WO2004051757A3 - Optoelektronisches bauelement - Google Patents

Optoelektronisches bauelement Download PDF

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Publication number
WO2004051757A3
WO2004051757A3 PCT/DE2003/003923 DE0303923W WO2004051757A3 WO 2004051757 A3 WO2004051757 A3 WO 2004051757A3 DE 0303923 W DE0303923 W DE 0303923W WO 2004051757 A3 WO2004051757 A3 WO 2004051757A3
Authority
WO
WIPO (PCT)
Prior art keywords
chip
component
chip carrier
carrier
terminals
Prior art date
Application number
PCT/DE2003/003923
Other languages
English (en)
French (fr)
Other versions
WO2004051757A2 (de
Inventor
Karlheinz Arndt
Georg Bogner
Guenter Waitl
Matthias Winter
Original Assignee
Osram Opto Semiconductors Gmbh
Karlheinz Arndt
Georg Bogner
Guenter Waitl
Matthias Winter
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32318837&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2004051757(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Osram Opto Semiconductors Gmbh, Karlheinz Arndt, Georg Bogner, Guenter Waitl, Matthias Winter filed Critical Osram Opto Semiconductors Gmbh
Priority to EP03767463.7A priority Critical patent/EP1565948B1/de
Priority to JP2004556018A priority patent/JP2006508537A/ja
Priority to US10/535,794 priority patent/US7271425B2/en
Publication of WO2004051757A2 publication Critical patent/WO2004051757A2/de
Publication of WO2004051757A3 publication Critical patent/WO2004051757A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Die Erfindung betrifft ein optoelektronisches Bauelement enthaltend einen optoelektronischen Chip (1) , einen Chipträger (2) mit einem zentralen Bereich (3), auf dem der Chip befestigt ist und mit Anschlüssen (41, 42, 43, 44), die vom zentralen Bereich des Chipträgers (2) ausgehend nach aussen verlaufen, bei dem der Chip und Teile des Chipträgers von einem Körper (5) umhüllt sind, und bei dem die Projektion des Körpers sowie der Längsachsen der Anschlüsse auf die Kontaktebene zwischen Chip und Chipträger jeweils im wesentlichen punktsymmetrisch zum Mittelpunkt des Chips sind. Ferner betrifft die Erfindung eine Anordnung mit dem Bauelement. Durch die symmetrische Ausgestaltung des Bauelements hat dieses den Vorteil, dass die Gefahr thermomechanisch bedingter Ausfälle des Bauelements verringert wird.
PCT/DE2003/003923 2002-11-29 2003-11-27 Optoelektronisches bauelement WO2004051757A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP03767463.7A EP1565948B1 (de) 2002-11-29 2003-11-27 Optoelektronisches bauelement
JP2004556018A JP2006508537A (ja) 2002-11-29 2003-11-27 オプトエレクトロニクス素子
US10/535,794 US7271425B2 (en) 2002-11-29 2003-11-27 Optoelectronic component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10255932.5 2002-11-29
DE10255932A DE10255932A1 (de) 2002-11-29 2002-11-29 Optoelektronisches Bauelement

Publications (2)

Publication Number Publication Date
WO2004051757A2 WO2004051757A2 (de) 2004-06-17
WO2004051757A3 true WO2004051757A3 (de) 2004-12-23

Family

ID=32318837

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/003923 WO2004051757A2 (de) 2002-11-29 2003-11-27 Optoelektronisches bauelement

Country Status (7)

Country Link
US (1) US7271425B2 (de)
EP (1) EP1565948B1 (de)
JP (1) JP2006508537A (de)
CN (1) CN100565943C (de)
DE (1) DE10255932A1 (de)
TW (1) TWI244217B (de)
WO (1) WO2004051757A2 (de)

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US7397067B2 (en) * 2003-12-31 2008-07-08 Intel Corporation Microdisplay packaging system
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
JP5130680B2 (ja) * 2006-03-02 2013-01-30 日亜化学工業株式会社 半導体装置およびその形成方法
US7675145B2 (en) * 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US11210971B2 (en) 2009-07-06 2021-12-28 Cree Huizhou Solid State Lighting Company Limited Light emitting diode display with tilted peak emission pattern
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US7635915B2 (en) * 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
DE102007005630B4 (de) * 2007-02-05 2019-08-08 Infineon Technologies Ag Sensorchip-Modul und Verfahren zur Herstellung eines Sensorchip-Moduls
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
TWM329244U (en) * 2007-10-01 2008-03-21 Everlight Electronics Co Ltd Light emitting diode device
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
US8049230B2 (en) 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
JP5464825B2 (ja) * 2008-07-23 2014-04-09 ローム株式会社 Ｌｅｄモジュール
US20100059783A1 (en) * 2008-09-08 2010-03-11 Harry Chandra Light Emitting Chip Package With Metal Leads For Enhanced Heat Dissipation
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
JP5340763B2 (ja) * 2009-02-25 2013-11-13 ローム株式会社 Ｌｅｄランプ
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8598809B2 (en) 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
US8350370B2 (en) 2010-01-29 2013-01-08 Cree Huizhou Opto Limited Wide angle oval light emitting diode package
US8455882B2 (en) 2010-10-15 2013-06-04 Cree, Inc. High efficiency LEDs
JP2013004905A (ja) * 2011-06-21 2013-01-07 Mitsubishi Chemicals Corp 半導体発光装置用パッケージ及び半導体発光装置
US8692282B2 (en) * 2011-10-27 2014-04-08 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting module comprising the same
US8823041B2 (en) * 2011-10-27 2014-09-02 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting module comprising the same
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
USD735683S1 (en) 2013-05-03 2015-08-04 Cree, Inc. LED package
US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
USD758976S1 (en) 2013-08-08 2016-06-14 Cree, Inc. LED package
DE102013110114A1 (de) 2013-09-13 2015-04-02 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
USD790486S1 (en) 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD777122S1 (en) 2015-02-27 2017-01-24 Cree, Inc. LED package
USD783547S1 (en) 2015-06-04 2017-04-11 Cree, Inc. LED package
CN106571383B (zh) 2015-10-08 2020-04-28 联华电子股份有限公司 半导体元件及其制作方法

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Publication number Priority date Publication date Assignee Title
JPS5516415A (en) * 1978-07-21 1980-02-05 Hitachi Ltd Diode
JPH04307975A (ja) * 1991-04-05 1992-10-30 Sharp Corp 光学装置
JPH10144965A (ja) * 1996-11-11 1998-05-29 Hamamatsu Photonics Kk 光半導体装置及びその製造方法
JPH11150295A (ja) * 1997-11-17 1999-06-02 Sony Corp 半導体発光素子、半導体発光素子の製造方法および表示装置
JP2000216413A (ja) * 1999-01-26 2000-08-04 Apic Yamada Corp Ｂｇａ型透明プラスチック半導体パッケ―ジ
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JPH04307975A (ja) * 1991-04-05 1992-10-30 Sharp Corp 光学装置
JPH10144965A (ja) * 1996-11-11 1998-05-29 Hamamatsu Photonics Kk 光半導体装置及びその製造方法
JPH11150295A (ja) * 1997-11-17 1999-06-02 Sony Corp 半導体発光素子、半導体発光素子の製造方法および表示装置
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JP2000216413A (ja) * 1999-01-26 2000-08-04 Apic Yamada Corp Ｂｇａ型透明プラスチック半導体パッケ―ジ
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Also Published As

Publication number Publication date
DE10255932A1 (de) 2004-06-17
CN1717813A (zh) 2006-01-04
CN100565943C (zh) 2009-12-02
EP1565948B1 (de) 2016-03-16
WO2004051757A2 (de) 2004-06-17
TW200419828A (en) 2004-10-01
EP1565948A2 (de) 2005-08-24
US7271425B2 (en) 2007-09-18
TWI244217B (en) 2005-11-21
US20060049477A1 (en) 2006-03-09
JP2006508537A (ja) 2006-03-09

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