WO2004095597A3 - Glass package that is hermetically sealed with a frit and method of fabrication - Google Patents

Glass package that is hermetically sealed with a frit and method of fabrication Download PDF

Info

Publication number
WO2004095597A3
WO2004095597A3 PCT/US2004/011349 US2004011349W WO2004095597A3 WO 2004095597 A3 WO2004095597 A3 WO 2004095597A3 US 2004011349 W US2004011349 W US 2004011349W WO 2004095597 A3 WO2004095597 A3 WO 2004095597A3
Authority
WO
WIPO (PCT)
Prior art keywords
frit
substrate plate
hermetically sealed
oleds
glass package
Prior art date
Application number
PCT/US2004/011349
Other languages
French (fr)
Other versions
WO2004095597A2 (en
Inventor
Robert M Morena
Joseph F Schroeder
Alexander Streltsov
Lisa A Lamberson
Richard J Ii Miller
Bruce G Aitken
Joel P Carberry
Steven E Demartino
Henry E Hagy
Sujanto Widjaja
Original Assignee
Corning Inc
Robert M Morena
Joseph F Schroeder
Alexander Streltsov
Lisa A Lamberson
Richard J Ii Miller
Bruce G Aitken
Joel P Carberry
Steven E Demartino
Henry E Hagy
Sujanto Widjaja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc, Robert M Morena, Joseph F Schroeder, Alexander Streltsov, Lisa A Lamberson, Richard J Ii Miller, Bruce G Aitken, Joel P Carberry, Steven E Demartino, Henry E Hagy, Sujanto Widjaja filed Critical Corning Inc
Priority to EP04750063A priority Critical patent/EP1620369A2/en
Priority to JP2006509972A priority patent/JP4540669B2/en
Priority to CA002522425A priority patent/CA2522425A1/en
Publication of WO2004095597A2 publication Critical patent/WO2004095597A2/en
Publication of WO2004095597A3 publication Critical patent/WO2004095597A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/005—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing with compositions containing more than 50% lead oxide by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/16—Silica-free oxide glass compositions containing phosphorus
    • C03C3/17—Silica-free oxide glass compositions containing phosphorus containing aluminium or beryllium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/16—Silica-free oxide glass compositions containing phosphorus
    • C03C3/19—Silica-free oxide glass compositions containing phosphorus containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/16—Silica-free oxide glass compositions containing phosphorus
    • C03C3/21—Silica-free oxide glass compositions containing phosphorus containing titanium, zirconium, vanadium, tungsten or molybdenum
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

A hermetically sealed glass package (100) and method (200) for manufacturing the hermetically sealed glass package (100) are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display (100) is manufactured by providing (step 202) a first substrate plate (102) and a second substrate plate (107) and depositing (step 208) a frit (106) onto the second substrate plate (107). OLEDs (104) are deposited (step 206) on the first substrate plate (102). An irradiation source (110)(e.g., laser, infrared light) is then used to heat (step 212) the frit (106) which melts and forms a hermetic seal (108) that connects the first substrate plate (102) to the second substrate plate (107) and also protects the OLEDs (104). The frit (106) is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source (110) heats the frit, it softens and forms a bond. This enables the frit (106) to melt and form the hermetic seal (108) while avoiding thermal damage to the OLEDs (104).
PCT/US2004/011349 2003-04-16 2004-04-13 Glass package that is hermetically sealed with a frit and method of fabrication WO2004095597A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP04750063A EP1620369A2 (en) 2003-04-16 2004-04-13 Glass package that is hermetically sealed with a frit and method of fabrication
JP2006509972A JP4540669B2 (en) 2003-04-16 2004-04-13 Organic light-emitting diode display sealed by frit and method of manufacturing the same
CA002522425A CA2522425A1 (en) 2003-04-16 2004-04-13 Glass package that is hermetically sealed with a frit and method of fabrication

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/414,794 2003-04-16
US10/414,794 US6998776B2 (en) 2003-04-16 2003-04-16 Glass package that is hermetically sealed with a frit and method of fabrication

Publications (2)

Publication Number Publication Date
WO2004095597A2 WO2004095597A2 (en) 2004-11-04
WO2004095597A3 true WO2004095597A3 (en) 2005-01-06

Family

ID=33158773

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/011349 WO2004095597A2 (en) 2003-04-16 2004-04-13 Glass package that is hermetically sealed with a frit and method of fabrication

Country Status (8)

Country Link
US (4) US6998776B2 (en)
EP (1) EP1620369A2 (en)
JP (1) JP4540669B2 (en)
KR (1) KR100759934B1 (en)
CN (2) CN101312234B (en)
CA (1) CA2522425A1 (en)
TW (1) TWI327560B (en)
WO (1) WO2004095597A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9004972B2 (en) 2006-01-20 2015-04-14 Samsung Display Co., Ltd. Organic light-emitting display device with frit seal and reinforcing structure

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* Cited by examiner, † Cited by third party
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