WO2005002794A3 - Cell, system and article for electrochemical mechanical processing (ecmp) - Google Patents

Cell, system and article for electrochemical mechanical processing (ecmp) Download PDF

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Publication number
WO2005002794A3
WO2005002794A3 PCT/US2004/022722 US2004022722W WO2005002794A3 WO 2005002794 A3 WO2005002794 A3 WO 2005002794A3 US 2004022722 W US2004022722 W US 2004022722W WO 2005002794 A3 WO2005002794 A3 WO 2005002794A3
Authority
WO
WIPO (PCT)
Prior art keywords
cell
polishing
platen assembly
article
electrochemical mechanical
Prior art date
Application number
PCT/US2004/022722
Other languages
French (fr)
Other versions
WO2005002794A2 (en
Inventor
Yan Wang
Siew S Neo
Feng Q Liu
Stan D Tsai
Yongqi Hu
Alain Duboust
Antoine P Manens
Ralph M Wadensweiler
Rashid Mavliv
Liang-Yuh Chen
Donald J K Olgado
Paul D Butterfield
Ming-Kuei Tseng
Shou-Sung Chang
Lizhong Sun
Original Assignee
Applied Materials Inc
Yan Wang
Siew S Neo
Feng Q Liu
Stan D Tsai
Yongqi Hu
Alain Duboust
Antoine P Manens
Ralph M Wadensweiler
Rashid Mavliv
Liang-Yuh Chen
Donald J K Olgado
Paul D Butterfield
Ming-Kuei Tseng
Shou-Sung Chang
Lizhong Sun
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/642,128 external-priority patent/US6962524B2/en
Application filed by Applied Materials Inc, Yan Wang, Siew S Neo, Feng Q Liu, Stan D Tsai, Yongqi Hu, Alain Duboust, Antoine P Manens, Ralph M Wadensweiler, Rashid Mavliv, Liang-Yuh Chen, Donald J K Olgado, Paul D Butterfield, Ming-Kuei Tseng, Shou-Sung Chang, Lizhong Sun filed Critical Applied Materials Inc
Priority to EP04757017A priority Critical patent/EP1648658A2/en
Priority to JP2006518987A priority patent/JP2007528794A/en
Publication of WO2005002794A2 publication Critical patent/WO2005002794A2/en
Publication of WO2005002794A3 publication Critical patent/WO2005002794A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention provides a cell, a system and an article for processing a substrate in an electrochemical mechanical polishing system. A cell for polishing a substrate includes a polishing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper polishing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. A system is provided having a bulk polishing cell and a residual polishing cell. The residual polishing cell includes a biased conductive polishing surface. In further embodiments, the conductive element is protected from attack by process chemistries.
PCT/US2004/022722 2003-07-01 2004-07-01 Cell, system and article for electrochemical mechanical processing (ecmp) WO2005002794A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04757017A EP1648658A2 (en) 2003-07-01 2004-07-01 Cell, system and article for electrochemical mechanical processing (ecmp)
JP2006518987A JP2007528794A (en) 2003-07-01 2004-07-01 Method and apparatus for electrochemical mechanical processing

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US48418903P 2003-07-01 2003-07-01
US60/484,189 2003-07-01
US10/642,128 US6962524B2 (en) 2000-02-17 2003-08-15 Conductive polishing article for electrochemical mechanical polishing
US10/642,128 2003-08-15
US51668003P 2003-11-03 2003-11-03
US60/516,680 2003-11-03

Publications (2)

Publication Number Publication Date
WO2005002794A2 WO2005002794A2 (en) 2005-01-13
WO2005002794A3 true WO2005002794A3 (en) 2005-03-31

Family

ID=33568609

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/022722 WO2005002794A2 (en) 2003-07-01 2004-07-01 Cell, system and article for electrochemical mechanical processing (ecmp)

Country Status (4)

Country Link
EP (1) EP1648658A2 (en)
JP (1) JP2007528794A (en)
KR (1) KR20060035653A (en)
WO (1) WO2005002794A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4598095B2 (en) * 2008-03-11 2010-12-15 育弘 池田 Polishing equipment
CN102089122A (en) * 2008-05-15 2011-06-08 3M创新有限公司 Polishing pad with endpoint window and systems and method using the same
TWI396603B (en) 2008-06-26 2013-05-21 3M Innovative Properties Co Polishing pad with porous elements and method of making and using the same
SG181678A1 (en) 2009-12-30 2012-07-30 3M Innovative Properties Co Polishing pads including phase-separated polymer blend and method of making and using the same
CN109773290B (en) * 2019-02-21 2020-06-02 清华大学 Microsphere electric contact feedback insulation material workpiece surface alignment system and method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6116998A (en) * 1997-01-13 2000-09-12 Struers A/S Attachment means and use of such means for attaching a sheet-formed abrasive or polishing means to a magnetized support
US20020148732A1 (en) * 2001-04-11 2002-10-17 Ismail Emesh Method and apparatus for electrochemically depositing a material onto a workpiece surface
US6497800B1 (en) * 2000-03-17 2002-12-24 Nutool Inc. Device providing electrical contact to the surface of a semiconductor workpiece during metal plating
US20030114087A1 (en) * 2001-12-19 2003-06-19 Applied Materials, Inc. Method and apparatus for face-up substrate polishing
US20030220053A1 (en) * 2000-02-17 2003-11-27 Applied Materials, Inc. Apparatus for electrochemical processing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6116998A (en) * 1997-01-13 2000-09-12 Struers A/S Attachment means and use of such means for attaching a sheet-formed abrasive or polishing means to a magnetized support
US20030220053A1 (en) * 2000-02-17 2003-11-27 Applied Materials, Inc. Apparatus for electrochemical processing
US6497800B1 (en) * 2000-03-17 2002-12-24 Nutool Inc. Device providing electrical contact to the surface of a semiconductor workpiece during metal plating
US20020148732A1 (en) * 2001-04-11 2002-10-17 Ismail Emesh Method and apparatus for electrochemically depositing a material onto a workpiece surface
US20030114087A1 (en) * 2001-12-19 2003-06-19 Applied Materials, Inc. Method and apparatus for face-up substrate polishing

Also Published As

Publication number Publication date
JP2007528794A (en) 2007-10-18
KR20060035653A (en) 2006-04-26
WO2005002794A2 (en) 2005-01-13
EP1648658A2 (en) 2006-04-26

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