * 1990-06-29 1993-04-20 Digital Equipment Corporation Wet micro-channel wafer chuck and cooling method
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US5057908A (en) 1990-07-10 1991-10-15 Iowa State University Research Foundation, Inc. High power semiconductor device with integral heat sink
US5420067A (en) 1990-09-28 1995-05-30 The United States Of America As Represented By The Secretary Of The Navy Method of fabricatring sub-half-micron trenches and holes
US5099910A (en) * 1991-01-15 1992-03-31 Massachusetts Institute Of Technology Microchannel heat sink with alternating flow directions
US5099311A (en) * 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
JPH06342990A (en) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> Integrated cooling system
US5131233A (en) 1991-03-08 1992-07-21 Cray Computer Corporation Gas-liquid forced turbulence cooling
US5263251A (en) 1991-04-02 1993-11-23 Microunity Systems Engineering Method of fabricating a heat exchanger for solid-state electronic devices
US5125451A (en) * 1991-04-02 1992-06-30 Microunity Systems Engineering, Inc. Heat exchanger for solid-state electronic devices
US5232047A (en) 1991-04-02 1993-08-03 Microunity Systems Engineering, Inc. Heat exchanger for solid-state electronic devices
US5294830A (en) * 1991-05-21 1994-03-15 International Business Machines Corporation Apparatus for indirect impingement cooling of integrated circuit chips
US5199487A (en) * 1991-05-31 1993-04-06 Hughes Aircraft Company Electroformed high efficiency heat exchanger and method for making
US5239200A (en) 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
US5228502A (en) 1991-09-04 1993-07-20 International Business Machines Corporation Cooling by use of multiple parallel convective surfaces
US5386143A (en) 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
JPH05217121A (en) 1991-11-22 1993-08-27 Internatl Business Mach Corp <Ibm> Method and apparatus for coupling of thermo- sensitive element such as chip provided with magnetic converter, etc.
DE69305667T2 (en) * 1992-03-09 1997-05-28 Sumitomo Metal Ind Heat sink with good heat dissipating properties and manufacturing processes
US5218515A (en) * 1992-03-13 1993-06-08 The United States Of America As Represented By The United States Department Of Energy Microchannel cooling of face down bonded chips
US5239443A (en) 1992-04-23 1993-08-24 International Business Machines Corporation Blind hole cold plate cooling system
US5317805A (en) * 1992-04-28 1994-06-07 Minnesota Mining And Manufacturing Company Method of making microchanneled heat exchangers utilizing sacrificial cores
US5294834A (en) 1992-06-01 1994-03-15 Sverdrup Technology, Inc. Low resistance contacts for shallow junction semiconductors
US5247800A (en) 1992-06-03 1993-09-28 General Electric Company Thermal connector with an embossed contact for a cryogenic apparatus
US5275237A (en) 1992-06-12 1994-01-04 Micron Technology, Inc. Liquid filled hot plate for precise temperature control
US5308429A (en) 1992-09-29 1994-05-03 Digital Equipment Corporation System for bonding a heatsink to a semiconductor chip package
DE4240082C1 (en) 1992-11-28 1994-04-21 Erno Raumfahrttechnik Gmbh Heat pipe
US5520244A (en) * 1992-12-16 1996-05-28 Sdl, Inc. Micropost waste heat removal system
DE4242841C2 (en) 1992-12-17 1995-05-11 Litef Gmbh Method and control device for temperature control for a Peltier-operated temperature control device
US5269372A (en) 1992-12-21 1993-12-14 International Business Machines Corporation Intersecting flow network for a cold plate cooling system
US5397919A (en) 1993-03-04 1995-03-14 Square Head, Inc. Heat sink assembly for solid state devices
US5299635A (en) * 1993-03-05 1994-04-05 Wynn's Climate Systems, Inc. Parallel flow condenser baffle
US5534328A (en) 1993-12-02 1996-07-09 E. I. Du Pont De Nemours And Company Integrated chemical processing apparatus and processes for the preparation thereof
JP3477781B2 (en) 1993-03-23 2003-12-10 セイコーエプソン株式会社 IC card
US5436793A (en) 1993-03-31 1995-07-25 Ncr Corporation Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member
US5459352A (en) 1993-03-31 1995-10-17 Unisys Corporation Integrated circuit package having a liquid metal-aluminum/copper joint
US5427174A (en) * 1993-04-30 1995-06-27 Heat Transfer Devices, Inc. Method and apparatus for a self contained heat exchanger
US5397019A (en) * 1993-05-24 1995-03-14 Schmitt; Norman L. Vending assembly
US5380956A (en) * 1993-07-06 1995-01-10 Sun Microsystems, Inc. Multi-chip cooling module and method
US5727618A (en) 1993-08-23 1998-03-17 Sdl Inc Modular microchannel heat exchanger
JP2864490B2 (en) * 1993-08-26 1999-03-03 株式会社クラレ Method for producing 2-norbornanone
US5704416A (en) 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5514906A (en) 1993-11-10 1996-05-07 Fujitsu Limited Apparatus for cooling semiconductor chips in multichip modules
KR100353020B1 (en) 1993-12-28 2003-01-10 쇼와 덴코 가부시키가이샤 Multilayer Heat Exchanger
CH689836A5 (en) 1994-01-14 1999-12-15 Westonbridge Int Ltd Micropump.
US5383340A (en) * 1994-03-24 1995-01-24 Aavid Laboratories, Inc. Two-phase cooling system for laptop computers
US5544696A (en) 1994-07-01 1996-08-13 The United States Of America As Represented By The Secretary Of The Air Force Enhanced nucleate boiling heat transfer for electronic cooling and thermal energy transfer
US6126723A (en) 1994-07-29 2000-10-03 Battelle Memorial Institute Microcomponent assembly for efficient contacting of fluid
US6129973A (en) 1994-07-29 2000-10-10 Battelle Memorial Institute Microchannel laminated mass exchanger and method of making
US5811062A (en) * 1994-07-29 1998-09-22 Battelle Memorial Institute Microcomponent chemical process sheet architecture
US5539153A (en) 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
US5526875A (en) 1994-10-14 1996-06-18 Lin; Shih-Jen Cooling device for CPU
US5641400A (en) 1994-10-19 1997-06-24 Hewlett-Packard Company Use of temperature control devices in miniaturized planar column devices and miniaturized total analysis systems
US5508234A (en) 1994-10-31 1996-04-16 International Business Machines Corporation Microcavity structures, fabrication processes, and applications thereof
JP3355824B2 (en) 1994-11-04 2002-12-09 株式会社デンソー Corrugated fin heat exchanger
US5585069A (en) 1994-11-10 1996-12-17 David Sarnoff Research Center, Inc. Partitioned microelectronic and fluidic device array for clinical diagnostics and chemical synthesis
JP3528376B2 (en) * 1994-11-30 2004-05-17 住友電気工業株式会社 Substrate manufacturing method
JP3528375B2 (en) * 1994-11-30 2004-05-17 住友電気工業株式会社 Substrate and heat dissipation substrate using the same, semiconductor device, element mounting device
EP0715352B1 (en) 1994-11-30 2003-07-30 Sumitomo Electric Industries, Ltd. Substrate, semiconductor device, element-mounted device
US5876655A (en) 1995-02-21 1999-03-02 E. I. Du Pont De Nemours And Company Method for eliminating flow wrinkles in compression molded panels
US6227809B1 (en) 1995-03-09 2001-05-08 University Of Washington Method for making micropumps
DE19514548C1 (en) * 1995-04-20 1996-10-02 Daimler Benz Ag Method of manufacturing a micro cooler
US5548605A (en) 1995-05-15 1996-08-20 The Regents Of The University Of California Monolithic microchannel heatsink
US5575929A (en) 1995-06-05 1996-11-19 The Regents Of The University Of California Method for making circular tubular channels with two silicon wafers
US6057149A (en) 1995-09-15 2000-05-02 The University Of Michigan Microscale devices and reactions in microscale devices
DE19536463C2 (en) * 1995-09-29 2002-02-07 Infineon Technologies Ag Method of manufacturing a plurality of laser diode devices
US5696405A (en) 1995-10-13 1997-12-09 Lucent Technologies Inc. Microelectronic package with device cooling
JPH09129790A (en) 1995-11-07 1997-05-16 Toshiba Corp Heat sink device
US5705018A (en) 1995-12-13 1998-01-06 Hartley; Frank T. Micromachined peristaltic pump
JP3029792B2 (en) 1995-12-28 2000-04-04 日本サーボ株式会社 Multi-phase permanent magnet type rotating electric machine
US6039114A (en) 1996-01-04 2000-03-21 Daimler - Benz Aktiengesellschaft Cooling body having lugs
US6010316A (en) 1996-01-16 2000-01-04 The Board Of Trustees Of The Leland Stanford Junior University Acoustic micropump
US5579828A (en) 1996-01-16 1996-12-03 Hudson Products Corporation Flexible insert for heat pipe freeze protection
CN1072060C (en) * 1996-02-13 2001-10-03 瑞典通用电器勃朗勃威力公司 Device for casting in a mould
US5768104A (en) * 1996-02-22 1998-06-16 Cray Research, Inc. Cooling approach for high power integrated circuits mounted on printed circuit boards
US5675473A (en) 1996-02-23 1997-10-07 Motorola, Inc. Apparatus and method for shielding an electronic module from electromagnetic radiation
US5703536A (en) 1996-04-08 1997-12-30 Harris Corporation Liquid cooling system for high power solid state AM transmitter
US5885470A (en) 1997-04-14 1999-03-23 Caliper Technologies Corporation Controlled fluid transport in microfabricated polymeric substrates
JP3716041B2 (en) * 1996-05-22 2005-11-16 松下電器産業株式会社 Absorption heat pump device
US5800690A (en) 1996-07-03 1998-09-01 Caliper Technologies Corporation Variable control of electroosmotic and/or electrophoretic forces within a fluid-containing structure via electrical forces
US5740013A (en) * 1996-07-03 1998-04-14 Hewlett-Packard Company Electronic device enclosure having electromagnetic energy containment and heat removal characteristics
US5692558A (en) 1996-07-22 1997-12-02 Northrop Grumman Corporation Microchannel cooling using aviation fuels for airborne electronics
US5801442A (en) 1996-07-22 1998-09-01 Northrop Grumman Corporation Microchannel cooling of high power semiconductor devices
US5763951A (en) 1996-07-22 1998-06-09 Northrop Grumman Corporation Non-mechanical magnetic pump for liquid cooling
US5731954A (en) * 1996-08-22 1998-03-24 Cheon; Kioan Cooling system for computer
JPH1084139A (en) 1996-09-09 1998-03-31 Technova:Kk Thermoelectric conversion device
JPH1099592A (en) 1996-09-27 1998-04-21 Matsushita Electric Ind Co Ltd Pump of washing machine or the like
US5835345A (en) 1996-10-02 1998-11-10 Sdl, Inc. Cooler for removing heat from a heated region
US5870823A (en) 1996-11-27 1999-02-16 International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels
US5964092A (en) 1996-12-13 1999-10-12 Nippon Sigmax, Co., Ltd. Electronic cooling apparatus
JPH10190071A (en) 1996-12-20 1998-07-21 Aisin Seiki Co Ltd Multistage electronic cooling device
SE9700205D0 (en) 1997-01-24 1997-01-24 Peter Lindberg Integrated microfluidic element
JP3450148B2 (en) 1997-03-07 2003-09-22 三菱電機株式会社 Loop type heat pipe
DE19710716C2 (en) 1997-03-14 2001-05-10 Fraunhofer Ges Forschung Device for cooling electronic components
US6391622B1 (en) 1997-04-04 2002-05-21 Caliper Technologies Corp. Closed-loop biochemical analyzers
US5993750A (en) 1997-04-11 1999-11-30 Eastman Kodak Company Integrated ceramic micro-chemical plant
US5921087A (en) 1997-04-22 1999-07-13 Intel Corporation Method and apparatus for cooling integrated circuits using a thermoelectric module
WO1998049548A1 (en) 1997-04-25 1998-11-05 Caliper Technologies Corporation Microfluidic devices incorporating improved channel geometries
WO1998049549A1 (en) 1997-04-30 1998-11-05 Orion Research, Inc. Capillary electrophoretic separation system
US5880524A (en) 1997-05-05 1999-03-09 Intel Corporation Heat pipe lid for electronic packages
EP0980446A4 (en) 1997-05-08 2000-08-23 Nanosystems Inc Silicon etching process for making microchannel plates
US6090251A (en) 1997-06-06 2000-07-18 Caliper Technologies, Inc. Microfabricated structures for facilitating fluid introduction into microfluidic devices
US5869004A (en) 1997-06-09 1999-02-09 Caliper Technologies Corp. Methods and apparatus for in situ concentration and/or dilution of materials in microfluidic systems
US5901037A (en) 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US5942093A (en) 1997-06-18 1999-08-24 Sandia Corporation Electro-osmotically driven liquid delivery method and apparatus
US6013164A (en) 1997-06-25 2000-01-11 Sandia Corporation Electokinetic high pressure hydraulic system
US6019882A (en) 1997-06-25 2000-02-01 Sandia Corporation Electrokinetic high pressure hydraulic system
US6277257B1 (en) * 1997-06-25 2001-08-21 Sandia Corporation Electrokinetic high pressure hydraulic system
US6001231A (en) 1997-07-15 1999-12-14 Caliper Technologies Corp. Methods and systems for monitoring and controlling fluid flow rates in microfluidic systems
US6907921B2 (en) * 1998-06-18 2005-06-21 3M Innovative Properties Company Microchanneled active fluid heat exchanger
JP4048579B2 (en) * 1997-08-28 2008-02-20 住友電気工業株式会社 Heat dissipating body including refrigerant flow path and manufacturing method thereof
US6400012B1 (en) * 1997-09-17 2002-06-04 Advanced Energy Voorhees, Inc. Heat sink for use in cooling an integrated circuit
US5909057A (en) * 1997-09-23 1999-06-01 Lsi Logic Corporation Integrated heat spreader/stiffener with apertures for semiconductor package
US6012902A (en) * 1997-09-25 2000-01-11 Caliper Technologies Corp. Micropump
US5842787A (en) * 1997-10-09 1998-12-01 Caliper Technologies Corporation Microfluidic systems incorporating varied channel dimensions
US5836750A (en) 1997-10-09 1998-11-17 Honeywell Inc. Electrostatically actuated mesopump having a plurality of elementary cells
US5945217A (en) 1997-10-14 1999-08-31 Gore Enterprise Holdings, Inc. Thermally conductive polytrafluoroethylene article
US5829514A (en) 1997-10-29 1998-11-03 Eastman Kodak Company Bonded cast, pin-finned heat sink and method of manufacture
US6174675B1 (en) * 1997-11-25 2001-01-16 Caliper Technologies Corp. Electrical current for controlling fluid parameters in microchannels
US5893726A (en) * 1997-12-15 1999-04-13 Micron Technology, Inc. Semiconductor package with pre-fabricated cover and method of fabrication
US6140860A (en) 1997-12-31 2000-10-31 Intel Corporation Thermal sensing circuit
US6167910B1 (en) 1998-01-20 2001-01-02 Caliper Technologies Corp. Multi-layer microfluidic devices
US6100541A (en) 1998-02-24 2000-08-08 Caliper Technologies Corporation Microfluidic devices and systems incorporating integrated optical elements
US6084178A (en) 1998-02-27 2000-07-04 Hewlett-Packard Company Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
US6019165A (en) 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
JP3858484B2 (en) * 1998-11-24 2006-12-13 松下電器産業株式会社 Laminate heat exchanger
US6227287B1 (en) * 1998-05-25 2001-05-08 Denso Corporation Cooling apparatus by boiling and cooling refrigerant
KR100266698B1 (en) 1998-06-12 2000-09-15 김영환 Semiconductor chip package and fabrication method thereof
US6196307B1 (en) * 1998-06-17 2001-03-06 Intersil Americas Inc. High performance heat exchanger and method
US5940270A (en) 1998-07-08 1999-08-17 Puckett; John Christopher Two-phase constant-pressure closed-loop water cooling system for a heat producing device
JP2000031362A (en) * 1998-07-13 2000-01-28 Denso Corp Cooler by boiling and condensing coolant
US5965813A (en) 1998-07-23 1999-10-12 Industry Technology Research Institute Integrated flow sensor
US6129260A (en) 1998-08-19 2000-10-10 Fravillig Technologies Company Solderable structures
JP2000077586A (en) * 1998-08-28 2000-03-14 Fuji Electric Co Ltd Boiling cooler
US6119729A (en) 1998-09-14 2000-09-19 Arise Technologies Corporation Freeze protection apparatus for fluid transport passages
US6146103A (en) 1998-10-09 2000-11-14 The Regents Of The University Of California Micromachined magnetohydrodynamic actuators and sensors
US6021045A (en) 1998-10-26 2000-02-01 Chip Coolers, Inc. Heat sink assembly with threaded collar and multiple pressure capability
US6032689A (en) * 1998-10-30 2000-03-07 Industrial Technology Research Institute Integrated flow controller module
JP3395164B2 (en) * 1998-11-05 2003-04-07 インターナショナル・ビジネス・マシーンズ・コーポレーション Semiconductor device
US6086330A (en) 1998-12-21 2000-07-11 Motorola, Inc. Low-noise, high-performance fan
US6313992B1 (en) 1998-12-22 2001-11-06 James J. Hildebrandt Method and apparatus for increasing the power density of integrated circuit boards and their components
US6365962B1 (en) 2000-03-29 2002-04-02 Intel Corporation Flip-chip on flex for high performance packaging applications
US6416642B1 (en) 1999-01-21 2002-07-09 Caliper Technologies Corp. Method and apparatus for continuous liquid flow in microscale channels using pressure injection, wicking, and electrokinetic injection
ATE508200T1 (en) 1999-02-23 2011-05-15 Caliper Life Sciences Inc SEQUENCING THROUGH INCORPORATION
US6553253B1 (en) * 1999-03-12 2003-04-22 Biophoretic Therapeutic Systems, Llc Method and system for electrokinetic delivery of a substance
US6406605B1 (en) * 1999-06-01 2002-06-18 Ysi Incorporated Electroosmotic flow controlled microfluidic devices
US6495015B1 (en) 1999-06-18 2002-12-17 Sandia National Corporation Electrokinetically pumped high pressure sprays
US6287440B1 (en) 1999-06-18 2001-09-11 Sandia Corporation Method for eliminating gas blocking in electrokinetic pumping systems
US6096656A (en) 1999-06-24 2000-08-01 Sandia Corporation Formation of microchannels from low-temperature plasma-deposited silicon oxynitride
US6234240B1 (en) 1999-07-01 2001-05-22 Kioan Cheon Fanless cooling system for computer
US6131650A (en) 1999-07-20 2000-10-17 Thermal Corp. Fluid cooled single phase heat sink
US6396706B1 (en) * 1999-07-30 2002-05-28 Credence Systems Corporation Self-heating circuit board
US6457515B1 (en) 1999-08-06 2002-10-01 The Ohio State University Two-layered micro channel heat sink, devices and systems incorporating same
JP3518434B2 (en) * 1999-08-11 2004-04-12 株式会社日立製作所 Multi-chip module cooling system
US6693320B1 (en) 1999-08-30 2004-02-17 Micron Technology, Inc. Capacitor structures with recessed hemispherical grain silicon
US6360814B1 (en) * 1999-08-31 2002-03-26 Denso Corporation Cooling device boiling and condensing refrigerant
US6293333B1 (en) 1999-09-02 2001-09-25 The United States Of America As Represented By The Secretary Of The Air Force Micro channel heat pipe having wire cloth wick and method of fabrication
US6216343B1 (en) 1999-09-02 2001-04-17 The United States Of America As Represented By The Secretary Of The Air Force Method of making micro channel heat pipe having corrugated fin elements
US6210986B1 (en) * 1999-09-23 2001-04-03 Sandia Corporation Microfluidic channel fabrication method
JP2001110956A (en) * 1999-10-04 2001-04-20 Matsushita Electric Ind Co Ltd Cooling equipment for electronic component
AUPQ332199A0 (en) 1999-10-07 1999-11-04 Hydrocool Pty Limited Heat exchanger for an electronic heat pump
KR100338810B1 (en) 1999-11-08 2002-05-31 윤종용 cooling device
US6166907A (en) 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US6729383B1 (en) 1999-12-16 2004-05-04 The United States Of America As Represented By The Secretary Of The Navy Fluid-cooled heat sink with turbulence-enhancing support pins
US6324075B1 (en) 1999-12-20 2001-11-27 Intel Corporation Partially covered motherboard with EMI partition gateway
JP2001185306A (en) 1999-12-28 2001-07-06 Jst Mfg Co Ltd Connector for module
US6154363A (en) 1999-12-29 2000-11-28 Chang; Neng Chao Electronic device cooling arrangement
US6272012B1 (en) 2000-02-03 2001-08-07 Crystal Group Inc. System and method for cooling compact PCI circuit cards in a computer
JP2001223309A (en) * 2000-02-09 2001-08-17 Fujine Sangyo:Kk Sealing-type plate heat movable body
US6415860B1 (en) 2000-02-09 2002-07-09 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College Crossflow micro heat exchanger
US6301109B1 (en) 2000-02-11 2001-10-09 International Business Machines Corporation Isothermal heat sink with cross-flow openings between channels
EP1123739B1 (en) 2000-02-11 2006-11-29 STMicroelectronics S.r.l. Integrated device for microfluid thermoregulation, and manufacturing process thereof
US6337794B1 (en) * 2000-02-11 2002-01-08 International Business Machines Corporation Isothermal heat sink with tiered cooling channels
US6253835B1 (en) 2000-02-11 2001-07-03 International Business Machines Corporation Isothermal heat sink with converging, diverging channels
US6417060B2 (en) 2000-02-25 2002-07-09 Borealis Technical Limited Method for making a diode device
US6761211B2 (en) 2000-03-14 2004-07-13 Delphi Technologies, Inc. High-performance heat sink for electronics cooling
US6257320B1 (en) 2000-03-28 2001-07-10 Alec Wargo Heat sink device for power semiconductors
US6347036B1 (en) 2000-03-29 2002-02-12 Dell Products L.P. Apparatus and method for mounting a heat generating component in a computer system
US6366467B1 (en) * 2000-03-31 2002-04-02 Intel Corporation Dual-socket interposer and method of fabrication therefor
US6290909B1 (en) 2000-04-13 2001-09-18 Sandia Corporation Sample injector for high pressure liquid chromatography
US6508301B2 (en) * 2000-04-19 2003-01-21 Thermal Form & Function Cold plate utilizing fin with evaporating refrigerant
JP2001326311A (en) 2000-05-15 2001-11-22 Hitachi Ltd Cooling device for electronic equipment
FR2809281B1 (en) 2000-05-22 2002-07-12 Alstom ELECTRONIC POWER DEVICE
US6787052B1 (en) 2000-06-19 2004-09-07 Vladimir Vaganov Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers
US20020031947A1 (en) * 2000-07-17 2002-03-14 Gundermann James Edward Electrical connector module and electrical connector assembly including same
US6366462B1 (en) 2000-07-18 2002-04-02 International Business Machines Corporation Electronic module with integral refrigerant evaporator assembly and control system therefore
US6459582B1 (en) 2000-07-19 2002-10-01 Fujitsu Limited Heatsink apparatus for de-coupling clamping forces on an integrated circuit package
JP2002093968A (en) * 2000-09-11 2002-03-29 Denki Kagaku Kogyo Kk Module structure
US6915648B2 (en) 2000-09-14 2005-07-12 Xdx Inc. Vapor compression systems, expansion devices, flow-regulating members, and vehicles, and methods for using vapor compression systems
US6317326B1 (en) 2000-09-14 2001-11-13 Sun Microsystems, Inc. Integrated circuit device package and heat dissipation device
US6388317B1 (en) * 2000-09-25 2002-05-14 Lockheed Martin Corporation Solid-state chip cooling by use of microchannel coolant flow
JP2002110878A (en) * 2000-09-28 2002-04-12 Matsushita Refrig Co Ltd Cooling module and cooling system comprising it
US6469893B1 (en) 2000-09-29 2002-10-22 Intel Corporation Direct heatpipe attachment to die using center point loading
US6324058B1 (en) 2000-10-25 2001-11-27 Chieh-Jen Hsiao Heat-dissipating apparatus for an integrated circuit device
US6537437B1 (en) * 2000-11-13 2003-03-25 Sandia Corporation Surface-micromachined microfluidic devices
US6367544B1 (en) 2000-11-21 2002-04-09 Thermal Corp. Thermal jacket for reducing condensation and method for making same
US6478258B1 (en) 2000-11-21 2002-11-12 Space Systems/Loral, Inc. Spacecraft multiple loop heat pipe thermal system for internal equipment panel applications
US6578626B1 (en) 2000-11-21 2003-06-17 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
US6336497B1 (en) 2000-11-24 2002-01-08 Ching-Bin Lin Self-recirculated heat dissipating means for cooling central processing unit
US6437981B1 (en) 2000-11-30 2002-08-20 Harris Corporation Thermally enhanced microcircuit package and method of forming same
US6367543B1 (en) 2000-12-11 2002-04-09 Thermal Corp. Liquid-cooled heat sink with thermal jacket
US6459581B1 (en) 2000-12-19 2002-10-01 Harris Corporation Electronic device using evaporative micro-cooling and associated methods
JP2002188876A (en) 2000-12-20 2002-07-05 Hitachi Ltd Liquid cooling system and personal computer provided with the system
US6431260B1 (en) 2000-12-21 2002-08-13 International Business Machines Corporation Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof
US6698924B2 (en) 2000-12-21 2004-03-02 Tank, Inc. Cooling system comprising a circular venturi
JP2002280508A (en) * 2001-01-11 2002-09-27 Matsushita Refrig Co Ltd Cooling module and cooling system using the cooling module
US6466442B2 (en) 2001-01-29 2002-10-15 Ching-Bin Lin Guidably-recirculated heat dissipating means for cooling central processing unit
US6484521B2 (en) 2001-02-22 2002-11-26 Hewlett-Packard Company Spray cooling with local control of nozzles
KR100909544B1 (en) 2001-03-02 2009-07-27 산요덴키가부시키가이샤 Electronic device
US6424531B1 (en) 2001-03-13 2002-07-23 Delphi Technologies, Inc. High performance heat sink for electronics cooling
US20020134543A1 (en) 2001-03-20 2002-09-26 Motorola, Inc Connecting device with local heating element and method for using same
US6682844B2 (en) 2001-04-27 2004-01-27 Plug Power Inc. Release valve and method for venting a system
US6601643B2 (en) 2001-04-27 2003-08-05 Samsung Electronics Co., Ltd Flat evaporator
US6609560B2 (en) 2001-04-28 2003-08-26 Samsung Electronics Co., Ltd. Flat evaporator
US6600220B2 (en) 2001-05-14 2003-07-29 Hewlett-Packard Company Power distribution in multi-chip modules
US6651735B2 (en) 2001-05-15 2003-11-25 Samsung Electronics Co., Ltd. Evaporator of CPL cooling apparatus having fine wick structure
US7462852B2 (en) 2001-12-17 2008-12-09 Tecomet, Inc. Devices, methods, and systems involving cast collimators
US6449162B1 (en) 2001-06-07 2002-09-10 International Business Machines Corporation Removable land grid array cooling solution
WO2002102124A2 (en) 2001-06-12 2002-12-19 Liebert Corporation Single or dual buss thermal transfer system
US6657121B2 (en) 2001-06-27 2003-12-02 Thermal Corp. Thermal management system and method for electronics system
US6519151B2 (en) * 2001-06-27 2003-02-11 International Business Machines Corporation Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof
US6536510B2 (en) 2001-07-10 2003-03-25 Thermal Corp. Thermal bus for cabinets housing high power electronics equipment
US6385044B1 (en) * 2001-07-27 2002-05-07 International Business Machines Corporation Heat pipe heat sink assembly for cooling semiconductor chips
US6438984B1 (en) 2001-08-29 2002-08-27 Sun Microsystems, Inc. Refrigerant-cooled system and method for cooling electronic components
US6587343B2 (en) 2001-08-29 2003-07-01 Sun Microsystems, Inc. Water-cooled system and method for cooling electronic components
US6533029B1 (en) 2001-09-04 2003-03-18 Thermal Corp. Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator
JP3636118B2 (en) 2001-09-04 2005-04-06 株式会社日立製作所 Water cooling device for electronic equipment
US6981543B2 (en) 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
TW516810U (en) 2001-09-27 2003-01-01 Hoya Tech Co Ltd Fastening device for heat sink
US6449157B1 (en) 2001-10-03 2002-09-10 Ho Kang Chu IC package assembly with retention mechanism
US6581388B2 (en) * 2001-11-27 2003-06-24 Sun Microsystems, Inc. Active temperature gradient reducer
US6527835B1 (en) * 2001-12-21 2003-03-04 Sandia Corporation Chemical preconcentrator with integral thermal flow sensor
US6477045B1 (en) 2001-12-28 2002-11-05 Tien-Lai Wang Heat dissipater for a central processing unit
US6643132B2 (en) 2002-01-04 2003-11-04 Intel Corporation Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system
US6700785B2 (en) * 2002-01-04 2004-03-02 Intel Corporation Computer system which locks a server unit subassembly in a selected position in a support frame
US6679315B2 (en) * 2002-01-14 2004-01-20 Marconi Communications, Inc. Small scale chip cooler assembly
JP4195392B2 (en) 2002-02-26 2008-12-10 ミクロス・マニュファクチュアリング・インコーポレーテッド Capillary evaporator
US6591625B1 (en) 2002-04-17 2003-07-15 Agilent Technologies, Inc. Cooling of substrate-supported heat-generating components
US7209355B2 (en) 2002-05-15 2007-04-24 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
TWI234063B (en) 2002-05-15 2005-06-11 Matsushita Electric Ind Co Ltd Cooling apparatus for electronic equipment
US6827128B2 (en) 2002-05-20 2004-12-07 The Board Of Trustees Of The University Of Illinois Flexible microchannel heat exchanger
US6988534B2 (en) 2002-11-01 2006-01-24 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
US20040008483A1 (en) 2002-07-13 2004-01-15 Kioan Cheon Water cooling type cooling system for electronic device
US6588498B1 (en) 2002-07-18 2003-07-08 Delphi Technologies, Inc. Thermosiphon for electronics cooling with high performance boiling and condensing surfaces
US20040020225A1 (en) 2002-08-02 2004-02-05 Patel Chandrakant D. Cooling system
US6836131B2 (en) 2002-08-16 2004-12-28 Credence Systems Corp. Spray cooling and transparent cooling plate thermal management system
JP3641258B2 (en) 2002-08-26 2005-04-20 株式会社東芝 Electronics
TW578992U (en) * 2002-09-09 2004-03-01 Hon Hai Prec Ind Co Ltd Heat sink assembly
US6714412B1 (en) * 2002-09-13 2004-03-30 International Business Machines Corporation Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use
DE10243026B3 (en) * 2002-09-13 2004-06-03 Oliver Laing Device for local cooling or heating of an object
US6894899B2 (en) 2002-09-13 2005-05-17 Hong Kong Cheung Tat Electrical Co. Ltd. Integrated fluid cooling system for electronic components
DE10242776B4 (en) * 2002-09-14 2013-05-23 Alstom Technology Ltd. Method for operating an emission control system
US20040052052A1 (en) 2002-09-18 2004-03-18 Rivera Rudy A. Circuit cooling apparatus
AU2003270882A1 (en) 2002-09-23 2004-05-04 Cooligy, Inc. Micro-fabricated electrokinetic pump with on-frit electrode
US6881039B2 (en) 2002-09-23 2005-04-19 Cooligy, Inc. Micro-fabricated electrokinetic pump
US6807056B2 (en) 2002-09-24 2004-10-19 Hitachi, Ltd. Electronic equipment
US6994151B2 (en) 2002-10-22 2006-02-07 Cooligy, Inc. Vapor escape microchannel heat exchanger
US6829142B2 (en) 2002-10-25 2004-12-07 Hewlett-Packard Development Company, L.P. Cell thermal connector
US6986382B2 (en) * 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US7000684B2 (en) * 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
JP2006522463A (en) 2002-11-01 2006-09-28 クーリギー インコーポレイテッド Optimal spreader system, apparatus and method for micro heat exchange cooled by fluid
US20040112571A1 (en) 2002-11-01 2004-06-17 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
AU2003286855A1 (en) 2002-11-01 2004-06-07 Cooligy, Inc. Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
US20060060333A1 (en) * 2002-11-05 2006-03-23 Lalit Chordia Methods and apparatuses for electronics cooling
US6889515B2 (en) 2002-11-12 2005-05-10 Isothermal Systems Research, Inc. Spray cooling system
US7210227B2 (en) * 2002-11-26 2007-05-01 Intel Corporation Decreasing thermal contact resistance at a material interface
US6809928B2 (en) 2002-12-27 2004-10-26 Intel Corporation Sealed and pressurized liquid cooling system for microprocessor
KR20040065626A (en) 2003-01-15 2004-07-23 엘지전자 주식회사 Heat exchanger
US7090001B2 (en) 2003-01-31 2006-08-15 Cooligy, Inc. Optimized multiple heat pipe blocks for electronics cooling
US7201012B2 (en) 2003-01-31 2007-04-10 Cooligy, Inc. Remedies to prevent cracking in a liquid system
US7044196B2 (en) 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
US7293423B2 (en) 2004-06-04 2007-11-13 Cooligy Inc. Method and apparatus for controlling freezing nucleation and propagation
US6798660B2 (en) 2003-02-13 2004-09-28 Dell Products L.P. Liquid cooling module
JP4199018B2 (en) 2003-02-14 2008-12-17 株式会社日立製作所 Rack mount server system
US7017654B2 (en) 2003-03-17 2006-03-28 Cooligy, Inc. Apparatus and method of forming channels in a heat-exchanging device
US6992891B2 (en) * 2003-04-02 2006-01-31 Intel Corporation Metal ball attachment of heat dissipation devices
US7337832B2 (en) 2003-04-30 2008-03-04 Valeo, Inc. Heat exchanger
US6763880B1 (en) 2003-06-26 2004-07-20 Evserv Tech Corporation Liquid cooled radiation module for servers
CN100579348C (en) 2003-06-27 2010-01-06 日本电气株式会社 Cooler for electronic equipment
US7021369B2 (en) 2003-07-23 2006-04-04 Cooligy, Inc. Hermetic closed loop fluid system
JP2005064186A (en) 2003-08-11 2005-03-10 Hitachi Ltd Electronic apparatus equipped with cooling system
US7508672B2 (en) * 2003-09-10 2009-03-24 Qnx Cooling Systems Inc. Cooling system
JP4157451B2 (en) 2003-09-30 2008-10-01 株式会社東芝 Gas-liquid separation mechanism, reserve tank, and electronic equipment
TWM248227U (en) * 2003-10-17 2004-10-21 Hon Hai Prec Ind Co Ltd Liquid cooling apparatus
US7273088B2 (en) 2003-12-17 2007-09-25 Hewlett-Packard Development Company, L.P. One or more heat exchanger components in major part operably locatable outside computer chassis
US7009842B2 (en) 2004-01-30 2006-03-07 Isothermal Systems Research, Inc. Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules
US7021012B2 (en) 2004-02-04 2006-04-04 Karl Zeng Watertight decking
US20050257532A1 (en) 2004-03-11 2005-11-24 Masami Ikeda Module for cooling semiconductor device
US7011143B2 (en) 2004-05-04 2006-03-14 International Business Machines Corporation Method and apparatus for cooling electronic components
US7248472B2 (en) 2004-05-21 2007-07-24 Hewlett-Packard Development Company, L.P. Air distribution system
US7188662B2 (en) 2004-06-04 2007-03-13 Cooligy, Inc. Apparatus and method of efficient fluid delivery for cooling a heat producing device
US7301773B2 (en) 2004-06-04 2007-11-27 Cooligy Inc. Semi-compliant joining mechanism for semiconductor cooling applications
US7154749B2 (en) 2004-06-08 2006-12-26 Nvidia Corporation System for efficiently cooling a processor
JP4056504B2 (en) * 2004-08-18 2008-03-05 Necディスプレイソリューションズ株式会社 COOLING DEVICE AND ELECTRONIC DEVICE HAVING THE SAME
US7243704B2 (en) 2004-11-18 2007-07-17 Delta Design, Inc. Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end
US7184269B2 (en) 2004-12-09 2007-02-27 International Business Machines Company Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
US7327570B2 (en) 2004-12-22 2008-02-05 Hewlett-Packard Development Company, L.P. Fluid cooled integrated circuit module
CN100371854C (en) 2004-12-24 2008-02-27 富准精密工业(深圳)有限公司 Liquid cooling type heat sink
US7599761B2 (en) 2005-01-19 2009-10-06 Hewlett-Packard Development Company, L.P. Cooling assist module
US7254957B2 (en) 2005-02-15 2007-08-14 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
US20060187639A1 (en) 2005-02-23 2006-08-24 Lytron, Inc. Electronic component cooling and interface system
US20080013283A1 (en) * 2006-07-17 2008-01-17 Gilbert Gary L Mechanism for cooling electronic components

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2039593A (en) * 1935-06-20 1936-05-05 Theodore N Hubbuch Heat transfer coil
US4450472A (en) * 1981-03-02 1984-05-22 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
US4574876A (en) * 1981-05-11 1986-03-11 Extracorporeal Medical Specialties, Inc. Container with tapered walls for heating or cooling fluids
US5310440A (en) * 1990-04-27 1994-05-10 International Business Machines Corporation Convection transfer system
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US5978220A (en) * 1996-10-23 1999-11-02 Asea Brown Boveri Ag Liquid cooling device for a high-power semiconductor module
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US6034872A (en) * 1997-07-16 2000-03-07 International Business Machines Corporation Cooling computer systems
US6536516B2 (en) * 2000-12-21 2003-03-25 Long Manufacturing Ltd. Finned plate heat exchanger
US20030062149A1 (en) * 2001-09-28 2003-04-03 Goodson Kenneth E. Electroosmotic microchannel cooling system
US6606251B1 (en) * 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module

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