WO2004047144A3 - Organisches elektronisches bauelement mit stukturierter halbleitender funktionsschicht und herstellungsverfahren dazu - Google Patents

Organisches elektronisches bauelement mit stukturierter halbleitender funktionsschicht und herstellungsverfahren dazu Download PDF

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Publication number
WO2004047144A3
WO2004047144A3 PCT/DE2003/003770 DE0303770W WO2004047144A3 WO 2004047144 A3 WO2004047144 A3 WO 2004047144A3 DE 0303770 W DE0303770 W DE 0303770W WO 2004047144 A3 WO2004047144 A3 WO 2004047144A3
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WO
WIPO (PCT)
Prior art keywords
component
structured
semi
producing
functional layer
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Application number
PCT/DE2003/003770
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English (en)
French (fr)
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WO2004047144A2 (de
Inventor
Wolfgang Clemens
Walter Fix
Andreas Ullmann
Original Assignee
Siemens Ag
Wolfgang Clemens
Walter Fix
Andreas Ullmann
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Publication date
Application filed by Siemens Ag, Wolfgang Clemens, Walter Fix, Andreas Ullmann filed Critical Siemens Ag
Priority to DE50306538T priority Critical patent/DE50306538D1/de
Priority to EP03785505A priority patent/EP1563553B1/de
Priority to US10/535,448 priority patent/US7442954B2/en
Publication of WO2004047144A2 publication Critical patent/WO2004047144A2/de
Publication of WO2004047144A3 publication Critical patent/WO2004047144A3/de

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • H10K19/10Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00 comprising field-effect transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/468Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/464Lateral top-gate IGFETs comprising only a single gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Bipolar Transistors (AREA)

Abstract

Die Erfindung betrifft ein organisches elektronisches Bauelement wie einen organischen Feld-Effekt-Transistor und ein Herstellungsverfahren dazu, wobei die halbleitende Schicht des Bauelements strukturiert ist, obwohl das Bauelement im preisgünstigen Druckverfahren herstellbar ist. Um dies zu erreichen wird die untere Funktionsschicht durch eine Behandlung so präpariert, dass sie Teilbereiche hat, auf denen im nachfolgenden Prozessschritt Benetzung stattfindet und Teilbereiche, auf denen keine Benetzung erfolgt.
PCT/DE2003/003770 2002-11-19 2003-11-13 Organisches elektronisches bauelement mit stukturierter halbleitender funktionsschicht und herstellungsverfahren dazu WO2004047144A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE50306538T DE50306538D1 (de) 2002-11-19 2003-11-13 Organische elektronische schaltung mit stukturierter halbleitender funktionsschicht und herstellungsverfahren dazu
EP03785505A EP1563553B1 (de) 2002-11-19 2003-11-13 Organische elektronische schaltung mit stukturierter halbleitender funktionsschicht und herstellungsverfahren dazu
US10/535,448 US7442954B2 (en) 2002-11-19 2003-11-13 Organic electronic component comprising a patterned, semi-conducting functional layer and a method for producing said component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10253953 2002-11-19
DE10253953.7 2002-11-19

Publications (2)

Publication Number Publication Date
WO2004047144A2 WO2004047144A2 (de) 2004-06-03
WO2004047144A3 true WO2004047144A3 (de) 2004-09-02

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PCT/DE2003/003770 WO2004047144A2 (de) 2002-11-19 2003-11-13 Organisches elektronisches bauelement mit stukturierter halbleitender funktionsschicht und herstellungsverfahren dazu

Country Status (6)

Country Link
US (1) US7442954B2 (de)
EP (1) EP1563553B1 (de)
AT (1) ATE354182T1 (de)
DE (1) DE50306538D1 (de)
ES (1) ES2282708T3 (de)
WO (1) WO2004047144A2 (de)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7678857B2 (en) 2003-09-03 2010-03-16 Polyic Gmbh & Co. Kg Polymer mixtures for printed polymer electronic circuits
US7709865B2 (en) 2002-06-13 2010-05-04 Polyic Gmbh & Co. Kg Substrate for an organic field effect transistor, use of said substrate, method of increasing the charge carrier mobility, and organic field effect transistor (OFET)
US7724550B2 (en) 2004-12-23 2010-05-25 Polyic Gmbh & Co. Kg Organic rectifier
US7786818B2 (en) 2004-12-10 2010-08-31 Polyic Gmbh & Co. Kg Electronic component comprising a modulator
US7812343B2 (en) 2005-04-15 2010-10-12 Polyic Gmbh & Co. Kg Multilayer composite body having an electronic function
US7843342B2 (en) 2005-03-01 2010-11-30 Polyic Gmbh & Co. Kg Organic clock generator
US7847695B2 (en) 2004-08-23 2010-12-07 Polyic Gmbh & Co. Kg External package capable of being radio-tagged
US7846838B2 (en) 2005-07-29 2010-12-07 Polyic Gmbh & Co. Kg Method for producing an electronic component
US7875975B2 (en) 2000-08-18 2011-01-25 Polyic Gmbh & Co. Kg Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag
US7940340B2 (en) 2005-07-04 2011-05-10 Polyic Gmbh & Co. Kg Multilayer body with electrically controllable optically active systems of layers
US7940159B2 (en) 2004-12-10 2011-05-10 Polyic Gmbh & Co. Kg Identification system
US8044517B2 (en) 2002-07-29 2011-10-25 Polyic Gmbh & Co. Kg Electronic component comprising predominantly organic functional materials and a method for the production thereof

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7244626B2 (en) * 2004-06-30 2007-07-17 Motorola, Inc. Semiconductor devices shared element(s) apparatus and method
GB0427563D0 (en) * 2004-12-16 2005-01-19 Plastic Logic Ltd A method of semiconductor patterning
GB0506896D0 (en) * 2005-04-05 2005-05-11 Plastic Logic Ltd Stack ablation
DE102005044306A1 (de) * 2005-09-16 2007-03-22 Polyic Gmbh & Co. Kg Elektronische Schaltung und Verfahren zur Herstellung einer solchen
DE102006047388A1 (de) * 2006-10-06 2008-04-17 Polyic Gmbh & Co. Kg Feldeffekttransistor sowie elektrische Schaltung
US7704786B2 (en) * 2007-12-26 2010-04-27 Organicid Inc. Printed organic logic circuits using a floating gate transistor as a load device
US7723153B2 (en) * 2007-12-26 2010-05-25 Organicid, Inc. Printed organic logic circuits using an organic semiconductor as a resistive load device
DE102009009442A1 (de) 2009-02-18 2010-09-09 Polylc Gmbh & Co. Kg Organische Elektronikschaltung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999054936A1 (en) * 1998-04-16 1999-10-28 Cambridge Display Technology Ltd. Polymer devices
DE19918193A1 (de) * 1998-04-24 1999-11-25 Cambridge Display Tech Ltd Selektives Aufbringen von Polymerfilmen
US20030059987A1 (en) * 1999-12-21 2003-03-27 Plastic Logic Limited Inkjet-fabricated integrated circuits

Family Cites Families (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3512052A (en) 1968-01-11 1970-05-12 Gen Motors Corp Metal-insulator-semiconductor voltage variable capacitor with controlled resistivity dielectric
US3769096A (en) 1971-03-12 1973-10-30 Bell Telephone Labor Inc Pyroelectric devices
JPS543594B2 (de) 1973-10-12 1979-02-24
JPS54101176A (en) 1978-01-26 1979-08-09 Shinetsu Polymer Co Contact member for push switch
US4442019A (en) 1978-05-26 1984-04-10 Marks Alvin M Electroordered dipole suspension
DE3321071A1 (de) 1983-06-10 1984-12-13 Basf Ag Druckschalter
DE3338597A1 (de) 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
EP0239808B1 (de) 1986-03-03 1991-02-27 Kabushiki Kaisha Toshiba Strahlungsdetektor
EP0268370B1 (de) 1986-10-13 1995-06-28 Canon Kabushiki Kaisha Schaltungselement
GB2215307B (en) 1988-03-04 1991-10-09 Unisys Corp Electronic component transportation container
DE68912426T2 (de) 1988-06-21 1994-05-11 Gec Avery Ltd Herstellung von tragbaren elektronischen Karten.
US5892244A (en) 1989-01-10 1999-04-06 Mitsubishi Denki Kabushiki Kaisha Field effect transistor including πconjugate polymer and liquid crystal display including the field effect transistor
US6331356B1 (en) 1989-05-26 2001-12-18 International Business Machines Corporation Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
US5206525A (en) 1989-12-27 1993-04-27 Nippon Petrochemicals Co., Ltd. Electric element capable of controlling the electric conductivity of π-conjugated macromolecular materials
FI91573C (sv) 1990-01-04 1994-07-11 Neste Oy Sätt att framställa elektroniska och elektro-optiska komponenter och kretsar
FR2664430B1 (fr) 1990-07-04 1992-09-18 Centre Nat Rech Scient Transistor a effet de champ en couche mince de structure mis, dont l'isolant et le semiconducteur sont realises en materiaux organiques.
FR2673041A1 (fr) 1991-02-19 1992-08-21 Gemplus Card Int Procede de fabrication de micromodules de circuit integre et micromodule correspondant.
EP0501456A3 (de) 1991-02-26 1992-09-09 Sony Corporation Mit eine optischen Plattenantrieb ausgerüsteter Videospielcomputer
US5408109A (en) 1991-02-27 1995-04-18 The Regents Of The University Of California Visible light emitting diodes fabricated from soluble semiconducting polymers
JPH0580530A (ja) 1991-09-24 1993-04-02 Hitachi Ltd 薄膜パターン製造方法
US5173835A (en) 1991-10-15 1992-12-22 Motorola, Inc. Voltage variable capacitor
DE59105477D1 (de) 1991-10-30 1995-06-14 Fraunhofer Ges Forschung Belichtungsvorrichtung.
JP2709223B2 (ja) 1992-01-30 1998-02-04 三菱電機株式会社 非接触形携帯記憶装置
DE4243832A1 (de) 1992-12-23 1994-06-30 Daimler Benz Ag Tastsensoranordnung
JP3457348B2 (ja) 1993-01-15 2003-10-14 株式会社東芝 半導体装置の製造方法
FR2701117B1 (fr) 1993-02-04 1995-03-10 Asulab Sa Système de mesures électrochimiques à capteur multizones, et son application au dosage du glucose.
US5567550A (en) 1993-03-25 1996-10-22 Texas Instruments Incorporated Method of making a mask for making integrated circuits
WO1995006240A1 (en) 1993-08-24 1995-03-02 Metrika Laboratories, Inc. Novel disposable electronic assay device
JP3460863B2 (ja) 1993-09-17 2003-10-27 三菱電機株式会社 半導体装置の製造方法
FR2710413B1 (fr) 1993-09-21 1995-11-03 Asulab Sa Dispositif de mesure pour capteurs amovibles.
US5556706A (en) 1993-10-06 1996-09-17 Matsushita Electric Industrial Co., Ltd. Conductive layered product and method of manufacturing the same
IL111151A (en) 1994-10-03 1998-09-24 News Datacom Ltd Secure access systems
CN1106696C (zh) 1994-05-16 2003-04-23 皇家菲利浦电子有限公司 带有有机半导体材料的半导体器件
JP3246189B2 (ja) 1994-06-28 2002-01-15 株式会社日立製作所 半導体表示装置
US5574291A (en) 1994-12-09 1996-11-12 Lucent Technologies Inc. Article comprising a thin film transistor with low conductivity organic layer
US5630986A (en) 1995-01-13 1997-05-20 Bayer Corporation Dispensing instrument for fluid monitoring sensors
JP3068430B2 (ja) 1995-04-25 2000-07-24 富山日本電気株式会社 固体電解コンデンサ及びその製造方法
US5652645A (en) 1995-07-24 1997-07-29 Anvik Corporation High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates
GB2310493B (en) 1996-02-26 2000-08-02 Unilever Plc Determination of the characteristics of fluid
DE19629656A1 (de) 1996-07-23 1998-01-29 Boehringer Mannheim Gmbh Diagnostischer Testträger mit mehrschichtigem Testfeld und Verfahren zur Bestimmung von Analyt mit dessen Hilfe
US6344662B1 (en) 1997-03-25 2002-02-05 International Business Machines Corporation Thin-film field-effect transistor with organic-inorganic hybrid semiconductor requiring low operating voltages
US5946551A (en) 1997-03-25 1999-08-31 Dimitrakopoulos; Christos Dimitrios Fabrication of thin film effect transistor comprising an organic semiconductor and chemical solution deposited metal oxide gate dielectric
KR100248392B1 (ko) 1997-05-15 2000-09-01 정선종 유기물전계효과트랜지스터와결합된유기물능동구동전기발광소자및그소자의제작방법
EP0968537B1 (de) 1997-08-22 2012-05-02 Creator Technology B.V. Feld-effekt-transistor, der im wesentlichen aus organischen materialien besteht
ES2199705T1 (es) 1997-09-11 2004-03-01 Prec Dynamics Corp Transpondor de identificacion con circuito integrado consistente de materiales organicos.
US6251513B1 (en) 1997-11-08 2001-06-26 Littlefuse, Inc. Polymer composites for overvoltage protection
JPH11142810A (ja) 1997-11-12 1999-05-28 Nintendo Co Ltd 携帯型情報処理装置
WO1999030432A1 (en) 1997-12-05 1999-06-17 Koninklijke Philips Electronics N.V. Identification transponder
US5997817A (en) 1997-12-05 1999-12-07 Roche Diagnostics Corporation Electrochemical biosensor test strip
US6083104A (en) 1998-01-16 2000-07-04 Silverlit Toys (U.S.A.), Inc. Programmable toy with an independent game cartridge
AU739848B2 (en) 1998-01-28 2001-10-18 Thin Film Electronics Asa A method for generation of electrical conducting or semiconducting structures in three dimensions and methods for erasure of the same structures
US6087196A (en) 1998-01-30 2000-07-11 The Trustees Of Princeton University Fabrication of organic semiconductor devices using ink jet printing
US6045977A (en) 1998-02-19 2000-04-04 Lucent Technologies Inc. Process for patterning conductive polyaniline films
DE19816860A1 (de) 1998-03-06 1999-11-18 Deutsche Telekom Ag Chipkarte, insbesondere Guthabenkarte
US6033202A (en) 1998-03-27 2000-03-07 Lucent Technologies Inc. Mold for non - photolithographic fabrication of microstructures
US5967048A (en) 1998-06-12 1999-10-19 Howard A. Fromson Method and apparatus for the multiple imaging of a continuous web
US6215130B1 (en) 1998-08-20 2001-04-10 Lucent Technologies Inc. Thin film transistors
US6506438B2 (en) 1998-12-15 2003-01-14 E Ink Corporation Method for printing of transistor arrays on plastic substrates
US6321571B1 (en) 1998-12-21 2001-11-27 Corning Incorporated Method of making glass structures for flat panel displays
US6517955B1 (en) 1999-02-22 2003-02-11 Nippon Steel Corporation High strength galvanized steel plate excellent in adhesion of plated metal and formability in press working and high strength alloy galvanized steel plate and method for production thereof
WO2000052457A1 (en) 1999-03-02 2000-09-08 Helix Biopharma Corporation Card-based biosensor device
US6180956B1 (en) 1999-03-03 2001-01-30 International Business Machine Corp. Thin film transistors with organic-inorganic hybrid materials as semiconducting channels
US6207472B1 (en) 1999-03-09 2001-03-27 International Business Machines Corporation Low temperature thin film transistor fabrication
DE19921024C2 (de) 1999-05-06 2001-03-08 Wolfgang Eichelmann Videospielanlage
US6383664B2 (en) 1999-05-11 2002-05-07 The Dow Chemical Company Electroluminescent or photocell device having protective packaging
DE19933757A1 (de) 1999-07-19 2001-01-25 Giesecke & Devrient Gmbh Chipkarte mit integrierter Batterie
DE19935527A1 (de) 1999-07-28 2001-02-08 Giesecke & Devrient Gmbh Aktive Folie für Chipkarten mit Display
DE19937262A1 (de) 1999-08-06 2001-03-01 Siemens Ag Anordnung mit Transistor-Funktion
US6517995B1 (en) 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
US6340822B1 (en) 1999-10-05 2002-01-22 Agere Systems Guardian Corp. Article comprising vertically nano-interconnected circuit devices and method for making the same
US6335539B1 (en) 1999-11-05 2002-01-01 International Business Machines Corporation Method for improving performance of organic semiconductors in bottom electrode structure
US6284562B1 (en) 1999-11-17 2001-09-04 Agere Systems Guardian Corp. Thin film transistors
US6706159B2 (en) 2000-03-02 2004-03-16 Diabetes Diagnostics Combined lancet and electrochemical analyte-testing apparatus
DE10012204A1 (de) 2000-03-13 2001-09-20 Siemens Ag Einrichtung zum Kennzeichnen von Stückgut
DE10033112C2 (de) 2000-07-07 2002-11-14 Siemens Ag Verfahren zur Herstellung und Strukturierung organischer Feldeffekt-Transistoren (OFET), hiernach gefertigter OFET und seine Verwendung
JP2004506985A (ja) 2000-08-18 2004-03-04 シーメンス アクチエンゲゼルシヤフト 封入された有機電子構成素子、その製造方法および使用
DE10120687A1 (de) 2001-04-27 2002-10-31 Siemens Ag Verkapseltes organisch-elektronisches Bauteil, Verfahren zu seiner Herstellung und seine Verwendung
DE10043204A1 (de) 2000-09-01 2002-04-04 Siemens Ag Organischer Feld-Effekt-Transistor, Verfahren zur Strukturierung eines OFETs und integrierte Schaltung
DE10045192A1 (de) 2000-09-13 2002-04-04 Siemens Ag Organischer Datenspeicher, RFID-Tag mit organischem Datenspeicher, Verwendung eines organischen Datenspeichers
DE10047171A1 (de) 2000-09-22 2002-04-18 Siemens Ag Elektrode und/oder Leiterbahn für organische Bauelemente und Herstellungverfahren dazu
KR20020036916A (ko) 2000-11-11 2002-05-17 주승기 실리콘 박막의 결정화 방법 및 이에 의해 제조된 반도체소자
DE10058559A1 (de) 2000-11-24 2002-05-29 Interactiva Biotechnologie Gmb System zur Abwicklung eines Warentransfers und Warenvorrats-Behälter
KR100390522B1 (ko) 2000-12-01 2003-07-07 피티플러스(주) 결정질 실리콘 활성층을 포함하는 박막트랜지스터 제조 방법
DE10061297C2 (de) 2000-12-08 2003-05-28 Siemens Ag Verfahren zur Sturkturierung eines OFETs
DE10117663B4 (de) 2001-04-09 2004-09-02 Samsung SDI Co., Ltd., Suwon Verfahren zur Herstellung von Matrixanordnungen auf Basis verschiedenartiger organischer leitfähiger Materialien
US20020170897A1 (en) 2001-05-21 2002-11-21 Hall Frank L. Methods for preparing ball grid array substrates via use of a laser
JP4841751B2 (ja) * 2001-06-01 2011-12-21 株式会社半導体エネルギー研究所 有機半導体装置及びその作製方法
US6870180B2 (en) 2001-06-08 2005-03-22 Lucent Technologies Inc. Organic polarizable gate transistor apparatus and method
JP2003089259A (ja) 2001-09-18 2003-03-25 Hitachi Ltd パターン形成方法およびパターン形成装置
US7351660B2 (en) 2001-09-28 2008-04-01 Hrl Laboratories, Llc Process for producing high performance interconnects
DE10219905B4 (de) 2002-05-03 2011-06-22 OSRAM Opto Semiconductors GmbH, 93055 Optoelektronisches Bauelement mit organischen funktionellen Schichten und zwei Trägern sowie Verfahren zur Herstellung eines solchen optoelektronischen Bauelements
US6812509B2 (en) 2002-06-28 2004-11-02 Palo Alto Research Center Inc. Organic ferroelectric memory cells
US6870183B2 (en) 2002-11-04 2005-03-22 Advanced Micro Devices, Inc. Stacked organic memory devices and methods of operating and fabricating

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999054936A1 (en) * 1998-04-16 1999-10-28 Cambridge Display Technology Ltd. Polymer devices
DE19918193A1 (de) * 1998-04-24 1999-11-25 Cambridge Display Tech Ltd Selektives Aufbringen von Polymerfilmen
US20030059987A1 (en) * 1999-12-21 2003-03-27 Plastic Logic Limited Inkjet-fabricated integrated circuits

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7875975B2 (en) 2000-08-18 2011-01-25 Polyic Gmbh & Co. Kg Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag
US7709865B2 (en) 2002-06-13 2010-05-04 Polyic Gmbh & Co. Kg Substrate for an organic field effect transistor, use of said substrate, method of increasing the charge carrier mobility, and organic field effect transistor (OFET)
US8044517B2 (en) 2002-07-29 2011-10-25 Polyic Gmbh & Co. Kg Electronic component comprising predominantly organic functional materials and a method for the production thereof
US7678857B2 (en) 2003-09-03 2010-03-16 Polyic Gmbh & Co. Kg Polymer mixtures for printed polymer electronic circuits
US7847695B2 (en) 2004-08-23 2010-12-07 Polyic Gmbh & Co. Kg External package capable of being radio-tagged
US7786818B2 (en) 2004-12-10 2010-08-31 Polyic Gmbh & Co. Kg Electronic component comprising a modulator
US7940159B2 (en) 2004-12-10 2011-05-10 Polyic Gmbh & Co. Kg Identification system
US7724550B2 (en) 2004-12-23 2010-05-25 Polyic Gmbh & Co. Kg Organic rectifier
US7843342B2 (en) 2005-03-01 2010-11-30 Polyic Gmbh & Co. Kg Organic clock generator
US7812343B2 (en) 2005-04-15 2010-10-12 Polyic Gmbh & Co. Kg Multilayer composite body having an electronic function
US7940340B2 (en) 2005-07-04 2011-05-10 Polyic Gmbh & Co. Kg Multilayer body with electrically controllable optically active systems of layers
US7846838B2 (en) 2005-07-29 2010-12-07 Polyic Gmbh & Co. Kg Method for producing an electronic component

Also Published As

Publication number Publication date
ATE354182T1 (de) 2007-03-15
US20060118779A1 (en) 2006-06-08
WO2004047144A2 (de) 2004-06-03
ES2282708T3 (es) 2007-10-16
US7442954B2 (en) 2008-10-28
DE50306538D1 (de) 2007-03-29
EP1563553A2 (de) 2005-08-17
EP1563553B1 (de) 2007-02-14

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