WO2004090502A3 - Whole-substrate spectral imaging system for cmp - Google Patents

Whole-substrate spectral imaging system for cmp Download PDF

Info

Publication number
WO2004090502A3
WO2004090502A3 PCT/US2004/010326 US2004010326W WO2004090502A3 WO 2004090502 A3 WO2004090502 A3 WO 2004090502A3 US 2004010326 W US2004010326 W US 2004010326W WO 2004090502 A3 WO2004090502 A3 WO 2004090502A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
cmp
whole
imaging system
spectral imaging
Prior art date
Application number
PCT/US2004/010326
Other languages
French (fr)
Other versions
WO2004090502A2 (en
Inventor
Scott A Chalmers
Randall S Geels
Thomas F A Bibby
Original Assignee
Filmetrics Inc
Scott A Chalmers
Randall S Geels
Thomas F A Bibby
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Filmetrics Inc, Scott A Chalmers, Randall S Geels, Thomas F A Bibby filed Critical Filmetrics Inc
Priority to JP2006509672A priority Critical patent/JP2006522493A/en
Priority to EP04758852A priority patent/EP1622743A4/en
Publication of WO2004090502A2 publication Critical patent/WO2004090502A2/en
Publication of WO2004090502A3 publication Critical patent/WO2004090502A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

System (100) of and method (800) for capturing a plurality of one-dimensional images representative of substantially all of the surface of a substrate (180) within a single revolution of a rotating platen (120) holding a polishing pad (135) in operative contact with the surface of the substrate during chemical-mechanical planarization. A two-dimensional image comprising frame data, which may comprise a spectral image, is derived from the plurality of one-dimensional images. The frame data provides information useful for subsequent chemical-mechanical processing of the substrate.
PCT/US2004/010326 2003-04-01 2004-04-01 Whole-substrate spectral imaging system for cmp WO2004090502A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006509672A JP2006522493A (en) 2003-04-01 2004-04-01 Spectral imaging system for whole substrate for CMP
EP04758852A EP1622743A4 (en) 2003-04-01 2004-04-01 Whole-substrate spectral imaging system for cmp

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US45987603P 2003-04-01 2003-04-01
US60/459,876 2003-04-01
US46944903P 2003-05-05 2003-05-05
US60/469,449 2003-05-05

Publications (2)

Publication Number Publication Date
WO2004090502A2 WO2004090502A2 (en) 2004-10-21
WO2004090502A3 true WO2004090502A3 (en) 2005-01-20

Family

ID=33162216

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/010326 WO2004090502A2 (en) 2003-04-01 2004-04-01 Whole-substrate spectral imaging system for cmp

Country Status (4)

Country Link
US (1) US20040259472A1 (en)
EP (1) EP1622743A4 (en)
JP (1) JP2006522493A (en)
WO (1) WO2004090502A2 (en)

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US7544617B1 (en) * 2005-06-29 2009-06-09 Iowa State University Research Foundation, Inc. Die scale control of chemical mechanical polishing
US20070077671A1 (en) * 2005-10-03 2007-04-05 Applied Materials In-situ substrate imaging
KR101357290B1 (en) * 2006-10-06 2014-01-28 가부시끼가이샤 도시바 Processing end point detection method, polishing method, and polishing apparatus
US20090305610A1 (en) * 2008-06-06 2009-12-10 Applied Materials, Inc. Multiple window pad assembly
KR20110120893A (en) * 2009-01-16 2011-11-04 어플라이드 머티어리얼스, 인코포레이티드 Polishing pad and system with window support
US20130017762A1 (en) * 2011-07-15 2013-01-17 Infineon Technologies Ag Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine
US9095952B2 (en) 2013-01-23 2015-08-04 Applied Materials, Inc. Reflectivity measurements during polishing using a camera
JP6423600B2 (en) 2014-03-12 2018-11-14 株式会社荏原製作所 Film thickness measuring device and polishing device
KR101664794B1 (en) * 2015-08-04 2016-10-12 주식회사 케이씨텍 Chemical mechanical polishing apparatus
US9970754B2 (en) 2015-08-26 2018-05-15 Industrial Technology Research Institute Surface measurement device and method thereof
US10565701B2 (en) 2015-11-16 2020-02-18 Applied Materials, Inc. Color imaging for CMP monitoring
US11557048B2 (en) 2015-11-16 2023-01-17 Applied Materials, Inc. Thickness measurement of substrate using color metrology
US10298570B2 (en) * 2016-03-03 2019-05-21 Ams Sensors Singapore Pte. Ltd. Optoelectronic systems and method for operating the same
TWI784719B (en) 2016-08-26 2022-11-21 美商應用材料股份有限公司 Method of obtaining measurement representative of thickness of layer on substrate, and metrology system and computer program product
JP7472111B2 (en) 2018-09-24 2024-04-22 アプライド マテリアルズ インコーポレイテッド Machine Vision as Input to CMP Process Control Algorithms
JP2022505459A (en) 2018-10-22 2022-01-14 アプライド マテリアルズ インコーポレイテッド Residue detection using luminance histogram
US11100628B2 (en) 2019-02-07 2021-08-24 Applied Materials, Inc. Thickness measurement of substrate using color metrology
JP2023516872A (en) 2020-06-29 2023-04-21 アプライド マテリアルズ インコーポレイテッド Film thickness estimation from substrate image processing based on machine learning

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US6494766B1 (en) * 1998-11-02 2002-12-17 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6621584B2 (en) * 1997-05-28 2003-09-16 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6657737B2 (en) * 1999-12-13 2003-12-02 Ebara Corporation Method and apparatus for measuring film thickness
US6758723B2 (en) * 2001-12-28 2004-07-06 Ebara Corporation Substrate polishing apparatus

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US5081421A (en) * 1990-05-01 1992-01-14 At&T Bell Laboratories In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection
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US6261155B1 (en) * 1997-05-28 2001-07-17 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6621584B2 (en) * 1997-05-28 2003-09-16 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6494766B1 (en) * 1998-11-02 2002-12-17 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6657737B2 (en) * 1999-12-13 2003-12-02 Ebara Corporation Method and apparatus for measuring film thickness
US6758723B2 (en) * 2001-12-28 2004-07-06 Ebara Corporation Substrate polishing apparatus

Non-Patent Citations (1)

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Title
See also references of EP1622743A4 *

Also Published As

Publication number Publication date
JP2006522493A (en) 2006-09-28
EP1622743A2 (en) 2006-02-08
WO2004090502A2 (en) 2004-10-21
US20040259472A1 (en) 2004-12-23
EP1622743A4 (en) 2007-04-04

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