WO2004070776A3 - Methods for transferring supercritical fluids in microelectronic and other industrial processes - Google Patents
Methods for transferring supercritical fluids in microelectronic and other industrial processes Download PDFInfo
- Publication number
- WO2004070776A3 WO2004070776A3 PCT/US2003/040155 US0340155W WO2004070776A3 WO 2004070776 A3 WO2004070776 A3 WO 2004070776A3 US 0340155 W US0340155 W US 0340155W WO 2004070776 A3 WO2004070776 A3 WO 2004070776A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fluid
- supercritical fluid
- microelectronic
- methods
- pressure
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02101—Cleaning only involving supercritical fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2401/00—Form of the coating product, e.g. solution, water dispersion, powders or the like
- B05D2401/90—Form of the coating product, e.g. solution, water dispersion, powders or the like at least one component of the composition being in supercritical state or close to supercritical state
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03799942A EP1590307A4 (en) | 2003-01-27 | 2003-12-08 | Methods for transferring supercritical fluids in microelectronic and other industrial processes |
AU2003299658A AU2003299658A1 (en) | 2003-01-27 | 2003-12-08 | Methods for transferring supercritical fluids in microelectronic and other industrial processes |
JP2004568030A JP2006513582A (en) | 2003-01-27 | 2003-12-08 | Supercritical fluid transfer method in microelectronics and other industrial processes |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US44286703P | 2003-01-27 | 2003-01-27 | |
US60/442,867 | 2003-01-27 | ||
US10/448,474 | 2003-05-30 | ||
US10/448,474 US6905555B2 (en) | 2001-02-15 | 2003-05-30 | Methods for transferring supercritical fluids in microelectronic and other industrial processes |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004070776A2 WO2004070776A2 (en) | 2004-08-19 |
WO2004070776A3 true WO2004070776A3 (en) | 2005-01-20 |
Family
ID=32853325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/040155 WO2004070776A2 (en) | 2003-01-27 | 2003-12-08 | Methods for transferring supercritical fluids in microelectronic and other industrial processes |
Country Status (6)
Country | Link |
---|---|
US (1) | US6905555B2 (en) |
EP (1) | EP1590307A4 (en) |
JP (1) | JP2006513582A (en) |
KR (1) | KR20050097514A (en) |
AU (1) | AU2003299658A1 (en) |
WO (1) | WO2004070776A2 (en) |
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WO2003064065A1 (en) * | 2002-01-25 | 2003-08-07 | Supercritical Systems Inc. | Method for reducing the formation of contaminants during supercritical carbon dioxide processes |
US6924086B1 (en) * | 2002-02-15 | 2005-08-02 | Tokyo Electron Limited | Developing photoresist with supercritical fluid and developer |
US7387868B2 (en) * | 2002-03-04 | 2008-06-17 | Tokyo Electron Limited | Treatment of a dielectric layer using supercritical CO2 |
CN1642665A (en) * | 2002-03-22 | 2005-07-20 | 东京毅力科创株式会社 | Removal of contaminants using supercritical processing |
EP1442802A1 (en) * | 2003-01-28 | 2004-08-04 | Linde Aktiengesellschaft | Cleaning with liquid carbon dioxide |
US20040231707A1 (en) * | 2003-05-20 | 2004-11-25 | Paul Schilling | Decontamination of supercritical wafer processing equipment |
US20050288485A1 (en) * | 2004-06-24 | 2005-12-29 | Mahl Jerry M | Method and apparatus for pretreatment of polymeric materials utilized in carbon dioxide purification, delivery and storage systems |
DE102004037902A1 (en) * | 2004-08-05 | 2006-03-16 | Robert Bosch Gmbh | Method for depositing an anti-adhesion layer |
US20060081273A1 (en) * | 2004-10-20 | 2006-04-20 | Mcdermott Wayne T | Dense fluid compositions and processes using same for article treatment and residue removal |
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US7550075B2 (en) * | 2005-03-23 | 2009-06-23 | Tokyo Electron Ltd. | Removal of contaminants from a fluid |
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US20060226117A1 (en) * | 2005-03-29 | 2006-10-12 | Bertram Ronald T | Phase change based heating element system and method |
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US20070000519A1 (en) * | 2005-06-30 | 2007-01-04 | Gunilla Jacobson | Removal of residues for low-k dielectric materials in wafer processing |
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KR102521416B1 (en) * | 2017-05-24 | 2023-04-14 | 도쿄엘렉트론가부시키가이샤 | Substrate processing apparatus and substrate processing method |
KR102134261B1 (en) * | 2018-10-25 | 2020-07-16 | 세메스 주식회사 | Apparatus and method for processing substrate |
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KR102378329B1 (en) * | 2019-10-07 | 2022-03-25 | 세메스 주식회사 | Apparatus and method for treating substrate |
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US6562146B1 (en) * | 2001-02-15 | 2003-05-13 | Micell Technologies, Inc. | Processes for cleaning and drying microelectronic structures using liquid or supercritical carbon dioxide |
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-
2003
- 2003-05-30 US US10/448,474 patent/US6905555B2/en not_active Expired - Fee Related
- 2003-12-08 EP EP03799942A patent/EP1590307A4/en not_active Withdrawn
- 2003-12-08 JP JP2004568030A patent/JP2006513582A/en active Pending
- 2003-12-08 WO PCT/US2003/040155 patent/WO2004070776A2/en active Application Filing
- 2003-12-08 AU AU2003299658A patent/AU2003299658A1/en not_active Abandoned
- 2003-12-08 KR KR1020057013683A patent/KR20050097514A/en not_active Application Discontinuation
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US6670402B1 (en) * | 1999-10-21 | 2003-12-30 | Aspen Aerogels, Inc. | Rapid aerogel production process |
US6562146B1 (en) * | 2001-02-15 | 2003-05-13 | Micell Technologies, Inc. | Processes for cleaning and drying microelectronic structures using liquid or supercritical carbon dioxide |
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Non-Patent Citations (1)
Title |
---|
See also references of EP1590307A4 * |
Also Published As
Publication number | Publication date |
---|---|
US6905555B2 (en) | 2005-06-14 |
EP1590307A2 (en) | 2005-11-02 |
US20040020518A1 (en) | 2004-02-05 |
JP2006513582A (en) | 2006-04-20 |
KR20050097514A (en) | 2005-10-07 |
AU2003299658A8 (en) | 2004-08-30 |
AU2003299658A1 (en) | 2004-08-30 |
EP1590307A4 (en) | 2010-09-22 |
WO2004070776A2 (en) | 2004-08-19 |
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