WO2004090634A2 - Environmental system including vaccum scavange for an immersion lithography apparatus - Google Patents
Environmental system including vaccum scavange for an immersion lithography apparatus Download PDFInfo
- Publication number
- WO2004090634A2 WO2004090634A2 PCT/IB2004/002704 IB2004002704W WO2004090634A2 WO 2004090634 A2 WO2004090634 A2 WO 2004090634A2 IB 2004002704 W IB2004002704 W IB 2004002704W WO 2004090634 A2 WO2004090634 A2 WO 2004090634A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fluid
- stage
- gap
- exposure apparatus
- bearing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70816—Bearings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims
Priority Applications (32)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020127005579A KR101280628B1 (en) | 2003-04-10 | 2004-03-29 | Environmental system including vaccum scavange for an immersion lithography apparatus |
KR1020127009421A KR101364889B1 (en) | 2003-04-10 | 2004-03-29 | Environmental system including vaccum scavange for an immersion lithography apparatus |
KR1020117016454A KR101178754B1 (en) | 2003-04-10 | 2004-03-29 | Environmental system including vaccum scavange for an immersion lithography apparatus |
KR1020137000740A KR101364928B1 (en) | 2003-04-10 | 2004-03-29 | Environmental system including vaccum scavange for an immersion lithography apparatus |
JP2006506634A JP4775256B2 (en) | 2003-04-10 | 2004-03-29 | Environmental system with reduced pressure discharge for immersion lithography equipment |
KR1020057019305A KR101121655B1 (en) | 2003-04-10 | 2004-03-29 | Environmental system including vaccum scavange for an immersion lithography apparatus |
KR1020147008472A KR101506431B1 (en) | 2003-04-10 | 2004-03-29 | Environmental system including vaccum scavange for an immersion lithography apparatus |
KR1020127013759A KR101319152B1 (en) | 2003-04-10 | 2004-03-29 | Environmental system including vaccum scavange for an immersion lithography apparatus |
KR1020177008966A KR101886027B1 (en) | 2003-04-10 | 2004-03-29 | Environmental system including vaccum scavange for an immersion lithography apparatus |
EP20130180843 EP2667252B1 (en) | 2003-04-10 | 2004-03-29 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
KR1020147032380A KR101599182B1 (en) | 2003-04-10 | 2004-03-29 | Environmental system including vaccum scavange for an immersion lithography apparatus |
KR1020157019817A KR101724117B1 (en) | 2003-04-10 | 2004-03-29 | Environmental system including vaccum scavange for an immersion lithography apparatus |
EP04758599.7A EP1611485B1 (en) | 2003-04-10 | 2004-03-29 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
KR1020137000739A KR101369016B1 (en) | 2003-04-10 | 2004-03-29 | Environmental system including vaccum scavange for an immersion lithography apparatus |
CN200480009675.7A CN101061429B (en) | 2003-04-10 | 2004-03-29 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
KR1020137022423A KR101469405B1 (en) | 2003-04-10 | 2004-03-29 | Environmental system including vaccum scavange for an immersion lithography apparatus |
KR1020187022187A KR20180089562A (en) | 2003-04-10 | 2004-03-29 | Environmental system including vaccum scavange for an immersion lithography apparatus |
CN2004800096738A CN1774668B (en) | 2003-04-10 | 2004-04-01 | Environmental system including a transport region for an immersion lithography apparatus |
US11/237,799 US7321415B2 (en) | 2003-04-10 | 2005-09-29 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US11/253,597 US20060033899A1 (en) | 2003-04-10 | 2005-10-20 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US11/329,269 US7355676B2 (en) | 2003-04-10 | 2006-01-11 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
HK06106368.5A HK1086637A1 (en) | 2003-04-10 | 2006-06-02 | Environmental system including vaccum scavange for an immersion lithography apparatus |
US11/646,238 US20070103662A1 (en) | 2003-04-10 | 2006-12-28 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US11/701,378 US8089610B2 (en) | 2003-04-10 | 2007-02-02 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US11/819,089 US7456930B2 (en) | 2003-04-10 | 2007-06-25 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US12/382,661 US8456610B2 (en) | 2003-04-10 | 2009-03-20 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US12/926,029 US8810768B2 (en) | 2003-04-10 | 2010-10-21 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US13/529,663 US8836914B2 (en) | 2003-04-10 | 2012-06-21 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US14/324,607 US9244362B2 (en) | 2003-04-10 | 2014-07-07 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US14/955,909 US9658537B2 (en) | 2003-04-10 | 2015-12-01 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US15/585,624 US9977350B2 (en) | 2003-04-10 | 2017-05-03 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
US15/981,243 US20180259860A1 (en) | 2003-04-10 | 2018-05-16 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US46211203P | 2003-04-10 | 2003-04-10 | |
US60/462,112 | 2003-04-10 | ||
US48447603P | 2003-07-01 | 2003-07-01 | |
US60/484,476 | 2003-07-01 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/237,799 Continuation US7321415B2 (en) | 2003-04-10 | 2005-09-29 | Environmental system including vacuum scavenge for an immersion lithography apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004090634A2 true WO2004090634A2 (en) | 2004-10-21 |
WO2004090634A3 WO2004090634A3 (en) | 2007-03-01 |
Family
ID=33162259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2004/002704 WO2004090634A2 (en) | 2003-04-10 | 2004-03-29 | Environmental system including vaccum scavange for an immersion lithography apparatus |
Country Status (8)
Country | Link |
---|---|
US (13) | US7321415B2 (en) |
EP (7) | EP2950148B1 (en) |
JP (10) | JP4775256B2 (en) |
KR (13) | KR101369016B1 (en) |
CN (7) | CN103383528B (en) |
HK (8) | HK1086637A1 (en) |
SG (6) | SG2012050829A (en) |
WO (1) | WO2004090634A2 (en) |
Cited By (146)
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---|---|---|---|---|
US7081943B2 (en) | 2002-11-12 | 2006-07-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2006210542A (en) * | 2005-01-27 | 2006-08-10 | Jsr Corp | Process for producing liquid immersion exposure liquid and recycling method |
US7119874B2 (en) | 2003-06-27 | 2006-10-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2006332100A (en) * | 2005-05-23 | 2006-12-07 | Canon Inc | Immersion aligner |
WO2006130338A1 (en) * | 2005-06-01 | 2006-12-07 | Nikon Corporation | Immersion fluid containment system and method for immersion lithography |
JP2007005731A (en) * | 2005-06-27 | 2007-01-11 | Jsr Corp | Liquid for immersion exposure and method for refining thereof |
EP1756663A1 (en) * | 2004-06-17 | 2007-02-28 | Nikon Corporation | Fluid pressure compensation for immersion lithography lens |
US7196770B2 (en) | 2004-12-07 | 2007-03-27 | Asml Netherlands B.V. | Prewetting of substrate before immersion exposure |
US7199858B2 (en) | 2002-11-12 | 2007-04-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US7224431B2 (en) | 2005-02-22 | 2007-05-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7291850B2 (en) | 2005-04-08 | 2007-11-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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US7324185B2 (en) | 2005-03-04 | 2008-01-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7330238B2 (en) | 2005-03-28 | 2008-02-12 | Asml Netherlands, B.V. | Lithographic apparatus, immersion projection apparatus and device manufacturing method |
US7378025B2 (en) | 2005-02-22 | 2008-05-27 | Asml Netherlands B.V. | Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method |
US7403261B2 (en) | 2004-12-15 | 2008-07-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7405805B2 (en) | 2004-12-28 | 2008-07-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7411657B2 (en) | 2004-11-17 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7411658B2 (en) | 2005-10-06 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7420194B2 (en) | 2005-12-27 | 2008-09-02 | Asml Netherlands B.V. | Lithographic apparatus and substrate edge seal |
US7426014B2 (en) | 2004-07-01 | 2008-09-16 | Nikon Corporation | Dynamic fluid control system for immersion lithography |
US7428038B2 (en) | 2005-02-28 | 2008-09-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid |
US7436486B2 (en) | 2002-12-10 | 2008-10-14 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US7446850B2 (en) | 2004-12-03 | 2008-11-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7466392B2 (en) | 2002-12-10 | 2008-12-16 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
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US8102502B2 (en) | 2003-10-28 | 2012-01-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8111375B2 (en) | 2003-04-07 | 2012-02-07 | Nikon Corporation | Exposure apparatus and method for manufacturing device |
US8111373B2 (en) | 2004-03-25 | 2012-02-07 | Nikon Corporation | Exposure apparatus and device fabrication method |
US8120763B2 (en) | 2002-12-20 | 2012-02-21 | Carl Zeiss Smt Gmbh | Device and method for the optical measurement of an optical system by using an immersion fluid |
US8120751B2 (en) | 2003-07-09 | 2012-02-21 | Nikon Corporation | Coupling apparatus, exposure apparatus, and device fabricating method |
US8130361B2 (en) | 2003-10-09 | 2012-03-06 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8138486B2 (en) | 2005-11-23 | 2012-03-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8154708B2 (en) | 2003-06-09 | 2012-04-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4934043B2 (en) * | 2005-08-29 | 2012-05-16 | 三井化学株式会社 | Liquid for immersion type ArF laser exposure and method for liquid immersion type ArF laser exposure |
US8203693B2 (en) | 2005-04-19 | 2012-06-19 | Asml Netherlands B.V. | Liquid immersion lithography system comprising a tilted showerhead relative to a substrate |
US8218125B2 (en) | 2003-07-28 | 2012-07-10 | Asml Netherlands B.V. | Immersion lithographic apparatus with a projection system having an isolated or movable part |
JP2012134554A (en) * | 2004-09-17 | 2012-07-12 | Nikon Corp | Exposure device, exposure method, and device manufacturing method |
US8233133B2 (en) | 2003-05-28 | 2012-07-31 | Nikon Corporation | Exposure method, exposure apparatus, and method for producing device |
US8237911B2 (en) | 2007-03-15 | 2012-08-07 | Nikon Corporation | Apparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine |
USRE43576E1 (en) | 2005-04-08 | 2012-08-14 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
US8243253B2 (en) | 2003-04-10 | 2012-08-14 | Nikon Corporation | Lyophobic run-off path to collect liquid for an immersion lithography apparatus |
US8248577B2 (en) | 2005-05-03 | 2012-08-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2012191219A (en) * | 2006-05-10 | 2012-10-04 | Nikon Corp | Exposure apparatus and device manufacturing method |
US8305553B2 (en) | 2004-08-18 | 2012-11-06 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US8319939B2 (en) | 2004-07-07 | 2012-11-27 | Asml Netherlands B.V. | Immersion lithographic apparatus and device manufacturing method detecting residual liquid |
JP5109661B2 (en) * | 2005-10-05 | 2012-12-26 | 株式会社ニコン | Exposure apparatus and exposure method |
US8363206B2 (en) | 2006-05-09 | 2013-01-29 | Carl Zeiss Smt Gmbh | Optical imaging device with thermal attenuation |
US8373843B2 (en) | 2004-06-10 | 2013-02-12 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8390779B2 (en) | 2006-02-16 | 2013-03-05 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8451424B2 (en) | 2003-07-28 | 2013-05-28 | Nikon Corporation | Exposure apparatus, method for producing device, and method for controlling exposure apparatus |
US8472001B2 (en) | 2003-05-23 | 2013-06-25 | Nikon Corporation | Exposure method, exposure apparatus, and method for producing device |
US8482716B2 (en) | 2004-06-10 | 2013-07-09 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8508718B2 (en) | 2003-07-08 | 2013-08-13 | Nikon Corporation | Wafer table having sensor for immersion lithography |
US8508713B2 (en) | 2004-06-10 | 2013-08-13 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8520187B2 (en) | 2003-09-03 | 2013-08-27 | Nikon Corporation | Apparatus and method for providing fluid for immersion lithography |
US8520184B2 (en) | 2004-06-09 | 2013-08-27 | Nikon Corporation | Immersion exposure apparatus and device manufacturing method with measuring device |
US8629418B2 (en) | 2005-02-28 | 2014-01-14 | Asml Netherlands B.V. | Lithographic apparatus and sensor therefor |
US8638415B2 (en) | 2004-05-18 | 2014-01-28 | Asml Netherlands B.V. | Active drying station and method to remove immersion liquid using gas flow supply with gas outlet between two gas inlets |
US8675174B2 (en) | 2004-09-17 | 2014-03-18 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8692973B2 (en) | 2005-01-31 | 2014-04-08 | Nikon Corporation | Exposure apparatus and method for producing device |
US8717533B2 (en) | 2004-06-10 | 2014-05-06 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US8941810B2 (en) | 2005-12-30 | 2015-01-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9004459B2 (en) | 2007-01-26 | 2015-04-14 | Asml Netherlands B.V. | Humidifying apparatus, lithographic apparatus and humidifying method |
US9081300B2 (en) | 2005-05-03 | 2015-07-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9134623B2 (en) | 2003-11-14 | 2015-09-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9176393B2 (en) | 2008-05-28 | 2015-11-03 | Asml Netherlands B.V. | Lithographic apparatus and a method of operating the apparatus |
US9223224B2 (en) | 2003-08-29 | 2015-12-29 | Nikon Corporation | Exposure apparatus with component from which liquid is protected and/or removed and device fabricating method |
US9411247B2 (en) | 2004-06-10 | 2016-08-09 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
US9618853B2 (en) | 2005-11-16 | 2017-04-11 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9632425B2 (en) | 2006-12-07 | 2017-04-25 | Asml Holding N.V. | Lithographic apparatus, a dryer and a method of removing liquid from a surface |
US9645506B2 (en) | 2006-12-07 | 2017-05-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9703210B2 (en) | 2004-12-20 | 2017-07-11 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9740106B2 (en) | 2004-12-10 | 2017-08-22 | Asml Netherlands B.V. | Substrate placement in immersion lithography |
US9746781B2 (en) | 2005-01-31 | 2017-08-29 | Nikon Corporation | Exposure apparatus and method for producing device |
US9766556B2 (en) | 2005-06-28 | 2017-09-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9772565B2 (en) | 2005-02-10 | 2017-09-26 | Asml Netherlands B.V. | Immersion liquid, exposure apparatus, and exposure process |
US9798246B2 (en) | 2003-05-13 | 2017-10-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9846372B2 (en) | 2010-04-22 | 2017-12-19 | Asml Netherlands B.V. | Fluid handling structure, lithographic apparatus and device manufacturing method |
US9857695B2 (en) | 2005-04-05 | 2018-01-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP3267258A1 (en) * | 2006-02-21 | 2018-01-10 | Nikon Corporation | Exposure apparatus, exposure method and device manufacturing method |
EP3428724A1 (en) * | 2004-12-15 | 2019-01-16 | Nikon Corporation | Exposure apparatus and device fabricating method |
US10261428B2 (en) | 2002-11-12 | 2019-04-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10503084B2 (en) | 2002-11-12 | 2019-12-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US10802410B2 (en) | 2006-04-14 | 2020-10-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method involving a barrier structure to handle liquid |
US11209738B2 (en) | 2005-11-16 | 2021-12-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7372541B2 (en) * | 2002-11-12 | 2008-05-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
TWI347741B (en) * | 2003-05-30 | 2011-08-21 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
EP1491956B1 (en) | 2003-06-27 | 2006-09-06 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP3862678B2 (en) * | 2003-06-27 | 2006-12-27 | キヤノン株式会社 | Exposure apparatus and device manufacturing method |
SG109000A1 (en) * | 2003-07-16 | 2005-02-28 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
TW200513805A (en) * | 2003-08-26 | 2005-04-16 | Nippon Kogaku Kk | Optical device and exposure apparatus |
TWI245163B (en) | 2003-08-29 | 2005-12-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
JP2005150533A (en) * | 2003-11-18 | 2005-06-09 | Canon Inc | Aligner |
JP4429023B2 (en) * | 2004-01-07 | 2010-03-10 | キヤノン株式会社 | Exposure apparatus and device manufacturing method |
JP4677986B2 (en) | 2004-04-19 | 2011-04-27 | 株式会社ニコン | Nozzle member, exposure method, exposure apparatus, and device manufacturing method |
WO2005119368A2 (en) | 2004-06-04 | 2005-12-15 | Carl Zeiss Smt Ag | System for measuring the image quality of an optical imaging system |
JP4894515B2 (en) | 2004-07-12 | 2012-03-14 | 株式会社ニコン | Exposure apparatus, device manufacturing method, and liquid detection method |
US7304715B2 (en) | 2004-08-13 | 2007-12-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7423720B2 (en) | 2004-11-12 | 2008-09-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
TWI393170B (en) * | 2004-11-18 | 2013-04-11 | 尼康股份有限公司 | A position measuring method, a position control method, a measuring method, a loading method, an exposure method, an exposure apparatus, and a device manufacturing method |
US7365827B2 (en) | 2004-12-08 | 2008-04-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8018573B2 (en) | 2005-02-22 | 2011-09-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7385673B2 (en) * | 2005-06-10 | 2008-06-10 | International Business Machines Corporation | Immersion lithography with equalized pressure on at least projection optics component and wafer |
US7652746B2 (en) | 2005-06-21 | 2010-01-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP5243957B2 (en) * | 2005-08-16 | 2013-07-24 | カール・ツァイス・エスエムティー・ゲーエムベーハー | Objective for immersion lithography |
US7580112B2 (en) * | 2005-08-25 | 2009-08-25 | Nikon Corporation | Containment system for immersion fluid in an immersion lithography apparatus |
US8045134B2 (en) | 2006-03-13 | 2011-10-25 | Asml Netherlands B.V. | Lithographic apparatus, control system and device manufacturing method |
JP4889331B2 (en) * | 2006-03-22 | 2012-03-07 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and substrate processing method |
KR20080108341A (en) | 2006-04-03 | 2008-12-12 | 가부시키가이샤 니콘 | Incidence surfaces and optical windows that are solvophobic to immersion liquids |
US8144305B2 (en) * | 2006-05-18 | 2012-03-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7656502B2 (en) * | 2006-06-22 | 2010-02-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8045135B2 (en) | 2006-11-22 | 2011-10-25 | Asml Netherlands B.V. | Lithographic apparatus with a fluid combining unit and related device manufacturing method |
US8011377B2 (en) * | 2007-05-04 | 2011-09-06 | Asml Netherlands B.V. | Cleaning device and a lithographic apparatus cleaning method |
US7900641B2 (en) | 2007-05-04 | 2011-03-08 | Asml Netherlands B.V. | Cleaning device and a lithographic apparatus cleaning method |
US7866330B2 (en) * | 2007-05-04 | 2011-01-11 | Asml Netherlands B.V. | Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method |
US8947629B2 (en) | 2007-05-04 | 2015-02-03 | Asml Netherlands B.V. | Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method |
NL1036009A1 (en) * | 2007-10-05 | 2009-04-07 | Asml Netherlands Bv | An Immersion Lithography Apparatus. |
US8741967B2 (en) * | 2007-12-12 | 2014-06-03 | Children's Hospital & Research Center At Oakland | Use of unsaturated sphingosine compounds as chemotherapeutic agents for the treatment of cancer |
TWI457714B (en) * | 2008-09-17 | 2014-10-21 | Asml Netherlands Bv | Lithographic apparatus and a method of operating the apparatus |
NL2003392A (en) | 2008-09-17 | 2010-03-18 | Asml Netherlands Bv | Lithographic apparatus and a method of operating the apparatus. |
US8047354B2 (en) | 2008-09-26 | 2011-11-01 | Corning Incorporated | Liquid-ejecting bearings for transport of glass sheets |
EP2172766A1 (en) * | 2008-10-03 | 2010-04-07 | ASML Netherlands B.V. | Lithographic apparatus and humidity measurement system |
US8511461B2 (en) | 2008-11-25 | 2013-08-20 | Corning Incorporated | Gas-ejecting bearings for transport of glass sheets |
NL2003638A (en) | 2008-12-03 | 2010-06-07 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
NL2004497A (en) | 2009-05-01 | 2010-11-02 | Asml Netherlands Bv | Lithographic apparatus and a method of operating the apparatus. |
JP5016705B2 (en) | 2009-06-09 | 2012-09-05 | エーエスエムエル ネザーランズ ビー.ブイ. | Fluid handling structure |
NL2005207A (en) | 2009-09-28 | 2011-03-29 | Asml Netherlands Bv | Heat pipe, lithographic apparatus and device manufacturing method. |
US9120700B2 (en) | 2010-03-26 | 2015-09-01 | Corning Incorporated | Non-contact etching of moving glass sheets |
NL2008199A (en) * | 2011-02-28 | 2012-08-29 | Asml Netherlands Bv | A fluid handling structure, a lithographic apparatus and a device manufacturing method. |
US8715518B2 (en) | 2011-10-12 | 2014-05-06 | Intermolecular, Inc. | Gas barrier with vent ring for protecting a surface region from liquid |
US8728334B2 (en) | 2011-11-29 | 2014-05-20 | Intermolecular, Inc. | Dynamic gas flow control of touchless reactor cells |
US8617409B2 (en) | 2011-11-22 | 2013-12-31 | Intermolecular, Inc. | Magnetically levitated gas cell for touchless site-isolated wet processing |
US9016289B2 (en) | 2011-11-28 | 2015-04-28 | Intermolecular, Inc. | System and method for reducing particles and marks on wafer surface following reactor processing |
US8690136B2 (en) | 2011-11-29 | 2014-04-08 | Intermolecular, Inc. | Internal rinsing in touchless interstitial processing |
US8883607B2 (en) | 2011-12-27 | 2014-11-11 | Intermolecular, Inc. | Full wafer processing by multiple passes through a combinatorial reactor |
US9268231B2 (en) * | 2012-04-10 | 2016-02-23 | Nikon Corporation | Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium |
JP6537194B2 (en) * | 2014-07-04 | 2019-07-03 | エーエスエムエル ネザーランズ ビー.ブイ. | Lithographic apparatus and method of manufacturing a device using a lithographic apparatus |
US9405287B1 (en) * | 2015-07-22 | 2016-08-02 | Applied Materials, Inc. | Apparatus and method for optical calibration of wafer placement by a robot |
CN109143768A (en) * | 2018-09-13 | 2019-01-04 | 杭州行开科技有限公司 | A kind of naked eye 3D display system suitable for laser projection |
CN116802565A (en) * | 2021-02-03 | 2023-09-22 | 应用材料公司 | Pneumatically controlled flexure system for stabilizing projection device |
US11543754B1 (en) * | 2021-06-16 | 2023-01-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Extractor piping on outermost sidewall of immersion hood apparatus |
Family Cites Families (228)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US181859A (en) * | 1876-09-05 | Improvement in warming floors | ||
US279795A (en) * | 1883-06-19 | Paper-weight | ||
US273683A (en) * | 1883-03-06 | John f | ||
GB1242527A (en) | 1967-10-20 | 1971-08-11 | Kodak Ltd | Optical instruments |
DE2102922C3 (en) * | 1971-01-22 | 1978-08-24 | Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar | Arrangement for automatic focusing on objects to be viewed in optical devices |
US4509852A (en) * | 1980-10-06 | 1985-04-09 | Werner Tabarelli | Apparatus for the photolithographic manufacture of integrated circuit elements |
US4346164A (en) * | 1980-10-06 | 1982-08-24 | Werner Tabarelli | Photolithographic method for the manufacture of integrated circuits |
JPS57153433A (en) | 1981-03-18 | 1982-09-22 | Hitachi Ltd | Manufacturing device for semiconductor |
JPS5822299A (en) * | 1981-07-29 | 1983-02-09 | 日産自動車株式会社 | Forklift |
JPS58202448A (en) | 1982-05-21 | 1983-11-25 | Hitachi Ltd | Exposing device |
JPS5919912A (en) | 1982-07-26 | 1984-02-01 | Hitachi Ltd | Immersion distance holding device |
US4441808A (en) * | 1982-11-15 | 1984-04-10 | Tre Semiconductor Equipment Corp. | Focusing device for photo-exposure system |
DD242880A1 (en) * | 1983-01-31 | 1987-02-11 | Kuch Karl Heinz | DEVICE FOR PHOTOLITHOGRAPHIC STRUCTURAL TRANSMISSION |
DD221563A1 (en) * | 1983-09-14 | 1985-04-24 | Mikroelektronik Zt Forsch Tech | IMMERSIONS OBJECTIVE FOR THE STEP-BY-STEP PROJECTION IMAGING OF A MASK STRUCTURE |
DD224448A1 (en) * | 1984-03-01 | 1985-07-03 | Zeiss Jena Veb Carl | DEVICE FOR PHOTOLITHOGRAPHIC STRUCTURAL TRANSMISSION |
JPS6265326A (en) | 1985-09-18 | 1987-03-24 | Hitachi Ltd | Exposure device |
JPS63157419A (en) | 1986-12-22 | 1988-06-30 | Toshiba Corp | Fine pattern transfer apparatus |
US4837443A (en) | 1987-10-15 | 1989-06-06 | The Perkin-Elmer Corporation | Guard ring for a differentially pumped seal apparatus |
JPH04305917A (en) | 1991-04-02 | 1992-10-28 | Nikon Corp | Adhesion type exposure device |
JPH04305915A (en) | 1991-04-02 | 1992-10-28 | Nikon Corp | Adhesion type exposure device |
JPH0562877A (en) | 1991-09-02 | 1993-03-12 | Yasuko Shinohara | Optical system for lsi manufacturing contraction projection aligner by light |
JP3374413B2 (en) * | 1992-07-20 | 2003-02-04 | 株式会社ニコン | Projection exposure apparatus, projection exposure method, and integrated circuit manufacturing method |
JP3246615B2 (en) | 1992-07-27 | 2002-01-15 | 株式会社ニコン | Illumination optical device, exposure apparatus, and exposure method |
JPH06188169A (en) | 1992-08-24 | 1994-07-08 | Canon Inc | Method of image formation, exposure system, and manufacture of device |
JPH06124873A (en) * | 1992-10-09 | 1994-05-06 | Canon Inc | Liquid-soaking type projection exposure apparatus |
JP2753930B2 (en) * | 1992-11-27 | 1998-05-20 | キヤノン株式会社 | Immersion type projection exposure equipment |
JP3747958B2 (en) | 1995-04-07 | 2006-02-22 | 株式会社ニコン | Catadioptric optics |
JP3212199B2 (en) | 1993-10-04 | 2001-09-25 | 旭硝子株式会社 | Flat cathode ray tube |
JPH07220990A (en) | 1994-01-28 | 1995-08-18 | Hitachi Ltd | Pattern forming method and exposure apparatus therefor |
US5874820A (en) | 1995-04-04 | 1999-02-23 | Nikon Corporation | Window frame-guided stage mechanism |
US5528118A (en) | 1994-04-01 | 1996-06-18 | Nikon Precision, Inc. | Guideless stage with isolated reaction stage |
US5623853A (en) | 1994-10-19 | 1997-04-29 | Nikon Precision Inc. | Precision motion stage with single guide beam and follower stage |
JPH08136475A (en) | 1994-11-14 | 1996-05-31 | Kawasaki Steel Corp | Surface observing apparatus for plate-like material |
JPH08171054A (en) | 1994-12-16 | 1996-07-02 | Nikon Corp | Reflection refraction optical system |
JPH08316125A (en) | 1995-05-19 | 1996-11-29 | Hitachi Ltd | Method and apparatus for projection exposing |
JPH08316124A (en) * | 1995-05-19 | 1996-11-29 | Hitachi Ltd | Method and apparatus for projection exposing |
JPH09148235A (en) * | 1995-11-22 | 1997-06-06 | Nikon Corp | Scanning projection aligner |
US5707535A (en) | 1996-01-11 | 1998-01-13 | Harris; Ronald B. | Vacuum loadable divided phase separator for liquid/solid separation |
JPH103039A (en) | 1996-06-14 | 1998-01-06 | Nikon Corp | Reflective/refractive optical system |
JPH1020195A (en) | 1996-06-28 | 1998-01-23 | Nikon Corp | Cata-dioptric system |
JP3227595B2 (en) | 1996-08-20 | 2001-11-12 | 東京エレクトロン株式会社 | Development processing method and development processing apparatus |
WO1998009278A1 (en) * | 1996-08-26 | 1998-03-05 | Digital Papyrus Technologies | Method and apparatus for coupling an optical lens to a disk through a coupling medium having a relatively high index of refraction |
US5825043A (en) * | 1996-10-07 | 1998-10-20 | Nikon Precision Inc. | Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus |
JP4029182B2 (en) | 1996-11-28 | 2008-01-09 | 株式会社ニコン | Exposure method |
AU5067898A (en) | 1996-11-28 | 1998-06-22 | Nikon Corporation | Aligner and method for exposure |
JP4029183B2 (en) | 1996-11-28 | 2008-01-09 | 株式会社ニコン | Projection exposure apparatus and projection exposure method |
JP3728613B2 (en) | 1996-12-06 | 2005-12-21 | 株式会社ニコン | Method for adjusting scanning exposure apparatus and scanning exposure apparatus using the method |
EP0890136B9 (en) | 1996-12-24 | 2003-12-10 | ASML Netherlands B.V. | Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device |
EP0900412B1 (en) | 1997-03-10 | 2005-04-06 | ASML Netherlands B.V. | Lithographic apparatus comprising a positioning device having two object holders |
JPH10255319A (en) | 1997-03-12 | 1998-09-25 | Hitachi Maxell Ltd | Master disk exposure device and method therefor |
JP3747566B2 (en) * | 1997-04-23 | 2006-02-22 | 株式会社ニコン | Immersion exposure equipment |
JP3817836B2 (en) * | 1997-06-10 | 2006-09-06 | 株式会社ニコン | EXPOSURE APPARATUS, ITS MANUFACTURING METHOD, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD |
US20010003028A1 (en) * | 1997-09-19 | 2001-06-07 | Nikon Corporation | Scanning Exposure Method |
JP4210871B2 (en) | 1997-10-31 | 2009-01-21 | 株式会社ニコン | Exposure equipment |
JPH11176727A (en) * | 1997-12-11 | 1999-07-02 | Nikon Corp | Projection aligner |
JPH11260791A (en) | 1998-03-10 | 1999-09-24 | Toshiba Mach Co Ltd | Drying method of semiconductor wafer and drying equipment |
AU2747999A (en) * | 1998-03-26 | 1999-10-18 | Nikon Corporation | Projection exposure method and system |
US5997963A (en) * | 1998-05-05 | 1999-12-07 | Ultratech Stepper, Inc. | Microchamber |
JP2000058436A (en) * | 1998-08-11 | 2000-02-25 | Nikon Corp | Projection aligner and exposure method |
JP2000076707A (en) * | 1998-08-31 | 2000-03-14 | Sony Corp | Master disk recording device for manufacture of optical recording medium |
AU5447499A (en) * | 1998-09-03 | 2000-03-27 | Nikon Corporation | Exposure apparatus and exposure method, and device and method for producing the same |
EP1052552A3 (en) | 1999-04-19 | 2003-03-12 | ASML Netherlands B.V. | Gas bearings for use with vacuum chambers and their application in lithographic projection apparatus |
JP3653198B2 (en) | 1999-07-16 | 2005-05-25 | アルプス電気株式会社 | Nozzle for drying, drying apparatus and cleaning apparatus using the same |
JP2001118773A (en) * | 1999-10-18 | 2001-04-27 | Nikon Corp | Stage device and exposure system |
WO2001035168A1 (en) | 1999-11-10 | 2001-05-17 | Massachusetts Institute Of Technology | Interference lithography utilizing phase-locked scanning beams |
TWI264617B (en) | 1999-12-21 | 2006-10-21 | Asml Netherlands Bv | Balanced positioning system for use in lithographic apparatus |
US7187503B2 (en) * | 1999-12-29 | 2007-03-06 | Carl Zeiss Smt Ag | Refractive projection objective for immersion lithography |
US6995930B2 (en) * | 1999-12-29 | 2006-02-07 | Carl Zeiss Smt Ag | Catadioptric projection objective with geometric beam splitting |
TW579664B (en) | 2000-01-11 | 2004-03-11 | Matsushita Electric Ind Co Ltd | Apparatus and method for manufacturing printed circuit board |
JP3630054B2 (en) | 2000-01-11 | 2005-03-16 | 松下電器産業株式会社 | Printed wiring board manufacturing apparatus and printed wiring board manufacturing method using the same |
US7000622B2 (en) | 2002-09-30 | 2006-02-21 | Lam Research Corporation | Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus |
US6488040B1 (en) * | 2000-06-30 | 2002-12-03 | Lam Research Corporation | Capillary proximity heads for single wafer cleaning and drying |
TW591653B (en) * | 2000-08-08 | 2004-06-11 | Koninkl Philips Electronics Nv | Method of manufacturing an optically scannable information carrier |
JPWO2002025711A1 (en) * | 2000-09-21 | 2004-01-29 | 株式会社ニコン | Measurement method of exposure characteristics and exposure method |
JP2002134384A (en) * | 2000-10-20 | 2002-05-10 | Nikon Corp | Exposure method and projection aligner and device- manufacturing method |
KR100866818B1 (en) * | 2000-12-11 | 2008-11-04 | 가부시키가이샤 니콘 | Projection optical system and exposure apparatus comprising the same |
US20020080339A1 (en) | 2000-12-25 | 2002-06-27 | Nikon Corporation | Stage apparatus, vibration control method and exposure apparatus |
US6731372B2 (en) | 2001-03-27 | 2004-05-04 | Nikon Corporation | Multiple chamber fluid mount |
US20020163629A1 (en) * | 2001-05-07 | 2002-11-07 | Michael Switkes | Methods and apparatus employing an index matching medium |
TW529172B (en) | 2001-07-24 | 2003-04-21 | Asml Netherlands Bv | Imaging apparatus |
US7032658B2 (en) | 2002-01-31 | 2006-04-25 | Smart Drilling And Completion, Inc. | High power umbilicals for electric flowline immersion heating of produced hydrocarbons |
JP2003124180A (en) | 2001-10-16 | 2003-04-25 | Ebara Corp | Substrate processor |
US6811613B2 (en) | 2001-11-26 | 2004-11-02 | Tokyo Electron Limited | Coating film forming apparatus |
US6764386B2 (en) | 2002-01-11 | 2004-07-20 | Applied Materials, Inc. | Air bearing-sealed micro-processing chamber |
EP1480258A4 (en) * | 2002-01-29 | 2005-11-09 | Nikon Corp | Exposure device and exposure method |
WO2003066246A1 (en) | 2002-02-06 | 2003-08-14 | Akrion, Llc | Capillary drying of substrates |
DE10210899A1 (en) | 2002-03-08 | 2003-09-18 | Zeiss Carl Smt Ag | Refractive projection lens for immersion lithography |
US7092069B2 (en) * | 2002-03-08 | 2006-08-15 | Carl Zeiss Smt Ag | Projection exposure method and projection exposure system |
DE10229818A1 (en) * | 2002-06-28 | 2004-01-15 | Carl Zeiss Smt Ag | Focus detection method and imaging system with focus detection system |
JP2004029063A (en) * | 2002-06-21 | 2004-01-29 | Adtec Engineeng Co Ltd | Contact type exposure device |
WO2004019128A2 (en) | 2002-08-23 | 2004-03-04 | Nikon Corporation | Projection optical system and method for photolithography and exposure apparatus and method using same |
US6988326B2 (en) * | 2002-09-30 | 2006-01-24 | Lam Research Corporation | Phobic barrier meniscus separation and containment |
US7520285B2 (en) | 2002-09-30 | 2009-04-21 | Lam Research Corporation | Apparatus and method for processing a substrate |
US7367345B1 (en) | 2002-09-30 | 2008-05-06 | Lam Research Corporation | Apparatus and method for providing a confined liquid for immersion lithography |
US7240679B2 (en) | 2002-09-30 | 2007-07-10 | Lam Research Corporation | System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold |
US6988327B2 (en) * | 2002-09-30 | 2006-01-24 | Lam Research Corporation | Methods and systems for processing a substrate using a dynamic liquid meniscus |
US6954993B1 (en) * | 2002-09-30 | 2005-10-18 | Lam Research Corporation | Concentric proximity processing head |
US7093375B2 (en) * | 2002-09-30 | 2006-08-22 | Lam Research Corporation | Apparatus and method for utilizing a meniscus in substrate processing |
US7383843B2 (en) | 2002-09-30 | 2008-06-10 | Lam Research Corporation | Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer |
US6788477B2 (en) * | 2002-10-22 | 2004-09-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus for method for immersion lithography |
EP1420299B1 (en) * | 2002-11-12 | 2011-01-05 | ASML Netherlands B.V. | Immersion lithographic apparatus and device manufacturing method |
US7110081B2 (en) * | 2002-11-12 | 2006-09-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
SG121822A1 (en) * | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
KR100588124B1 (en) | 2002-11-12 | 2006-06-09 | 에이에스엠엘 네델란즈 비.브이. | Lithographic Apparatus and Device Manufacturing Method |
JP3977324B2 (en) * | 2002-11-12 | 2007-09-19 | エーエスエムエル ネザーランズ ビー.ブイ. | Lithographic apparatus |
EP1420300B1 (en) * | 2002-11-12 | 2015-07-29 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
DE60335595D1 (en) * | 2002-11-12 | 2011-02-17 | Asml Netherlands Bv | Immersion lithographic apparatus and method of making a device |
CN101382738B (en) * | 2002-11-12 | 2011-01-12 | Asml荷兰有限公司 | Lithographic projection apparatus |
EP1420298B1 (en) * | 2002-11-12 | 2013-02-20 | ASML Netherlands B.V. | Lithographic apparatus |
SG131766A1 (en) * | 2002-11-18 | 2007-05-28 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
DE10253679A1 (en) * | 2002-11-18 | 2004-06-03 | Infineon Technologies Ag | Optical arrangement used in the production of semiconductor components comprises a lens system arranged behind a mask, and a medium having a specified refractive index lying between the mask and the lens system |
DE10258718A1 (en) * | 2002-12-09 | 2004-06-24 | Carl Zeiss Smt Ag | Projection lens, in particular for microlithography, and method for tuning a projection lens |
EP1429190B1 (en) * | 2002-12-10 | 2012-05-09 | Canon Kabushiki Kaisha | Exposure apparatus and method |
EP1571697A4 (en) | 2002-12-10 | 2007-07-04 | Nikon Corp | Exposure system and device producing method |
WO2004053953A1 (en) | 2002-12-10 | 2004-06-24 | Nikon Corporation | Exposure apparatus and method for manufacturing device |
AU2003289271A1 (en) | 2002-12-10 | 2004-06-30 | Nikon Corporation | Exposure apparatus, exposure method and method for manufacturing device |
WO2004055803A1 (en) | 2002-12-13 | 2004-07-01 | Koninklijke Philips Electronics N.V. | Liquid removal in a method and device for irradiating spots on a layer |
JP4364805B2 (en) | 2002-12-19 | 2009-11-18 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Method and apparatus for irradiating a spot on a layer |
EP1732075A3 (en) | 2002-12-19 | 2007-02-21 | Koninklijke Philips Electronics N.V. | Method and device for irradiating spots on a layer |
US7010958B2 (en) * | 2002-12-19 | 2006-03-14 | Asml Holding N.V. | High-resolution gas gauge proximity sensor |
US6781670B2 (en) * | 2002-12-30 | 2004-08-24 | Intel Corporation | Immersion lithography |
US7090964B2 (en) * | 2003-02-21 | 2006-08-15 | Asml Holding N.V. | Lithographic printing with polarized light |
TW200500813A (en) | 2003-02-26 | 2005-01-01 | Nikon Corp | Exposure apparatus and method, and method of producing device |
JP4352930B2 (en) | 2003-02-26 | 2009-10-28 | 株式会社ニコン | Exposure apparatus, exposure method, and device manufacturing method |
US6943941B2 (en) * | 2003-02-27 | 2005-09-13 | Asml Netherlands B.V. | Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems |
US7206059B2 (en) * | 2003-02-27 | 2007-04-17 | Asml Netherlands B.V. | Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems |
US7029832B2 (en) * | 2003-03-11 | 2006-04-18 | Samsung Electronics Co., Ltd. | Immersion lithography methods using carbon dioxide |
US20050164522A1 (en) | 2003-03-24 | 2005-07-28 | Kunz Roderick R. | Optical fluids, and systems and methods of making and using the same |
KR101181688B1 (en) * | 2003-03-25 | 2012-09-19 | 가부시키가이샤 니콘 | Exposure system and device production method |
JP4902201B2 (en) | 2003-04-07 | 2012-03-21 | 株式会社ニコン | Exposure apparatus, exposure method, and device manufacturing method |
KR101177331B1 (en) * | 2003-04-09 | 2012-08-30 | 가부시키가이샤 니콘 | Immersion lithography fluid control system |
SG2012050829A (en) * | 2003-04-10 | 2015-07-30 | Nippon Kogaku Kk | Environmental system including vacuum scavange for an immersion lithography apparatus |
JP4650413B2 (en) * | 2003-04-10 | 2011-03-16 | 株式会社ニコン | Environmental system including a transfer area for an immersion lithography apparatus |
EP2921905B1 (en) | 2003-04-10 | 2017-12-27 | Nikon Corporation | Run-off path to collect liquid for an immersion lithography apparatus |
JP4656057B2 (en) | 2003-04-10 | 2011-03-23 | 株式会社ニコン | Electro-osmotic element for immersion lithography equipment |
WO2004092830A2 (en) | 2003-04-11 | 2004-10-28 | Nikon Corporation | Liquid jet and recovery system for immersion lithography |
SG185136A1 (en) | 2003-04-11 | 2012-11-29 | Nikon Corp | Cleanup method for optics in immersion lithography |
KR101225884B1 (en) | 2003-04-11 | 2013-01-28 | 가부시키가이샤 니콘 | Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine |
WO2004095135A2 (en) | 2003-04-17 | 2004-11-04 | Nikon Corporation | Optical arrangement of autofocus elements for use with immersion lithography |
JP2004321968A (en) * | 2003-04-25 | 2004-11-18 | Nec Corp | Waste processing system and waste processing method |
JP4146755B2 (en) * | 2003-05-09 | 2008-09-10 | 松下電器産業株式会社 | Pattern formation method |
JP4025683B2 (en) * | 2003-05-09 | 2007-12-26 | 松下電器産業株式会社 | Pattern forming method and exposure apparatus |
EP1477856A1 (en) | 2003-05-13 | 2004-11-17 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
TWI295414B (en) | 2003-05-13 | 2008-04-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
TWI470671B (en) * | 2003-05-23 | 2015-01-21 | 尼康股份有限公司 | Exposure method and exposure apparatus, and device manufacturing method |
JP2004349645A (en) | 2003-05-26 | 2004-12-09 | Sony Corp | Liquid-immersed differential liquid-drainage static-pressure floating pad, master-disk exposure apparatus, and method of exposure using liquid-immersed differential liquid-drainage |
TWI347741B (en) * | 2003-05-30 | 2011-08-21 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
DE10324477A1 (en) | 2003-05-30 | 2004-12-30 | Carl Zeiss Smt Ag | Microlithographic projection exposure system |
US7213963B2 (en) | 2003-06-09 | 2007-05-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4054285B2 (en) * | 2003-06-12 | 2008-02-27 | 松下電器産業株式会社 | Pattern formation method |
JP4084710B2 (en) | 2003-06-12 | 2008-04-30 | 松下電器産業株式会社 | Pattern formation method |
US6867844B2 (en) * | 2003-06-19 | 2005-03-15 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
KR101289979B1 (en) | 2003-06-19 | 2013-07-26 | 가부시키가이샤 니콘 | Exposure device and device producing method |
JP4084712B2 (en) * | 2003-06-23 | 2008-04-30 | 松下電器産業株式会社 | Pattern formation method |
JP4029064B2 (en) * | 2003-06-23 | 2008-01-09 | 松下電器産業株式会社 | Pattern formation method |
EP1498778A1 (en) | 2003-06-27 | 2005-01-19 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP3862678B2 (en) | 2003-06-27 | 2006-12-27 | キヤノン株式会社 | Exposure apparatus and device manufacturing method |
US6809794B1 (en) * | 2003-06-27 | 2004-10-26 | Asml Holding N.V. | Immersion photolithography system and method using inverted wafer-projection optics interface |
US7236232B2 (en) | 2003-07-01 | 2007-06-26 | Nikon Corporation | Using isotopically specified fluids as optical elements |
US6919647B2 (en) * | 2003-07-03 | 2005-07-19 | American Semiconductor, Inc. | SRAM cell |
WO2005006417A1 (en) * | 2003-07-09 | 2005-01-20 | Nikon Corporation | Exposure apparatus and method for manufacturing device |
US7384149B2 (en) | 2003-07-21 | 2008-06-10 | Asml Netherlands B.V. | Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system |
US7006209B2 (en) | 2003-07-25 | 2006-02-28 | Advanced Micro Devices, Inc. | Method and apparatus for monitoring and controlling imaging in immersion lithography systems |
US7326522B2 (en) * | 2004-02-11 | 2008-02-05 | Asml Netherlands B.V. | Device manufacturing method and a substrate |
US7175968B2 (en) * | 2003-07-28 | 2007-02-13 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and a substrate |
US7061578B2 (en) | 2003-08-11 | 2006-06-13 | Advanced Micro Devices, Inc. | Method and apparatus for monitoring and controlling imaging in immersion lithography systems |
US7700267B2 (en) * | 2003-08-11 | 2010-04-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Immersion fluid for immersion lithography, and method of performing immersion lithography |
US7579135B2 (en) * | 2003-08-11 | 2009-08-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lithography apparatus for manufacture of integrated circuits |
US7085075B2 (en) | 2003-08-12 | 2006-08-01 | Carl Zeiss Smt Ag | Projection objectives including a plurality of mirrors with lenses ahead of mirror M3 |
US6844206B1 (en) | 2003-08-21 | 2005-01-18 | Advanced Micro Devices, Llp | Refractive index system monitor and control for immersion lithography |
US6954256B2 (en) * | 2003-08-29 | 2005-10-11 | Asml Netherlands B.V. | Gradient immersion lithography |
US7070915B2 (en) * | 2003-08-29 | 2006-07-04 | Tokyo Electron Limited | Method and system for drying a substrate |
US7014966B2 (en) * | 2003-09-02 | 2006-03-21 | Advanced Micro Devices, Inc. | Method and apparatus for elimination of bubbles in immersion medium in immersion lithography systems |
KR20170070264A (en) | 2003-09-03 | 2017-06-21 | 가부시키가이샤 니콘 | Apparatus and method for providing fluid for immersion lithography |
JP4378136B2 (en) * | 2003-09-04 | 2009-12-02 | キヤノン株式会社 | Exposure apparatus and device manufacturing method |
US20050069499A1 (en) * | 2003-09-25 | 2005-03-31 | Moshe Arkin | Foamable compositions, processes of preparing same and uses thereof |
US6961186B2 (en) * | 2003-09-26 | 2005-11-01 | Takumi Technology Corp. | Contact printing using a magnified mask image |
EP1519230A1 (en) | 2003-09-29 | 2005-03-30 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4513299B2 (en) | 2003-10-02 | 2010-07-28 | 株式会社ニコン | Exposure apparatus, exposure method, and device manufacturing method |
JP4515209B2 (en) | 2003-10-02 | 2010-07-28 | 株式会社ニコン | Exposure apparatus, exposure method, and device manufacturing method |
US7369217B2 (en) | 2003-10-03 | 2008-05-06 | Micronic Laser Systems Ab | Method and device for immersion lithography |
US7678527B2 (en) * | 2003-10-16 | 2010-03-16 | Intel Corporation | Methods and compositions for providing photoresist with improved properties for contacting liquids |
JP2005159322A (en) | 2003-10-31 | 2005-06-16 | Nikon Corp | Surface plate, stage apparatus, exposure device and exposing method |
WO2005050324A2 (en) | 2003-11-05 | 2005-06-02 | Dsm Ip Assets B.V. | A method and apparatus for producing microchips |
US7924397B2 (en) * | 2003-11-06 | 2011-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Anti-corrosion layer on objective lens for liquid immersion lithography applications |
US7545481B2 (en) * | 2003-11-24 | 2009-06-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1695148B1 (en) | 2003-11-24 | 2015-10-28 | Carl Zeiss SMT GmbH | Immersion objective |
US7125652B2 (en) | 2003-12-03 | 2006-10-24 | Advanced Micro Devices, Inc. | Immersion lithographic process using a conforming immersion medium |
KR101200654B1 (en) | 2003-12-15 | 2012-11-12 | 칼 짜이스 에스엠티 게엠베하 | Projection objective having a high aperture and a planar end surface |
WO2005059654A1 (en) | 2003-12-15 | 2005-06-30 | Carl Zeiss Smt Ag | Objective as a microlithography projection objective with at least one liquid lens |
US20050185269A1 (en) * | 2003-12-19 | 2005-08-25 | Carl Zeiss Smt Ag | Catadioptric projection objective with geometric beam splitting |
US7460206B2 (en) * | 2003-12-19 | 2008-12-02 | Carl Zeiss Smt Ag | Projection objective for immersion lithography |
JP5102492B2 (en) | 2003-12-19 | 2012-12-19 | カール・ツァイス・エスエムティー・ゲーエムベーハー | Objective lens for microlithography projection with crystal elements |
JP2005183744A (en) | 2003-12-22 | 2005-07-07 | Nikon Corp | Aligner and method for manufacturing device |
US7589818B2 (en) * | 2003-12-23 | 2009-09-15 | Asml Netherlands B.V. | Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus |
US7394521B2 (en) | 2003-12-23 | 2008-07-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7119884B2 (en) | 2003-12-24 | 2006-10-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20050147920A1 (en) * | 2003-12-30 | 2005-07-07 | Chia-Hui Lin | Method and system for immersion lithography |
US7088422B2 (en) * | 2003-12-31 | 2006-08-08 | International Business Machines Corporation | Moving lens for immersion optical lithography |
JP4371822B2 (en) * | 2004-01-06 | 2009-11-25 | キヤノン株式会社 | Exposure equipment |
JP4429023B2 (en) * | 2004-01-07 | 2010-03-10 | キヤノン株式会社 | Exposure apparatus and device manufacturing method |
US20050153424A1 (en) * | 2004-01-08 | 2005-07-14 | Derek Coon | Fluid barrier with transparent areas for immersion lithography |
DE602005008707D1 (en) | 2004-01-14 | 2008-09-18 | Zeiss Carl Smt Ag | CATADIOPRIC PROJECTION LENS |
KR101295439B1 (en) | 2004-01-16 | 2013-08-09 | 칼 짜이스 에스엠티 게엠베하 | Polarization-modulating optical element |
WO2005069078A1 (en) | 2004-01-19 | 2005-07-28 | Carl Zeiss Smt Ag | Microlithographic projection exposure apparatus with immersion projection lens |
JP4843503B2 (en) | 2004-01-20 | 2011-12-21 | カール・ツァイス・エスエムティー・ゲーエムベーハー | Microlithographic projection exposure apparatus and measuring apparatus for projection lens |
US7026259B2 (en) * | 2004-01-21 | 2006-04-11 | International Business Machines Corporation | Liquid-filled balloons for immersion lithography |
US7391501B2 (en) * | 2004-01-22 | 2008-06-24 | Intel Corporation | Immersion liquids with siloxane polymer for immersion lithography |
WO2005074606A2 (en) | 2004-02-03 | 2005-08-18 | Rochester Institute Of Technology | Method of photolithography using a fluid and a system thereof |
US7050146B2 (en) * | 2004-02-09 | 2006-05-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
WO2005076084A1 (en) | 2004-02-09 | 2005-08-18 | Carl Zeiss Smt Ag | Projection objective for a microlithographic projection exposure apparatus |
US20070165198A1 (en) | 2004-02-13 | 2007-07-19 | Carl Zeiss Smt Ag | Projection objective for a microlithographic projection exposure apparatus |
WO2005081030A1 (en) | 2004-02-18 | 2005-09-01 | Corning Incorporated | Catadioptric imaging system for high numerical aperture imaging with deep ultraviolet light |
US20050205108A1 (en) * | 2004-03-16 | 2005-09-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for immersion lithography lens cleaning |
US7027125B2 (en) * | 2004-03-25 | 2006-04-11 | International Business Machines Corporation | System and apparatus for photolithography |
US7084960B2 (en) * | 2004-03-29 | 2006-08-01 | Intel Corporation | Lithography using controlled polarization |
US7227619B2 (en) | 2004-04-01 | 2007-06-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7034917B2 (en) | 2004-04-01 | 2006-04-25 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufactured thereby |
US7295283B2 (en) | 2004-04-02 | 2007-11-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7091502B2 (en) | 2004-05-12 | 2006-08-15 | Taiwan Semiconductor Manufacturing, Co., Ltd. | Apparatus and method for immersion lithography |
US7486381B2 (en) | 2004-05-21 | 2009-02-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR101259190B1 (en) | 2004-06-17 | 2013-04-29 | 가부시키가이샤 니콘 | Fluid pressure compensation for immersion lithography lens |
US7057702B2 (en) * | 2004-06-23 | 2006-06-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4565272B2 (en) | 2004-07-01 | 2010-10-20 | 株式会社ニコン | Dynamic fluid control system for immersion lithography |
US7701550B2 (en) * | 2004-08-19 | 2010-04-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7355674B2 (en) | 2004-09-28 | 2008-04-08 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and computer program product |
US7161654B2 (en) | 2004-12-02 | 2007-01-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7265813B2 (en) | 2004-12-28 | 2007-09-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
-
2004
- 2004-03-29 SG SG2012050829A patent/SG2012050829A/en unknown
- 2004-03-29 KR KR1020137000739A patent/KR101369016B1/en active IP Right Grant
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- 2004-03-29 CN CN201410838351.XA patent/CN104597717B/en not_active Expired - Fee Related
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- 2004-03-29 CN CN201310235130.9A patent/CN103383527B/en not_active Expired - Fee Related
- 2004-03-29 KR KR1020147032380A patent/KR101599182B1/en active IP Right Grant
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- 2004-03-29 KR KR1020127013759A patent/KR101319152B1/en active IP Right Grant
- 2004-03-29 KR KR1020117016454A patent/KR101178754B1/en active IP Right Grant
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- 2004-03-29 SG SG2014015184A patent/SG2014015184A/en unknown
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- 2004-04-01 CN CN2004800096738A patent/CN1774668B/en not_active Expired - Fee Related
-
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- 2005-09-29 US US11/237,799 patent/US7321415B2/en not_active Expired - Lifetime
- 2005-10-20 US US11/253,597 patent/US20060033899A1/en not_active Abandoned
-
2006
- 2006-01-11 US US11/329,269 patent/US7355676B2/en not_active Expired - Fee Related
- 2006-06-02 HK HK06106368.5A patent/HK1086637A1/en not_active IP Right Cessation
- 2006-12-28 US US11/646,238 patent/US20070103662A1/en not_active Abandoned
-
2007
- 2007-02-02 US US11/701,378 patent/US8089610B2/en not_active Expired - Fee Related
- 2007-06-25 US US11/819,089 patent/US7456930B2/en not_active Expired - Fee Related
-
2009
- 2009-03-20 US US12/382,661 patent/US8456610B2/en not_active Expired - Fee Related
-
2010
- 2010-02-08 JP JP2010026002A patent/JP5152219B2/en not_active Expired - Fee Related
- 2010-10-21 US US12/926,029 patent/US8810768B2/en not_active Expired - Fee Related
-
2011
- 2011-04-25 JP JP2011097540A patent/JP5550188B2/en not_active Expired - Fee Related
-
2012
- 2012-03-30 JP JP2012083119A patent/JP5541309B2/en not_active Expired - Fee Related
- 2012-06-21 US US13/529,663 patent/US8836914B2/en not_active Expired - Fee Related
-
2013
- 2013-08-12 JP JP2013167890A patent/JP5692304B2/en not_active Expired - Fee Related
- 2013-12-27 JP JP2013272247A patent/JP5745611B2/en not_active Expired - Lifetime
-
2014
- 2014-04-24 HK HK14103956.0A patent/HK1190797A1/en not_active IP Right Cessation
- 2014-04-24 HK HK14103957.9A patent/HK1190798A1/en not_active IP Right Cessation
- 2014-07-07 US US14/324,607 patent/US9244362B2/en not_active Expired - Fee Related
- 2014-08-01 HK HK14107893.7A patent/HK1194486A1/en not_active IP Right Cessation
- 2014-11-10 JP JP2014227827A patent/JP5949876B2/en not_active Expired - Fee Related
-
2015
- 2015-09-22 HK HK15109292.9A patent/HK1208736A1/en not_active IP Right Cessation
- 2015-11-06 JP JP2015218810A patent/JP6137276B2/en not_active Expired - Fee Related
- 2015-12-01 US US14/955,909 patent/US9658537B2/en not_active Expired - Fee Related
-
2016
- 2016-04-26 HK HK16104744.3A patent/HK1216781A1/en not_active IP Right Cessation
- 2016-04-26 HK HK16104745.2A patent/HK1216782A1/en not_active IP Right Cessation
- 2016-09-26 HK HK16111263.9A patent/HK1223161A1/en not_active IP Right Cessation
- 2016-10-13 JP JP2016201561A patent/JP6332394B2/en not_active Expired - Fee Related
-
2017
- 2017-05-03 US US15/585,624 patent/US9977350B2/en not_active Expired - Fee Related
- 2017-11-30 JP JP2017229742A patent/JP2018028705A/en active Pending
-
2018
- 2018-05-16 US US15/981,243 patent/US20180259860A1/en not_active Abandoned
Non-Patent Citations (2)
Title |
---|
None |
See also references of EP1611485A4 |
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JP2006332100A (en) * | 2005-05-23 | 2006-12-07 | Canon Inc | Immersion aligner |
WO2006130338A1 (en) * | 2005-06-01 | 2006-12-07 | Nikon Corporation | Immersion fluid containment system and method for immersion lithography |
JP2007005731A (en) * | 2005-06-27 | 2007-01-11 | Jsr Corp | Liquid for immersion exposure and method for refining thereof |
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JP5109661B2 (en) * | 2005-10-05 | 2012-12-26 | 株式会社ニコン | Exposure apparatus and exposure method |
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JP2012186509A (en) * | 2005-10-06 | 2012-09-27 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
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EP3267258A1 (en) * | 2006-02-21 | 2018-01-10 | Nikon Corporation | Exposure apparatus, exposure method and device manufacturing method |
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US8902401B2 (en) | 2006-05-09 | 2014-12-02 | Carl Zeiss Smt Gmbh | Optical imaging device with thermal attenuation |
JP2012191219A (en) * | 2006-05-10 | 2012-10-04 | Nikon Corp | Exposure apparatus and device manufacturing method |
JP5151977B2 (en) * | 2006-05-10 | 2013-02-27 | 株式会社ニコン | Exposure apparatus and device manufacturing method |
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