WO2004055834A1 - Electric conductors - Google Patents

Electric conductors Download PDF

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Publication number
WO2004055834A1
WO2004055834A1 PCT/IB2003/006245 IB0306245W WO2004055834A1 WO 2004055834 A1 WO2004055834 A1 WO 2004055834A1 IB 0306245 W IB0306245 W IB 0306245W WO 2004055834 A1 WO2004055834 A1 WO 2004055834A1
Authority
WO
WIPO (PCT)
Prior art keywords
wire
copper
wire according
power supply
alloy
Prior art date
Application number
PCT/IB2003/006245
Other languages
French (fr)
Italian (it)
Inventor
Paolo Agostinelli
Original Assignee
St. Francis Of Assisi Foundation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St. Francis Of Assisi Foundation filed Critical St. Francis Of Assisi Foundation
Priority to DK03778694T priority Critical patent/DK1581955T3/en
Priority to US10/539,907 priority patent/US7501578B2/en
Priority to DE60325899T priority patent/DE60325899D1/en
Priority to EP03778694A priority patent/EP1581955B1/en
Priority to AU2003289662A priority patent/AU2003289662A1/en
Priority to JP2004560140A priority patent/JP4914009B2/en
Publication of WO2004055834A1 publication Critical patent/WO2004055834A1/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3468Applying molten solder
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/022Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/024Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08Tin or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/044Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coating With Molten Metal (AREA)
  • Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Valve Device For Special Equipments (AREA)
  • Glass Compositions (AREA)
  • Cable Accessories (AREA)

Abstract

Electric wires are described consisting of a metallic wire able to conduct the electric current, the outer surface of which is coated in an alloy consisting of specific metals in set quantities.

Description

ELECTRIC CONDUCTORS
Field of the invention
The present invention refers to the field of electric wires.
State of the art The transmission of small and variable electric signals, like audio signals for example, is proving to be a much more complex phenomenon than known to the state of the art since in transmission of the electric signals, phenomena occur that are audible to the listener although they cannot be identified instrumentally, such as timbre, spatiality and harshness of the sound. The distortion in high frequency or packing in medium audio frequency, caused by the copper used for the production of traditional electric wires, is audible and is immediately perceived by the silver wiring.
To overcome the above problem, the patent US 6,399,885 describes cables consisting of a number of wires, positioned in series or in parallel, each one made of a different metal (in particular gold, copper or silver), said wires being insulated from each other and wrapped in a dielectric sheath.
Despite the validity of these wires they are obviously difficult to implement at industrial level given the necessary presence of gold and the manufacturing problems they entail. Another solution consists in the application of filters or compensating networks in order to compensate for the various timbres or distortions produced by the metals of the components and wiring. The results are not completely satisfactory, however, and distortions remain which cannot be eliminated and which are perceived by the listener. Hence the importance of eliminating the above negative factors associated with pure metals in view of the fact that the use of silver alone produces a very clear non-distorted sound but is rather faint and decidedly too metallic.
Summary of the invention
It has surprisingly been found that it is possible to solve the problem in an entirely satisfactory manner by means of metal wires, on the surface of which an alloy is deposited consisting of appropriate metals in set percentages. Furthermore, it has been found that the wires as described and claimed in the present application not only perfectly solve the above-mentioned problem but also permit other applications in which the purity of transmission of the electric signal is essential for obtaining excellent final performance. Detailed description of the invention
The wires according to the invention consist of a normal metal wire able to conduct the current, for example a copper wire, the outer surface of which is covered in an alloy containing tin, antimony and copper.
Preferably the various metals constituting the alloy are present in the following concentrations:
Tin from 74% to 98.9%
Antimony from 1% to 10%
Copper from 0.1% to 25%
More preferably the alloy according to the invention consists of Tin 95%, Antimony 4%, Copper 1%.
Normally the qualities of the wire increase as the thickness of the alloy layer increases.
To obtain a wire according to the invention, the metallic wire is dipped in a bath consisting of the molten alloy. Obviously the time the wire is left in the bath will depend on the temperature of the bath, the type of metal constituting the wire and its dimensions in order to permit deposit of the alloy on the wire without the latter melting or being damaged by immersion for too long at an excessively high temperature.
If, for example, the wire is 0.40 mm in diameter, a bath with temperature between 300°C and 450°C is used, and the wire immersion time is approximately three seconds.
Before being dipped in the molten alloy bath, the metallic wire is preferably passed through a flux, of the type normally used in the welding of electrical material or in the manufacturing of electric circuits, for example rosin, and then left to dry; the flux improves adhesion of the molten alloy to the wire.
If preferred, before immersion in the alloy bath, the wire is pre-heated, for example to a temperature between 60° and 90°C. Examples of production of wires according to the invention are given below. Example 1
A copper wire, diameter 0.40 mm, is passed through rosin and left to dry; the wire is then pre-heated to 60° - 80°C. The wire is then dipped, at a speed of 3 m/min., in a crucible containing a molten alloy consisting of tin (95%), antimony (4%) and copper (1%) at a temperature of approximately 400°C; the immersion time is approximately 3 seconds. The wire, on which a layer of alloy is deposited, is then left to cool. Example 2 Example 1 is repeated using a 0.90 mm wire and dipping it at a speed of approximately 3.3 cm/sec, maintaining the alloy bath at a temperature of approximately 400°C.
Tests performed with wires produced according to the above examples show that the resolution increases considerably since in the audio or video field for example, the parameters linked to it increase: ambience, microcontrast and colour. The wires according to the invention are suitable for a very wide range of uses, not only as connection cables for low level signals but also for connection cables for power supply, for printed circuit tracks, for coupling, signal, impulse and power transformers, for dipole, array and microstrip antennae, for connectors for signals or power supply and for electromagnetic screens. In particular the invention refers to a power transformer, for electric distribution network, of analogue, digital and pulse signals and/or a coupling transformer, the windings of which are made of wires as described above.
Preferably the dielectric sheath used for the transformer according to the invention is made of black silk, preferably woven over the wire itself. In particular, said transformers permit increase of the dynamics in audio signals, reducing the power supply noise; they also permit increase of the microinformation and ambience and change of the timbre in both recording and reproduction systems; said phenomena are also obtained in coupling transformers. Using the power transformer with video systems, there was an increase in the colour and contrast and a reduction in noise. Transformers for digital signals produced with wires as described above have provided much better results than those produced with other wire materials in the above parameters.

Claims

1. Electric wire consisting of a metal able to conduct the current, the outer surface of which is covered in a layer of alloy containing tin, antimony and copper.
2. Wire according to claim 1 in which said alloy consists of: tin (74 - 98.9%), antimony ( 1 - 10%) and copper (0.1 - 10%), said quantities being expressed in weight.
3. Wire according to claim 2 in which said alloy consists of: tin (95%), antimony (4%) and copper (1%), said quantities being expressed in weight.
4. Wire according to claims 1 - 3 in which said wire is a metal wire able to conduct the current.
5. Wire according to claim 5 in which said metal wire is a copper wire.
6. Process for the preparation of a wire according to claims 1 - 5 in which the wire is passed through a flux and left to dry, pre-heated and then dipped in a bath consisting of the molten alloy.
7. Use of a wire according to claims 1 - 5 for the production of connection cables for low level signals, connection cables for power supply, printed circuit tracks and coupling, signal, pulse and power transformers, dipole, array and microstrip antennae, connectors for signals or power supply and for electromagnetic screens.
8. Connection cables for low level signals, connection cables for power supply, printed circuit tracks, coupling, signal, pulse and power transformers, dipole, array and microstrip antennae, connectors for signals or power supply and for electromagnetic screens.
9. Power transformer for electric distribution network, the windings of which are made of a wire according to claims 1 - 5.
10. Transformer according to claim 7 in which the dielectric sheath is made of black silk, woven over the wire itself.
PCT/IB2003/006245 2002-12-18 2003-12-17 Electric conductors WO2004055834A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DK03778694T DK1581955T3 (en) 2002-12-18 2003-12-17 Electrical conductors
US10/539,907 US7501578B2 (en) 2002-12-18 2003-12-17 Electric conductors
DE60325899T DE60325899D1 (en) 2002-12-18 2003-12-17 ELECTRIC HEAD
EP03778694A EP1581955B1 (en) 2002-12-18 2003-12-17 Electric conductors
AU2003289662A AU2003289662A1 (en) 2002-12-18 2003-12-17 Electric conductors
JP2004560140A JP4914009B2 (en) 2002-12-18 2003-12-17 Electrical conductor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITMI2002A002672 2002-12-18
IT002672A ITMI20022672A1 (en) 2002-12-18 2002-12-18 ELECTRIC CONDUCTORS.

Publications (1)

Publication Number Publication Date
WO2004055834A1 true WO2004055834A1 (en) 2004-07-01

Family

ID=32587869

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2003/006245 WO2004055834A1 (en) 2002-12-18 2003-12-17 Electric conductors

Country Status (10)

Country Link
US (1) US7501578B2 (en)
EP (1) EP1581955B1 (en)
JP (1) JP4914009B2 (en)
CN (1) CN100401429C (en)
AT (1) ATE421154T1 (en)
AU (1) AU2003289662A1 (en)
DE (1) DE60325899D1 (en)
DK (1) DK1581955T3 (en)
IT (1) ITMI20022672A1 (en)
WO (1) WO2004055834A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3015762B1 (en) * 2013-12-19 2017-12-15 Nexans OXIDATION RESISTANT ELECTRICALLY CONDUCTIVE ELECTRICALLY CONDUCTIVE ELEMENT

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3692578A (en) * 1969-11-13 1972-09-19 Siemens Ag Method of producing tin layers or tin alloy layers on copper or copper alloy wires by hot tin plating
US4314230A (en) * 1980-07-31 1982-02-02 Raychem Corporation Devices comprising conductive polymers
DD220915A1 (en) * 1984-01-20 1985-04-10 Mansfeld Kom W Pieck Fi F Ne M METHOD FOR THE PRODUCTION OF WIRE OF METAL ALLOYS WITH A SOLIDUSTEMPERATURE OF LESS THAN 600 K
US4524241A (en) * 1979-12-18 1985-06-18 Thomson-Brandt Insulated multiwire electric cable having protected solderable and non-heat-sealing conductors
JPS6123737A (en) * 1984-07-09 1986-02-01 Nippon Mining Co Ltd Copper alloy having superior heat resistance and electric conductivity
JPS61154790A (en) * 1984-12-27 1986-07-14 Toshiba Corp Wire for build-up welding of bearing metal
JPS61190058A (en) * 1985-02-19 1986-08-23 Hitachi Cable Ltd Hot dipping method
EP0481493A2 (en) * 1990-10-18 1992-04-22 Sumitomo Electric Industries, Limited Fuse Conductor
US5939215A (en) * 1994-11-26 1999-08-17 Federal-Mogul Wiesbaden Gmbh Laminated material and process for producing the same
US6399885B1 (en) * 1998-07-21 2002-06-04 Paolo Agostinelli Audio signal connection cable for recording and reproduction devices

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Publication number Priority date Publication date Assignee Title
US3692578A (en) * 1969-11-13 1972-09-19 Siemens Ag Method of producing tin layers or tin alloy layers on copper or copper alloy wires by hot tin plating
US4524241A (en) * 1979-12-18 1985-06-18 Thomson-Brandt Insulated multiwire electric cable having protected solderable and non-heat-sealing conductors
US4314230A (en) * 1980-07-31 1982-02-02 Raychem Corporation Devices comprising conductive polymers
DD220915A1 (en) * 1984-01-20 1985-04-10 Mansfeld Kom W Pieck Fi F Ne M METHOD FOR THE PRODUCTION OF WIRE OF METAL ALLOYS WITH A SOLIDUSTEMPERATURE OF LESS THAN 600 K
JPS6123737A (en) * 1984-07-09 1986-02-01 Nippon Mining Co Ltd Copper alloy having superior heat resistance and electric conductivity
JPS61154790A (en) * 1984-12-27 1986-07-14 Toshiba Corp Wire for build-up welding of bearing metal
JPS61190058A (en) * 1985-02-19 1986-08-23 Hitachi Cable Ltd Hot dipping method
EP0481493A2 (en) * 1990-10-18 1992-04-22 Sumitomo Electric Industries, Limited Fuse Conductor
US5939215A (en) * 1994-11-26 1999-08-17 Federal-Mogul Wiesbaden Gmbh Laminated material and process for producing the same
US6399885B1 (en) * 1998-07-21 2002-06-04 Paolo Agostinelli Audio signal connection cable for recording and reproduction devices

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Also Published As

Publication number Publication date
EP1581955A1 (en) 2005-10-05
JP2006511041A (en) 2006-03-30
US20060054347A1 (en) 2006-03-16
DK1581955T3 (en) 2009-05-11
DE60325899D1 (en) 2009-03-05
ATE421154T1 (en) 2009-01-15
CN1726564A (en) 2006-01-25
AU2003289662A1 (en) 2004-07-09
EP1581955B1 (en) 2009-01-14
CN100401429C (en) 2008-07-09
ITMI20022672A1 (en) 2004-06-19
US7501578B2 (en) 2009-03-10
JP4914009B2 (en) 2012-04-11

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