WO2005006076A3 - Systems for magnification and distortion correction for imprint lithography processes - Google Patents

Systems for magnification and distortion correction for imprint lithography processes Download PDF

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Publication number
WO2005006076A3
WO2005006076A3 PCT/US2004/022454 US2004022454W WO2005006076A3 WO 2005006076 A3 WO2005006076 A3 WO 2005006076A3 US 2004022454 W US2004022454 W US 2004022454W WO 2005006076 A3 WO2005006076 A3 WO 2005006076A3
Authority
WO
WIPO (PCT)
Prior art keywords
template
magnification
systems
contact members
distortion correction
Prior art date
Application number
PCT/US2004/022454
Other languages
French (fr)
Other versions
WO2005006076A2 (en
Inventor
Byung Jin Choi
Sidlgata V Sreenivasan
Mario J Meissl
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Priority to EP04778126A priority Critical patent/EP1642170A4/en
Priority to JP2006518977A priority patent/JP4594305B2/en
Publication of WO2005006076A2 publication Critical patent/WO2005006076A2/en
Publication of WO2005006076A3 publication Critical patent/WO2005006076A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning

Abstract

The present invention is directed toward a system to vary dimensions of a template in order to attenuate if not prevent distortions in an underlying pattern formed by the template. To that end, the system features a compression device that includes a pair of spaced-apart contact members to compress a perimeter surface of the template between the pair of spaced-apart contact members. The compression device includes first and second bodies, each has a contact member and an actuator arm. One of the actuator arms is coupled to the first body to reciprocate about an axis in response to variations of a volume of a bladder disposed adjacent to the actuator arm. In this manner, the distance between the two contact members may be varied.
PCT/US2004/022454 2003-07-09 2004-07-08 Systems for magnification and distortion correction for imprint lithography processes WO2005006076A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04778126A EP1642170A4 (en) 2003-07-09 2004-07-08 Systems for magnification and distortion correction for imprint lithography processes
JP2006518977A JP4594305B2 (en) 2003-07-09 2004-07-08 System for correcting magnification and distortion in imprint lithography processes

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/616,294 US7150622B2 (en) 2003-07-09 2003-07-09 Systems for magnification and distortion correction for imprint lithography processes
US10/616,294 2003-07-09

Publications (2)

Publication Number Publication Date
WO2005006076A2 WO2005006076A2 (en) 2005-01-20
WO2005006076A3 true WO2005006076A3 (en) 2006-07-06

Family

ID=33564732

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/022454 WO2005006076A2 (en) 2003-07-09 2004-07-08 Systems for magnification and distortion correction for imprint lithography processes

Country Status (8)

Country Link
US (1) US7150622B2 (en)
EP (1) EP1642170A4 (en)
JP (1) JP4594305B2 (en)
KR (1) KR20060034694A (en)
CN (1) CN1871103A (en)
MY (1) MY137556A (en)
TW (1) TW200522155A (en)
WO (1) WO2005006076A2 (en)

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JP4594305B2 (en) 2010-12-08
US7150622B2 (en) 2006-12-19
MY137556A (en) 2009-02-27
EP1642170A2 (en) 2006-04-05
CN1871103A (en) 2006-11-29
WO2005006076A2 (en) 2005-01-20
KR20060034694A (en) 2006-04-24
EP1642170A4 (en) 2009-04-15
US20050006343A1 (en) 2005-01-13
TW200522155A (en) 2005-07-01
JP2007535121A (en) 2007-11-29

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