WO2004079294A3 - Characterizing and profiling complex surface structures using scanning interferometry - Google Patents

Characterizing and profiling complex surface structures using scanning interferometry Download PDF

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Publication number
WO2004079294A3
WO2004079294A3 PCT/US2004/007014 US2004007014W WO2004079294A3 WO 2004079294 A3 WO2004079294 A3 WO 2004079294A3 US 2004007014 W US2004007014 W US 2004007014W WO 2004079294 A3 WO2004079294 A3 WO 2004079294A3
Authority
WO
WIPO (PCT)
Prior art keywords
scanning interferometry
models
characterizing
surface structures
test object
Prior art date
Application number
PCT/US2004/007014
Other languages
French (fr)
Other versions
WO2004079294A2 (en
Inventor
Groot Peter J De
Robert Stoner
Lega Xavier Colonna De
Original Assignee
Zygo Corp
Groot Peter J De
Robert Stoner
Lega Xavier Colonna De
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zygo Corp, Groot Peter J De, Robert Stoner, Lega Xavier Colonna De filed Critical Zygo Corp
Priority to KR1020057016623A priority Critical patent/KR101169293B1/en
Priority to CN2004800123237A priority patent/CN1784588B/en
Priority to JP2006506943A priority patent/JP4791354B2/en
Priority to EP04718562.4A priority patent/EP1604169B1/en
Publication of WO2004079294A2 publication Critical patent/WO2004079294A2/en
Publication of WO2004079294A3 publication Critical patent/WO2004079294A3/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02001—Interferometers characterised by controlling or generating intrinsic radiation properties
    • G01B9/0201—Interferometers characterised by controlling or generating intrinsic radiation properties using temporal phase variation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02055—Reduction or prevention of errors; Testing; Calibration
    • G01B9/02056—Passive reduction of errors
    • G01B9/02057—Passive reduction of errors by using common path configuration, i.e. reference and object path almost entirely overlapping
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02083—Interferometers characterised by particular signal processing and presentation
    • G01B9/02084—Processing in the Fourier or frequency domain when not imaged in the frequency domain
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02083—Interferometers characterised by particular signal processing and presentation
    • G01B9/02088—Matching signals with a database
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/0209—Low-coherence interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2290/00—Aspects of interferometers not specifically covered by any group under G01B9/02
    • G01B2290/70—Using polarization in the interferometer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Mathematical Physics (AREA)
  • Databases & Information Systems (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

A method including comparing information derivable from a scanning interferometry signal for a first surface location of a test object to information corresponding to multiple models of the test objects, wherein the multiple models are parametrized by a series of characteristics for the test object. The information corresponding to the multiple models may include information about at least one amplitude component of a transform (eg. A Fourier transform) of a scanning interferometry signal corresponding to each of the models of the test object. In a second aspect the models correspond to a fixed surface height and they are parametrized by a series of characteristics different from the fixed surface height. In a third aspect the comparing comprises accounting for systematic contributions to the interferometry signal.
PCT/US2004/007014 2003-03-06 2004-03-08 Characterizing and profiling complex surface structures using scanning interferometry WO2004079294A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020057016623A KR101169293B1 (en) 2003-03-06 2004-03-08 Profiling complex surface structures using scanning interferometry
CN2004800123237A CN1784588B (en) 2003-03-06 2004-03-08 Characterizing and profiling complex surface structures using scanning interferometry
JP2006506943A JP4791354B2 (en) 2003-03-06 2004-03-08 Profiling complex surface structures using scanning interferometry
EP04718562.4A EP1604169B1 (en) 2003-03-06 2004-03-08 Method for profiling complex surface structures using scanning interferometry

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45261503P 2003-03-06 2003-03-06
US60/452,615 2003-03-06

Publications (2)

Publication Number Publication Date
WO2004079294A2 WO2004079294A2 (en) 2004-09-16
WO2004079294A3 true WO2004079294A3 (en) 2005-05-19

Family

ID=32962738

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/007014 WO2004079294A2 (en) 2003-03-06 2004-03-08 Characterizing and profiling complex surface structures using scanning interferometry

Country Status (4)

Country Link
JP (3) JP4791354B2 (en)
KR (1) KR101169293B1 (en)
CN (1) CN1784588B (en)
WO (1) WO2004079294A2 (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
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US7324214B2 (en) * 2003-03-06 2008-01-29 Zygo Corporation Interferometer and method for measuring characteristics of optically unresolved surface features
GB0415766D0 (en) * 2004-07-14 2004-08-18 Taylor Hobson Ltd Apparatus for and a method of determining a characteristic of a layer or layers
US7428057B2 (en) * 2005-01-20 2008-09-23 Zygo Corporation Interferometer for determining characteristics of an object surface, including processing and calibration
GB0502677D0 (en) 2005-02-09 2005-03-16 Taylor Hobson Ltd Apparatus for and a method of determining a surface characteristic
JP2009516171A (en) * 2005-11-15 2009-04-16 ザイゴ コーポレーション Interferometer and method for measuring properties of optically unprocessed surface features
DE102006007573B4 (en) * 2006-02-18 2009-08-13 Carl Mahr Holding Gmbh Method and device for 3D geometry detection of object surfaces
US7916927B2 (en) * 2007-01-16 2011-03-29 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
EP2232195B1 (en) * 2007-12-14 2015-03-18 Zygo Corporation Analyzing surface structure using scanning interferometry
JP4940122B2 (en) * 2007-12-21 2012-05-30 株式会社日立製作所 Method and apparatus for inspecting patterns on hard disk media
JP5302631B2 (en) * 2008-11-08 2013-10-02 株式会社堀場製作所 Optical measuring apparatus, program, and measuring method
CN102414537B (en) * 2010-01-06 2015-03-04 松下电器产业株式会社 Film thickness measuring apparatus using interference and method of measuring film thickness using interference
EP2482031A1 (en) * 2011-01-26 2012-08-01 Mitutoyo Research Center Europe B.V. Method and apparatus for performing film thickness measurements using white light scanning interferometry
EP2541193A1 (en) 2011-06-27 2013-01-02 Hexagon Technology Center GmbH Interferometric distance measuring method for measuring surfaces and corresponding measuring apparatus
CN104797961B (en) * 2012-11-21 2018-02-02 3M创新有限公司 Optical diffusion and preparation method thereof
JP6186215B2 (en) * 2013-09-04 2017-08-23 株式会社日立エルジーデータストレージ Optical measuring device and optical tomographic observation method
EP3397949B1 (en) * 2015-12-31 2022-05-18 Zygo Corporation Method and apparatus for optimizing the optical performance of interferometers
CN110836633B (en) * 2016-11-18 2022-06-14 齐戈股份有限公司 Method and apparatus for optimizing optical performance of interferometer
CN108169175B (en) * 2016-12-08 2022-07-26 松下知识产权经营株式会社 Optical detection system
CN108168715B (en) * 2016-12-08 2021-02-19 松下知识产权经营株式会社 Optical detection device
FR3089286B1 (en) * 2018-11-30 2022-04-01 Unity Semiconductor Method and system for measuring a surface of an object comprising different structures by low coherence interferometry
JP7358185B2 (en) 2019-10-15 2023-10-10 株式会社ディスコ Thickness measurement device and processing equipment equipped with thickness measurement device
CN111386441B (en) 2020-02-24 2021-02-19 长江存储科技有限责任公司 System for measuring surface topography of semiconductor chip
WO2021168613A1 (en) 2020-02-24 2021-09-02 Yangtze Memory Technologies Co., Ltd. Systems and methods for semiconductor chip surface topography metrology
CN111406198B (en) 2020-02-24 2021-02-19 长江存储科技有限责任公司 System and method for semiconductor chip surface topography metrology
WO2021168611A1 (en) 2020-02-24 2021-09-02 Yangtze Memory Technologies Co., Ltd. Systems and methods for semiconductor chip surface topography metrology
CN112066909B (en) * 2020-08-24 2022-04-08 南京理工大学 Anti-vibration interference measurement method based on inclined plane high-precision extraction
CN113405486B (en) * 2021-05-26 2022-06-21 天津大学 Film morphology detection system and method based on white light interference time-frequency domain analysis
CN113639661B (en) * 2021-08-11 2022-10-14 中国科学院长春光学精密机械与物理研究所 Morphology detection system and morphology detection method
CN114910015A (en) * 2022-04-29 2022-08-16 深圳市中图仪器股份有限公司 Reconstruction method of white light interference signal
CN114910016B (en) * 2022-04-29 2024-04-12 深圳市中图仪器股份有限公司 White light interference signal reconstruction device
CN116625275B (en) * 2023-03-31 2024-02-13 东莞理工学院 Ultra-thin multi-layer graph micro-nano structure three-dimensional reconstruction method based on light field information fusion

Citations (5)

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US5398113A (en) * 1993-02-08 1995-03-14 Zygo Corporation Method and apparatus for surface topography measurement by spatial-frequency analysis of interferograms
US5587792A (en) * 1993-06-21 1996-12-24 Nishizawa; Seiji Apparatus and method for measuring thickness of thin semiconductor multi-layer film
US5900633A (en) * 1997-12-15 1999-05-04 On-Line Technologies, Inc Spectrometric method for analysis of film thickness and composition on a patterned sample
EP0929094A2 (en) * 1998-01-07 1999-07-14 International Business Machines Corporation Method and device for measuring the depth of a buried interface
US6242739B1 (en) * 1998-04-21 2001-06-05 Alexander P. Cherkassky Method and apparatus for non-destructive determination of film thickness and dopant concentration using fourier transform infrared spectrometry

Family Cites Families (1)

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GB9213159D0 (en) * 1992-06-22 1992-08-05 British Tech Group Method of and apparatus for interferometrically inspecting a surface of an object

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5398113A (en) * 1993-02-08 1995-03-14 Zygo Corporation Method and apparatus for surface topography measurement by spatial-frequency analysis of interferograms
US5587792A (en) * 1993-06-21 1996-12-24 Nishizawa; Seiji Apparatus and method for measuring thickness of thin semiconductor multi-layer film
US5900633A (en) * 1997-12-15 1999-05-04 On-Line Technologies, Inc Spectrometric method for analysis of film thickness and composition on a patterned sample
EP0929094A2 (en) * 1998-01-07 1999-07-14 International Business Machines Corporation Method and device for measuring the depth of a buried interface
US6242739B1 (en) * 1998-04-21 2001-06-05 Alexander P. Cherkassky Method and apparatus for non-destructive determination of film thickness and dopant concentration using fourier transform infrared spectrometry

Also Published As

Publication number Publication date
JP4791354B2 (en) 2011-10-12
KR101169293B1 (en) 2012-07-30
JP2011169920A (en) 2011-09-01
KR20050116372A (en) 2005-12-12
WO2004079294A2 (en) 2004-09-16
JP2010133976A (en) 2010-06-17
CN1784588A (en) 2006-06-07
CN1784588B (en) 2011-07-13
JP5443209B2 (en) 2014-03-19
JP2006519992A (en) 2006-08-31

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