WO2004088570A3 - Chip attachment in an rfid tag - Google Patents

Chip attachment in an rfid tag Download PDF

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Publication number
WO2004088570A3
WO2004088570A3 PCT/US2004/009050 US2004009050W WO2004088570A3 WO 2004088570 A3 WO2004088570 A3 WO 2004088570A3 US 2004009050 W US2004009050 W US 2004009050W WO 2004088570 A3 WO2004088570 A3 WO 2004088570A3
Authority
WO
WIPO (PCT)
Prior art keywords
disclosed
rfid tag
attachment
chip attachment
multiple die
Prior art date
Application number
PCT/US2004/009050
Other languages
French (fr)
Other versions
WO2004088570A2 (en
Inventor
Bruce B Roesner
Original Assignee
Bella Id Solutions Inc
Bruce B Roesner
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bella Id Solutions Inc, Bruce B Roesner filed Critical Bella Id Solutions Inc
Priority to EP04758282A priority Critical patent/EP1611606A2/en
Publication of WO2004088570A2 publication Critical patent/WO2004088570A2/en
Publication of WO2004088570A3 publication Critical patent/WO2004088570A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
    • H—ELECTRICITY
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
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    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
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    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
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    • H01L2924/30—Technical effects
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    • H01L2924/30105—Capacitance

Abstract

A system and method for attaching an RFID chip to a conductive pattern is disclosed. According to the invention, multiple die are aligned with respective multiple conductive modules for structural and electrical attachment. As disclosed, the multiple die can be attached near simultaneously and without the need for intermediate handling. Therefore, substantial cost benefits are realized. Also disclosed is a method of making electrical connections employing the use of a laser. A photosensitive adhesive material is used to structurally secure the attachment.
PCT/US2004/009050 2003-03-25 2004-03-24 Chip attachment in an rfid tag WO2004088570A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP04758282A EP1611606A2 (en) 2003-03-25 2004-03-24 Chip attachment in an rfid tag

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/396,932 2003-03-25
US10/396,932 US6982190B2 (en) 2003-03-25 2003-03-25 Chip attachment in an RFID tag

Publications (2)

Publication Number Publication Date
WO2004088570A2 WO2004088570A2 (en) 2004-10-14
WO2004088570A3 true WO2004088570A3 (en) 2005-06-09

Family

ID=32988894

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/009050 WO2004088570A2 (en) 2003-03-25 2004-03-24 Chip attachment in an rfid tag

Country Status (5)

Country Link
US (1) US6982190B2 (en)
EP (1) EP1611606A2 (en)
JP (1) JP2004297066A (en)
TW (1) TWI239575B (en)
WO (1) WO2004088570A2 (en)

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US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
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US7479614B2 (en) * 2004-01-12 2009-01-20 Symbol Technologies Radio frequency identification tag inlay sortation and assembly
US7158408B2 (en) * 2004-02-25 2007-01-02 Id Solutions, Inc. Current source control in RFID memory
DE102004015994B9 (en) * 2004-04-01 2006-09-07 Mühlbauer Ag Device for separating and positioning module bridges
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
WO2006059732A1 (en) * 2004-12-03 2006-06-08 Hallys Corporation Interposer bonding device
EP1833290A4 (en) * 2004-12-03 2009-11-11 Hallys Corp Electronic component production method and electronic component production equipment
US7307528B2 (en) * 2004-12-15 2007-12-11 Impinj, Inc. RFID tag design with circuitry for wafer level testing
US7312622B2 (en) * 2004-12-15 2007-12-25 Impinj, Inc. Wafer level testing for RFID tags
US7380190B2 (en) * 2004-12-15 2008-05-27 Impinj, Inc. RFID tag with bist circuits
US7528724B2 (en) * 2005-02-28 2009-05-05 Impinj, Inc. On die RFID tag antenna
US7400255B2 (en) 2005-02-28 2008-07-15 Impinj, Inc. Wireless functional testing of RFID tag
EP1876877B1 (en) 2005-04-06 2010-08-25 Hallys Corporation Electronic component manufacturing apparatus
US20090166431A1 (en) * 2005-04-18 2009-07-02 Hallys Corporation Electronic component and manufacturing method thereof
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
US7364983B2 (en) * 2005-05-04 2008-04-29 Avery Dennison Corporation Method and apparatus for creating RFID devices
US20060264006A1 (en) * 2005-05-19 2006-11-23 Avery Dennison Corporation Method and apparatus for RFID device assembly
US7534320B2 (en) * 2005-11-15 2009-05-19 Northrop Grumman Corporation Lamination press pad
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
DE502007001359D1 (en) * 2006-03-17 2009-10-01 Polyic Gmbh & Co Kg Method for producing an active or passive electronic component and electronic component
KR20080069765A (en) * 2007-01-24 2008-07-29 엘지이노텍 주식회사 Manufacturing method for fluorescent material and light emitting diode using thereof
JP4952280B2 (en) * 2007-02-09 2012-06-13 富士通株式会社 Electronic device manufacturing system and electronic device manufacturing method
US20080241991A1 (en) * 2007-03-26 2008-10-02 National Semiconductor Corporation Gang flipping for flip-chip packaging
KR100921567B1 (en) 2007-09-03 2009-10-12 주식회사 엘티에스 Rfid tag in-line manufacturing system and method using a laser
ES2386614T3 (en) * 2010-02-06 2012-08-23 Textilma Ag Mounting device for applying an RFID chip module on a substrate, especially a label
FR3033080B1 (en) * 2015-02-20 2018-02-02 Jean Pierre FOUCAULT METHOD FOR MANUFACTURING DIELECTRIC BRIDGES (ENGLISH STRAPS) WITHOUT CONTACTING IDENTIFICATION
US11443160B2 (en) 2019-09-18 2022-09-13 Sensormatic Electronics, LLC Systems and methods for laser tuning and attaching RFID tags to products
US10970613B1 (en) 2019-09-18 2021-04-06 Sensormatic Electronics, LLC Systems and methods for providing tags adapted to be incorporated with or in items
US11055588B2 (en) 2019-11-27 2021-07-06 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
US11755874B2 (en) 2021-03-03 2023-09-12 Sensormatic Electronics, LLC Methods and systems for heat applied sensor tag
US11869324B2 (en) 2021-12-23 2024-01-09 Sensormatic Electronics, LLC Securing a security tag into an article

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US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
US3868764A (en) * 1973-11-09 1975-03-04 Gen Motors Corp Multiple magnetic alignment of semiconductor devices for bonding
US5897337A (en) * 1994-09-30 1999-04-27 Nec Corporation Process for adhesively bonding a semiconductor chip to a carrier film

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US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
US3722072A (en) * 1971-11-15 1973-03-27 Signetics Corp Alignment and bonding method for semiconductor components
US3868764A (en) * 1973-11-09 1975-03-04 Gen Motors Corp Multiple magnetic alignment of semiconductor devices for bonding
US5897337A (en) * 1994-09-30 1999-04-27 Nec Corporation Process for adhesively bonding a semiconductor chip to a carrier film

Also Published As

Publication number Publication date
US20040192011A1 (en) 2004-09-30
TW200419681A (en) 2004-10-01
JP2004297066A (en) 2004-10-21
TWI239575B (en) 2005-09-11
EP1611606A2 (en) 2006-01-04
WO2004088570A2 (en) 2004-10-14
US6982190B2 (en) 2006-01-03

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