WO2004091445A3 - Hermetically sealed product and related methods of manufacture - Google Patents

Hermetically sealed product and related methods of manufacture Download PDF

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Publication number
WO2004091445A3
WO2004091445A3 PCT/US2004/010366 US2004010366W WO2004091445A3 WO 2004091445 A3 WO2004091445 A3 WO 2004091445A3 US 2004010366 W US2004010366 W US 2004010366W WO 2004091445 A3 WO2004091445 A3 WO 2004091445A3
Authority
WO
WIPO (PCT)
Prior art keywords
manufacture
hermetically sealed
related methods
components
sealed product
Prior art date
Application number
PCT/US2004/010366
Other languages
French (fr)
Other versions
WO2004091445A2 (en
Inventor
Heerden David Peter Van
Dale Deger
Timothy P Weihs
Omar M Knio
Original Assignee
Reactive Nanotechnologies Inc
Heerden David Peter Van
Dale Deger
Timothy P Weihs
Omar M Knio
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Reactive Nanotechnologies Inc, Heerden David Peter Van, Dale Deger, Timothy P Weihs, Omar M Knio filed Critical Reactive Nanotechnologies Inc
Priority to AU2004229368A priority Critical patent/AU2004229368A1/en
Priority to MXPA05010799A priority patent/MXPA05010799A/en
Priority to JP2006509683A priority patent/JP2006522722A/en
Priority to EP04749740A priority patent/EP1618604A2/en
Priority to CA002521852A priority patent/CA2521852A1/en
Priority to BRPI0409118-3A priority patent/BRPI0409118A/en
Publication of WO2004091445A2 publication Critical patent/WO2004091445A2/en
Publication of WO2004091445A3 publication Critical patent/WO2004091445A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/10—Container closures formed after filling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/038—Bonding techniques not provided for in B81C2203/031 - B81C2203/037

Abstract

Embodiments of the invention include a method for sealing a container. The method includes, providing at least two components of the container, positioning a crushable material between the at least two components, positioning a reactive multilayer material between the at least two components, deforming the crushable material so as to form a seal between the at least two components, chemically transforming the reactive multilayer material so as to join the at least two components.
PCT/US2004/010366 2003-04-09 2004-04-06 Hermetically sealed product and related methods of manufacture WO2004091445A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AU2004229368A AU2004229368A1 (en) 2003-04-09 2004-04-06 Hermetically sealed product and related methods of manufacture
MXPA05010799A MXPA05010799A (en) 2003-04-09 2004-04-06 Hermetically sealed product and related methods of manufacture.
JP2006509683A JP2006522722A (en) 2003-04-09 2004-04-06 Hermetically sealed product and related manufacturing method
EP04749740A EP1618604A2 (en) 2003-04-09 2004-04-06 Hermetically sealed product and related methods of manufacture
CA002521852A CA2521852A1 (en) 2003-04-09 2004-04-06 Hermetically sealed product and related methods of manufacture
BRPI0409118-3A BRPI0409118A (en) 2003-04-09 2004-04-06 container sealing method, sealed product, sealed container kit and sealing tester

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US46119603P 2003-04-09 2003-04-09
US60/461,196 2003-04-09
US10/814,243 2004-04-01
US10/814,243 US7121402B2 (en) 2003-04-09 2004-04-01 Container hermetically sealed with crushable material and reactive multilayer material

Publications (2)

Publication Number Publication Date
WO2004091445A2 WO2004091445A2 (en) 2004-10-28
WO2004091445A3 true WO2004091445A3 (en) 2005-04-28

Family

ID=33135171

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/010366 WO2004091445A2 (en) 2003-04-09 2004-04-06 Hermetically sealed product and related methods of manufacture

Country Status (10)

Country Link
US (3) US7121402B2 (en)
EP (1) EP1618604A2 (en)
JP (1) JP2006522722A (en)
KR (1) KR20050123153A (en)
AU (1) AU2004229368A1 (en)
BR (1) BRPI0409118A (en)
CA (1) CA2521852A1 (en)
MX (1) MXPA05010799A (en)
TW (1) TW200502419A (en)
WO (1) WO2004091445A2 (en)

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JP5330697B2 (en) * 2007-03-19 2013-10-30 株式会社リコー Functional element package and manufacturing method thereof
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US20110024416A1 (en) * 2007-06-26 2011-02-03 Reactive Nanotechnolgies, Inc. Gasketless low temperature hermetic sealing with solder
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US20100104823A1 (en) * 2008-10-23 2010-04-29 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Reactive composite material structures with multiple reaction-propagation circuits
US8440923B2 (en) * 2008-10-23 2013-05-14 The Invention Science Fund I Llc Electrical closing switch made from reactive composite materials
US20100104493A1 (en) * 2008-10-23 2010-04-29 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Reactive composite material structures with endothermic reactants
US8871121B2 (en) * 2008-10-23 2014-10-28 The Invention Science Fund I Llc Optical and metamaterial devices based on reactive composite materials
US20100104834A1 (en) * 2008-10-23 2010-04-29 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Foam-like structures based on reactive composite materials
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CN102185580A (en) * 2010-01-18 2011-09-14 精工爱普生株式会社 Electronic apparatus, method of manufacturing substrate, and method of manufacturing electronic apparatus
US9969022B2 (en) * 2010-09-28 2018-05-15 Applied Materials, Inc. Vacuum process chamber component and methods of making
US10036385B2 (en) * 2012-03-02 2018-07-31 Dover Pump Solutions Group (Europe) Gmbh Sealing arrangement, a conveying device having a sealing arrangement and a method for operating the sealing arrangement
DE102012206869B4 (en) * 2012-04-25 2021-05-27 Robert Bosch Gmbh Micromechanical component and method for producing a micromechanical component
US9315417B2 (en) * 2013-02-17 2016-04-19 Invenias Inc Attachment of a cap to a substrate-based device with in situ monitoring of bond quality
JP2015088579A (en) * 2013-10-30 2015-05-07 セイコーエプソン株式会社 Package, optical device, optical sensor, electronic device, and electronic apparatus
US9540231B2 (en) * 2014-01-28 2017-01-10 Taiwan Semiconductor Manufacturing Co., Ltd. MEMS device with a bonding layer embedded in the cap
US20150226053A1 (en) * 2014-02-12 2015-08-13 Baker Hughes Incorporated Reactive multilayer foil usage in wired pipe systems
CN103910325B (en) * 2014-02-27 2015-06-17 厦门大学 High-reliability micro-electromechanical system (MEMS) packaging structure and method capable of achieving accurate control of bonding gap
JP6365215B2 (en) * 2014-10-15 2018-08-01 三菱電機株式会社 Manufacturing method of semiconductor device
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KR101947426B1 (en) * 2015-12-14 2019-02-13 주식회사 씨에이치솔루션 Vacuum chamber with sealing member and sealing member used in it
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KR20200110047A (en) * 2019-03-15 2020-09-23 주식회사 케이씨텍 Apparatus for Treating Substrate

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Also Published As

Publication number Publication date
TW200502419A (en) 2005-01-16
US7121402B2 (en) 2006-10-17
JP2006522722A (en) 2006-10-05
BRPI0409118A (en) 2006-03-28
AU2004229368A1 (en) 2004-10-28
CA2521852A1 (en) 2004-10-28
EP1618604A2 (en) 2006-01-25
US20040200736A1 (en) 2004-10-14
US20060032193A1 (en) 2006-02-16
US20060108365A1 (en) 2006-05-25
MXPA05010799A (en) 2006-03-09
US7143568B2 (en) 2006-12-05
WO2004091445A2 (en) 2004-10-28
KR20050123153A (en) 2005-12-29

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