WO2004098832A1 - Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces - Google Patents
Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces Download PDFInfo
- Publication number
- WO2004098832A1 WO2004098832A1 PCT/US2004/012760 US2004012760W WO2004098832A1 WO 2004098832 A1 WO2004098832 A1 WO 2004098832A1 US 2004012760 W US2004012760 W US 2004012760W WO 2004098832 A1 WO2004098832 A1 WO 2004098832A1
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- WIPO (PCT)
- Prior art keywords
- pad
- under
- magnetic field
- polishing
- cavity
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
Definitions
- the present invention relates to polishing machines and methods for polishing microfeature workpieces.
- the present invention relates to mechanical and/or chemical-mechanical polishing of microfeature workpieces with polishing machines that include under-pads.
- FIG. 1 schematically illustrates a rotary CMP machine 10 with a platen 20, a carrier head 30, and a planarizing pad 40.
- the CMP machine 10 may also include an under-pad 50 between an upper surface 22 of the platen 20 and a lower surface of the planarizing pad 40.
- the under-pad 50 provides a thermal and mechanical interface between the planarizing pad 40 and the platen 20.
- a drive assembly 26 rotates the platen 20 (indicated by arrow F) and/or reciprocates the platen 20 back and forth (indicated by arrow G). Since the planarizing pad 40 is attached to the under-pad 50, the planarizing pad 40 moves with the platen 20 during planarization.
- the carrier head 30 has a lower surface 32 to which a microfeature workpiece 12 may be attached, or the workpiece 12 may be attached to a resilient pad 34 under the lower surface 32.
- the carrier head 30 may be a weighted, free- floating wafer carrier, or an actuator assembly 31 may be attached to the carrier head 30 to impart rotational motion to the microfeature workpiece 12 (indicated by arrow J) and/or reciprocate the workpiece 12 back and forth (indicated by arrow I).
- the planarizing pad 40 and a planarizing solution 44 define a planarizing medium that mechanically and/or chemically-mechanically removes material from the surface of the microfeature workpiece 12.
- the planarizing solution 44 may be a conventional CMP slurry with abrasive particles and chemicals that etch and/or oxidize the surface of the microfeature workpiece 12, or the planarizing solution 44 may be a "clean" nonabrasive planarizing solution without abrasive particles. In most CMP applications, abrasive slurries with abrasive particles are used on nonabrasive polishing pads, and clean nonabrasive solutions without abrasive particles are used on fixed-abrasive polishing pads.
- the carrier head 30 presses the workpiece 12 facedown against the planarizing pad 40. More specifically, the carrier head 30 generally presses the microfeature workpiece 12 against the planarizing solution 44 on a planarizing surface 42 of the planarizing pad 40, and the platen 20 and/or the carrier head 30 moves to rub the workpiece 12 against the planarizing surface 42. As the microfeature workpiece 12 rubs against the planarizing surface 42, the planarizing medium removes material from the face of the workpiece 12.
- the force generated by friction between the microfeature workpiece 12 and the planarizing pad 40 will, at any given instant, be exerted across the surface of the workpiece 12 primarily in the direction of the relative movement between the workpiece 12 and the planarizing pad 40.
- a retaining ring 33 can be used to counter this force and hold the microfeature workpiece 12 in position. The frictional force drives the microfeature workpiece 12 against the retaining ring 33, which exerts a counterbalancing force to maintain the workpiece 12 in position.
- the CMP process must consistently and accurately produce a uniformly planar surface on workpieces to enable precise fabrication of circuits and photo- patterns.
- a nonuniform surface can result, for example, when material from one area of a workpiece is removed more quickly than material from another area during CMP processing.
- the downward pressure of the retaining ring causes the under-pad and the planarizing pad to deform, creating a standing wave inside the retaining ring. Consequently, the planarizing pad removes material more quickly from the region of the workpiece adjacent to the standing wave than from the regions of the workpiece radially outward and inward from the wave.
- the CMP process may not produce a planar surface on the workpiece.
- One approach to improve the planarity of a workpiece surface is to use a carrier head with interior and exterior bladders that modulate the downward forces on selected areas of the workpiece. These bladders can exert pressure on selected areas of the back side of the workpiece to increase the rate at which material is removed from corresponding areas on the front side.
- These carrier heads have several drawbacks.
- the typical bladder has a curved edge that makes it difficult to exert a uniform downward force at the perimeter.
- conventional bladders cover a fairly broad area of the workpiece which limits the ability to localize the downward force on the workpiece.
- conventional bladders are often filled with compressible air that inhibits precise control of the downward force.
- carrier heads with multiple bladders form a complex system that is subject to significant downtime for repair and/or maintenance causing a concomitant reduction in throughput.
- Figure 1 is a schematic cross-sectional side view of a portion of a rotary planarizing machine in accordance with the prior art.
- Figure 2 is a schematic cross-sectional view of a portion of a CMP machine for polishing a microfeature workpiece in accordance with one embodiment of the invention.
- Figure 3A is a schematic top planform view of a plurality of magnetic field sources for use in a CMP machine in accordance with an additional embodiment of the invention.
- Figure 3B is a schematic top planform view of a plurality of magnetic field sources for use in a CMP machine in accordance with an additional embodiment of the invention.
- Figure 4 is a schematic cross-sectional view of a portion of a CMP machine in accordance with another embodiment of the invention.
- Figure 5 is a schematic cross-sectional top view of an under-pad in accordance with yet another embodiment of the invention.
- Figure 6 is a schematic cross-sectional view of a portion of a CMP machine in accordance with still another embodiment of the invention.
- Figure 7 is a schematic cross-sectional view of a portion of a CMP machine in accordance with yet another embodiment of the invention.
- microfeature workpiece is used throughout to include substrates in or on which microelectronic devices, micro-mechanical devices, data storage elements, and other features are fabricated.
- microfeature workpieces can be semiconductor wafers, glass substrates, insulated substrates, or many other types of substrates.
- planarization and “planarizing” mean either forming a planar surface and/or forming a smooth surface (e.g., "polishing").
- One aspect of the invention is directed to a polishing machine for mechanical and/or chemical-mechanical polishing of microfeature workpieces.
- the machine includes a table having a support surface, an under-pad carried by the support surface, and a workpiece carrier assembly over the table.
- the under-pad has a cavity and the carrier assembly is configured to carry a microfeature workpiece.
- the machine further includes a magnetic field source configured to generate a magnetic field in the cavity and a magnetorheological fluid disposed within the cavity.
- the magnetorheological fluid changes viscosity within the cavity under the influence of the magnetic field source. The change in the viscosity of the magnetorheological fluid changes the compressibility of the under-pad.
- the magnetic field source is carried by the under-pad, the workpiece carrier assembly, or the table.
- the under-pad includes a first surface and a second surface, and the cavity is enclosed between the first surface and the second surface.
- the under-pad for use on a polishing machine in the mechanical and/or chemical-mechanical polishing of microfeature workpieces.
- the under-pad includes a body having a first surface, a second surface, and a cavity between the first and second surfaces. The first surface is juxtaposed to the second surface.
- the under-pad further includes a magnetorheological fluid in the cavity. The magnetorheological fluid changes viscosity within the cavity in response to a magnetic field.
- the cavity includes a plurality of cells arranged generally concentrically, in a grid, or in another pattern.
- the magnetic field source includes an electrically conductive coil or an electromagnet.
- Another aspect of the invention is directed to a method of polishing a microfeature workpiece with a polishing machine having a carrier head, a polishing pad, and an under-pad carrying the polishing pad.
- the method includes moving at least one of the carrier head and the polishing pad relative to the other to rub the microfeature workpiece against the polishing pad.
- the under-pad has a cavity and a magnetorheological fluid disposed within the cavity.
- the method further includes changing the compressibility of the under-pad by generating a magnetic field to change the viscosity of the magnetorheological fluid within the cavity of the under-pad.
- generating the magnetic field comprises energizing an electromagnet or an electrically conductive coil.
- FIG. 2 is a schematic cross-sectional view of a CMP machine 110 for polishing a microfeature workpiece 112 in accordance with one embodiment of the invention.
- the CMP machine 110 includes a platen 120, a workpiece carrier assembly 130 over the platen 120, and a planarizing pad 140 coupled to the platen 120.
- the workpiece carrier assembly 130 can be coupled to an actuator assembly 131 (shown schematically) to move the workpiece 112 across a planarizing surface 142 of the planarizing pad 140.
- the workpiece carrier assembly 130 includes a head 132 having a support member 134 and a retaining ring 133 coupled to the support member 134.
- the support member 134 can be an annular housing having an upper plate coupled to the actuator assembly 131.
- the retaining ring 133 can extend around the support member 134 and project toward the workpiece 112 below a bottom rim of the support member 134.
- the CMP machine 110 further includes a dynamic under-pad 150 that dynamically modulates its compressibility to control the polishing rate, defects, planarity, and other characteristics of the polishing process.
- the under-pad 150 has an upper surface 153 attached to the planarizing pad 140, a lower surface 154 attached to the platen 120, and a cavity 152 between the upper surface 153 and the lower surface 154.
- the cavity 152 is defined by a first surface 156, a second surface 157 opposite the first surface 156, and an outer surface 158.
- the cavity 152 is configured to hold a viscosity changing fluid to selectively change the compressibility of the under-pad 150.
- the under-pad 150 can be manufactured using polymers, rubbers, coated fabrics, composites, and/or any other suitable materials.
- the under-pad 150 has a thickness T of between approximately 0.5 mm to approximately 10 mm. In other embodiments, the thickness T of the under-pad 150 can be less than 0.5 mm or greater than 10 mm.
- the cavity 152 contains a magnetorheological fluid 160 that changes viscosity in response to a magnetic field.
- the viscosity of the magnetorheological fluid 160 can increase from a viscosity similar to that of motor oil to a viscosity of a nearly solid material depending on the polarity and magnitude of the magnetic field.
- the magnetorheological fluid 160 may experience a smaller change in viscosity in response to the magnetic field and/or the magnetorheological fluid 160 may decrease in viscosity in response to the magnetic field.
- the CMP machine 110 further includes a magnetic field source 170 that is configured to generate a magnetic field in the cavity 152 of the under-pad 150.
- the magnetic field source 170 includes an electromagnet that is selectively energized to generate the magnetic field.
- the magnetic field source 170 can be an electrically conductive coil, a magnet, or any other suitable device to generate the magnetic field in the cavity 152.
- the platen 120 includes a depression 122 that receives the magnetic field source 170. Accordingly, an upper surface 172 of the magnetic field source 170 and an upper surface 124 of the platen 120 carry the under-pad 150.
- the platen 120 may not carry the magnetic field source 170.
- the workpiece carrier assembly 130, the planarizing pad 140, and/or the under-pad 150 can carry the magnetic field source 170.
- the CMP machine 110 also includes a controller 190 operably coupled to the magnetic field source 170 to selectively energize the magnetic field source 170.
- the controller 190 selectively energizes the magnetic field source 170, which generates a magnetic field to change the viscosity of the magnetorheological fluid 160 within the cavity 152.
- the compressibility of the under-pad 150 decreases.
- the controller 190 can dynamically control in real time the compressibility of the under-pad 150 by varying the power applied to the magnetic field source 170 before, during, and/or after polishing workpieces.
- One embodiment of a process for polishing the workpiece 112 includes a first stage in which the under-pad 150 is generally hard and a second stage in which the under-pad 150 is generally compressible.
- the planarizing pad 140 efficiently creates a planar surface on the workpiece 112 without removing excessive amounts of material from the workpiece 112.
- the hard under-pad 150 can create a significant number of defects on the surface of the workpiece 112. For example, the defects can result from particles in the planarizing solution that become trapped between the planarizing pad 140 and the surface of the workpiece 112.
- the planarizing pad 140 removes the defects from the surface of the workpiece 112.
- the under-pad 150 is not compressible during the first stage of the polishing process because a compressible under-pad does not efficiently create a planar surface on the workpiece 112 and can cause dishing in low density areas of the workpiece 112.
- One feature of the CMP machine 110 of this embodiment is the ability to change the compressibility of the under-pad in real time during the polishing cycle.
- An advantage of this feature is the ability to obtain the benefits of polishing the workpiece using a hard under-pad and polishing the workpiece using a compressible under-pad at different stages of planarizing a workpiece. More specifically, the under-pad can efficiently create a planar surface on the workpiece and then remove the defects from the planar surface.
- Figures 3A and 3B are schematic top planform views of several configurations of magnetic field sources for use in CMP machines in accordance with additional embodiments of the invention.
- Figure 3A illustrates a plurality of magnetic field sources 270 arranged in a grid with a plurality of rows RrR 8 and a plurality of columns C ⁇ -C 8 .
- the magnetic field sources proximate to the perimeter can have a curved side that corresponds with the curvature of an under-pad.
- the magnetic field sources 270 can be operably coupled to a controller to generate magnetic fields in corresponding portions of an under-pad.
- the size of the magnetic field sources 270 can decrease to increase the resolution such that a much larger number of rows and columns can be used.
- Figure 3B is a schematic top planform view of a plurality of magnetic field sources 370 (identified individually as 370a-d) in accordance with another embodiment of the invention.
- a first magnetic field source 370a, a second magnetic field source 370b, and a third magnetic field source 370c have generally annular configurations and are arranged concentrically around a fourth magnetic field source 370d.
- the magnetic field sources 370 can be spaced apart from each other and/or arranged in other configurations such as in quadrants.
- FIG 4 is a schematic cross-sectional view of a CMP machine 410 in accordance with another embodiment of the invention.
- the CMP machine 410 can be similar to the CMP machine 110 discussed above with reference to Figure 2.
- the CMP machine 410 includes a platen 420, a workpiece carrier assembly 130 over the platen 420, and a planarizing pad 140 over the platen 420.
- the CMP machine 410 further includes an under-pad 450 between the platen 420 and the planarizing pad 140.
- the underpad 450 has a cavity 452 with a plurality of cells 452a-c and a magnetorheological fluid 160 disposed within the cells 452a- c.
- a first cell 452a and a second cell 452b have generally annular configurations and are arranged concentrically around a third cell 452c.
- the cells 452a-c are defined by a first surface 456, a second surface 457 opposite the first surface 456, a third surface 458, and a fourth surface 459 opposite the third surface 458.
- Discrete volumes of the magnetorheological fluid 160 are disposed within the cells 452a-c.
- an under-pad can include a different number of cells and/or the cells can be arranged in a different configuration.
- the CMP machine 410 also includes a plurality of magnetic field sources
- the magnetic field sources 470 are positioned to selectively generate magnetic fields in corresponding cells 452a-c.
- a first magnetic field source 470a is positioned to generate a magnetic field in the first cell 452a.
- discrete portions of the under-pad 450 can be compressible while other portions of the under-pad 450 are hard.
- a second magnetic field source 470b generates a magnetic field in the second cell 452b. Consequently, the region of the under-pad 450 defined by the second cell 452b is hard while the regions of the under-pad 450 defined by the first and third cells 452a and 452c are compressible.
- the magnetic field sources 470 are electrically conductive coils embedded in the under-pad 450 between a lower surface 454 and the second surface 457.
- a CMP machine may include a different number of magnetic field sources and/or the magnetic field sources may be positioned in other locations in the under-pad.
- the under-pad 450 can be used in conjunction with other configurations and/or types of magnetic field sources, such as magnetic field sources that are carried by the platen as described with reference to Figures 2-3B, 6 and 7.
- Figure 5 is a schematic cross-sectional top view of an under-pad 550 for use on a CMP machine in accordance with another embodiment of the invention.
- the under-pad 550 includes a plurality of cells 552 arranged in a grid with a plurality of columns CrC 8 and a plurality of rows R R 8 .
- the cells 552 are defined by a first surface 554, a second surface 555 opposite the first surface 554, a third surface 558, and a fourth surface 559 opposite the third surface 558.
- the cells 552 proximate to the perimeter have a curved side that corresponds with the curvature of the under-pad 550.
- the cells 552 are configured to receive discrete portions of the magnetorheological fluid 160 ( Figure 4).
- the size of the cells 552 can decrease to increase the resolution such that a much larger number of rows and columns can be used.
- FIG. 6 is a schematic cross-sectional view of a CMP machine 610 in accordance with another embodiment of the invention.
- the CMP machine 610 can be similar to the CMP machine 110 discussed above with reference to Figure 2.
- the CMP machine 610 includes a planarizing pad 140, an underpad 150 carrying the planarizing pad 140, a platen 620 carrying the under-pad 150, and a workpiece carrier assembly 630 over the planarizing pad 140.
- the under-pad 150 has a cavity 152 containing a magnetorheological fluid 160.
- the workpiece carrier assembly 630 includes a head 632 having a support member 634 and a retaining ring 633 coupled to the support member 634.
- the support member 634 can include a plurality of magnetic field sources 670 that are configured to generate magnetic fields in at least a portion of the cavity 152 proximate to the workpiece carrier assembly 630. Accordingly, the CMP machine 610 can selectively control the compressibility of the under-pad 150 proximate to the workpiece carrier assembly 630.
- FIG. 7 is a schematic cross-sectional view of a CMP machine 710 in accordance with another embodiment of the invention.
- the CMP machine 710 can be similar to the CMP machine 110 discussed above with reference to Figure 2.
- the CMP machine 710 includes a workpiece carrier assembly 130, a planarizing pad 140, an under-pad 750 carrying the planarizing pad 140, a platen 720 carrying the under-pad 750, and a magnetic field source 770 carried by the platen 720.
- the under-pad 750 has a cavity 752 containing a magnetorheological fluid 160.
- the CMP machine 710 further includes a reservoir 762 in fluid communication with the cavity 752 and a pump 764 to transfer the magnetorheological fluid 160 between the cavity 752 and the reservoir 762.
- a conduit 768 extending through an aperture 726 in the platen 720 and an aperture 772 in the magnetic field source 770 couples the cavity 752 to the reservoir 762 and the pump 764.
- the pump 764 can transfer a portion of the magnetorheological fluid 160 from the reservoir 762 to the cavity 752 to increase the pressure in the cavity 752. The increased pressure in the cavity 752 accordingly reduces the compressibility of the under-pad 750.
- the pump 764 can transfer a portion of the magnetorheological fluid 160 from the cavity 752 to the reservoir 762 to increase the compressibility of the under-pad 750.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006513312A JP2006524587A (en) | 2003-04-28 | 2004-04-26 | Polishing machine and method including an underpad for mechanically and / or chemically mechanically polishing a micro-shaped workpiece |
EP04750645A EP1635991A1 (en) | 2003-04-28 | 2004-04-26 | Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US10/425,467 | 2003-04-28 | ||
US10/425,467 US6935929B2 (en) | 2003-04-28 | 2003-04-28 | Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces |
Publications (1)
Publication Number | Publication Date |
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WO2004098832A1 true WO2004098832A1 (en) | 2004-11-18 |
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ID=33299516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/US2004/012760 WO2004098832A1 (en) | 2003-04-28 | 2004-04-26 | Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces |
Country Status (7)
Country | Link |
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US (1) | US6935929B2 (en) |
EP (1) | EP1635991A1 (en) |
JP (1) | JP2006524587A (en) |
KR (1) | KR20060020614A (en) |
CN (1) | CN1805823A (en) |
TW (1) | TWI288047B (en) |
WO (1) | WO2004098832A1 (en) |
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Also Published As
Publication number | Publication date |
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TWI288047B (en) | 2007-10-11 |
EP1635991A1 (en) | 2006-03-22 |
KR20060020614A (en) | 2006-03-06 |
US20040214514A1 (en) | 2004-10-28 |
US6935929B2 (en) | 2005-08-30 |
CN1805823A (en) | 2006-07-19 |
TW200510117A (en) | 2005-03-16 |
JP2006524587A (en) | 2006-11-02 |
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