WO2004051721A1 - 半導体基板の切断方法 - Google Patents
半導体基板の切断方法 Download PDFInfo
- Publication number
- WO2004051721A1 WO2004051721A1 PCT/JP2003/011624 JP0311624W WO2004051721A1 WO 2004051721 A1 WO2004051721 A1 WO 2004051721A1 JP 0311624 W JP0311624 W JP 0311624W WO 2004051721 A1 WO2004051721 A1 WO 2004051721A1
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- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor substrate
- cutting
- cut
- forming
- region
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
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- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
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- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
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- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
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- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
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Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES03812274.3T ES2479791T3 (es) | 2002-12-03 | 2003-09-11 | Procedimiento de corte de un sustrato semiconductor |
AU2003262077A AU2003262077A1 (en) | 2002-12-03 | 2003-09-11 | Method for cutting semiconductor substrate |
EP03812274.3A EP1580800B1 (en) | 2002-12-03 | 2003-09-11 | Method for cutting semiconductor substrate |
US10/537,509 US8263479B2 (en) | 2002-12-03 | 2003-09-11 | Method for cutting semiconductor substrate |
US13/206,181 US8409968B2 (en) | 2002-12-03 | 2011-08-09 | Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansion |
US13/608,676 US8450187B2 (en) | 2002-12-03 | 2012-09-10 | Method of cutting semiconductor substrate |
US13/829,683 US8865566B2 (en) | 2002-12-03 | 2013-03-14 | Method of cutting semiconductor substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002351600A JP4358502B2 (ja) | 2002-03-12 | 2002-12-03 | 半導体基板の切断方法 |
JP2002-351600 | 2002-12-03 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10537509 A-371-Of-International | 2003-09-11 | ||
US13/206,181 Continuation US8409968B2 (en) | 2002-12-03 | 2011-08-09 | Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansion |
US13/608,676 Division US8450187B2 (en) | 2002-12-03 | 2012-09-10 | Method of cutting semiconductor substrate |
Publications (1)
Publication Number | Publication Date |
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WO2004051721A1 true WO2004051721A1 (ja) | 2004-06-17 |
Family
ID=32463160
Family Applications (1)
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US8138450B2 (en) | 2005-07-04 | 2012-03-20 | Hamamatsu Photonics K.K. | Method for cutting workpiece |
WO2007004607A1 (ja) * | 2005-07-04 | 2007-01-11 | Hamamatsu Photonics K.K. | 加工対象物切断方法 |
JP2007013056A (ja) * | 2005-07-04 | 2007-01-18 | Hamamatsu Photonics Kk | 加工対象物切断方法 |
EP1906438A4 (en) * | 2005-07-04 | 2009-04-22 | Hamamatsu Photonics Kk | METHOD FOR CUTTING A WORKPIECE |
KR101226309B1 (ko) | 2005-07-04 | 2013-01-24 | 하마마츠 포토닉스 가부시키가이샤 | 가공 대상물 절단 방법 |
US7754583B2 (en) | 2005-11-18 | 2010-07-13 | Hamamatsu Photonics K.K. | Laser processing method |
US8124500B2 (en) | 2005-11-18 | 2012-02-28 | Hamamatsu Photonics K.K. | Laser processing method |
US8389384B2 (en) | 2005-12-27 | 2013-03-05 | Hamamatsu Photonics K.K. | Laser beam machining method and semiconductor chip |
KR101369567B1 (ko) | 2005-12-27 | 2014-03-05 | 하마마츠 포토닉스 가부시키가이샤 | 레이저 가공방법 및 반도체 칩 |
US8759948B2 (en) | 2005-12-27 | 2014-06-24 | Hamamatsu Photonics K.K. | Laser beam machining method and semiconductor chip |
WO2007074823A1 (ja) * | 2005-12-27 | 2007-07-05 | Hamamatsu Photonics K.K. | レーザ加工方法及び半導体チップ |
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