WO2004100275A1 - White light emitting lamp - Google Patents
White light emitting lamp Download PDFInfo
- Publication number
- WO2004100275A1 WO2004100275A1 PCT/US2004/010141 US2004010141W WO2004100275A1 WO 2004100275 A1 WO2004100275 A1 WO 2004100275A1 US 2004010141 W US2004010141 W US 2004010141W WO 2004100275 A1 WO2004100275 A1 WO 2004100275A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- lamp
- conversion material
- emitting
- led
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Definitions
- This invention relates to light emitting diodes (LEDs) and more particularly to an apparatus with multiple LEDs that in combination produce white light.
- LEDs are an important class of solid-state devices that convert electric energy to light. They generally comprise an active layer of semiconductor material sandwiched between two oppositely doped layers. When a bias is applied across the doped layers, holes and electrons are injected into the active layer where they recombine to generate light. Light is emitted omnidirectionally from the active layer and from all surfaces of the LED. Recent advances in LEDs (such as nitride based LEDs) have resulted in highly efficient light sources that surpass the efficiency of filament-based light sources, providing light with equal or greater brightness in relation to input power.
- white light can be produced by combining the light from red, green and blue emitting LEDs, or combining the light from blue and yellow LEDs.
- NSPW300BS, NSPW312BS, etc. See also U.S. Patent No. 5959316 to Hayden, "Multiple Encapsulation of Phosphor-LED Devices”] .
- the surrounding phosphor material "downconverts" the wavelength of at least some of the LED light, changing its color. For example, if a nitride-based blue emitting LED is surrounded by a yellow phosphor, some of the blue light passes through the phosphor without being changed while a substantial portion of the remaining light is downconverted to yellow. The LED will thus emit both blue and yellow light, which combine to provide a white light.
- This approach has been successfully used to commercialize white LEDs for a variety of applications such as flashlights, indicator lights, display backlighting, and architectural lighting.
- the resulting white light is produced without a red light source. Since the resulting light is typically deficient in one of the primary colors, lamps fabricated in this manner display poor color rendering.
- the desired spectrum can be more closely achieved using a combination of a blue LED with two separate phosphors emitting in the green and red spectral regions, or using an ultra violet LED with red, green and blue phosphors.
- suitable red phosphors having high conversion efficiency and the desired excitation and emission characteristics have yet to be reported. Even if such red phosphors were available, they would be subject to significant energy (Stokes) losses due to the conversion of high energy blue or UV photons to lower energy red photons .
- Patent Publication No. US 2002/0070681 Al to Shimizu discloses an LED lamp exhibiting a spectrum closer to the desired spectrum.
- the lamp has a blue LED for producing a blue wavelength light, a red emitting LED, and a phosphor which is photoexcited by the emission of the blue LED to exhibit luminescence having an emission spectrum wavelength between the blue and red wavelength spectrum.
- the phosphor is preferably a yellow or green emitting phosphor and in the embodiments shown, the phosphor covers both the red and blue LEDs .
- One of the disadvantages of the Shimizu lamp is that blue LEDs are not as efficient as other LEDs emitting at other wavelength spectrums and a limited number of phosphors are available for luminescence from a blue wavelength of light.
- Another disadvantage is that with red and blue LEDs placed side by side, the projected light may have an asymmetric appearance such that the light appears red on one side and blue on the other. Since phosphor particles typically must be on the order of at least a few microns diameter to achieve high conversion efficiency
- Shimizu Another disadvantage of a number of the embodiments disclosed in Shimizu is that they show blue and red LEDs placed on top of one another and then covered by the phosphor. This can result in the shorter wavelength blue light being absorbed by the component device layers (e.g., active layers, metallization layers) of the red LED device, thereby decreasing the overall efficiency of the lamp. Also, by covering the red LED with phosphor some of the phosphor particles may absorb some of the red light, which can result in a loss of efficiency because it is generally not possible to "up-convert" the absorbed red light to higher energy green light in an efficient manner. Shimizu also discloses an optical lens as part of its lamp, with the inside surface of the lens being roughened to increase mixing of the LED light. Such approaches are generally not effective and can decrease efficiency by interfering with the purpose of the lens, which is to reduce backscattering of light at the lens/air interface and possible subsequent re-absorption within the body of the lamp or LED.
- the component device layers e.g., active
- Solid-state semiconductor lasers convert electrical energy to light in much the same way as LEDs. They are structurally similar to LEDs but include mirrors on two opposing surfaces, one of which is partially transmissive. In the case of edge emitting lasers, the mirrors are on the side surfaces; the mirrors provide optical feedback so that stimulated emission can occur. This stimulated emission provides a highly collimated/coherent light source.
- a vertical cavity laser works much the same as an edge emitting laser but the mirrors are on the top and the bottom. It provides a similar collimated output from its top surface.
- a white light emitting lamp according to the present invention comprises a solid state ultra violet (UV) emitter (e.g., laser or LED) that emits light in the UV wavelength spectrum.
- a conversion material is arranged to absorb at least some of the light emitting from the UV emitter and re-emit light at one or more different wavelengths of light.
- One or more complimentary solid-state emitters are included that emit wavelength spectrums of light that are different than the UV emitter and the conversion material.
- the lamp emits a white light combination of light emitted from the complimentary emitters and from the conversion material, with the white light having high efficacy and good color rendering.
- a second embodiment of white light emitting lamp comprises a solid-state laser emitting light in a first wavelength spectrum.
- a conversion material is arranged to absorb at least some of the light emitting from the laser and re-emits light at one or more different wavelength spectrums of light.
- One or more complimentary solid-state emitters are included that emit wavelengths of light different than the laser and the conversion material.
- the lamp emits a white light combination of light emitted from the laser, complimentary emitters, and conversion material, the white light having high efficacy and good color rendering.
- the lamp may also incorporate various optics or scattering materials/surfaces to promote mixing and dispersion or mixing and focusing of the component light colors.
- a white light emitting lamp comprises a first solid state emitter that emits light in a first wavelength spectrum.
- a conversion material is included to absorb at least some of the light from the first solid-state emitter and emit light at one or more different wavelength spectrums.
- One or more complimentary emitters are included with each emitting light at a wavelength spectrum different from said first wavelength spectrum and said conversion material wavelength spectrums.
- Scattering elements (such as particles, microviods, etc.) are arranged to scatter the light from the first emitter, conversion material and complimentary emitters.
- the lamp emits a uniform white light combination of light from the first emitter, conversion material and complimentary emitters.
- An embodiment of a high flux white emitting lamp comprises a large area light emitting diode (LED) that emits light at a first wavelength spectrum.
- a conversion material is arranged to absorb at least some of the light from the large area LED and re-emit at least one wavelength light in a spectrum different from the first wavelength spectrum.
- a plurality of complimentary solid-state emitters surround the large area LED, with each emitter emitting light in a spectrum different from the large area LED and conversion material.
- the lamp emits a balanced and uniform white light combination of light from the large area LED, conversion material and complimentary emitters.
- the white light also has high efficacy and good color rendering.
- One embodiment of a method for producing white light with high efficacy and good color rendering comprises generating light in the UV wavelength spectrum and passing the UV light through a conversion material that absorbs the UV light and re-emits light at one or more different wavelength spectrums.
- the method further comprises generating complimentary light at one or more wavelength spectrums, each of which is different from the conversion material wavelength spectrums.
- the conversion material light and the complimentary light are combined to generate white light with high efficacy and good color rendering.
- Another method for producing white light with high efficacy and good color rendering comprises generating laser light that is passed through a conversion material that absorbs at least some of the laser light and re-emits light at one or more different wavelength spectrums.
- the method further comprises generating complimentary light at one or more wavelength spectrums that is different from the wavelength spectrum for the conversion material light and combining the conversion material light and said complimentary light to generate white light with high efficacy and good color rendering.
- FIG. 1 is a sectional view of one embodiment of a lamp according to the present invention comprising a red LED, a UV LED, and conversion material covering the UV LED;
- FIG. 2 is a sectional view of another embodiment of a lamp according to the present invention that is similar to the lamp in FIG. 1, with the conversion material also covers the red LED;
- FIGs. ' 3 is a sectional view of another embodiment of a lamp according to the present invention comprising a green LED, red LED, UV LED, and conversion material covering the UV LED;
- FIG. 4 is a sectional view of another embodiment of a lamp according to the present invention that is similar to the lamp in FIG. 3, with the conversion material covering all of the LEDs;
- FIGs. 5 is a sectional view of another embodiment of another lamp according to the present invention comprising a blue LED, red LED, UV LED, and conversion material covering the UV LED;
- FIG. 6 is a sectional view of another embodiment of a lamp according to the invention that is similar to the lamp in FIG. 5, with the conversion material covering all of the LEDs ;
- FIGs. 7 is a sectional view of another embodiment of a lamp according to the present invention, with a red LED, blue laser and conversion material covering the blue laser;
- FIG. 8 is a sectional view of another embodiment of a lamp according to the present invention that is similar to the lamp in FIG. 7, with a different conversion material covering the blue laser;
- FIG. 9 is a sectional view of another embodiment of a lamp according to the present invention that is similar to the lamp in FIGs. 7 or 8, with the conversion material also covering the red LED;
- FIG. 10 is a sectional view of another embodiment of a lamp according to the present invention comprising blue LEDs covered by a yellow conversion material and two red lasers;
- FIG. 11 is a plan view of another embodiment of a lamp according to the present invention comprising a large area LED surrounded by complementary LEDs;
- FIG. 12 is a sectional view of the lamp in FIG. 11, taken along section lines 12-12;
- FIG. 13 is a sectional view of another embodiment of a white emitting lamp according to the present invention comprising scattering particles in its conversion material;
- FIG. 14 is a sectional view of another embodiment of a lamp according to the present invention comprising scattering particles in its epoxy
- FIG. 15 is a sectional view of another embodiment of a lamp according to the present invention comprising a layer of scattering particles
- FIG. 16 is a sectional view of another embodiment of a lamp according to the present invention comprising a clear/transparent material between the emitters and conversion material .
- FIG. 1 shows one embodiment of a multi-component solid-state lamp white lamp 10 constructed in accordance with the invention. It comprises a first light emitter 12 that emits in the ultraviolet wavelength spectrum. Alternatively, the first light emitter 12 can emit light in other "short" wavelength spectrums.
- the emitter 12 is preferably a light emitting diode (LED) , but it can also be other emitters, such as a solid-state laser or organic light emitting diode.
- the lamp 10 further comprises a complimentary second light emitter 14 that emits in the red wavelength spectrum and is also preferably a LED, but can also be a solid-state laser or organic light emitting diode .
- the details of operation and fabrication of conventional LEDs are known and are only briefly discussed.
- LEDs can be fabricated from a number of material systems by known methods, with a suitable method being fabrication by Metal Organic Chemical Vapor Deposition (MOCVD) .
- LEDs typically have an active layer sandwiched between two oppositely doped layers that are either doped p-type or n-type.
- the top layer of the LED is usually p-type and bottom layer 13 is usually n-type, although LEDs also work if the layers are reversed.
- the p- type and n-type layers have respective contacts that each have a lead to apply a bias across p- and n-type layers. This bias results in the active layer emitting light omnidirectionally.
- the entire LED can be grown on a substrate .
- the first and second LEDs 12, 14 are mounted on a submount 16 for mechanical stability.
- the submount 16 can also contain electrical circuitry for controlling the relative amount of current or power applied to the respective LEDs 12, 14, or to otherwise modify the electric signal applied to the LEDs 12, 14.
- the submount 16 can also contain components and circuitry to make the lamp resistant to electrostatic shock.
- one or both of the LEDs 12, 14 can be in electrical contact with the submount 16.
- the submount 16 is mounted at the horizontal base 17 of "metal cup" 18 that typically has conductive paths (not shown) for applying a bias across the contacts on the LEDs 12, 14, to cause each of the LEDs to emit light.
- the bias can either be applied directly to the LEDs along the conductive paths or it can be applied to the LEDs fully or partially through the submount 16 and its electronic circuitry.
- the cup 18 can have a reflective surface 20 that reflects light emitted from the LEDs 12,14 so that it contributes to the light emitted from the lamp 10.
- the lamp 10 further comprises a conversion material 22 that surrounds the first UV emitter 12 except for the surface of the emitter 12 that is adjacent to the submount.
- the material 22 can be one or more flourescent or phosphorescent material such as a phosphor, flourescent dye or photoluminescent semiconductor.
- the material 22 absorbs at least some of the electromagnetic radiation (light) emitted by the UV LED 12 and re-emits at least some of the absorbed radiation at one or more wavelength spectrums that are different from the absorbed wavelength.
- the conversion material 22 has a combination of materials that absorb UV light and re-emit light in the green and blue wavelength spectrums.
- Different materials can be used for absorbing the UV light and re- emitting green light, with a preferred material being a Sr : thiogallate phosphor. Different materials can also be used for absorbing UV light and re-emitting blue light, with a preferred material being ZnS or BaMgAl 10 O 17 doped with appropriate impurities.
- the LEDs 12,14, submount 16, and conversion material 22 can be encased in and protected by a clear epoxy 24 that fills the metal cup 16.
- the UV and red LEDs 12, 14, emit light at their respective characteristic spectrum. At least some of the UV light is absorbed by the conversion material 22 and re-emitted as green and blue light.
- the combination of blue, green light from the conversion material, and red light from the red LED, provides white light with high efficacy and color rendering that appears white when viewed by the human eye .
- the lamp 10 shows the combination of a blue and green light being re-emitted from the conversion material, but in an alternative embodiment according to the present invention, a yellow emitting phosphor can be used instead of green.
- a full range of broad yellow spectral emission is possible using phosphors based on the (Gd, Y) 3 (Al, Ga) 5 0 ⁇ 2 : Ce system. These phosphors are stable and typically display high conversion efficiency when excited using UV light.
- the combination of light from these phosphors, along with light from the blue emitting phosphor and red LED provide a versatile white lamp with high efficacy and high color rendering .
- UV emitter 12 with a conversion material 22 to convert UV to blue/green or blue/yellow light has a number of advantages .
- Higher efficiency UV emitters are available compared to blue or green emitters and in the case of solid-state lasers, short wavelength lasers are more easily achieved than blue lasers.
- a wider variety of high efficiency phosphors are available which can be excited by short wavelength radiation (250-400 nm) .
- FIG. 2 shows another embodiment of a solid state white lamp 30 according to the present invention. It has the same submount 16, first UV LED 12, second red LED 14, metal cup 18 and epoxy 24. However, the lamp 30 has a conversion material 32 that covers both the UV and red LEDs 12, 14, with the conversion material absorbing the UV light and re- emitting in the blue and green wavelength spectrum. Most of the light emitted by the red LED is not absorbed by the conversion material, and passes through to contribute to emission by the lamp 30.
- the UV and red LEDs 12, 14 can be placed as close together as practical. By covering both the LEDs 12, 14 with the conversion material 32, the manufacturing problems and reduced yield associated with covering only one LED, can be avoided. However, covering the red LED with the conversion material may result in some of the red light being absorbed as it passes through the conversion material.
- FIGs. 3 and 4 show additional embodiments of a lamp 40, 60, according to the present invention, with each of the lamps having a UV emitter 42, used in combination with complimentary green and red emitters 44, 46.
- the emitters are preferably LEDs, although other devices can also be used.
- Each of the LEDs 42, 44, 46 is mounted on a submount 48 similar to the submount 16 in FIGs. 1 and 2, and in each embodiment the submount 48 is mounted at the base of a metal cup 50 that is similar to the metal cup 18 in FIGs. 1 and 2.
- the cup 50 includes conductive paths (not shown) for applying a bias across the LEDs 42, 44, 46, to cause each of them to emit light .
- the bias can either be applied directly to the emitters or can be applied through the submount 48 and its electronic circuitry.
- the lamps 40 and 60 can also be encased in an epoxy 54 that fills the cup 50 to cover and protect the lamp components.
- the LEDs 42, 44, 46 produce light at their respective wavelength spectrum.
- the UV emitter 42 is covered by a blue conversion material 52 made of ZnS or BaMgAl 10 O 17 doped with appropriate impurities or another suitable blue-converting material, such that at least some of the UV light from the UV emitter 42 is absorbed by the conversion material 52 and re-emitted as blue light.
- the lamp 40 simultaneously radiates blue, green and red light, which combine to produce a white light having high efficacy and high color rendering.
- all of the LEDs 42, 44, 46 are covered by the blue conversion material 56. Light from the UV LED 42 is absorbed by the conversion material 56 and re-emitted as blue light. Most of the light from the green and red LEDs 44, 46 passes through the conversion material 56 without being absorbed, such that the lamp 60 emits a white combination of the blue, green and red light.
- FIGs . 5 and 6 show additional embodiments of a lamp 70, 90, according to the present invention, with each having a UV emitter 72, used in combination with a blue emitter 74 and a red emitter 76.
- Each of the emitters 72, 74, 76 is preferably an LED and each is mounted on a submount 78 similar to the submount 16 in FIGs. 1 and 2.
- the submount 78 is mounted at the base of a metal cup 80 that is similar to the cup 18 in FIGs. 1 and 2.
- Conductive paths (not shown) are included for applying a bias across the LEDs 72, 74, 76, to cause each of them to emit light.
- Each of the lamps also includes a clear epoxy 82 to cover and protect the lamp components.
- the UV LED 72 is covered by a conversion material 84 (e.g. thiogallate phosphor) that absorbs UV light and re-emits green light.
- a similar conversion material 86 covers the UV LED 72 and also covers the red and blue LEDs 74, 76.
- the LEDs 72, 74, 76 emit in their respective wavelength spectrums when a bias is applied and the UV wavelength light from each UV LED 72 is absorbed by the respective conversion material 84, 86 and re-emitted as green light.
- the green light combines with the direct light from the blue and green emitters 74, 76.
- the green light combines with the blue and red light that passes through the conversion material 86.
- the lamps 70, 90 emit a white light combination of red, blue and green.
- the particular conversion material such that it absorbs essentially all of the UV light from its particular UV emitter. UV light is not useful for illumination and at certain intensity levels can be harmful to eyes or skin.
- the optimal arrangement may require a plurality of LEDs of one or both types. Further, the LEDs shown can have larger or smaller emission areas.
- FIG. 7 shows another embodiment of a lamp 100 according to the present invention. It comprises a solid- state laser 102 and a complimentary second emitter 106 that are both mounted to a submount 108 similar to the submounts described above. Conductive paths can be included to apply a bias across the laser 102 and second emitter 106, and the device can then be mounted to the bottom of a metal cup 110, filled with epoxy. A conversion material 104 is included that covers the laser 102 and absorbs blue light and re-emits in a different wavelength spectrum than the light from the laser 102. For the lamp 100, the laser 102 preferably emits blue wavelength spectrum, although other types of lasers can be used.
- the conversion material 104 is preferably made of a material that absorbs blue light and re-emits green light.
- the emitter 106 is preferably a LED that emits in the red light spectrum. When a bias is applied across the laser 102 and the LED 106, the laser 102 emits in the blue light wavelength spectrum and a suitable amount of conversion material 104 is included so that less than all of the blue light is absorbed by the conversion material 104 and some of the blue light passes through.
- the red LED 106 emits red light and the conversion material 104 re-emits green light such that the lamp 100 emits a white light combination of the red, green and blue light, with high efficacy and good color rendering.
- Lasers have the advantage of emitting a coherent light source that can be selectively scattered or directed. As lasers are further developed they may become preferable over LEDs, because they have the potential for higher efficiency and higher output than LEDs.
- FIG. 8 shows another lamp 120 according to the present invention that is similar to the lamp 100 in FIG. 7. It includes a blue emitting laser 122 and a red emitter 124 that is preferably a LED.
- the laser 122 and red LED 124 are mounted to a submount 123, and the submount 123 can then be mounted to the bottom of a metal cup 128.
- the blue laser 122 is covered by a yellow conversion material 130 that absorbs blue light and re-emits yellow light.
- the yellow conversion material 130 absorbs some of the blue light and emits yellow light such that the lamp 100 emits a white light combination of blue, yellow and red light having good efficacy and color rendering.
- the conversion material can cover the laser and complimentary LED.
- FIG. 9 shows another embodiment of a lamp 140 according to the present invention that includes a blue emitting laser 142 and a red emitting LED 144 mounted on a submount 146.
- a conversion material 148 covers the laser 142 and the red LED 144.
- the conversion material 148 contains material that absorbs some of the lasers blue light and re-emits green (or yellow) . Most of the light from the red LED 144 passes through the conversion material 148 such that the lamp 140 emits a white light combination of blue, green (or yellow) and red light.
- FIG. 10 shows another embodiment of a similar lamp 150 according to the present invention having two blue emitting LEDs 152 between two red solid-state lasers 154.
- the blue LEDs 152 are covered by a conversion material 156 that absorbs blue light and re-emits green light.
- the conversion material absorbs some of the blue light such that the lamp 150 emits a white light combination of blue, green and red light.
- the conversion material 156 covers the blue LEDs 152 and the red lasers 154.
- blue LEDs may be combined with red lasers, with at least some of the light emitted from the blue laser converted to light of another wavelength by a downconverting media according to the present invention.
- the prior art lamps can produce a projected light that can have an asymmetric appearance.
- lamp embodiments with a blue emitter, conversion material, and red emitter can appear as though the projected light is more red on one side and more blue on the other.
- multiple complimentary LEDs can be used to surround each large area LED (or to surround a group of large area LEDs) such that the high luminous flux of the large area LED is balanced by the surrounding LEDs .
- This type of arrangement in a single package can also provide advantages in heat sinking, compactness and color mixing.
- FIGs. 11 and 12 show a lamp 160 according to the present invention having a large area LED 162 surrounded by a plurality of complimentary LEDs 164.
- the LEDs are mounted to a submount 166, which can then be mounted to the base of a metal cup 167.
- Many different large area LEDs can be used, with a suitable large area LED 164 being a blue emitting LED.
- a conversion material 168 covers the LED 162 with the preferred conversion material 168 absorbing the blue light and re- emitting yellow light. In another embodiment of the lamp 160, the conversion material 168 absorbs blue light and re- emits green light.
- the surrounding LEDs 164 emit red light and are spaced around the LED 162 in a sufficient number to provide a balance to the high flux of the LED 162 such that the lamp emits a balanced white light.
- the lamp 160 has four surrounding LEDs 164 around the large area LED 162, but a different number of surrounding LEDs 164 can be used depending on the intensity of the large area LED 162, and the size and intensity of the surrounding LEDs 164. When the large area LED 162 and surrounding LEDs 164 are emitting, the lamp 160 emits a balanced white light combination of the blue, green and red light.
- the components of the lamp 160 can be encased in epoxy 169 and the submount 166 and/or metal cup 167 can have conductors to apply a bias to the LEDs 162, 164.
- the conversion material can cover all the LEDs 162, 164 and different colors of LED 162, 164 can be used. Scattering Particles
- One way to scatter light is by using scattering particles that randomly refract light.
- the diameter of these particles should be approximately one half of the wavelength of the light being scattered. In air, this would result in the particles being approximately 0.2 to 0.25 microns in diameter and the diameters would be smaller if the particles are in a medium having a different index of refraction than air such as epoxy.
- a conversion material typically surrounds at least one of the emitters and typically comprises phosphor particles.
- the conversion efficiency of phosphors generally decreases as the size of the phosphor particles decrease. As a result, it is difficult to obtain high conversion efficiency phosphors particles that are smaller than approximately 1 micron in diameter, making phosphor particles generally too large to effectively scatter light.
- scattering particles can be included such that light from the emitters passes through them and is refracted to mix the light and provide an overall light emission that is more uniform in color and intensity.
- the scattering particles can be arranged in different locations, such as in the conversion material or epoxy, or the particles can form their own layer.
- the preferred scattering particles would not substantially absorb light at any of the wavelengths involved and would have a substantially different index of refraction than the material in which it is embedded (for example, epoxy)
- the scattering particles should have as high of an index of refraction as possible.
- FIG. 13 shows one embodiment of a lamp 170, according to the present invention, having a UV emitting LED 172 and red emitting LED 174 mounted on a submount 176 along with the necessary conductive paths.
- a conversion material 178 is included that covers both the UV and red LEDs 172, 174 such that light from the LEDs passes through the conversion material 178.
- the conversion material 178 contains scattering particles 180 disposed to refract the light passing through the conversion material 178.
- Each of the scattering particles 180 can be similarly sized so that they primarily scatter a single wavelength of light, such as from the UV LED 72, or they can have different sizes to scatter light of different wavelengths of light, such as from the LEDs 172, 174 and the conversion material 178.
- the LEDs 172, 174, conversion material 178, and submount 176 are in a metal cup 182 and are encased in an epoxy 184.
- FIGs. 14 and 15 show two additional embodiments of a lamp 190, 200, according to the present invention.
- Each lamp 190, 200 has a UV and red LED 172, 174, a submount 176, and a conversion material 178, all of which are in a metal cup 182 and epoxy 184.
- the scattering particles 192 are disposed in the epoxy 184.
- the scattering particles 194 are formed in a layer on top of the epoxy 184.
- the light from the LEDs 172, 174 and conversion material 176 passes through the scattering particles 192, 194 where different wavelengths of light can be refracted depending on the size and material of the particles 192, 194.
- the scattering particles 192, 194 can be similarly sized or can have different sizes depending on the wavelength of light emitted from the LEDs 172, 174 and the conversion material 176.
- FIG. 16 shows another embodiment of a lamp 210 according to the present invention having a clear material 212, such as an epoxy, arranged over the emitters 214, 216, which in this embodiment are UV and red emitting LEDs respectively.
- the material 212 preferably forms a hemispheric volume with the LED 212, 216 as close as practical to the origin of the hemisphere.
- the hemisphere should have a large radius compared to the dimensions of the LEDs.
- the material 212 preferably has an index of refraction approximately the same as the primary surfaces of the LEDs 214, 216 from which most of the light is emitted (e.g.
- the intensities of the individual LEDs (and lasers) can be controlled. This can be accomplished by controlling the relative emission of the LEDs through control of the applied current, and controlling the blue/green emission of the conversion material by controlling the amount and location of the conversion material. This type of control allows the lamps to emit at color points not accessible using the blue LED/yellow phosphor approach.
- This control/adjustability could also enhance manufacturing yield by selecting and matching the emission characteristics of the different LEDs (peak emission wavelength, etc.), thereby allowing the fabrication of lamps having very tight spectral distribution (color, hue, etc.) over a large range of color temperature.
- a lamp according to the invention could be provided that allows the end user to control the relative powers applied to the respective LEDs. The lamp could be "tuned” by the user to achieve desired colors or hues from a single lamp. This type of control can be provided by known control electronics.
- the lamps according to the present invention can also include lenses and facets to control the direction of the lamp's emitting light.
- Other components could be added related to thermal management, optical control, or electrical signal modification and control, to further adapt the lamps to a variety of applications.
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/427,274 | 2003-05-01 | ||
US10/427,274 US7005679B2 (en) | 2003-05-01 | 2003-05-01 | Multiple component solid state white light |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004100275A1 true WO2004100275A1 (en) | 2004-11-18 |
Family
ID=33310093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/010141 WO2004100275A1 (en) | 2003-05-01 | 2004-03-31 | White light emitting lamp |
Country Status (3)
Country | Link |
---|---|
US (3) | US7005679B2 (en) |
TW (1) | TWI344705B (en) |
WO (1) | WO2004100275A1 (en) |
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006119750A2 (en) * | 2005-05-11 | 2006-11-16 | Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg | Spotlight for shooting films and videos |
EP1766692A1 (en) * | 2004-05-06 | 2007-03-28 | Seoul Opto Device Co., Ltd. | Light emitting device |
WO2007069148A2 (en) * | 2005-12-14 | 2007-06-21 | Koninklijke Philips Electronics N.V. | Semiconductor light source and method of producing light of a desired color point |
EP1850383A1 (en) * | 2006-04-25 | 2007-10-31 | ILED Photoelectronics Inc. | Three wavelength light emitting diode |
JP2008235458A (en) * | 2007-03-19 | 2008-10-02 | Toshiba Corp | White light emitting device, backlight using same device, display using same device, and illuminating apparatus using same device |
US7826698B1 (en) | 2007-12-19 | 2010-11-02 | Oree, Inc. | Elimination of stitch artifacts in a planar illumination area |
US8128272B2 (en) | 2005-06-07 | 2012-03-06 | Oree, Inc. | Illumination apparatus |
EP2448020A1 (en) * | 2009-06-23 | 2012-05-02 | Koito Manufacturing Co., Ltd. | Light emitting module |
US8182128B2 (en) | 2007-12-19 | 2012-05-22 | Oree, Inc. | Planar white illumination apparatus |
US8215815B2 (en) | 2005-06-07 | 2012-07-10 | Oree, Inc. | Illumination apparatus and methods of forming the same |
US8231237B2 (en) | 2008-03-05 | 2012-07-31 | Oree, Inc. | Sub-assembly and methods for forming the same |
US8272758B2 (en) | 2005-06-07 | 2012-09-25 | Oree, Inc. | Illumination apparatus and methods of forming the same |
US8297786B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
US8301002B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
US8328406B2 (en) | 2009-05-13 | 2012-12-11 | Oree, Inc. | Low-profile illumination device |
US8431954B2 (en) | 2007-08-28 | 2013-04-30 | Seoul Semiconductor Co., Ltd. | Light emitting device employing non-stoichiometric tetragonal alkaline earth silicate phosphors |
CN103165645A (en) * | 2011-12-09 | 2013-06-19 | 索尼公司 | Display unit and method of manufacturing the same, electronic apparatus, illumination unit, and light-emitting device and method of manufacturing the same |
US8476820B2 (en) | 2006-11-01 | 2013-07-02 | Wake Forest University | Solid state lighting compositions and systems |
US8501040B2 (en) | 2007-08-22 | 2013-08-06 | Seoul Semiconductor Co., Ltd. | Non-stoichiometric tetragonal copper alkaline earth silicate phosphors and method of preparing the same |
US8591072B2 (en) | 2011-11-16 | 2013-11-26 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
US8624527B1 (en) | 2009-03-27 | 2014-01-07 | Oree, Inc. | Independently controllable illumination device |
US8727597B2 (en) | 2009-06-24 | 2014-05-20 | Oree, Inc. | Illumination apparatus with high conversion efficiency and methods of forming the same |
US9312246B2 (en) | 2006-03-31 | 2016-04-12 | Seoul Semiconductor Co., Ltd. | Light emitting device and lighting system having the same |
US9857519B2 (en) | 2012-07-03 | 2018-01-02 | Oree Advanced Illumination Solutions Ltd. | Planar remote phosphor illumination apparatus |
US10186642B2 (en) | 2004-05-13 | 2019-01-22 | Seoul Semiconductor Co., Ltd. | Light emitting device including RGB light emitting diodes and phosphor |
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
Families Citing this family (406)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6953341B2 (en) * | 2003-08-20 | 2005-10-11 | Oralum, Llc | Toothpick for light treatment of body structures |
KR101148332B1 (en) * | 2003-04-30 | 2012-05-25 | 크리, 인코포레이티드 | High powered light emitter packages with compact optics |
US7005679B2 (en) * | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
US8796030B2 (en) * | 2003-07-12 | 2014-08-05 | Parallel Synthesis Technologies, Inc. | Methods for optically encoding an object with upconverting materials and compositions used therein |
US7009213B2 (en) * | 2003-07-31 | 2006-03-07 | Lumileds Lighting U.S., Llc | Light emitting devices with improved light extraction efficiency |
US20050152145A1 (en) * | 2003-08-28 | 2005-07-14 | Currie Robert M. | Vehicle lighting system having an electronic module circuit and light emitting diodes |
US7569863B2 (en) * | 2004-02-19 | 2009-08-04 | Panasonic Corporation | Semiconductor light emitting device |
US7083302B2 (en) * | 2004-03-24 | 2006-08-01 | J. S. Technology Co., Ltd. | White light LED assembly |
US7355284B2 (en) | 2004-03-29 | 2008-04-08 | Cree, Inc. | Semiconductor light emitting devices including flexible film having therein an optical element |
US7868343B2 (en) * | 2004-04-06 | 2011-01-11 | Cree, Inc. | Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same |
US7514867B2 (en) * | 2004-04-19 | 2009-04-07 | Panasonic Corporation | LED lamp provided with optical diffusion layer having increased thickness and method of manufacturing thereof |
US7837348B2 (en) | 2004-05-05 | 2010-11-23 | Rensselaer Polytechnic Institute | Lighting system using multiple colored light emitting sources and diffuser element |
KR101256919B1 (en) | 2004-05-05 | 2013-04-25 | 렌슬러 폴리테크닉 인스티튜트 | High efficiency light source using solid-state emitter and down-conversion material |
US7045825B2 (en) * | 2004-05-28 | 2006-05-16 | Eastman Kodak Company | Vertical cavity laser producing different color light |
US8482663B2 (en) * | 2004-06-30 | 2013-07-09 | Osram Opto Semiconductors Gmbh | Light-emitting diode arrangement, optical recording device and method for the pulsed operation of at least one light-emitting diode |
US7534633B2 (en) * | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
JP5081370B2 (en) * | 2004-08-31 | 2012-11-28 | 日亜化学工業株式会社 | Light emitting device |
US7842526B2 (en) * | 2004-09-09 | 2010-11-30 | Toyoda Gosei Co., Ltd. | Light emitting device and method of producing same |
KR100524098B1 (en) * | 2004-09-10 | 2005-10-26 | 럭스피아 주식회사 | Semiconductor device capable of emitting light and the menufacturing mehtod of the same |
EP1812884A4 (en) * | 2004-10-22 | 2009-09-02 | Parallel Synthesis Technologie | Rare earth downconverting phosphor compositions for optically encoding objects and methods and apparatus relating to same |
US20060097385A1 (en) * | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
US7419839B2 (en) | 2004-11-12 | 2008-09-02 | Philips Lumileds Lighting Company, Llc | Bonding an optical element to a light emitting device |
US7462502B2 (en) * | 2004-11-12 | 2008-12-09 | Philips Lumileds Lighting Company, Llc | Color control by alteration of wavelength converting element |
US7404652B2 (en) * | 2004-12-15 | 2008-07-29 | Avago Technologies Ecbu Ip Pte Ltd | Light-emitting diode flash module with enhanced spectral emission |
US7564180B2 (en) | 2005-01-10 | 2009-07-21 | Cree, Inc. | Light emission device and method utilizing multiple emitters and multiple phosphors |
US8125137B2 (en) | 2005-01-10 | 2012-02-28 | Cree, Inc. | Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US7316488B2 (en) * | 2005-02-07 | 2008-01-08 | Philips Lumileds Lighting Company, Llc | Beam shutter in LED package |
TWI248220B (en) * | 2005-04-14 | 2006-01-21 | Genesis Photonics Inc | White light device having light-emitting diode |
US7350933B2 (en) * | 2005-05-23 | 2008-04-01 | Avago Technologies Ecbu Ip Pte Ltd | Phosphor converted light source |
US9412926B2 (en) * | 2005-06-10 | 2016-08-09 | Cree, Inc. | High power solid-state lamp |
US8669572B2 (en) | 2005-06-10 | 2014-03-11 | Cree, Inc. | Power lamp package |
CN100508224C (en) * | 2005-06-13 | 2009-07-01 | 新世纪光电股份有限公司 | White light apparatus with light-emitting diode |
WO2007002234A1 (en) | 2005-06-23 | 2007-01-04 | Rensselaer Polytechnic Institute | Package design for producing white light with short-wavelength leds and down-conversion materials |
US20070007542A1 (en) * | 2005-07-07 | 2007-01-11 | Sumitomo Electric Industries,Ltd. | White-Light Emitting Device |
US20070019129A1 (en) | 2005-07-20 | 2007-01-25 | Cree, Inc. | Independent control of light emitting diodes for backlighting of color displays |
US7345813B2 (en) * | 2005-07-21 | 2008-03-18 | Avago Technologies General Ip Pte Ltd | UV adjustable optical attenuator |
US20070039077A1 (en) * | 2005-08-10 | 2007-02-15 | Pentax Corporation | Endoscope |
JP2007116131A (en) * | 2005-09-21 | 2007-05-10 | Sanyo Electric Co Ltd | Led light emitting device |
KR100724591B1 (en) * | 2005-09-30 | 2007-06-04 | 서울반도체 주식회사 | Light emitting device and LCD backlight using the same |
US20070080364A1 (en) * | 2005-10-06 | 2007-04-12 | Bear Hsiung | White light emitting device capable of adjusting color temperature |
US20070080636A1 (en) * | 2005-10-07 | 2007-04-12 | Taiwan Oasis Technology Co., Ltd. | White multi-wavelength LED & its manufacturing process |
WO2007051035A1 (en) * | 2005-10-28 | 2007-05-03 | Parallel Synthesis Technologies, Inc. | Methods for fabricating optically encoded particles and methods for optically encoding objects with such particles |
US7993021B2 (en) * | 2005-11-18 | 2011-08-09 | Cree, Inc. | Multiple color lighting element cluster tiles for solid state lighting panels |
US7213940B1 (en) | 2005-12-21 | 2007-05-08 | Led Lighting Fixtures, Inc. | Lighting device and lighting method |
BRPI0620413A2 (en) * | 2005-12-21 | 2011-11-08 | Cree Led Lighting Solutions | lighting device and lighting method |
EP1963743B1 (en) * | 2005-12-21 | 2016-09-07 | Cree, Inc. | Lighting device |
EP1969633B1 (en) | 2005-12-22 | 2018-08-29 | Cree, Inc. | Lighting device |
US7772604B2 (en) * | 2006-01-05 | 2010-08-10 | Illumitex | Separate optical device for directing light from an LED |
US7569406B2 (en) * | 2006-01-09 | 2009-08-04 | Cree, Inc. | Method for coating semiconductor device using droplet deposition |
US8441179B2 (en) | 2006-01-20 | 2013-05-14 | Cree, Inc. | Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources |
EP1835537A1 (en) * | 2006-03-16 | 2007-09-19 | Centro Ricerche Plast-Optica S.r.l. | Light emission device and adjustment process for its chromaticity |
US8174032B2 (en) * | 2006-03-16 | 2012-05-08 | Light Engines Corporation | Semiconductor white light sources |
US7675145B2 (en) | 2006-03-28 | 2010-03-09 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
US7821194B2 (en) | 2006-04-18 | 2010-10-26 | Cree, Inc. | Solid state lighting devices including light mixtures |
US8998444B2 (en) * | 2006-04-18 | 2015-04-07 | Cree, Inc. | Solid state lighting devices including light mixtures |
TWI460880B (en) | 2006-04-18 | 2014-11-11 | Cree Inc | Lighting device and lighting method |
US8513875B2 (en) * | 2006-04-18 | 2013-08-20 | Cree, Inc. | Lighting device and lighting method |
US9921428B2 (en) | 2006-04-18 | 2018-03-20 | Cree, Inc. | Light devices, display devices, backlighting devices, edge-lighting devices, combination backlighting and edge-lighting devices |
US9084328B2 (en) * | 2006-12-01 | 2015-07-14 | Cree, Inc. | Lighting device and lighting method |
US7997745B2 (en) * | 2006-04-20 | 2011-08-16 | Cree, Inc. | Lighting device and lighting method |
KR100799864B1 (en) * | 2006-04-21 | 2008-01-31 | 삼성전기주식회사 | LED Package |
EP2011164B1 (en) | 2006-04-24 | 2018-08-29 | Cree, Inc. | Side-view surface mount white led |
US8748915B2 (en) | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
US11210971B2 (en) * | 2009-07-06 | 2021-12-28 | Cree Huizhou Solid State Lighting Company Limited | Light emitting diode display with tilted peak emission pattern |
US7635915B2 (en) | 2006-04-26 | 2009-12-22 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
JP4805026B2 (en) * | 2006-05-29 | 2011-11-02 | シャープ株式会社 | LIGHT EMITTING DEVICE, DISPLAY DEVICE, AND LIGHT EMITTING DEVICE CONTROL METHOD |
WO2007142947A2 (en) * | 2006-05-31 | 2007-12-13 | Cree Led Lighting Solutions, Inc. | Lighting device with color control, and method of lighting |
KR20140116536A (en) * | 2006-05-31 | 2014-10-02 | 크리, 인코포레이티드 | Lighting device and method of lighting |
US20090128781A1 (en) * | 2006-06-13 | 2009-05-21 | Kenneth Li | LED multiplexer and recycler and micro-projector incorporating the Same |
US7661840B1 (en) | 2006-06-21 | 2010-02-16 | Ilight Technologies, Inc. | Lighting device with illuminated front panel |
TWI309480B (en) * | 2006-07-24 | 2009-05-01 | Everlight Electronics Co Ltd | Led packaging structure |
US8735920B2 (en) * | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
US8367945B2 (en) | 2006-08-16 | 2013-02-05 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
CN101554089A (en) * | 2006-08-23 | 2009-10-07 | 科锐Led照明科技公司 | Lighting device and lighting method |
KR100771772B1 (en) * | 2006-08-25 | 2007-10-30 | 삼성전기주식회사 | White light led module |
KR101258227B1 (en) | 2006-08-29 | 2013-04-25 | 서울반도체 주식회사 | Light emitting device |
US7703942B2 (en) * | 2006-08-31 | 2010-04-27 | Rensselaer Polytechnic Institute | High-efficient light engines using light emitting diodes |
US20100224890A1 (en) * | 2006-09-18 | 2010-09-09 | Cree, Inc. | Light emitting diode chip with electrical insulation element |
DE102006051746A1 (en) * | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Optoelectronic component with a luminescence conversion layer |
US8087960B2 (en) * | 2006-10-02 | 2012-01-03 | Illumitex, Inc. | LED system and method |
US20090275266A1 (en) * | 2006-10-02 | 2009-11-05 | Illumitex, Inc. | Optical device polishing |
US8035119B2 (en) * | 2006-10-03 | 2011-10-11 | Avago Technologies General IP Pte, Ltd. | System and method for light source with discontinuity-containing diffusant |
US20080151143A1 (en) * | 2006-10-19 | 2008-06-26 | Intematix Corporation | Light emitting diode based backlighting for color liquid crystal displays |
US7659549B2 (en) * | 2006-10-23 | 2010-02-09 | Chang Gung University | Method for obtaining a better color rendering with a photoluminescence plate |
JP2010508651A (en) * | 2006-10-31 | 2010-03-18 | ティーアイアール テクノロジー エルピー | Light source including photoexcitable medium |
US8029155B2 (en) * | 2006-11-07 | 2011-10-04 | Cree, Inc. | Lighting device and lighting method |
US7889421B2 (en) * | 2006-11-17 | 2011-02-15 | Rensselaer Polytechnic Institute | High-power white LEDs and manufacturing method thereof |
WO2008067441A1 (en) * | 2006-11-30 | 2008-06-05 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
US9441793B2 (en) * | 2006-12-01 | 2016-09-13 | Cree, Inc. | High efficiency lighting device including one or more solid state light emitters, and method of lighting |
WO2008073794A1 (en) * | 2006-12-07 | 2008-06-19 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
US8066402B2 (en) * | 2006-12-24 | 2011-11-29 | Brasscorp Limited | LED lamps including LED work lights |
JP2008166782A (en) | 2006-12-26 | 2008-07-17 | Seoul Semiconductor Co Ltd | Light-emitting element |
DE112007002696T5 (en) | 2006-12-26 | 2009-11-05 | Seoul Opto Device Co. Ltd., Ansan | Light emitting device |
DE102006061941A1 (en) * | 2006-12-29 | 2008-07-03 | Osram Opto Semiconductors Gmbh | Optoelectronic arrangement, has power light emitting diode, where radiation is emitted from power light emitting diode, and adjusting light emitting diode, where another radiation is emitted from adjusting light emitting diode |
US7686478B1 (en) | 2007-01-12 | 2010-03-30 | Ilight Technologies, Inc. | Bulb for light-emitting diode with color-converting insert |
US8109656B1 (en) | 2007-01-12 | 2012-02-07 | Ilight Technologies, Inc. | Bulb for light-emitting diode with modified inner cavity |
US20080169746A1 (en) * | 2007-01-12 | 2008-07-17 | Ilight Technologies, Inc. | Bulb for light-emitting diode |
US8021904B2 (en) * | 2007-02-01 | 2011-09-20 | Cree, Inc. | Ohmic contacts to nitrogen polarity GaN |
DE102007010244A1 (en) * | 2007-02-02 | 2008-08-07 | Osram Opto Semiconductors Gmbh | Arrangement and method for generating mixed light |
US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
CN101246876B (en) * | 2007-02-16 | 2010-05-19 | 厦门通士达照明有限公司 | LED lamp and method for acquiring the same |
US20080197369A1 (en) * | 2007-02-20 | 2008-08-21 | Cree, Inc. | Double flip semiconductor device and method for fabrication |
US20080198572A1 (en) | 2007-02-21 | 2008-08-21 | Medendorp Nicholas W | LED lighting systems including luminescent layers on remote reflectors |
JP5476128B2 (en) * | 2007-02-22 | 2014-04-23 | クリー インコーポレイテッド | Illumination device, illumination method, optical filter, and light filtering method |
US20080203900A1 (en) * | 2007-02-27 | 2008-08-28 | Farn Hin Chen | LED White Source with Improved Color Rendering |
US7972030B2 (en) * | 2007-03-05 | 2011-07-05 | Intematix Corporation | Light emitting diode (LED) based lighting systems |
US7777412B2 (en) * | 2007-03-22 | 2010-08-17 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Phosphor converted LED with improved uniformity and having lower phosphor requirements |
DE102007015233A1 (en) * | 2007-03-29 | 2008-10-02 | Osram Gesellschaft mit beschränkter Haftung | LED lamp for e.g. motor vehicle light, has LED emitting visible light, and radiation-emitting semiconductor component emitting electromagnetic radiation with maximum intensity outside visible spectral region |
JP2010527155A (en) * | 2007-05-08 | 2010-08-05 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | Lighting device and lighting method |
JP2010527157A (en) * | 2007-05-08 | 2010-08-05 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | Lighting device and lighting method |
EP2156090B1 (en) * | 2007-05-08 | 2016-07-06 | Cree, Inc. | Lighting device and lighting method |
JP2010527156A (en) * | 2007-05-08 | 2010-08-05 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | Lighting device and lighting method |
US8079729B2 (en) * | 2007-05-08 | 2011-12-20 | Cree, Inc. | Lighting device and lighting method |
DE102007022566A1 (en) * | 2007-05-14 | 2008-11-20 | Merck Patent Gmbh | Lighting unit consisting of discharge lamp, LEDs and conversion lamps |
US7999283B2 (en) * | 2007-06-14 | 2011-08-16 | Cree, Inc. | Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes |
JP5773646B2 (en) | 2007-06-25 | 2015-09-02 | キユーデイー・ビジヨン・インコーポレーテツド | Compositions and methods comprising depositing nanomaterials |
WO2009003176A1 (en) * | 2007-06-27 | 2008-12-31 | The Regents Of The University Of California | Optical designs for high-efficacy white-light emitting diodes |
WO2009014707A2 (en) | 2007-07-23 | 2009-01-29 | Qd Vision, Inc. | Quantum dot light enhancement substrate and lighting device including same |
US7663315B1 (en) | 2007-07-24 | 2010-02-16 | Ilight Technologies, Inc. | Spherical bulb for light-emitting diode with spherical inner cavity |
US8297061B2 (en) * | 2007-08-02 | 2012-10-30 | Cree, Inc. | Optoelectronic device with upconverting luminophoric medium |
US20090039375A1 (en) * | 2007-08-07 | 2009-02-12 | Cree, Inc. | Semiconductor light emitting devices with separated wavelength conversion materials and methods of forming the same |
US7863635B2 (en) * | 2007-08-07 | 2011-01-04 | Cree, Inc. | Semiconductor light emitting devices with applied wavelength conversion materials |
US11114594B2 (en) * | 2007-08-24 | 2021-09-07 | Creeled, Inc. | Light emitting device packages using light scattering particles of different size |
US8128249B2 (en) | 2007-08-28 | 2012-03-06 | Qd Vision, Inc. | Apparatus for selectively backlighting a material |
US20100200891A1 (en) * | 2007-09-10 | 2010-08-12 | Chang Gung University | Led structure |
DE102007043355A1 (en) * | 2007-09-12 | 2009-03-19 | Lumitech Produktion Und Entwicklung Gmbh | LED module, LED bulb and LED light for energy-efficient reproduction of white light |
CN101388161A (en) * | 2007-09-14 | 2009-03-18 | 科锐香港有限公司 | LED surface mounting device and LED display with the device |
BRPI0818048B1 (en) * | 2007-10-10 | 2018-11-21 | Cree Led Lighting Solutions Inc | lighting device |
KR101525274B1 (en) * | 2007-10-26 | 2015-06-02 | 크리, 인코포레이티드 | Illumination device having one or more lumiphors, and methods of fabricating same |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
KR100891810B1 (en) * | 2007-11-06 | 2009-04-07 | 삼성전기주식회사 | White light emitting device |
DE102007055003A1 (en) * | 2007-11-14 | 2009-05-20 | Carl Zeiss Surgical Gmbh | Medical lighting unit |
US8368100B2 (en) * | 2007-11-14 | 2013-02-05 | Cree, Inc. | Semiconductor light emitting diodes having reflective structures and methods of fabricating same |
US8536584B2 (en) * | 2007-11-14 | 2013-09-17 | Cree, Inc. | High voltage wire bond free LEDS |
US9634191B2 (en) * | 2007-11-14 | 2017-04-25 | Cree, Inc. | Wire bond free wafer level LED |
JP5212777B2 (en) * | 2007-11-28 | 2013-06-19 | スタンレー電気株式会社 | Semiconductor light emitting device and lighting device |
US8866410B2 (en) | 2007-11-28 | 2014-10-21 | Cree, Inc. | Solid state lighting devices and methods of manufacturing the same |
USD633631S1 (en) | 2007-12-14 | 2011-03-01 | Cree Hong Kong Limited | Light source of light emitting diode |
US9431589B2 (en) * | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
CN101463985B (en) * | 2007-12-21 | 2010-12-08 | 富士迈半导体精密工业(上海)有限公司 | LED lamp |
US10008637B2 (en) | 2011-12-06 | 2018-06-26 | Cree, Inc. | Light emitter devices and methods with reduced dimensions and improved light output |
JP2011512037A (en) * | 2008-02-08 | 2011-04-14 | イルミテックス, インコーポレイテッド | System and method for emitter layer shaping |
US8022388B2 (en) * | 2008-02-15 | 2011-09-20 | Cree, Inc. | Broadband light emitting device lamps for providing white light output |
US8567973B2 (en) * | 2008-03-07 | 2013-10-29 | Intematix Corporation | Multiple-chip excitation systems for white light emitting diodes (LEDs) |
US8916890B2 (en) * | 2008-03-19 | 2014-12-23 | Cree, Inc. | Light emitting diodes with light filters |
JP2009245981A (en) * | 2008-03-28 | 2009-10-22 | Toyota Central R&D Labs Inc | Led light-emitting device |
US8350461B2 (en) | 2008-03-28 | 2013-01-08 | Cree, Inc. | Apparatus and methods for combining light emitters |
KR101476421B1 (en) * | 2008-03-31 | 2014-12-26 | 서울반도체 주식회사 | backlight unit |
KR101562772B1 (en) | 2008-03-31 | 2015-10-26 | 서울반도체 주식회사 | Light emitting divece for white light of incandescent color |
CN101925775B (en) * | 2008-04-02 | 2012-04-25 | 夏普株式会社 | Illuminating device and display device |
TWI371480B (en) * | 2008-04-28 | 2012-09-01 | Epistar Corp | Wavelength converting material and use of same |
US9287469B2 (en) * | 2008-05-02 | 2016-03-15 | Cree, Inc. | Encapsulation for phosphor-converted white light emitting diode |
US9207385B2 (en) | 2008-05-06 | 2015-12-08 | Qd Vision, Inc. | Lighting systems and devices including same |
WO2009137053A1 (en) | 2008-05-06 | 2009-11-12 | Qd Vision, Inc. | Optical components, systems including an optical component, and devices |
EP2297762B1 (en) | 2008-05-06 | 2017-03-15 | Samsung Electronics Co., Ltd. | Solid state lighting devices including quantum confined semiconductor nanoparticles |
US8049230B2 (en) | 2008-05-16 | 2011-11-01 | Cree Huizhou Opto Limited | Apparatus and system for miniature surface mount devices |
TW200950136A (en) * | 2008-05-26 | 2009-12-01 | wei-hong Luo | LED packaging structure |
CN102113119A (en) | 2008-05-29 | 2011-06-29 | 克利公司 | Light source with near field mixing |
CN102057212B (en) * | 2008-06-04 | 2013-05-22 | 皇家飞利浦电子股份有限公司 | Lighting apparatus |
EP2301087A2 (en) * | 2008-06-05 | 2011-03-30 | 3M Innovative Properties Company | Light emitting diode with bonded semiconductor wavelength converter |
JP2009302339A (en) * | 2008-06-13 | 2009-12-24 | Sanken Electric Co Ltd | Semiconductor light emitting device |
CA2754433A1 (en) * | 2008-06-25 | 2009-12-30 | Mario W. Cardullo | Uv generated visible light source |
US8240875B2 (en) * | 2008-06-25 | 2012-08-14 | Cree, Inc. | Solid state linear array modules for general illumination |
CN101621054A (en) * | 2008-07-01 | 2010-01-06 | 展晶科技(深圳)有限公司 | LED light source device |
JP2010021202A (en) * | 2008-07-08 | 2010-01-28 | Ushio Inc | Light emitting device |
KR101266205B1 (en) * | 2008-07-08 | 2013-05-21 | 우시오덴키 가부시키가이샤 | Light emitting device and method for manufacturing the same |
KR101266226B1 (en) * | 2008-07-09 | 2013-05-21 | 우시오덴키 가부시키가이샤 | Light emitting device and method for manufacturing the same |
JP2011528509A (en) * | 2008-07-16 | 2011-11-17 | スリーエム イノベイティブ プロパティズ カンパニー | Stable light source |
CN102203970A (en) * | 2008-09-04 | 2011-09-28 | 3M创新有限公司 | Light source having light blocking components |
KR101519985B1 (en) * | 2008-09-11 | 2015-05-15 | 삼성디스플레이 주식회사 | Light source module and display apparatus having the same |
DE102008050643B4 (en) | 2008-10-07 | 2022-11-03 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | bulbs |
DK2347172T3 (en) * | 2008-11-06 | 2020-03-30 | Signify Holding Bv | ILLUMINATION DEVICES |
US8791471B2 (en) | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
DE102008057347A1 (en) * | 2008-11-14 | 2010-05-20 | Osram Opto Semiconductors Gmbh | Optoelectronic device |
US8220971B2 (en) | 2008-11-21 | 2012-07-17 | Xicato, Inc. | Light emitting diode module with three part color matching |
JP2010129583A (en) * | 2008-11-25 | 2010-06-10 | Citizen Electronics Co Ltd | Lighting fixture |
KR101018153B1 (en) * | 2008-11-27 | 2011-02-28 | 삼성엘이디 주식회사 | Light emitting diode package |
TW201034256A (en) * | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
JP5327601B2 (en) * | 2008-12-12 | 2013-10-30 | 東芝ライテック株式会社 | Light emitting module and lighting device |
US8408724B2 (en) * | 2008-12-26 | 2013-04-02 | Toshiba Lighting & Technology Corporation | Light source module and lighting apparatus |
KR101521098B1 (en) * | 2009-01-06 | 2015-05-20 | 삼성디스플레이 주식회사 | Method of driving a light-source and light-source apparatus for performing the method |
US8519611B2 (en) * | 2009-01-14 | 2013-08-27 | GE Lighting Solutions, LLC | Hybrid illumination system with improved color quality |
US8333631B2 (en) * | 2009-02-19 | 2012-12-18 | Cree, Inc. | Methods for combining light emitting devices in a package and packages including combined light emitting devices |
US7967652B2 (en) | 2009-02-19 | 2011-06-28 | Cree, Inc. | Methods for combining light emitting devices in a package and packages including combined light emitting devices |
US8138509B2 (en) * | 2009-02-27 | 2012-03-20 | Visera Technologies Company, Limited | Light emitting device having luminescent layer with opening to exposed bond pad on light emitting die for wire bonding pad to substrate |
US8476668B2 (en) * | 2009-04-06 | 2013-07-02 | Cree, Inc. | High voltage low current surface emitting LED |
US9093293B2 (en) | 2009-04-06 | 2015-07-28 | Cree, Inc. | High voltage low current surface emitting light emitting diode |
US8337030B2 (en) | 2009-05-13 | 2012-12-25 | Cree, Inc. | Solid state lighting devices having remote luminescent material-containing element, and lighting methods |
US8921876B2 (en) * | 2009-06-02 | 2014-12-30 | Cree, Inc. | Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements |
US20100301728A1 (en) * | 2009-06-02 | 2010-12-02 | Bridgelux, Inc. | Light source having a refractive element |
US8384114B2 (en) | 2009-06-27 | 2013-02-26 | Cooledge Lighting Inc. | High efficiency LEDs and LED lamps |
JP5767775B2 (en) * | 2009-07-06 | 2015-08-19 | 富士フイルム株式会社 | Endoscope device |
US8415692B2 (en) * | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
US8273588B2 (en) * | 2009-07-20 | 2012-09-25 | Osram Opto Semiconductros Gmbh | Method for producing a luminous device and luminous device |
US8716952B2 (en) * | 2009-08-04 | 2014-05-06 | Cree, Inc. | Lighting device having first, second and third groups of solid state light emitters, and lighting arrangement |
US8648546B2 (en) * | 2009-08-14 | 2014-02-11 | Cree, Inc. | High efficiency lighting device including one or more saturated light emitters, and method of lighting |
US10310156B2 (en) | 2009-08-17 | 2019-06-04 | Mario W. Cardullo | Visible light generated using UV light source |
WO2011021997A1 (en) * | 2009-08-17 | 2011-02-24 | Cardullo Mario W | Visible light generated using uv light source |
JP5581629B2 (en) | 2009-08-20 | 2014-09-03 | セイコーエプソン株式会社 | projector |
US8449128B2 (en) * | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
JP5504747B2 (en) * | 2009-08-20 | 2014-05-28 | セイコーエプソン株式会社 | projector |
US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
JP5407664B2 (en) * | 2009-08-27 | 2014-02-05 | セイコーエプソン株式会社 | projector |
US8933644B2 (en) | 2009-09-18 | 2015-01-13 | Soraa, Inc. | LED lamps with improved quality of light |
US9293667B2 (en) | 2010-08-19 | 2016-03-22 | Soraa, Inc. | System and method for selected pump LEDs with multiple phosphors |
US9293644B2 (en) | 2009-09-18 | 2016-03-22 | Soraa, Inc. | Power light emitting diode and method with uniform current density operation |
US8901845B2 (en) | 2009-09-24 | 2014-12-02 | Cree, Inc. | Temperature responsive control for lighting apparatus including light emitting devices providing different chromaticities and related methods |
US8258722B2 (en) * | 2009-09-24 | 2012-09-04 | Cree, Inc. | Lighting device with defined spectral power distribution |
KR20120094477A (en) | 2009-09-25 | 2012-08-24 | 크리, 인코포레이티드 | Lighting device with low glare and high light level uniformity |
DE102009047789A1 (en) * | 2009-09-30 | 2011-03-31 | Osram Gesellschaft mit beschränkter Haftung | Mixed light source |
US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
WO2011044931A1 (en) * | 2009-10-14 | 2011-04-21 | Osram Gesellschaft mit beschränkter Haftung | Lighting device for producing a white mixed light |
US9435493B2 (en) | 2009-10-27 | 2016-09-06 | Cree, Inc. | Hybrid reflector system for lighting device |
TW201115788A (en) * | 2009-10-30 | 2011-05-01 | Kingbright Electronics Co Ltd | Improved white light LED lighting device |
US7893445B2 (en) * | 2009-11-09 | 2011-02-22 | Cree, Inc. | Solid state emitter package including red and blue emitters |
CN102095155B (en) * | 2009-11-25 | 2014-05-14 | 松下电器产业株式会社 | Light-emitting unit and illumination fixture using same |
DE102010002332A1 (en) * | 2009-11-30 | 2011-06-01 | Ledon Lighting Jennersdorf Gmbh | Retrofit LED lamp with warm white, especially flame-like white light |
US8466611B2 (en) | 2009-12-14 | 2013-06-18 | Cree, Inc. | Lighting device with shaped remote phosphor |
US8653539B2 (en) | 2010-01-04 | 2014-02-18 | Cooledge Lighting, Inc. | Failure mitigation in arrays of light-emitting devices |
US9480133B2 (en) | 2010-01-04 | 2016-10-25 | Cooledge Lighting Inc. | Light-emitting element repair in array-based lighting devices |
US8508116B2 (en) | 2010-01-27 | 2013-08-13 | Cree, Inc. | Lighting device with multi-chip light emitters, solid state light emitter support members and lighting elements |
US8740413B1 (en) | 2010-02-03 | 2014-06-03 | Soraa, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
US20110215348A1 (en) * | 2010-02-03 | 2011-09-08 | Soraa, Inc. | Reflection Mode Package for Optical Devices Using Gallium and Nitrogen Containing Materials |
US8905588B2 (en) | 2010-02-03 | 2014-12-09 | Sorra, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
US10147850B1 (en) * | 2010-02-03 | 2018-12-04 | Soraa, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
KR100969100B1 (en) * | 2010-02-12 | 2010-07-09 | 엘지이노텍 주식회사 | Light emitting device, method for fabricating the same and light emitting device package |
US9625105B2 (en) | 2010-03-03 | 2017-04-18 | Cree, Inc. | LED lamp with active cooling element |
US9062830B2 (en) * | 2010-03-03 | 2015-06-23 | Cree, Inc. | High efficiency solid state lamp and bulb |
US8882284B2 (en) | 2010-03-03 | 2014-11-11 | Cree, Inc. | LED lamp or bulb with remote phosphor and diffuser configuration with enhanced scattering properties |
US8632196B2 (en) | 2010-03-03 | 2014-01-21 | Cree, Inc. | LED lamp incorporating remote phosphor and diffuser with heat dissipation features |
US8562161B2 (en) | 2010-03-03 | 2013-10-22 | Cree, Inc. | LED based pedestal-type lighting structure |
US9500325B2 (en) * | 2010-03-03 | 2016-11-22 | Cree, Inc. | LED lamp incorporating remote phosphor with heat dissipation features |
US9316361B2 (en) | 2010-03-03 | 2016-04-19 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration |
US9024517B2 (en) * | 2010-03-03 | 2015-05-05 | Cree, Inc. | LED lamp with remote phosphor and diffuser configuration utilizing red emitters |
US8931933B2 (en) | 2010-03-03 | 2015-01-13 | Cree, Inc. | LED lamp with active cooling element |
US20110227102A1 (en) * | 2010-03-03 | 2011-09-22 | Cree, Inc. | High efficacy led lamp with remote phosphor and diffuser configuration |
US9057511B2 (en) | 2010-03-03 | 2015-06-16 | Cree, Inc. | High efficiency solid state lamp and bulb |
US8646949B2 (en) * | 2010-03-03 | 2014-02-11 | LumenFlow Corp. | Constrained folded path resonant white light scintillator |
US9310030B2 (en) * | 2010-03-03 | 2016-04-12 | Cree, Inc. | Non-uniform diffuser to scatter light into uniform emission pattern |
US9275979B2 (en) | 2010-03-03 | 2016-03-01 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
US10359151B2 (en) | 2010-03-03 | 2019-07-23 | Ideal Industries Lighting Llc | Solid state lamp with thermal spreading elements and light directing optics |
US8508127B2 (en) * | 2010-03-09 | 2013-08-13 | Cree, Inc. | High CRI lighting device with added long-wavelength blue color |
EP2365525A3 (en) * | 2010-03-12 | 2013-05-29 | Toshiba Lighting & Technology Corporation | Illumination apparatus having an array of red and phosphour coated blue LEDs |
US8319247B2 (en) | 2010-03-25 | 2012-11-27 | Koninklijke Philips Electronics N.V. | Carrier for a light emitting device |
US8486761B2 (en) * | 2010-03-25 | 2013-07-16 | Koninklijke Philips Electronics N.V. | Hybrid combination of substrate and carrier mounted light emitting devices |
US8322884B2 (en) * | 2010-03-31 | 2012-12-04 | Abl Ip Holding Llc | Solid state lighting with selective matching of index of refraction |
US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
DE102010027875A1 (en) * | 2010-04-16 | 2011-10-20 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing an optoelectronic component |
US8329482B2 (en) | 2010-04-30 | 2012-12-11 | Cree, Inc. | White-emitting LED chips and method for making same |
WO2011143197A2 (en) | 2010-05-13 | 2011-11-17 | Cree, Inc. | Lighting device and method of making |
US8684559B2 (en) | 2010-06-04 | 2014-04-01 | Cree, Inc. | Solid state light source emitting warm light with high CRI |
WO2012000114A1 (en) | 2010-06-29 | 2012-01-05 | Cooledge Lightning Inc. | Electronic devices with yielding substrates |
US20120014091A1 (en) * | 2010-07-14 | 2012-01-19 | Shenzhen China Star Optoelectronics Technology Co Ltd. | Led package assembly and backlight module |
EP2407706A1 (en) * | 2010-07-14 | 2012-01-18 | Civilight Shenzhen Semiconductor Lighting Co., Ltd | Warm white light LED lamp with high luminance and high color rendering index and led module |
DE102010027579A1 (en) * | 2010-07-19 | 2012-01-19 | Osram Opto Semiconductors Gmbh | Light-emitting diode module and luminaire |
DE102010038396B4 (en) | 2010-07-26 | 2021-08-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelectronic component and lighting device with it |
US10451251B2 (en) | 2010-08-02 | 2019-10-22 | Ideal Industries Lighting, LLC | Solid state lamp with light directing optics and diffuser |
US20120051045A1 (en) | 2010-08-27 | 2012-03-01 | Xicato, Inc. | Led Based Illumination Module Color Matched To An Arbitrary Light Source |
TWI427834B (en) * | 2010-08-31 | 2014-02-21 | Advanced Optoelectronic Tech | Led package structure |
US9070851B2 (en) | 2010-09-24 | 2015-06-30 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
TWI476961B (en) * | 2010-10-12 | 2015-03-11 | 友達光電股份有限公司 | Led apparatus |
US9140429B2 (en) | 2010-10-14 | 2015-09-22 | Cree, Inc. | Optical element edge treatment for lighting device |
US8455882B2 (en) | 2010-10-15 | 2013-06-04 | Cree, Inc. | High efficiency LEDs |
DE102010061972A1 (en) * | 2010-10-15 | 2012-04-19 | Tridonic Jennersdorf Gmbh | LED spotlight with reflector |
US8654064B2 (en) * | 2010-10-18 | 2014-02-18 | Samsung Display Co., Ltd. | Backlight having blue light emitting diodes and method of driving same |
US9648673B2 (en) | 2010-11-05 | 2017-05-09 | Cree, Inc. | Lighting device with spatially segregated primary and secondary emitters |
US8491140B2 (en) * | 2010-11-05 | 2013-07-23 | Cree, Inc. | Lighting device with multiple emitters and remote lumiphor |
US8847481B2 (en) * | 2010-11-08 | 2014-09-30 | Lg Innotek Co., Ltd. | Lighting device comprising photoluminescent plate |
DE102010061801A1 (en) * | 2010-11-23 | 2012-05-24 | Tridonic Jennersdorf Gmbh | LED module with common color conversion module for at least two LED chips |
US8556469B2 (en) | 2010-12-06 | 2013-10-15 | Cree, Inc. | High efficiency total internal reflection optic for solid state lighting luminaires |
US9234655B2 (en) | 2011-02-07 | 2016-01-12 | Cree, Inc. | Lamp with remote LED light source and heat dissipating elements |
US9068701B2 (en) | 2012-01-26 | 2015-06-30 | Cree, Inc. | Lamp structure with remote LED light source |
US11251164B2 (en) | 2011-02-16 | 2022-02-15 | Creeled, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
US8796952B2 (en) | 2011-03-03 | 2014-08-05 | Cree, Inc. | Semiconductor light emitting devices having selectable and/or adjustable color points and related methods |
US8791642B2 (en) | 2011-03-03 | 2014-07-29 | Cree, Inc. | Semiconductor light emitting devices having selectable and/or adjustable color points and related methods |
DE102011013504B4 (en) * | 2011-03-10 | 2022-03-17 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Light Emitting Device |
US10147853B2 (en) | 2011-03-18 | 2018-12-04 | Cree, Inc. | Encapsulant with index matched thixotropic agent |
US9141101B2 (en) * | 2011-05-13 | 2015-09-22 | Lutron Electronics Co., Inc. | Wireless battery-powered remote control with glow-in-the-dark feature |
DE102011104302A1 (en) * | 2011-06-16 | 2012-12-20 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component and use of such a semiconductor device |
CN102853283A (en) * | 2011-06-30 | 2013-01-02 | 展晶科技(深圳)有限公司 | Light emitting diode lighting device |
US8927958B2 (en) | 2011-07-12 | 2015-01-06 | Epistar Corporation | Light-emitting element with multiple light-emitting stacked layers |
WO2013011628A1 (en) * | 2011-07-19 | 2013-01-24 | パナソニック株式会社 | Light emitting device and method for manufacturing same |
US10686107B2 (en) | 2011-07-21 | 2020-06-16 | Cree, Inc. | Light emitter devices and components with improved chemical resistance and related methods |
TW201312807A (en) | 2011-07-21 | 2013-03-16 | Cree Inc | Light emitter device packages, components, and methods for improved chemical resistance and related methods |
US10211380B2 (en) | 2011-07-21 | 2019-02-19 | Cree, Inc. | Light emitting devices and components having improved chemical resistance and related methods |
DE102011079697A1 (en) * | 2011-07-25 | 2013-01-31 | Osram Ag | lighting device |
JP5450527B2 (en) | 2011-08-10 | 2014-03-26 | 富士フイルム株式会社 | Endoscope device |
US9488324B2 (en) | 2011-09-02 | 2016-11-08 | Soraa, Inc. | Accessories for LED lamp systems |
DE102011085645B4 (en) * | 2011-11-03 | 2014-06-26 | Osram Gmbh | Light emitting diode module and method for operating a light emitting diode module |
KR101274046B1 (en) | 2011-11-07 | 2013-06-12 | 서울반도체 주식회사 | Warm white light emitting apparatus and back light module comprising the same |
TWI508332B (en) * | 2011-11-09 | 2015-11-11 | Au Optronics Corp | Luminescent light source and display panel thereof |
US8884508B2 (en) | 2011-11-09 | 2014-11-11 | Cree, Inc. | Solid state lighting device including multiple wavelength conversion materials |
US9496466B2 (en) | 2011-12-06 | 2016-11-15 | Cree, Inc. | Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction |
EP2610909B1 (en) * | 2011-12-28 | 2019-05-08 | Shanghai Sansi Electronics Engineering Co., Ltd. | LED lighting device with high color rendering index |
US20130170174A1 (en) * | 2011-12-29 | 2013-07-04 | Intematix Technology Center Corp. | Multi-cavities light emitting device |
RU2502917C2 (en) * | 2011-12-30 | 2013-12-27 | Закрытое Акционерное Общество "Научно-Производственная Коммерческая Фирма "Элтан Лтд" | Light diode source of white light with combined remote photoluminiscent converter |
EP2613354B1 (en) * | 2012-01-03 | 2020-05-06 | Epistar Corporation | Multi-cavaties light emitting device |
US9240530B2 (en) | 2012-02-13 | 2016-01-19 | Cree, Inc. | Light emitter devices having improved chemical and physical resistance and related methods |
US9343441B2 (en) * | 2012-02-13 | 2016-05-17 | Cree, Inc. | Light emitter devices having improved light output and related methods |
US8946747B2 (en) | 2012-02-13 | 2015-02-03 | Cree, Inc. | Lighting device including multiple encapsulant material layers |
US8957580B2 (en) * | 2012-02-13 | 2015-02-17 | Cree, Inc. | Lighting device including multiple wavelength conversion material layers |
TWM443813U (en) * | 2012-03-06 | 2012-12-21 | Winsky Technology Ltd | Illumination device |
US9488359B2 (en) | 2012-03-26 | 2016-11-08 | Cree, Inc. | Passive phase change radiators for LED lamps and fixtures |
JP5776599B2 (en) * | 2012-03-26 | 2015-09-09 | 東芝ライテック株式会社 | Light emitting module and lighting device |
CN103375708B (en) * | 2012-04-26 | 2015-10-28 | 展晶科技(深圳)有限公司 | Light-emitting diode lamp source device |
CN104247058B (en) * | 2012-04-26 | 2017-10-03 | 英特曼帝克司公司 | Method and apparatus for implementing color consistency in being changed in remote wavelength |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
US9231178B2 (en) | 2012-06-07 | 2016-01-05 | Cooledge Lighting, Inc. | Wafer-level flip chip device packages and related methods |
US9887327B2 (en) * | 2012-06-11 | 2018-02-06 | Cree, Inc. | LED package with encapsulant having curved and planar surfaces |
US20130328074A1 (en) * | 2012-06-11 | 2013-12-12 | Cree, Inc. | Led package with multiple element light source and encapsulant having planar surfaces |
US10424702B2 (en) | 2012-06-11 | 2019-09-24 | Cree, Inc. | Compact LED package with reflectivity layer |
US10468565B2 (en) * | 2012-06-11 | 2019-11-05 | Cree, Inc. | LED package with multiple element light source and encapsulant having curved and/or planar surfaces |
US9818919B2 (en) * | 2012-06-11 | 2017-11-14 | Cree, Inc. | LED package with multiple element light source and encapsulant having planar surfaces |
US20130329429A1 (en) * | 2012-06-11 | 2013-12-12 | Cree, Inc. | Emitter package with integrated mixing chamber |
CA2881841A1 (en) | 2012-08-23 | 2014-02-27 | The Regents Of The University Of California | Spectrally encoded microbeads and methods and devices for making and using same |
EP2835036B8 (en) * | 2012-08-24 | 2019-04-10 | Signify Holding B.V. | A light emitting assembly, a lamp and a luminaire |
EP2896078A4 (en) | 2012-09-13 | 2016-05-25 | 3M Innovative Properties Co | Efficient lighting system with wide color range |
US9353917B2 (en) | 2012-09-14 | 2016-05-31 | Cree, Inc. | High efficiency lighting device including one or more solid state light emitters, and method of lighting |
EP2907169A2 (en) * | 2012-10-10 | 2015-08-19 | Cree, Inc. | Led package with multiple element light source and encapsulant having planar surfaces |
CN102878467B (en) * | 2012-10-19 | 2015-02-11 | 纳晶科技股份有限公司 | Low-color-temperature lighting component |
TW201418414A (en) * | 2012-11-12 | 2014-05-16 | Genesis Photonics Inc | Wavelength converting substance, wavelength converting gel and light emitting device |
TWI458139B (en) * | 2012-11-23 | 2014-10-21 | Unity Opto Technology Co Ltd | White light emitting diode module |
US9761763B2 (en) | 2012-12-21 | 2017-09-12 | Soraa, Inc. | Dense-luminescent-materials-coated violet LEDs |
CN103972366A (en) * | 2013-01-24 | 2014-08-06 | 新世纪光电股份有限公司 | Wavelength conversion substance, wavelength conversion colloid and light-emitting device |
US9587790B2 (en) | 2013-03-15 | 2017-03-07 | Cree, Inc. | Remote lumiphor solid state lighting devices with enhanced light extraction |
DE102013103984A1 (en) * | 2013-04-19 | 2014-11-06 | Osram Opto Semiconductors Gmbh | Illumination device for backlighting a display or a television, display and television |
CN104241262B (en) | 2013-06-14 | 2020-11-06 | 惠州科锐半导体照明有限公司 | Light emitting device and display device |
CN103322525B (en) * | 2013-06-17 | 2015-04-22 | 深圳市源磊科技有限公司 | LED (light-emitting diode) lamp and filament thereof |
US20170271548A1 (en) | 2013-06-26 | 2017-09-21 | Epistar Corporation | Light-emitting device and manufacturing method thereof |
CN105453276B (en) | 2013-06-26 | 2019-07-05 | 晶元光电股份有限公司 | Light-emitting component and its manufacturing method |
TWI523277B (en) * | 2013-07-12 | 2016-02-21 | White light emitting diode module with ultraviolet light | |
JP6764340B2 (en) | 2013-08-01 | 2020-09-30 | シグニファイ ホールディング ビー ヴィSignify Holding B.V. | Luminescent device with adapted output spectrum |
US9461024B2 (en) | 2013-08-01 | 2016-10-04 | Cree, Inc. | Light emitter devices and methods for light emitting diode (LED) chips |
WO2015017091A1 (en) * | 2013-08-01 | 2015-02-05 | Cree, Inc. | Light emitting diode package with encapsulant having curved and planar surfaces |
US9410664B2 (en) | 2013-08-29 | 2016-08-09 | Soraa, Inc. | Circadian friendly LED light source |
US10283681B2 (en) * | 2013-09-12 | 2019-05-07 | Cree, Inc. | Phosphor-converted light emitting device |
JP2015092529A (en) * | 2013-10-01 | 2015-05-14 | ソニー株式会社 | Light-emitting device, light-emitting unit, display device, electronic apparatus, and light-emitting element |
JP6230392B2 (en) * | 2013-11-29 | 2017-11-15 | シチズン電子株式会社 | Light emitting device |
US9013108B1 (en) * | 2013-12-11 | 2015-04-21 | Anwell Semiconductor Corp. | LED element with color light enhancement function |
CN105164464B (en) * | 2013-12-17 | 2017-03-01 | 皇家飞利浦有限公司 | Solid state emitter package, light-emitting device, flexible LED strip body and light fixture |
US9360188B2 (en) | 2014-02-20 | 2016-06-07 | Cree, Inc. | Remote phosphor element filled with transparent material and method for forming multisection optical elements |
TWI559578B (en) * | 2014-03-11 | 2016-11-21 | Bright Led Electronics Corp | A light-emitting diode module with mixed light |
JP2015177019A (en) * | 2014-03-14 | 2015-10-05 | シチズン電子株式会社 | Led light emitting device |
DE102014107972B9 (en) * | 2014-04-17 | 2022-07-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Lighting device with a first phosphor and filter particles |
US9593812B2 (en) | 2014-04-23 | 2017-03-14 | Cree, Inc. | High CRI solid state lighting devices with enhanced vividness |
US9241384B2 (en) | 2014-04-23 | 2016-01-19 | Cree, Inc. | Solid state lighting devices with adjustable color point |
EP2947484B1 (en) * | 2014-05-14 | 2017-04-05 | Philips Lighting Holding B.V. | A light emitting device |
US9215761B2 (en) | 2014-05-15 | 2015-12-15 | Cree, Inc. | Solid state lighting devices with color point non-coincident with blackbody locus |
DE102014107472A1 (en) * | 2014-05-27 | 2015-12-03 | Osram Opto Semiconductors Gmbh | Semiconductor device and lighting device |
US9515056B2 (en) | 2014-06-06 | 2016-12-06 | Cree, Inc. | Solid state lighting device including narrow spectrum emitter |
US9192013B1 (en) | 2014-06-06 | 2015-11-17 | Cree, Inc. | Lighting devices with variable gamut |
EP3149108B1 (en) * | 2014-09-11 | 2017-12-20 | Philips Lighting Holding B.V. | Pc-led module with enhanced white rendering and conversion efficiency |
CN105449081A (en) * | 2014-09-29 | 2016-03-30 | 艾笛森光电股份有限公司 | Light emission module |
CN204717396U (en) * | 2014-11-19 | 2015-10-21 | 史伯梅 | LED luminescence unit |
CN205845994U (en) * | 2014-11-19 | 2016-12-28 | 史伯梅 | LED luminescence unit |
USD826871S1 (en) | 2014-12-11 | 2018-08-28 | Cree, Inc. | Light emitting diode device |
US10424562B2 (en) * | 2014-12-16 | 2019-09-24 | Citizen Electronics Co., Ltd. | Light emitting device with phosphors |
DE102015100842A1 (en) * | 2015-01-21 | 2016-07-21 | Tailorlux Gmbh | Lighting device with a phosphor layer and different light emitting diodes |
US9702524B2 (en) | 2015-01-27 | 2017-07-11 | Cree, Inc. | High color-saturation lighting devices |
US9530944B2 (en) | 2015-01-27 | 2016-12-27 | Cree, Inc. | High color-saturation lighting devices with enhanced long wavelength illumination |
US10090434B2 (en) * | 2015-02-26 | 2018-10-02 | Apple Inc. | Illumination device having dual-emitting light emitting diode (LED) die structures |
US9681510B2 (en) | 2015-03-26 | 2017-06-13 | Cree, Inc. | Lighting device with operation responsive to geospatial position |
US9943042B2 (en) | 2015-05-18 | 2018-04-17 | Biological Innovation & Optimization Systems, LLC | Grow light embodying power delivery and data communications features |
US20160356434A1 (en) * | 2015-06-02 | 2016-12-08 | Isuzu Optics Corp. | Light mixing structure |
US9900957B2 (en) | 2015-06-11 | 2018-02-20 | Cree, Inc. | Lighting device including solid state emitters with adjustable control |
US10918747B2 (en) | 2015-07-30 | 2021-02-16 | Vital Vio, Inc. | Disinfecting lighting device |
US10357582B1 (en) * | 2015-07-30 | 2019-07-23 | Vital Vio, Inc. | Disinfecting lighting device |
CN107921161B (en) | 2015-07-30 | 2020-08-28 | 维塔尔维奥公司 | Light emitting device for inactivating microorganisms |
JP6583673B2 (en) * | 2015-09-10 | 2019-10-02 | パナソニックIpマネジメント株式会社 | Light emitting device and lighting device |
US9788387B2 (en) | 2015-09-15 | 2017-10-10 | Biological Innovation & Optimization Systems, LLC | Systems and methods for controlling the spectral content of LED lighting devices |
US9844116B2 (en) | 2015-09-15 | 2017-12-12 | Biological Innovation & Optimization Systems, LLC | Systems and methods for controlling the spectral content of LED lighting devices |
US10669478B2 (en) | 2015-10-29 | 2020-06-02 | Signify Holding B.V. | White lighting device for retail illumination |
TWI603357B (en) * | 2016-02-02 | 2017-10-21 | 達方電子股份有限公司 | Illuminated keyswitch |
TWI583028B (en) * | 2016-02-05 | 2017-05-11 | 行家光電股份有限公司 | Light emitting device with beam shaping structure and manufacturing method of the same |
US10797209B2 (en) | 2016-02-05 | 2020-10-06 | Maven Optronics Co., Ltd. | Light emitting device with beam shaping structure and manufacturing method of the same |
CN205944139U (en) | 2016-03-30 | 2017-02-08 | 首尔伟傲世有限公司 | Ultraviolet ray light -emitting diode spare and contain this emitting diode module |
DE102016206524A1 (en) * | 2016-04-19 | 2017-10-19 | Osram Gmbh | LED for emission of illumination radiation |
DE102016207761A1 (en) * | 2016-05-04 | 2017-11-09 | Osram Gmbh | Optical device and vehicle headlights |
US10595376B2 (en) | 2016-09-13 | 2020-03-17 | Biological Innovation & Optimization Systems, LLC | Systems and methods for controlling the spectral content of LED lighting devices |
JP6493348B2 (en) * | 2016-09-30 | 2019-04-03 | 日亜化学工業株式会社 | Light emitting device |
DE102016119002B4 (en) * | 2016-10-06 | 2022-01-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING OPTOELECTRONIC DEVICE |
JP7044785B2 (en) * | 2016-12-21 | 2022-03-30 | ルミレッズ ホールディング ベーフェー | LED array module |
WO2018114527A1 (en) * | 2016-12-21 | 2018-06-28 | Lumileds Holding B.V. | Led array module |
US10465869B2 (en) | 2017-01-30 | 2019-11-05 | Ideal Industries Lighting Llc | Skylight fixture |
US10451229B2 (en) | 2017-01-30 | 2019-10-22 | Ideal Industries Lighting Llc | Skylight fixture |
WO2018200544A1 (en) * | 2017-04-27 | 2018-11-01 | Facilasystems, LLC | Visually indicating a waning power source of a safety sensor |
WO2018202534A1 (en) * | 2017-05-02 | 2018-11-08 | Philips Lighting Holding B.V. | Warm white led spectrum especially for retail applications |
US10498452B1 (en) * | 2017-07-07 | 2019-12-03 | Facebook Technologies, Llc | Integrated light emitting diode device for optical communication systems |
TWI702362B (en) * | 2017-07-13 | 2020-08-21 | 東貝光電科技股份有限公司 | Led lighting device |
KR102487411B1 (en) * | 2017-10-31 | 2023-01-12 | 엘지디스플레이 주식회사 | Light emitting device package, and electronic device |
US10835627B2 (en) | 2017-12-01 | 2020-11-17 | Vital Vio, Inc. | Devices using flexible light emitting layer for creating disinfecting illuminated surface, and related method |
US10309614B1 (en) | 2017-12-05 | 2019-06-04 | Vital Vivo, Inc. | Light directing element |
US10256376B1 (en) * | 2018-01-16 | 2019-04-09 | Leedarson Lighting Co. Ltd. | LED device |
US10413626B1 (en) | 2018-03-29 | 2019-09-17 | Vital Vio, Inc. | Multiple light emitter for inactivating microorganisms |
EP3614437B1 (en) * | 2018-08-22 | 2021-05-05 | Lumileds LLC | Semiconductor die |
US10866484B2 (en) | 2018-09-04 | 2020-12-15 | Abl Ip Holding Llc | Light frequency upconversion of laser light, for cleansing |
WO2020099928A1 (en) * | 2018-11-18 | 2020-05-22 | Juganu Ltd. | Illumination systems and methods for controllable light color |
US20200236744A1 (en) * | 2019-01-17 | 2020-07-23 | Xiamen Eco Lighting Co. Ltd. | Led light apparatus with adjustable characteristic |
US10873175B2 (en) * | 2019-01-28 | 2020-12-22 | Abl Ip Holding Llc | Light frequency up-conversion of laser light, for producing green or yellow light |
US11639897B2 (en) | 2019-03-29 | 2023-05-02 | Vyv, Inc. | Contamination load sensing device |
US11541135B2 (en) | 2019-06-28 | 2023-01-03 | Vyv, Inc. | Multiple band visible light disinfection |
WO2021030748A1 (en) | 2019-08-15 | 2021-02-18 | Vital Vio, Inc. | Devices configured to disinfect interiors |
US11878084B2 (en) | 2019-09-20 | 2024-01-23 | Vyv, Inc. | Disinfecting light emitting subcomponent |
US11576366B2 (en) * | 2020-01-02 | 2023-02-14 | The Boeing Company | Avian-deterring lighting systems and methods for aircraft |
KR102338177B1 (en) * | 2020-02-24 | 2021-12-10 | 주식회사 에스엘바이오닉스 | Semiconlight light emitting diode |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001069692A1 (en) * | 2000-03-14 | 2001-09-20 | Lumileds Lighting B.V. | Light-emitting diode, lighting device and method of manufacturing same |
EP1160883A2 (en) * | 2000-05-31 | 2001-12-05 | Matsushita Electric Industrial Co., Ltd. | LED lamp |
US20030026096A1 (en) * | 2001-07-31 | 2003-02-06 | Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh | LED-based planar light source |
US20030067773A1 (en) * | 1999-12-02 | 2003-04-10 | Koninklijke Philips Electronics N.V. | LED/phosphor-LED hybrid lighting systems |
Family Cites Families (334)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS508494Y1 (en) | 1970-11-13 | 1975-03-14 | ||
US3805937A (en) * | 1970-12-29 | 1974-04-23 | Glory Kogyo Kk | Automatic money dispensing machine |
FR2127239A5 (en) | 1971-03-01 | 1972-10-13 | Radiotechnique Compelec | |
JPS48102585A (en) * | 1972-04-04 | 1973-12-22 | ||
US4081764A (en) | 1972-10-12 | 1978-03-28 | Minnesota Mining And Manufacturing Company | Zinc oxide light emitting diode |
US3927290A (en) | 1974-11-14 | 1975-12-16 | Teletype Corp | Selectively illuminated pushbutton switch |
JPS5225484A (en) | 1975-08-21 | 1977-02-25 | Mitsubishi Electric Corp | Mixing light illuminating method |
JPS5722581Y2 (en) | 1979-08-21 | 1982-05-17 | ||
US4476620A (en) | 1979-10-19 | 1984-10-16 | Matsushita Electric Industrial Co., Ltd. | Method of making a gallium nitride light-emitting diode |
US4325146A (en) * | 1979-12-20 | 1982-04-13 | Lennington John W | Non-synchronous object identification system |
US4408157A (en) | 1981-05-04 | 1983-10-04 | Associated Research, Inc. | Resistance measuring arrangement |
US4420398A (en) | 1981-08-13 | 1983-12-13 | American National Red Cross | Filteration method for cell produced antiviral substances |
US4710699A (en) | 1983-10-14 | 1987-12-01 | Omron Tateisi Electronics Co. | Electronic switching device |
JPS61144890U (en) | 1985-02-28 | 1986-09-06 | ||
JPH0335568Y2 (en) | 1985-04-30 | 1991-07-29 | ||
JPH06104463B2 (en) | 1985-07-25 | 1994-12-21 | 日産自動車株式会社 | Vehicle Fender Structure |
JPS62143942U (en) | 1986-03-07 | 1987-09-10 | ||
JPH0428269Y2 (en) | 1986-04-15 | 1992-07-08 | ||
JPH077180Y2 (en) | 1986-05-23 | 1995-02-22 | 沖電気工業株式会社 | Booklet printing device |
JPH01230274A (en) | 1987-11-13 | 1989-09-13 | Iwasaki Electric Co Ltd | Light emitting diode |
US5094185A (en) | 1987-11-24 | 1992-03-10 | Lumel, Inc. | Electroluminescent lamps and phosphors |
JPH01139664U (en) | 1988-03-17 | 1989-09-25 | ||
JPH01287973A (en) | 1988-05-13 | 1989-11-20 | Takiron Co Ltd | Dot matrix light emitting indicator |
DE3916875A1 (en) | 1989-05-24 | 1990-12-06 | Ullmann Ulo Werk | Signal light esp. multi-compartment signal lights for motor vehicle - uses green, red, and blue LED's combined so that single light is given with help of mix optics |
US5407799A (en) * | 1989-09-14 | 1995-04-18 | Associated Universities, Inc. | Method for high-volume sequencing of nucleic acids: random and directed priming with libraries of oligonucleotides |
JPH0644567B2 (en) | 1989-12-18 | 1994-06-08 | 株式会社日立製作所 | Semiconductor shape improvement method |
JPH087614Y2 (en) | 1990-05-08 | 1996-03-04 | 中部電力株式会社 | Wire cap |
US5087883A (en) * | 1990-09-10 | 1992-02-11 | Mr. Coffee, Inc. | Differential conductivity meter for fluids and products containing such meters |
JP2765256B2 (en) | 1991-04-10 | 1998-06-11 | 日立電線株式会社 | Light emitting diode |
US5264997A (en) | 1992-03-04 | 1993-11-23 | Dominion Automotive Industries Corp. | Sealed, inductively powered lamp assembly |
JPH06275866A (en) | 1993-03-19 | 1994-09-30 | Fujitsu Ltd | Porous semiconductor light-emitting device and manufacture thereof |
JPH05327012A (en) | 1992-05-15 | 1993-12-10 | Sanyo Electric Co Ltd | Silicon carbide light emitting diode |
DE4228895C2 (en) | 1992-08-29 | 2002-09-19 | Bosch Gmbh Robert | Motor vehicle lighting device with multiple semiconductor light sources |
JPH06177427A (en) | 1992-12-03 | 1994-06-24 | Rohm Co Ltd | Light emitting diode lamp |
GB9320291D0 (en) | 1993-10-01 | 1993-11-17 | Brown John H | Optical directing devices for light emitting diodes |
US5410519A (en) * | 1993-11-19 | 1995-04-25 | Coastal & Offshore Pacific Corporation | Acoustic tracking system |
JPH07176794A (en) | 1993-12-17 | 1995-07-14 | Nichia Chem Ind Ltd | Planar light source |
US5585640A (en) | 1995-01-11 | 1996-12-17 | Huston; Alan L. | Glass matrix doped with activated luminescent nanocrystalline particles |
US5614734A (en) | 1995-03-15 | 1997-03-25 | Yale University | High efficency LED structure |
US5834889A (en) * | 1995-09-22 | 1998-11-10 | Gl Displays, Inc. | Cold cathode fluorescent display |
JPH09153646A (en) | 1995-09-27 | 1997-06-10 | Toshiba Corp | Optical semiconductor device and manufacture of the same |
JPH09138402A (en) | 1995-11-15 | 1997-05-27 | Kouha:Kk | Led back light device for illuminating liquid crystal display device |
US5957564A (en) | 1996-03-26 | 1999-09-28 | Dana G. Bruce | Low power lighting display |
US6600175B1 (en) * | 1996-03-26 | 2003-07-29 | Advanced Technology Materials, Inc. | Solid state white light emitter and display using same |
US5803579A (en) | 1996-06-13 | 1998-09-08 | Gentex Corporation | Illuminator assembly incorporating light emitting diodes |
US20040239243A1 (en) * | 1996-06-13 | 2004-12-02 | Roberts John K. | Light emitting assembly |
US6550949B1 (en) * | 1996-06-13 | 2003-04-22 | Gentex Corporation | Systems and components for enhancing rear vision from a vehicle |
JPH1012929A (en) | 1996-06-25 | 1998-01-16 | Hitachi Cable Ltd | Mounting structure for light emitting diode |
KR100662955B1 (en) * | 1996-06-26 | 2006-12-28 | 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 | Light-emitting semiconductor component with luminescence conversion element |
DE19638667C2 (en) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mixed-color light-emitting semiconductor component with luminescence conversion element |
TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
US5851063A (en) | 1996-10-28 | 1998-12-22 | General Electric Company | Light-emitting diode white light source |
US6076936A (en) * | 1996-11-25 | 2000-06-20 | George; Ben | Tread area and step edge lighting system |
JPH10163535A (en) | 1996-11-27 | 1998-06-19 | Kasei Optonix Co Ltd | White light-emitting element |
JP3065263B2 (en) | 1996-12-27 | 2000-07-17 | 日亜化学工業株式会社 | Light emitting device and LED display using the same |
DE69841612D1 (en) | 1997-02-13 | 2010-05-27 | Honeywell Int Inc | LIGHTING SYSTEM WITH REUSE OF LIGHT TO INCREASE BRIGHTNESS |
JPH10233532A (en) | 1997-02-21 | 1998-09-02 | Houshin Kagaku Sangiyoushiyo:Kk | Light emitting diode |
JP2000509912A (en) * | 1997-03-03 | 2000-08-02 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | White light emitting diode |
JP3985065B2 (en) | 1997-05-14 | 2007-10-03 | 忠弘 大見 | Porous silicon substrate forming method and porous silicon substrate forming apparatus |
US6784463B2 (en) * | 1997-06-03 | 2004-08-31 | Lumileds Lighting U.S., Llc | III-Phospide and III-Arsenide flip chip light-emitting devices |
JPH1126806A (en) | 1997-06-30 | 1999-01-29 | Matsushita Electric Works Ltd | Photo coupler type semiconductor relay |
US6319425B1 (en) | 1997-07-07 | 2001-11-20 | Asahi Rubber Inc. | Transparent coating member for light-emitting diodes and a fluorescent color light source |
US7014336B1 (en) | 1999-11-18 | 2006-03-21 | Color Kinetics Incorporated | Systems and methods for generating and modulating illumination conditions |
US6292901B1 (en) | 1997-08-26 | 2001-09-18 | Color Kinetics Incorporated | Power/data protocol |
US5962971A (en) | 1997-08-29 | 1999-10-05 | Chen; Hsing | LED structure with ultraviolet-light emission chip and multilayered resins to generate various colored lights |
US6340824B1 (en) | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
GB2329238A (en) * | 1997-09-12 | 1999-03-17 | Hassan Paddy Abdel Salam | LED light source |
US6346771B1 (en) | 1997-11-19 | 2002-02-12 | Unisplay S.A. | High power led lamp |
US6480299B1 (en) | 1997-11-25 | 2002-11-12 | University Technology Corporation | Color printer characterization using optimization theory and neural networks |
JPH11177129A (en) | 1997-12-16 | 1999-07-02 | Rohm Co Ltd | Chip type led, led lamp and led display |
US6252254B1 (en) | 1998-02-06 | 2001-06-26 | General Electric Company | Light emitting device with phosphor composition |
US6294800B1 (en) * | 1998-02-06 | 2001-09-25 | General Electric Company | Phosphors for white light generation from UV emitting diodes |
US6278135B1 (en) * | 1998-02-06 | 2001-08-21 | General Electric Company | Green-light emitting phosphors and light sources using the same |
US6255670B1 (en) | 1998-02-06 | 2001-07-03 | General Electric Company | Phosphors for light generation from light emitting semiconductors |
JP2607796Y2 (en) | 1998-02-09 | 2002-07-08 | 株式会社ケンウッド | Magnetic circuit for speaker |
DE19813269A1 (en) * | 1998-03-25 | 1999-09-30 | Hoechst Diafoil Gmbh | Sealable polyester film with high oxygen barrier, process for its production and its use |
JP3704941B2 (en) | 1998-03-30 | 2005-10-12 | 日亜化学工業株式会社 | Light emitting device |
DE19829197C2 (en) | 1998-06-30 | 2002-06-20 | Siemens Ag | Component emitting and / or receiving radiation |
JP4109756B2 (en) | 1998-07-07 | 2008-07-02 | スタンレー電気株式会社 | Light emitting diode |
TW406442B (en) * | 1998-07-09 | 2000-09-21 | Sumitomo Electric Industries | White colored LED and intermediate colored LED |
US5959316A (en) | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
EP1115163A4 (en) | 1998-09-10 | 2001-12-05 | Rohm Co Ltd | Semiconductor light-emitting device and method for manufacturing the same |
EP1046196B9 (en) | 1998-09-28 | 2013-01-09 | Koninklijke Philips Electronics N.V. | Lighting system |
US6429583B1 (en) * | 1998-11-30 | 2002-08-06 | General Electric Company | Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors |
US6149283A (en) | 1998-12-09 | 2000-11-21 | Rensselaer Polytechnic Institute (Rpi) | LED lamp with reflector and multicolor adjuster |
US6373188B1 (en) * | 1998-12-22 | 2002-04-16 | Honeywell International Inc. | Efficient solid-state light emitting device with excited phosphors for producing a visible light output |
JP2000208822A (en) | 1999-01-11 | 2000-07-28 | Matsushita Electronics Industry Corp | Semiconductor light-emitting device |
US6212213B1 (en) | 1999-01-29 | 2001-04-03 | Agilent Technologies, Inc. | Projector light source utilizing a solid state green light source |
CN1206746C (en) | 1999-02-05 | 2005-06-15 | 株式会社日矿材料 | Photoelectric conversion functional element and production method thereof |
US20010042866A1 (en) | 1999-02-05 | 2001-11-22 | Carrie Carter Coman | Inxalygazn optical emitters fabricated via substrate removal |
US6521916B2 (en) | 1999-03-15 | 2003-02-18 | Gentex Corporation | Radiation emitter device having an encapsulant with different zones of thermal conductivity |
US6222207B1 (en) | 1999-05-24 | 2001-04-24 | Lumileds Lighting, U.S. Llc | Diffusion barrier for increased mirror reflectivity in reflective solderable contacts on high power LED chip |
EP1059678A2 (en) | 1999-06-09 | 2000-12-13 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
JP2000353826A (en) | 1999-06-09 | 2000-12-19 | Sanyo Electric Co Ltd | Hybrid integrated circuit device and light irradiating device |
KR100425566B1 (en) * | 1999-06-23 | 2004-04-01 | 가부시키가이샤 시티즌 덴시 | Light emitting diode |
US6335538B1 (en) * | 1999-07-23 | 2002-01-01 | Impulse Dynamics N.V. | Electro-optically driven solid state relay system |
JP2001144331A (en) * | 1999-09-02 | 2001-05-25 | Toyoda Gosei Co Ltd | Light-emitting device |
US6504301B1 (en) | 1999-09-03 | 2003-01-07 | Lumileds Lighting, U.S., Llc | Non-incandescent lightbulb package using light emitting diodes |
US6686691B1 (en) * | 1999-09-27 | 2004-02-03 | Lumileds Lighting, U.S., Llc | Tri-color, white light LED lamps |
JP2001111114A (en) * | 1999-10-06 | 2001-04-20 | Sony Corp | White led |
US6712486B1 (en) * | 1999-10-19 | 2004-03-30 | Permlight Products, Inc. | Mounting arrangement for light emitting diodes |
DE19952932C1 (en) | 1999-11-03 | 2001-05-03 | Osram Opto Semiconductors Gmbh | LED white light source with broadband excitation |
JP4422832B2 (en) * | 1999-11-05 | 2010-02-24 | アビックス株式会社 | LED light |
US6597179B2 (en) * | 1999-11-19 | 2003-07-22 | Gelcore, Llc | Method and device for remote monitoring of LED lamps |
US6762563B2 (en) * | 1999-11-19 | 2004-07-13 | Gelcore Llc | Module for powering and monitoring light-emitting diodes |
US6357889B1 (en) * | 1999-12-01 | 2002-03-19 | General Electric Company | Color tunable light source |
US6410942B1 (en) | 1999-12-03 | 2002-06-25 | Cree Lighting Company | Enhanced light extraction through the use of micro-LED arrays |
US6657236B1 (en) | 1999-12-03 | 2003-12-02 | Cree Lighting Company | Enhanced light extraction in LEDs through the use of internal and external optical elements |
US6350041B1 (en) * | 1999-12-03 | 2002-02-26 | Cree Lighting Company | High output radial dispersing lamp using a solid state light source |
JP2001177153A (en) | 1999-12-17 | 2001-06-29 | Sharp Corp | Light emitting device |
US6573537B1 (en) | 1999-12-22 | 2003-06-03 | Lumileds Lighting, U.S., Llc | Highly reflective ohmic contacts to III-nitride flip-chip LEDs |
US6885035B2 (en) * | 1999-12-22 | 2005-04-26 | Lumileds Lighting U.S., Llc | Multi-chip semiconductor LED assembly |
US6486499B1 (en) | 1999-12-22 | 2002-11-26 | Lumileds Lighting U.S., Llc | III-nitride light-emitting device with increased light generating capability |
US6504860B2 (en) | 2001-01-29 | 2003-01-07 | Cymer, Inc. | Purge monitoring system for gas discharge laser |
JP2000315826A (en) | 2000-01-01 | 2000-11-14 | Nichia Chem Ind Ltd | Light emitting device, formation thereof, gun type light emitting diode, chip type led |
JP3696021B2 (en) | 2000-01-20 | 2005-09-14 | 三洋電機株式会社 | Light irradiation device |
TW465123B (en) | 2000-02-02 | 2001-11-21 | Ind Tech Res Inst | High power white light LED |
WO2001059851A1 (en) | 2000-02-09 | 2001-08-16 | Nippon Leiz Corporation | Light source |
EP1134300A3 (en) * | 2000-03-17 | 2002-05-22 | Hitachi Metals, Ltd. | Fe-Ni alloy |
US6538371B1 (en) * | 2000-03-27 | 2003-03-25 | The General Electric Company | White light illumination system with improved color output |
US6522065B1 (en) * | 2000-03-27 | 2003-02-18 | General Electric Company | Single phosphor for creating white light with high luminosity and high CRI in a UV led device |
US6394621B1 (en) * | 2000-03-30 | 2002-05-28 | Hanewinkel, Iii William Henry | Latching switch for compact flashlight providing an easy means for changing the power source |
US6603258B1 (en) * | 2000-04-24 | 2003-08-05 | Lumileds Lighting, U.S. Llc | Light emitting diode device that emits white light |
WO2001084640A1 (en) | 2000-04-26 | 2001-11-08 | Osram Opto Semiconductors Gmbh | Gan-based light-emitting-diode chip and a method for producing a luminescent diode component |
US6501100B1 (en) | 2000-05-15 | 2002-12-31 | General Electric Company | White light emitting phosphor blend for LED devices |
DE50113755D1 (en) | 2000-05-29 | 2008-04-30 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | WHITE-EMITTING LIGHTING UNIT ON LED BASE |
JP4386693B2 (en) | 2000-05-31 | 2009-12-16 | パナソニック株式会社 | LED lamp and lamp unit |
JP2001345485A (en) | 2000-06-02 | 2001-12-14 | Toyoda Gosei Co Ltd | Light emitting device |
GB0015898D0 (en) | 2000-06-28 | 2000-08-23 | Oxley Dev Co Ltd | Light |
US6737801B2 (en) * | 2000-06-28 | 2004-05-18 | The Fox Group, Inc. | Integrated color LED chip |
JP2002076443A (en) | 2000-08-29 | 2002-03-15 | Citizen Electronics Co Ltd | Reflection cup for led chip |
US6636003B2 (en) | 2000-09-06 | 2003-10-21 | Spectrum Kinetics | Apparatus and method for adjusting the color temperature of white semiconduct or light emitters |
JP2002141556A (en) | 2000-09-12 | 2002-05-17 | Lumileds Lighting Us Llc | Light emitting diode with improved light extraction efficiency |
US6490104B1 (en) | 2000-09-15 | 2002-12-03 | Three-Five Systems, Inc. | Illumination system for a micro display |
JP3466144B2 (en) | 2000-09-22 | 2003-11-10 | 士郎 酒井 | How to roughen the surface of a semiconductor |
JP3609709B2 (en) * | 2000-09-29 | 2005-01-12 | 株式会社シチズン電子 | Light emitting diode |
US6998281B2 (en) | 2000-10-12 | 2006-02-14 | General Electric Company | Solid state lighting device with reduced form factor including LED with directional emission and package with microoptics |
US6642666B1 (en) | 2000-10-20 | 2003-11-04 | Gelcore Company | Method and device to emulate a railway searchlight signal with light emitting diodes |
CN1182590C (en) | 2000-10-20 | 2004-12-29 | 中田仗祐 | Light-emitting or light-receiving semiconductor device and method for fabricating same |
JP2002150821A (en) | 2000-11-06 | 2002-05-24 | Citizen Electronics Co Ltd | Flat light source |
US6441558B1 (en) * | 2000-12-07 | 2002-08-27 | Koninklijke Philips Electronics N.V. | White LED luminary light control system |
JP5110744B2 (en) | 2000-12-21 | 2012-12-26 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | Light emitting device and manufacturing method thereof |
US6930737B2 (en) * | 2001-01-16 | 2005-08-16 | Visteon Global Technologies, Inc. | LED backlighting system |
US6624350B2 (en) | 2001-01-18 | 2003-09-23 | Arise Technologies Corporation | Solar power management system |
JP2002217450A (en) | 2001-01-22 | 2002-08-02 | Sanken Electric Co Ltd | Semiconductor light-emitting device and method of manufacturing the same |
US6791119B2 (en) | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
JP2002261333A (en) | 2001-03-05 | 2002-09-13 | Toyoda Gosei Co Ltd | Light-emitting device |
JP3830083B2 (en) | 2001-03-07 | 2006-10-04 | スタンレー電気株式会社 | Semiconductor device and manufacturing method thereof |
JP4430264B2 (en) | 2001-03-19 | 2010-03-10 | 日亜化学工業株式会社 | Surface mount light emitting device |
JP2003115204A (en) | 2001-10-04 | 2003-04-18 | Toyoda Gosei Co Ltd | Shading reflection type device and light source |
JP2002289923A (en) | 2001-03-28 | 2002-10-04 | Toyoda Gosei Co Ltd | Light-emitting diode and its manufacturing method |
US6547249B2 (en) * | 2001-03-29 | 2003-04-15 | Lumileds Lighting U.S., Llc | Monolithic series/parallel led arrays formed on highly resistive substrates |
JP2002299699A (en) | 2001-03-30 | 2002-10-11 | Sumitomo Electric Ind Ltd | Light-emitting device and method of manufacturing the same |
JP4101468B2 (en) | 2001-04-09 | 2008-06-18 | 豊田合成株式会社 | Method for manufacturing light emitting device |
US6841931B2 (en) * | 2001-04-12 | 2005-01-11 | Toyoda Gosei Co., Ltd. | LED lamp |
US6685852B2 (en) * | 2001-04-27 | 2004-02-03 | General Electric Company | Phosphor blends for generating white light from near-UV/blue light-emitting devices |
US6686676B2 (en) * | 2001-04-30 | 2004-02-03 | General Electric Company | UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same |
JP2002344029A (en) | 2001-05-17 | 2002-11-29 | Rohm Co Ltd | Method of adjusting color tone of light-emitting diode |
US6616862B2 (en) * | 2001-05-21 | 2003-09-09 | General Electric Company | Yellow light-emitting halophosphate phosphors and light sources incorporating the same |
JP3940596B2 (en) * | 2001-05-24 | 2007-07-04 | 松下電器産業株式会社 | Illumination light source |
JP3767420B2 (en) | 2001-05-29 | 2006-04-19 | 豊田合成株式会社 | Light emitting element |
US6642652B2 (en) | 2001-06-11 | 2003-11-04 | Lumileds Lighting U.S., Llc | Phosphor-converted light emitting device |
JP4789350B2 (en) | 2001-06-11 | 2011-10-12 | シチズン電子株式会社 | Manufacturing method of light emitting diode |
US6576488B2 (en) | 2001-06-11 | 2003-06-10 | Lumileds Lighting U.S., Llc | Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor |
JP4098568B2 (en) | 2001-06-25 | 2008-06-11 | 株式会社東芝 | Semiconductor light emitting device and manufacturing method thereof |
JP2003017756A (en) | 2001-06-28 | 2003-01-17 | Toyoda Gosei Co Ltd | Light emitting diode |
US6578986B2 (en) * | 2001-06-29 | 2003-06-17 | Permlight Products, Inc. | Modular mounting arrangement and method for light emitting diodes |
JP3548735B2 (en) | 2001-06-29 | 2004-07-28 | 士郎 酒井 | Method of manufacturing gallium nitride based compound semiconductor |
JP2003036707A (en) | 2001-07-25 | 2003-02-07 | Sanyo Electric Co Ltd | Lighting device and its manufacturing method |
JP4122737B2 (en) | 2001-07-26 | 2008-07-23 | 松下電工株式会社 | Method for manufacturing light emitting device |
US20030030063A1 (en) * | 2001-07-27 | 2003-02-13 | Krzysztof Sosniak | Mixed color leds for auto vanity mirrors and other applications where color differentiation is critical |
JP2003046117A (en) | 2001-07-30 | 2003-02-14 | Kyocera Corp | Method for manufacturing semiconductor light-emitting element |
JP4147755B2 (en) | 2001-07-31 | 2008-09-10 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
EP1462711B1 (en) | 2001-08-23 | 2014-12-03 | Yukiyasu Okumura | Color temperature-regulable led light |
EP2017901A1 (en) | 2001-09-03 | 2009-01-21 | Panasonic Corporation | Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting DEV |
TW506145B (en) | 2001-10-04 | 2002-10-11 | United Epitaxy Co Ltd | High Luminescence LED having transparent substrate flip-chip type LED die |
US6498355B1 (en) | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
US7858403B2 (en) | 2001-10-31 | 2010-12-28 | Cree, Inc. | Methods and systems for fabricating broad spectrum light emitting devices |
TW574523B (en) * | 2001-11-23 | 2004-02-01 | Ind Tech Res Inst | Color filter of liquid crystal display |
TW511782U (en) | 2001-11-29 | 2002-11-21 | Wen-Chin Lin | Improved structure of light-emitting diode |
US6552495B1 (en) * | 2001-12-19 | 2003-04-22 | Koninklijke Philips Electronics N.V. | Adaptive control system and method with spatial uniform color metric for RGB LED based white light illumination |
US6851834B2 (en) * | 2001-12-21 | 2005-02-08 | Joseph A. Leysath | Light emitting diode lamp having parabolic reflector and diffuser |
TW524391U (en) | 2001-12-27 | 2003-03-11 | Solidlite Corp | Connection type SMT LED |
JP4077312B2 (en) | 2001-12-28 | 2008-04-16 | 株式会社東芝 | LIGHT EMITTING DEVICE MANUFACTURING METHOD AND LIGHT EMITTING DEVICE |
US7153015B2 (en) | 2001-12-31 | 2006-12-26 | Innovations In Optics, Inc. | Led white light optical system |
JP3802424B2 (en) | 2002-01-15 | 2006-07-26 | 株式会社東芝 | Semiconductor light emitting device and manufacturing method thereof |
JP3782357B2 (en) | 2002-01-18 | 2006-06-07 | 株式会社東芝 | Manufacturing method of semiconductor light emitting device |
US6635503B2 (en) | 2002-01-28 | 2003-10-21 | Cree, Inc. | Cluster packaging of light emitting diodes |
AU2003207287B2 (en) | 2002-01-28 | 2007-12-13 | Nichia Corporation | Nitride semiconductor device having support substrate and its manufacturing method |
CN2535926Y (en) | 2002-02-08 | 2003-02-12 | 陈巧 | Light-emitting diode packaging structure |
JP2003234509A (en) | 2002-02-08 | 2003-08-22 | Citizen Electronics Co Ltd | Light emitting diode |
KR100983193B1 (en) | 2002-03-22 | 2010-09-20 | 니치아 카가쿠 고교 가부시키가이샤 | Nitride Phosphor and Production Process Thereof, and Light Emitting Device |
US7093958B2 (en) * | 2002-04-09 | 2006-08-22 | Osram Sylvania Inc. | LED light source assembly |
DE10216394B3 (en) * | 2002-04-12 | 2004-01-08 | Osram Opto Semiconductors Gmbh | LED module |
TW546854B (en) | 2002-05-21 | 2003-08-11 | Harvatek Corp | White light emitting device |
JP2003347601A (en) | 2002-05-28 | 2003-12-05 | Matsushita Electric Works Ltd | Light emitting diode illuminator |
US20030222268A1 (en) | 2002-05-31 | 2003-12-04 | Yocom Perry Niel | Light sources having a continuous broad emission wavelength and phosphor compositions useful therefor |
JP3707688B2 (en) | 2002-05-31 | 2005-10-19 | スタンレー電気株式会社 | Light emitting device and manufacturing method thereof |
JP2004031856A (en) | 2002-06-28 | 2004-01-29 | Sumitomo Electric Ind Ltd | ZnSe-BASED LIGHT EMITTING DEVICE AND ITS MANUFACTURING METHOD |
US8100552B2 (en) | 2002-07-12 | 2012-01-24 | Yechezkal Evan Spero | Multiple light-source illuminating system |
JP2004055772A (en) * | 2002-07-18 | 2004-02-19 | Citizen Electronics Co Ltd | Led light emitting device |
JP2004068909A (en) | 2002-08-06 | 2004-03-04 | Saginomiya Seisakusho Inc | Aluminum welding bellows and its manufacturing method |
JP4197109B2 (en) | 2002-08-06 | 2008-12-17 | 静雄 藤田 | Lighting device |
JP4360788B2 (en) * | 2002-08-29 | 2009-11-11 | シチズン電子株式会社 | Backlight for liquid crystal display panel and method of manufacturing light emitting diode used therefor |
EP1892764B1 (en) | 2002-08-29 | 2016-03-09 | Seoul Semiconductor Co., Ltd. | Light-emitting device having light-emitting diodes |
US7768189B2 (en) * | 2004-08-02 | 2010-08-03 | Lumination Llc | White LEDs with tunable CRI |
KR100622209B1 (en) | 2002-08-30 | 2006-09-19 | 젤코어 엘엘씨 | Coated led with improved efficiency |
JP3991961B2 (en) | 2002-09-05 | 2007-10-17 | 日亜化学工業株式会社 | Side-emitting type light emitting device |
JP4349782B2 (en) | 2002-09-11 | 2009-10-21 | 東芝ライテック株式会社 | LED lighting device |
TW546859B (en) | 2002-09-20 | 2003-08-11 | Formosa Epitaxy Inc | Structure and manufacturing method of GaN light emitting diode |
JP2004119839A (en) | 2002-09-27 | 2004-04-15 | Toshiba Corp | Optical semiconductor device and its manufacturing method |
JP2004127988A (en) | 2002-09-30 | 2004-04-22 | Toyoda Gosei Co Ltd | White light emitting device |
US6784460B2 (en) | 2002-10-10 | 2004-08-31 | Agilent Technologies, Inc. | Chip shaping for flip-chip light emitting diode |
US7009199B2 (en) * | 2002-10-22 | 2006-03-07 | Cree, Inc. | Electronic devices having a header and antiparallel connected light emitting diodes for producing light from AC current |
US7213942B2 (en) * | 2002-10-24 | 2007-05-08 | Ac Led Lighting, L.L.C. | Light emitting diodes for high AC voltage operation and general lighting |
US6957899B2 (en) | 2002-10-24 | 2005-10-25 | Hongxing Jiang | Light emitting diodes for high AC voltage operation and general lighting |
JP4277508B2 (en) | 2002-10-28 | 2009-06-10 | パナソニック電工株式会社 | Semiconductor light emitting device |
US6880954B2 (en) * | 2002-11-08 | 2005-04-19 | Smd Software, Inc. | High intensity photocuring system |
TW569479B (en) * | 2002-12-20 | 2004-01-01 | Ind Tech Res Inst | White-light LED applying omnidirectional reflector |
JP4397394B2 (en) | 2003-01-24 | 2010-01-13 | ディジタル・オプティクス・インターナショナル・コーポレイション | High density lighting system |
US7091661B2 (en) | 2003-01-27 | 2006-08-15 | 3M Innovative Properties Company | Phosphor based light sources having a reflective polarizer |
US7091653B2 (en) | 2003-01-27 | 2006-08-15 | 3M Innovative Properties Company | Phosphor based light sources having a non-planar long pass reflector |
JP2004253364A (en) | 2003-01-27 | 2004-09-09 | Matsushita Electric Ind Co Ltd | Lighting system |
JP2004238441A (en) | 2003-02-04 | 2004-08-26 | Nitto Denko Corp | Optical semiconductor element sealing resin |
US7042020B2 (en) | 2003-02-14 | 2006-05-09 | Cree, Inc. | Light emitting device incorporating a luminescent material |
US6936857B2 (en) * | 2003-02-18 | 2005-08-30 | Gelcore, Llc | White light LED device |
JP2004266124A (en) | 2003-03-03 | 2004-09-24 | Matsushita Electric Ind Co Ltd | Semiconductor light emitting device |
US20040218387A1 (en) | 2003-03-18 | 2004-11-04 | Robert Gerlach | LED lighting arrays, fixtures and systems and method for determining human color perception |
JP4504662B2 (en) | 2003-04-09 | 2010-07-14 | シチズン電子株式会社 | LED lamp |
US6964507B2 (en) | 2003-04-25 | 2005-11-15 | Everbrite, Llc | Sign illumination system |
KR101148332B1 (en) | 2003-04-30 | 2012-05-25 | 크리, 인코포레이티드 | High powered light emitter packages with compact optics |
US7005679B2 (en) * | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
WO2004100611A1 (en) | 2003-05-06 | 2004-11-18 | Ilumera Group Ag | Led lighting module and system |
JP2004356116A (en) | 2003-05-26 | 2004-12-16 | Citizen Electronics Co Ltd | Light emitting diode |
JP2005005482A (en) | 2003-06-12 | 2005-01-06 | Citizen Electronics Co Ltd | Led light emitting device and color display device using the same |
WO2005004202A2 (en) | 2003-06-24 | 2005-01-13 | Gelcore Llc | Full spectrum phosphor blends for white light generation with led chips |
JP4360858B2 (en) | 2003-07-29 | 2009-11-11 | シチズン電子株式会社 | Surface mount type LED and light emitting device using the same |
WO2005013365A2 (en) | 2003-07-30 | 2005-02-10 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light emitting device, light emitting module, and lighting apparatus |
DE10335077A1 (en) | 2003-07-31 | 2005-03-03 | Osram Opto Semiconductors Gmbh | LED module |
US6923002B2 (en) | 2003-08-28 | 2005-08-02 | General Electric Company | Combustion liner cap assembly for combustion dynamics reduction |
US7329024B2 (en) * | 2003-09-22 | 2008-02-12 | Permlight Products, Inc. | Lighting apparatus |
JP2005101296A (en) | 2003-09-25 | 2005-04-14 | Osram-Melco Ltd | Device, module, and lighting apparatus of variable color light emitting diode |
US6972438B2 (en) | 2003-09-30 | 2005-12-06 | Cree, Inc. | Light emitting diode with porous SiC substrate and method for fabricating |
JP2005109212A (en) | 2003-09-30 | 2005-04-21 | Stanley Electric Co Ltd | Semiconductor light emitting device |
DE10347463A1 (en) | 2003-10-02 | 2005-04-21 | Pintsch Bamag Ag | LED signal light for railway vehicles has first (white), second (green), third (yellow) and fourth (red) LEDs that radiate simultaneously in while light mode |
JP2005116363A (en) | 2003-10-08 | 2005-04-28 | Pioneer Plasma Display Corp | Plasma display panel |
US7102172B2 (en) | 2003-10-09 | 2006-09-05 | Permlight Products, Inc. | LED luminaire |
US20050082562A1 (en) | 2003-10-15 | 2005-04-21 | Epistar Corporation | High efficiency nitride based light emitting device |
JP4458804B2 (en) * | 2003-10-17 | 2010-04-28 | シチズン電子株式会社 | White LED |
US6841804B1 (en) * | 2003-10-27 | 2005-01-11 | Formosa Epitaxy Incorporation | Device of white light-emitting diode |
JP4590905B2 (en) | 2003-10-31 | 2010-12-01 | 豊田合成株式会社 | Light emitting element and light emitting device |
JP2005142311A (en) | 2003-11-06 | 2005-06-02 | Tzu-Chi Cheng | Light-emitting device |
JP2005144679A (en) * | 2003-11-11 | 2005-06-09 | Roland Dg Corp | Inkjet printer |
KR100669408B1 (en) | 2003-11-24 | 2007-01-15 | 삼성에스디아이 주식회사 | Plasma display panel |
TWI263356B (en) * | 2003-11-27 | 2006-10-01 | Kuen-Juei Li | Light-emitting device |
JP2005166937A (en) | 2003-12-02 | 2005-06-23 | Toyoda Gosei Co Ltd | Light emitting device |
JP2005191530A (en) | 2003-12-03 | 2005-07-14 | Sumitomo Electric Ind Ltd | Light emitting device |
JP2005167079A (en) | 2003-12-04 | 2005-06-23 | Toyoda Gosei Co Ltd | Light emitting device |
US7095056B2 (en) * | 2003-12-10 | 2006-08-22 | Sensor Electronic Technology, Inc. | White light emitting device and method |
JP4289144B2 (en) | 2003-12-15 | 2009-07-01 | シチズン電子株式会社 | Light emitting diode |
US7066623B2 (en) * | 2003-12-19 | 2006-06-27 | Soo Ghee Lee | Method and apparatus for producing untainted white light using off-white light emitting diodes |
JP4637478B2 (en) | 2003-12-26 | 2011-02-23 | 日本パイオニクス株式会社 | Vapor growth equipment |
JP4530739B2 (en) | 2004-01-29 | 2010-08-25 | 京セラ株式会社 | Light emitting element mounting substrate and light emitting device |
JP2005268770A (en) | 2004-02-19 | 2005-09-29 | Matsushita Electric Ind Co Ltd | White light emitting element and white light source |
US7250715B2 (en) * | 2004-02-23 | 2007-07-31 | Philips Lumileds Lighting Company, Llc | Wavelength converted semiconductor light emitting devices |
EP1571715A1 (en) | 2004-03-04 | 2005-09-07 | Nan Ya Plastics Corporation | Method for producing white light emission by means of secondary light exitation and its product |
US7256557B2 (en) | 2004-03-11 | 2007-08-14 | Avago Technologies General Ip(Singapore) Pte. Ltd. | System and method for producing white light using a combination of phosphor-converted white LEDs and non-phosphor-converted color LEDs |
US7009343B2 (en) * | 2004-03-11 | 2006-03-07 | Kevin Len Li Lim | System and method for producing white light using LEDs |
JP2005266124A (en) | 2004-03-17 | 2005-09-29 | Sharp Corp | Powder discharging apparatus and image forming apparatus |
US7009285B2 (en) | 2004-03-19 | 2006-03-07 | Lite-On Technology Corporation | Optoelectronic semiconductor component |
US7083302B2 (en) | 2004-03-24 | 2006-08-01 | J. S. Technology Co., Ltd. | White light LED assembly |
US7517728B2 (en) | 2004-03-31 | 2009-04-14 | Cree, Inc. | Semiconductor light emitting devices including a luminescent conversion element |
JP2005294736A (en) | 2004-04-05 | 2005-10-20 | Stanley Electric Co Ltd | Manufacturing method for semiconductor light emitting device |
JP4665209B2 (en) | 2004-04-15 | 2011-04-06 | スタンレー電気株式会社 | Flat illumination LED |
JP4128564B2 (en) | 2004-04-27 | 2008-07-30 | 松下電器産業株式会社 | Light emitting device |
US7315119B2 (en) | 2004-05-07 | 2008-01-01 | Avago Technologies Ip (Singapore) Pte Ltd | Light-emitting device having a phosphor particle layer with specific thickness |
KR100658700B1 (en) | 2004-05-13 | 2006-12-15 | 서울옵토디바이스주식회사 | Light emitting device with RGB diodes and phosphor converter |
US7278760B2 (en) | 2004-05-24 | 2007-10-09 | Osram Opto Semiconductor Gmbh | Light-emitting electronic component |
JP2005353816A (en) | 2004-06-10 | 2005-12-22 | Olympus Corp | Light emitting device, method for manufacturing the same, illuminant using the same, and projector |
JP2008503087A (en) | 2004-06-18 | 2008-01-31 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | LED with improved light emissivity profile |
US7958546B2 (en) * | 2004-06-29 | 2011-06-07 | International Business Machines Corporation | Identity access management system |
US7255469B2 (en) | 2004-06-30 | 2007-08-14 | 3M Innovative Properties Company | Phosphor based illumination system having a light guide and an interference reflector |
TWI274209B (en) * | 2004-07-16 | 2007-02-21 | Chi Lin Technology Co Ltd | Light emitting diode and backlight module having light emitting diode |
JP2006036930A (en) | 2004-07-27 | 2006-02-09 | Nitto Denko Corp | Resin for encapsulating optical semiconductor element |
US20060181192A1 (en) * | 2004-08-02 | 2006-08-17 | Gelcore | White LEDs with tailorable color temperature |
US7453195B2 (en) * | 2004-08-02 | 2008-11-18 | Lumination Llc | White lamps with enhanced color contrast |
JP4817629B2 (en) | 2004-09-15 | 2011-11-16 | 京セラ株式会社 | LIGHT EMITTING ELEMENT AND LIGHTING DEVICE USING THE LIGHT EMITTING ELEMENT |
US7135664B2 (en) | 2004-09-08 | 2006-11-14 | Emteq Lighting and Cabin Systems, Inc. | Method of adjusting multiple light sources to compensate for variation in light output that occurs with time |
KR100524098B1 (en) * | 2004-09-10 | 2005-10-26 | 럭스피아 주식회사 | Semiconductor device capable of emitting light and the menufacturing mehtod of the same |
US8513686B2 (en) | 2004-09-22 | 2013-08-20 | Cree, Inc. | High output small area group III nitride LEDs |
US8174037B2 (en) | 2004-09-22 | 2012-05-08 | Cree, Inc. | High efficiency group III nitride LED with lenticular surface |
US7633097B2 (en) | 2004-09-23 | 2009-12-15 | Philips Lumileds Lighting Company, Llc | Growth of III-nitride light emitting devices on textured substrates |
DE102004047766C5 (en) * | 2004-09-30 | 2014-02-27 | Osram Opto Semiconductors Gmbh | lighting device |
US20060067073A1 (en) | 2004-09-30 | 2006-03-30 | Chu-Chi Ting | White led device |
US7419839B2 (en) | 2004-11-12 | 2008-09-02 | Philips Lumileds Lighting Company, Llc | Bonding an optical element to a light emitting device |
US7462502B2 (en) | 2004-11-12 | 2008-12-09 | Philips Lumileds Lighting Company, Llc | Color control by alteration of wavelength converting element |
US7858408B2 (en) | 2004-11-15 | 2010-12-28 | Koninklijke Philips Electronics N.V. | LED with phosphor tile and overmolded phosphor in lens |
US7344902B2 (en) | 2004-11-15 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Overmolded lens over LED die |
US20060113548A1 (en) * | 2004-11-29 | 2006-06-01 | Ching-Chung Chen | Light emitting diode |
CN101073155B (en) | 2004-12-06 | 2010-09-29 | 皇家飞利浦电子股份有限公司 | Single chip LED as compact color variable light source |
KR100638666B1 (en) | 2005-01-03 | 2006-10-30 | 삼성전기주식회사 | Nitride based semiconductor light emitting device |
US8125137B2 (en) | 2005-01-10 | 2012-02-28 | Cree, Inc. | Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same |
US7221044B2 (en) * | 2005-01-21 | 2007-05-22 | Ac Led Lighting, L.L.C. | Heterogeneous integrated high voltage DC/AC light emitter |
JP2006216717A (en) | 2005-02-02 | 2006-08-17 | Harvatek Corp | Wafer level electro-optical semiconductor assembly structure and its manufacturing method |
JP4715227B2 (en) | 2005-02-21 | 2011-07-06 | パナソニック株式会社 | Manufacturing method of semiconductor light emitting device |
EP1861876A1 (en) | 2005-03-24 | 2007-12-05 | Tir Systems Ltd. | Solid-state lighting device package |
US7358954B2 (en) * | 2005-04-04 | 2008-04-15 | Cree, Inc. | Synchronized light emitting diode backlighting systems and methods for displays |
TW200707799A (en) | 2005-04-21 | 2007-02-16 | Aonex Technologies Inc | Bonded intermediate substrate and method of making same |
US20060245184A1 (en) | 2005-04-29 | 2006-11-02 | Galli Robert D | Iris diffuser for adjusting light beam properties |
TWM277882U (en) | 2005-05-31 | 2005-10-11 | Sheng-Li Yang | Diffusion type light source structure |
JP2006339362A (en) | 2005-06-01 | 2006-12-14 | Ngk Spark Plug Co Ltd | Wiring board for mounting light emitting element |
TW200717866A (en) | 2005-07-29 | 2007-05-01 | Toshiba Kk | Semiconductor light emitting device |
JP2007067326A (en) | 2005-09-02 | 2007-03-15 | Shinko Electric Ind Co Ltd | Light emitting diode and method of manufacturing same |
JP2007080885A (en) | 2005-09-09 | 2007-03-29 | New Japan Chem Co Ltd | Optical semiconductor sealing agent, optical semiconductor and its manufacturing method |
US7718449B2 (en) | 2005-10-28 | 2010-05-18 | Lumination Llc | Wafer level package for very small footprint and low profile white LED devices |
US7993021B2 (en) | 2005-11-18 | 2011-08-09 | Cree, Inc. | Multiple color lighting element cluster tiles for solid state lighting panels |
US7514721B2 (en) | 2005-11-29 | 2009-04-07 | Koninklijke Philips Electronics N.V. | Luminescent ceramic element for a light emitting device |
US7213940B1 (en) * | 2005-12-21 | 2007-05-08 | Led Lighting Fixtures, Inc. | Lighting device and lighting method |
EP1969633B1 (en) | 2005-12-22 | 2018-08-29 | Cree, Inc. | Lighting device |
WO2007073001A1 (en) | 2005-12-22 | 2007-06-28 | Showa Denko K.K. | Light-emitting diode and method for fabricant thereof |
JP2007180430A (en) | 2005-12-28 | 2007-07-12 | Toshiba Lighting & Technology Corp | Light-emitting diode device |
US7682850B2 (en) | 2006-03-17 | 2010-03-23 | Philips Lumileds Lighting Company, Llc | White LED for backlight with phosphor plates |
US7364338B2 (en) | 2006-03-29 | 2008-04-29 | Tpo Displays Corp. | Systems for providing backlight module with stacked light source |
JP2007273763A (en) | 2006-03-31 | 2007-10-18 | Sony Corp | Semiconductor device and its manufacturing method |
EP2011164B1 (en) | 2006-04-24 | 2018-08-29 | Cree, Inc. | Side-view surface mount white led |
US8080828B2 (en) | 2006-06-09 | 2011-12-20 | Philips Lumileds Lighting Company, Llc | Low profile side emitting LED with window layer and phosphor layer |
US7842960B2 (en) * | 2006-09-06 | 2010-11-30 | Lumination Llc | Light emitting packages and methods of making same |
JP4458116B2 (en) | 2007-05-30 | 2010-04-28 | 住友電気工業株式会社 | Group III nitride semiconductor layer bonded substrate for epitaxial layer growth and semiconductor device |
US20090173958A1 (en) | 2008-01-04 | 2009-07-09 | Cree, Inc. | Light emitting devices with high efficiency phospor structures |
US8740400B2 (en) * | 2008-03-07 | 2014-06-03 | Intematix Corporation | White light illumination system with narrow band green phosphor and multiple-wavelength excitation |
JP5388666B2 (en) | 2008-04-21 | 2014-01-15 | キヤノン株式会社 | Surface emitting laser |
JP5298384B2 (en) | 2008-08-07 | 2013-09-25 | 船井電機株式会社 | Microphone unit |
JP5371375B2 (en) | 2008-10-30 | 2013-12-18 | 三菱レイヨン・テキスタイル株式会社 | Wiping fabric |
US20110018013A1 (en) | 2009-07-21 | 2011-01-27 | Koninklijke Philips Electronics N.V. | Thin-film flip-chip series connected leds |
-
2003
- 2003-05-01 US US10/427,274 patent/US7005679B2/en not_active Expired - Lifetime
-
2004
- 2004-03-31 WO PCT/US2004/010141 patent/WO2004100275A1/en active Search and Examination
- 2004-04-14 TW TW093110313A patent/TWI344705B/en active
-
2006
- 2006-02-02 US US11/347,645 patent/US7791092B2/en active Active
-
2010
- 2010-07-28 US US12/845,629 patent/US8901585B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030067773A1 (en) * | 1999-12-02 | 2003-04-10 | Koninklijke Philips Electronics N.V. | LED/phosphor-LED hybrid lighting systems |
WO2001069692A1 (en) * | 2000-03-14 | 2001-09-20 | Lumileds Lighting B.V. | Light-emitting diode, lighting device and method of manufacturing same |
EP1160883A2 (en) * | 2000-05-31 | 2001-12-05 | Matsushita Electric Industrial Co., Ltd. | LED lamp |
US20030026096A1 (en) * | 2001-07-31 | 2003-02-06 | Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh | LED-based planar light source |
Cited By (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
US8071988B2 (en) | 2004-05-06 | 2011-12-06 | Seoul Semiconductor Co., Ltd. | White light emitting device comprising a plurality of light emitting diodes with different peak emission wavelengths and a wavelength converter |
EP1766692A1 (en) * | 2004-05-06 | 2007-03-28 | Seoul Opto Device Co., Ltd. | Light emitting device |
EP1766692A4 (en) * | 2004-05-06 | 2011-08-24 | Seoul Semiconductor Co Ltd | Light emitting device |
US11605762B2 (en) | 2004-05-13 | 2023-03-14 | Seoul Semiconductor Co., Ltd. | Light emitting device including RGB light emitting diodes and phosphor |
US10916684B2 (en) | 2004-05-13 | 2021-02-09 | Seoul Semiconductor Co., Ltd. | Light emitting device including RGB light emitting diodes and phosphor |
US10672956B2 (en) | 2004-05-13 | 2020-06-02 | Seoul Semiconductor Co., Ltd. | Light emitting device including RGB light emitting diodes and phosphor |
US10186642B2 (en) | 2004-05-13 | 2019-01-22 | Seoul Semiconductor Co., Ltd. | Light emitting device including RGB light emitting diodes and phosphor |
WO2006119750A3 (en) * | 2005-05-11 | 2007-03-29 | Arnold & Richter Kg | Spotlight for shooting films and videos |
US7744242B2 (en) | 2005-05-11 | 2010-06-29 | Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg | Spotlight for shooting films and videos |
WO2006119750A2 (en) * | 2005-05-11 | 2006-11-16 | Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg | Spotlight for shooting films and videos |
US8414174B2 (en) | 2005-06-07 | 2013-04-09 | Oree, Inc. | Illumination apparatus |
US8272758B2 (en) | 2005-06-07 | 2012-09-25 | Oree, Inc. | Illumination apparatus and methods of forming the same |
US8128272B2 (en) | 2005-06-07 | 2012-03-06 | Oree, Inc. | Illumination apparatus |
US8579466B2 (en) | 2005-06-07 | 2013-11-12 | Oree, Inc. | Illumination apparatus and methods of forming the same |
US8215815B2 (en) | 2005-06-07 | 2012-07-10 | Oree, Inc. | Illumination apparatus and methods of forming the same |
US8641254B2 (en) | 2005-06-07 | 2014-02-04 | Oree, Inc. | Illumination apparatus |
WO2007069148A2 (en) * | 2005-12-14 | 2007-06-21 | Koninklijke Philips Electronics N.V. | Semiconductor light source and method of producing light of a desired color point |
WO2007069148A3 (en) * | 2005-12-14 | 2007-09-27 | Koninkl Philips Electronics Nv | Semiconductor light source and method of producing light of a desired color point |
US9576939B2 (en) | 2006-03-31 | 2017-02-21 | Seoul Semiconductor Co., Ltd. | Light emitting device and lighting system having the same |
US11322484B2 (en) | 2006-03-31 | 2022-05-03 | Seoul Semiconductor Co., Ltd. | Light emitting device and lighting system having the same |
US9312246B2 (en) | 2006-03-31 | 2016-04-12 | Seoul Semiconductor Co., Ltd. | Light emitting device and lighting system having the same |
EP1850383A1 (en) * | 2006-04-25 | 2007-10-31 | ILED Photoelectronics Inc. | Three wavelength light emitting diode |
US8476820B2 (en) | 2006-11-01 | 2013-07-02 | Wake Forest University | Solid state lighting compositions and systems |
WO2008123027A1 (en) * | 2007-03-19 | 2008-10-16 | Kabushiki Kaisha Toshiba | White light emitting device, and backlight, display device and illuminating device using the white light emitting device |
JP2008235458A (en) * | 2007-03-19 | 2008-10-02 | Toshiba Corp | White light emitting device, backlight using same device, display using same device, and illuminating apparatus using same device |
US8501040B2 (en) | 2007-08-22 | 2013-08-06 | Seoul Semiconductor Co., Ltd. | Non-stoichiometric tetragonal copper alkaline earth silicate phosphors and method of preparing the same |
US8431954B2 (en) | 2007-08-28 | 2013-04-30 | Seoul Semiconductor Co., Ltd. | Light emitting device employing non-stoichiometric tetragonal alkaline earth silicate phosphors |
US8550684B2 (en) | 2007-12-19 | 2013-10-08 | Oree, Inc. | Waveguide-based packaging structures and methods for discrete lighting elements |
US8459856B2 (en) | 2007-12-19 | 2013-06-11 | Oree, Inc. | Planar white illumination apparatus |
US7826698B1 (en) | 2007-12-19 | 2010-11-02 | Oree, Inc. | Elimination of stitch artifacts in a planar illumination area |
US8064743B2 (en) | 2007-12-19 | 2011-11-22 | Oree, Inc. | Discrete light guide-based planar illumination area |
US8238703B2 (en) | 2007-12-19 | 2012-08-07 | Oree Inc. | Waveguide sheet containing in-coupling, propagation, and out-coupling regions |
US8182128B2 (en) | 2007-12-19 | 2012-05-22 | Oree, Inc. | Planar white illumination apparatus |
US8172447B2 (en) | 2007-12-19 | 2012-05-08 | Oree, Inc. | Discrete lighting elements and planar assembly thereof |
US8231237B2 (en) | 2008-03-05 | 2012-07-31 | Oree, Inc. | Sub-assembly and methods for forming the same |
US8297786B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
US9164218B2 (en) | 2008-07-10 | 2015-10-20 | Oree, Inc. | Slim waveguide coupling apparatus and method |
US8301002B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
US8624527B1 (en) | 2009-03-27 | 2014-01-07 | Oree, Inc. | Independently controllable illumination device |
US8328406B2 (en) | 2009-05-13 | 2012-12-11 | Oree, Inc. | Low-profile illumination device |
EP2448020A4 (en) * | 2009-06-23 | 2014-04-30 | Koito Mfg Co Ltd | Light emitting module |
EP2448020A1 (en) * | 2009-06-23 | 2012-05-02 | Koito Manufacturing Co., Ltd. | Light emitting module |
US8727597B2 (en) | 2009-06-24 | 2014-05-20 | Oree, Inc. | Illumination apparatus with high conversion efficiency and methods of forming the same |
US8840276B2 (en) | 2011-11-16 | 2014-09-23 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
US9039244B2 (en) | 2011-11-16 | 2015-05-26 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
US8591072B2 (en) | 2011-11-16 | 2013-11-26 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
CN103165645A (en) * | 2011-12-09 | 2013-06-19 | 索尼公司 | Display unit and method of manufacturing the same, electronic apparatus, illumination unit, and light-emitting device and method of manufacturing the same |
US9857519B2 (en) | 2012-07-03 | 2018-01-02 | Oree Advanced Illumination Solutions Ltd. | Planar remote phosphor illumination apparatus |
Also Published As
Publication number | Publication date |
---|---|
TWI344705B (en) | 2011-07-01 |
US20040217364A1 (en) | 2004-11-04 |
US20060138435A1 (en) | 2006-06-29 |
US8901585B2 (en) | 2014-12-02 |
US7791092B2 (en) | 2010-09-07 |
US20100290221A1 (en) | 2010-11-18 |
US7005679B2 (en) | 2006-02-28 |
TW200505054A (en) | 2005-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7005679B2 (en) | Multiple component solid state white light | |
US8217406B2 (en) | Solid state light emitter with pumped nanophosphors for producing high CRI white light | |
US7963666B2 (en) | Efficient emitting LED package and method for efficiently emitting light | |
JP5951180B2 (en) | Emitter package with saturation conversion material | |
US8593063B2 (en) | White light emitting device | |
US7781783B2 (en) | White light LED device | |
US8905588B2 (en) | System and method for providing color light sources in proximity to predetermined wavelength conversion structures | |
US6933535B2 (en) | Light emitting devices with enhanced luminous efficiency | |
US20110012141A1 (en) | Single-color wavelength-converted light emitting devices | |
US9537062B2 (en) | Solid state light emitter package, a light emission device, a flexible LED strip and a luminaire | |
US20060038198A1 (en) | Device and method for producing output light having a wavelength spectrum in the visible range and the infrared range using a fluorescent material | |
US10147850B1 (en) | System and method for providing color light sources in proximity to predetermined wavelength conversion structures | |
CN114695627A (en) | LED module and lighting device | |
US20140353696A1 (en) | Solid State Lighting Device | |
KR20100076655A (en) | White light emitting device | |
US20110127555A1 (en) | Solid state light emitter with phosphors dispersed in a liquid or gas for producing high cri white light | |
KR20180121986A (en) | LED devices using neodymium-based materials with variable contents of fluorine and oxygen | |
KR100712880B1 (en) | White light emitting diode capable of reducing correlated color temperature variation | |
KR20140105902A (en) | Semiconductor light emitting device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DPEN | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101) | ||
122 | Ep: pct application non-entry in european phase | ||
DPE1 | Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101) |