WO2004055834A1 - Electric conductors - Google Patents
Electric conductors Download PDFInfo
- Publication number
- WO2004055834A1 WO2004055834A1 PCT/IB2003/006245 IB0306245W WO2004055834A1 WO 2004055834 A1 WO2004055834 A1 WO 2004055834A1 IB 0306245 W IB0306245 W IB 0306245W WO 2004055834 A1 WO2004055834 A1 WO 2004055834A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wire
- copper
- wire according
- power supply
- alloy
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/022—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/024—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coating With Molten Metal (AREA)
- Insulated Conductors (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Valve Device For Special Equipments (AREA)
- Glass Compositions (AREA)
- Cable Accessories (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK03778694T DK1581955T3 (en) | 2002-12-18 | 2003-12-17 | Electrical conductors |
US10/539,907 US7501578B2 (en) | 2002-12-18 | 2003-12-17 | Electric conductors |
DE60325899T DE60325899D1 (en) | 2002-12-18 | 2003-12-17 | ELECTRIC HEAD |
EP03778694A EP1581955B1 (en) | 2002-12-18 | 2003-12-17 | Electric conductors |
AU2003289662A AU2003289662A1 (en) | 2002-12-18 | 2003-12-17 | Electric conductors |
JP2004560140A JP4914009B2 (en) | 2002-12-18 | 2003-12-17 | Electrical conductor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI2002A002672 | 2002-12-18 | ||
IT002672A ITMI20022672A1 (en) | 2002-12-18 | 2002-12-18 | ELECTRIC CONDUCTORS. |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004055834A1 true WO2004055834A1 (en) | 2004-07-01 |
Family
ID=32587869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2003/006245 WO2004055834A1 (en) | 2002-12-18 | 2003-12-17 | Electric conductors |
Country Status (10)
Country | Link |
---|---|
US (1) | US7501578B2 (en) |
EP (1) | EP1581955B1 (en) |
JP (1) | JP4914009B2 (en) |
CN (1) | CN100401429C (en) |
AT (1) | ATE421154T1 (en) |
AU (1) | AU2003289662A1 (en) |
DE (1) | DE60325899D1 (en) |
DK (1) | DK1581955T3 (en) |
IT (1) | ITMI20022672A1 (en) |
WO (1) | WO2004055834A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3015762B1 (en) * | 2013-12-19 | 2017-12-15 | Nexans | OXIDATION RESISTANT ELECTRICALLY CONDUCTIVE ELECTRICALLY CONDUCTIVE ELEMENT |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3692578A (en) * | 1969-11-13 | 1972-09-19 | Siemens Ag | Method of producing tin layers or tin alloy layers on copper or copper alloy wires by hot tin plating |
US4314230A (en) * | 1980-07-31 | 1982-02-02 | Raychem Corporation | Devices comprising conductive polymers |
DD220915A1 (en) * | 1984-01-20 | 1985-04-10 | Mansfeld Kom W Pieck Fi F Ne M | METHOD FOR THE PRODUCTION OF WIRE OF METAL ALLOYS WITH A SOLIDUSTEMPERATURE OF LESS THAN 600 K |
US4524241A (en) * | 1979-12-18 | 1985-06-18 | Thomson-Brandt | Insulated multiwire electric cable having protected solderable and non-heat-sealing conductors |
JPS6123737A (en) * | 1984-07-09 | 1986-02-01 | Nippon Mining Co Ltd | Copper alloy having superior heat resistance and electric conductivity |
JPS61154790A (en) * | 1984-12-27 | 1986-07-14 | Toshiba Corp | Wire for build-up welding of bearing metal |
JPS61190058A (en) * | 1985-02-19 | 1986-08-23 | Hitachi Cable Ltd | Hot dipping method |
EP0481493A2 (en) * | 1990-10-18 | 1992-04-22 | Sumitomo Electric Industries, Limited | Fuse Conductor |
US5939215A (en) * | 1994-11-26 | 1999-08-17 | Federal-Mogul Wiesbaden Gmbh | Laminated material and process for producing the same |
US6399885B1 (en) * | 1998-07-21 | 2002-06-04 | Paolo Agostinelli | Audio signal connection cable for recording and reproduction devices |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2744063A (en) * | 1951-12-11 | 1956-05-01 | Gen Motors Corp | Electrodeposition of tin-antimonycopper alloys |
US2774063A (en) * | 1954-02-05 | 1956-12-11 | Photocon Res Products | Sequential circuit control device |
US2950149A (en) * | 1957-01-29 | 1960-08-23 | John B Thomson | Relatively reciprocable shaft and bearing |
US3027269A (en) * | 1959-09-09 | 1962-03-27 | Yawata Iron & Steel Co | Process for coating ferrous metal with aluminum |
JPS60253115A (en) * | 1984-05-29 | 1985-12-13 | 古河電気工業株式会社 | Method of producing sn or sn alloy plating conductor |
CN1005852B (en) * | 1986-10-22 | 1989-11-22 | 北京市电信设备厂 | Multi-element lead alloy for cable sheathing and process for making the alloy |
JPH03229848A (en) * | 1990-02-05 | 1991-10-11 | Furukawa Electric Co Ltd:The | Manufacture of hot-dip metal coated wire |
US5491036A (en) * | 1992-03-27 | 1996-02-13 | The Louis Berkman Company | Coated strip |
JP2942458B2 (en) * | 1993-04-16 | 1999-08-30 | 住友電気工業株式会社 | Manufacturing method and manufacturing equipment for conductor for flat cable |
JP3353640B2 (en) * | 1997-04-16 | 2002-12-03 | 富士電機株式会社 | Solder alloy |
JPH11211143A (en) * | 1998-01-29 | 1999-08-06 | Matsushita Electric Ind Co Ltd | Power board for separate type air conditioner |
JP2000119602A (en) * | 1998-10-16 | 2000-04-25 | Tomoegawa Paper Co Ltd | Material for fixing fibrous coating for wire and method of fixing |
JP2000156450A (en) * | 1998-11-19 | 2000-06-06 | Hitachi Cable Ltd | Lead for electronic part |
JP3266242B2 (en) * | 1999-10-12 | 2002-03-18 | 理研電線株式会社 | Thermal oxidation yellowing prevention method for tin plated wire |
JP3445213B2 (en) * | 2000-02-16 | 2003-09-08 | 株式会社タムラ製作所 | Power transformer |
JP2001262391A (en) * | 2000-03-14 | 2001-09-26 | Ishihara Chem Co Ltd | Tin-copper based alloy plating bath and electronic parts having coating film formed with the same |
-
2002
- 2002-12-18 IT IT002672A patent/ITMI20022672A1/en unknown
-
2003
- 2003-12-17 JP JP2004560140A patent/JP4914009B2/en not_active Expired - Fee Related
- 2003-12-17 US US10/539,907 patent/US7501578B2/en not_active Expired - Fee Related
- 2003-12-17 DK DK03778694T patent/DK1581955T3/en active
- 2003-12-17 DE DE60325899T patent/DE60325899D1/en not_active Expired - Lifetime
- 2003-12-17 AU AU2003289662A patent/AU2003289662A1/en not_active Abandoned
- 2003-12-17 WO PCT/IB2003/006245 patent/WO2004055834A1/en active Application Filing
- 2003-12-17 AT AT03778694T patent/ATE421154T1/en active
- 2003-12-17 CN CNB2003801057308A patent/CN100401429C/en not_active Expired - Fee Related
- 2003-12-17 EP EP03778694A patent/EP1581955B1/en not_active Expired - Lifetime
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3692578A (en) * | 1969-11-13 | 1972-09-19 | Siemens Ag | Method of producing tin layers or tin alloy layers on copper or copper alloy wires by hot tin plating |
US4524241A (en) * | 1979-12-18 | 1985-06-18 | Thomson-Brandt | Insulated multiwire electric cable having protected solderable and non-heat-sealing conductors |
US4314230A (en) * | 1980-07-31 | 1982-02-02 | Raychem Corporation | Devices comprising conductive polymers |
DD220915A1 (en) * | 1984-01-20 | 1985-04-10 | Mansfeld Kom W Pieck Fi F Ne M | METHOD FOR THE PRODUCTION OF WIRE OF METAL ALLOYS WITH A SOLIDUSTEMPERATURE OF LESS THAN 600 K |
JPS6123737A (en) * | 1984-07-09 | 1986-02-01 | Nippon Mining Co Ltd | Copper alloy having superior heat resistance and electric conductivity |
JPS61154790A (en) * | 1984-12-27 | 1986-07-14 | Toshiba Corp | Wire for build-up welding of bearing metal |
JPS61190058A (en) * | 1985-02-19 | 1986-08-23 | Hitachi Cable Ltd | Hot dipping method |
EP0481493A2 (en) * | 1990-10-18 | 1992-04-22 | Sumitomo Electric Industries, Limited | Fuse Conductor |
US5939215A (en) * | 1994-11-26 | 1999-08-17 | Federal-Mogul Wiesbaden Gmbh | Laminated material and process for producing the same |
US6399885B1 (en) * | 1998-07-21 | 2002-06-04 | Paolo Agostinelli | Audio signal connection cable for recording and reproduction devices |
Non-Patent Citations (4)
Title |
---|
DATABASE CHEMABS [online] CHEMICAL ABSTRACTS SERVICE, COLUMBUS, OHIO, US; 7 March 1987 (1987-03-07), SAITO, KAZUO: "Hot-dip coating of strip or wire", retrieved from STN Database accession no. 1987:71682 * |
PATENT ABSTRACTS OF JAPAN vol. 0101, no. 72 (C - 354) 18 June 1986 (1986-06-18) * |
PATENT ABSTRACTS OF JAPAN vol. 0103, no. 57 (M - 540) 2 December 1986 (1986-12-02) * |
PATENT ABSTRACTS OF JAPAN vol. 0110, no. 13 (C - 397) 14 January 1987 (1987-01-14) * |
Also Published As
Publication number | Publication date |
---|---|
EP1581955A1 (en) | 2005-10-05 |
JP2006511041A (en) | 2006-03-30 |
US20060054347A1 (en) | 2006-03-16 |
DK1581955T3 (en) | 2009-05-11 |
DE60325899D1 (en) | 2009-03-05 |
ATE421154T1 (en) | 2009-01-15 |
CN1726564A (en) | 2006-01-25 |
AU2003289662A1 (en) | 2004-07-09 |
EP1581955B1 (en) | 2009-01-14 |
CN100401429C (en) | 2008-07-09 |
ITMI20022672A1 (en) | 2004-06-19 |
US7501578B2 (en) | 2009-03-10 |
JP4914009B2 (en) | 2012-04-11 |
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