WO2004064198A8 - Cover for ball-grid array connector - Google Patents
Cover for ball-grid array connectorInfo
- Publication number
- WO2004064198A8 WO2004064198A8 PCT/US2004/000516 US2004000516W WO2004064198A8 WO 2004064198 A8 WO2004064198 A8 WO 2004064198A8 US 2004000516 W US2004000516 W US 2004000516W WO 2004064198 A8 WO2004064198 A8 WO 2004064198A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ball
- cover
- grid array
- array connector
- housing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04701244A EP1586224A4 (en) | 2003-01-10 | 2004-01-09 | Cover for ball-grid array connector |
JP2006500877A JP4755079B2 (en) | 2003-01-10 | 2004-01-09 | Kit for installing the ball grid array connector on the board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/340,279 US6900389B2 (en) | 2003-01-10 | 2003-01-10 | Cover for ball-grid array connector |
US10/340,279 | 2003-01-10 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2004064198A2 WO2004064198A2 (en) | 2004-07-29 |
WO2004064198A3 WO2004064198A3 (en) | 2005-04-07 |
WO2004064198A8 true WO2004064198A8 (en) | 2005-08-25 |
Family
ID=32711291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/000516 WO2004064198A2 (en) | 2003-01-10 | 2004-01-09 | Cover for ball-grid array connector |
Country Status (7)
Country | Link |
---|---|
US (2) | US6900389B2 (en) |
EP (1) | EP1586224A4 (en) |
JP (2) | JP4755079B2 (en) |
KR (1) | KR20050097935A (en) |
CN (1) | CN100493304C (en) |
TW (1) | TWI246803B (en) |
WO (1) | WO2004064198A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7037121B1 (en) * | 2003-10-07 | 2006-05-02 | Maxtor Corporation | Printed circuit board assembly with power cover |
US20130101659A1 (en) * | 2009-11-13 | 2013-04-25 | Yoshiki Sawa | Cell sheet for myocardial regeneration, method of producing the same, and method of using the same |
US11205867B2 (en) | 2017-09-15 | 2021-12-21 | Molex, Llc | Grid array connector system |
TWI695550B (en) | 2017-09-15 | 2020-06-01 | 美商莫仕有限公司 | Grid array connector system |
CN111566531B (en) | 2017-11-14 | 2023-01-24 | 申泰公司 | Data communication system |
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-
2003
- 2003-01-10 US US10/340,279 patent/US6900389B2/en not_active Expired - Fee Related
- 2003-12-31 TW TW092137654A patent/TWI246803B/en not_active IP Right Cessation
-
2004
- 2004-01-09 JP JP2006500877A patent/JP4755079B2/en not_active Expired - Lifetime
- 2004-01-09 KR KR1020057012769A patent/KR20050097935A/en not_active Application Discontinuation
- 2004-01-09 CN CNB2004800019712A patent/CN100493304C/en not_active Expired - Fee Related
- 2004-01-09 WO PCT/US2004/000516 patent/WO2004064198A2/en active Application Filing
- 2004-01-09 EP EP04701244A patent/EP1586224A4/en not_active Withdrawn
-
2005
- 2005-03-09 US US11/075,457 patent/US7320426B2/en not_active Expired - Fee Related
- 2005-09-26 JP JP2005277926A patent/JP4481910B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006516064A (en) | 2006-06-15 |
JP4481910B2 (en) | 2010-06-16 |
JP2006093153A (en) | 2006-04-06 |
KR20050097935A (en) | 2005-10-10 |
US7320426B2 (en) | 2008-01-22 |
EP1586224A2 (en) | 2005-10-19 |
US20050159032A1 (en) | 2005-07-21 |
CN1802886A (en) | 2006-07-12 |
WO2004064198A3 (en) | 2005-04-07 |
US20040134676A1 (en) | 2004-07-15 |
TW200428711A (en) | 2004-12-16 |
TWI246803B (en) | 2006-01-01 |
WO2004064198A2 (en) | 2004-07-29 |
EP1586224A4 (en) | 2009-04-29 |
JP4755079B2 (en) | 2011-08-24 |
CN100493304C (en) | 2009-05-27 |
US6900389B2 (en) | 2005-05-31 |
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Free format text: IN PCT GAZETTE 31/2004 UNDER (71) REPLACE "APPLICANT FOR (BR, CA, MX, US ONLY): FCI [FR/FR]; 145/147 RUE YVES LE COZE , 78000 VERSAILLES (FR)." BY "APPLICANT FOR (ALL DESIGNATED STATES EXCEPT BR, CA, MX, US): FCI [FR/FR]; 145/147 RUE YVES LE COZE , 78000 VERSAILLES (FR)." |
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