WO2005008790A3 - Leuchtdiode sowie led-lichtquelle - Google Patents

Leuchtdiode sowie led-lichtquelle Download PDF

Info

Publication number
WO2005008790A3
WO2005008790A3 PCT/EP2004/051066 EP2004051066W WO2005008790A3 WO 2005008790 A3 WO2005008790 A3 WO 2005008790A3 EP 2004051066 W EP2004051066 W EP 2004051066W WO 2005008790 A3 WO2005008790 A3 WO 2005008790A3
Authority
WO
WIPO (PCT)
Prior art keywords
led
circuit board
pcb
emitting diode
contacts
Prior art date
Application number
PCT/EP2004/051066
Other languages
English (en)
French (fr)
Other versions
WO2005008790A2 (de
Inventor
Guenther Leising
Original Assignee
Guenther Leising
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guenther Leising filed Critical Guenther Leising
Priority to EP04741760.5A priority Critical patent/EP1839344B1/de
Priority to EP11181590.8A priority patent/EP2398080B1/de
Priority to CA2553921A priority patent/CA2553921C/en
Priority to US10/586,386 priority patent/US8614456B2/en
Publication of WO2005008790A2 publication Critical patent/WO2005008790A2/de
Publication of WO2005008790A3 publication Critical patent/WO2005008790A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

Abstract

Ein LED-Die (3) ist mit einem Kleber (4) auf einem LED-PCB (6) angeordnet. Das LED-PCB (6) weist an der dem LED­Die (3) gegenüberliegenden Seite Rückseitenkontakte (7) auf. Dadurch wird eine eigenständige LED-Lampe gebildet, die z.B. durch SMT auf einer Platine (9) angebracht werden kann bzw. In einen Lampensockel eingeffihrt werden kann. Erfindungsgemäss decken die Rückseitenkontakte (7) mindestens die halbe Fläche, vorzugsweise bis auf notwendige Ausnahmen die gesamte Fläche des LED-PCB (6) ab. Dadurch kann die Wärme mit geringem thermischem Widerstand abgeleitet werden. Vorzugsweise ist auf der Rückseite der Platine (9) ein Kühlkörper (11) angeordnet. In diesem Fall ist es zweckmässig, wenn die Platine (9) Durchkontaktierungen zur Erhöhung der Wärmeleitfähigkeit aufweist.
PCT/EP2004/051066 2003-07-11 2004-06-09 Leuchtdiode sowie led-lichtquelle WO2005008790A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP04741760.5A EP1839344B1 (de) 2003-07-11 2004-06-09 Leuchtdiode sowie led-lichtquelle
EP11181590.8A EP2398080B1 (de) 2003-07-11 2004-06-09 Leuchtdioden-Lichtquelle
CA2553921A CA2553921C (en) 2003-07-11 2004-06-09 Led and led light source
US10/586,386 US8614456B2 (en) 2003-07-11 2004-06-09 LED and LED light source

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATA1072/2003 2003-07-11
AT0107203A AT501081B8 (de) 2003-07-11 2003-07-11 Led sowie led-lichtquelle

Publications (2)

Publication Number Publication Date
WO2005008790A2 WO2005008790A2 (de) 2005-01-27
WO2005008790A3 true WO2005008790A3 (de) 2005-06-09

Family

ID=34069593

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/051066 WO2005008790A2 (de) 2003-07-11 2004-06-09 Leuchtdiode sowie led-lichtquelle

Country Status (5)

Country Link
US (1) US8614456B2 (de)
EP (2) EP2398080B1 (de)
AT (1) AT501081B8 (de)
CA (1) CA2553921C (de)
WO (1) WO2005008790A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602005016280D1 (de) * 2005-11-29 2009-10-08 Nat Central University Jungli Licht aussendendes Bauelement
CN100459194C (zh) * 2006-02-28 2009-02-04 财团法人工业技术研究院 封装结构与封装方法
US7735738B2 (en) * 2007-06-28 2010-06-15 Symbol Technologies, Inc. Thermal management in imaging reader
KR100877881B1 (ko) * 2007-09-06 2009-01-08 엘지이노텍 주식회사 발광다이오드 패키지 및 그 제조방법
US10256385B2 (en) * 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US20100027281A1 (en) * 2008-07-31 2010-02-04 Waters Stanley E LED Anti-Collision Light for Commercial Aircraft
EP3108178B1 (de) * 2014-01-02 2017-11-15 TE Connectivity Nederland B.V. Led-fassungsanordnung
US10908351B2 (en) 2017-02-13 2021-02-02 Signify Holding B.V. Frame for supporting a light guide panel and luminaire comprising the frame

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19963264A1 (de) * 1999-12-17 2001-06-21 Sli Miniature Lighting Gmbh Trägermaterial für ein elektronisches Hochleistungs-Bauelement und ein damit hergestelltes Bauelement
US6531328B1 (en) * 2001-10-11 2003-03-11 Solidlite Corporation Packaging of light-emitting diode
WO2004088760A2 (en) * 2003-03-28 2004-10-14 Gelcore Llc Led power package

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6072281A (ja) 1983-09-28 1985-04-24 Sanyo Electric Co Ltd 発光ダイオ−ド基板
JPH0343750U (de) * 1989-09-04 1991-04-24
US5491362A (en) * 1992-04-30 1996-02-13 Vlsi Technology, Inc. Package structure having accessible chip
JP2915706B2 (ja) 1992-07-15 1999-07-05 シャープ株式会社 発光装置
JPH06163794A (ja) * 1992-11-19 1994-06-10 Shinko Electric Ind Co Ltd メタルコアタイプの多層リードフレーム
JP3535602B2 (ja) * 1995-03-23 2004-06-07 松下電器産業株式会社 面実装型ｌｅｄ
JP3269397B2 (ja) * 1995-09-19 2002-03-25 株式会社デンソー プリント配線基板
US6045240A (en) * 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
JPH11168235A (ja) * 1997-12-05 1999-06-22 Toyoda Gosei Co Ltd 発光ダイオード
JP3183643B2 (ja) 1998-06-17 2001-07-09 株式会社カツラヤマテクノロジー 凹みプリント配線板の製造方法
AT407977B (de) * 1999-03-02 2001-07-25 Lumitech Univ Prof Dr Leising Warndreieck mit roten reflektoren und innerhalb liegenden rot lumieszierenden flächen
DE19928576C2 (de) * 1999-06-22 2003-05-22 Osram Opto Semiconductors Gmbh Oberflächenmontierbares LED-Bauelement mit verbesserter Wärmeabfuhr
TW465123B (en) * 2000-02-02 2001-11-21 Ind Tech Res Inst High power white light LED
US6428189B1 (en) * 2000-03-31 2002-08-06 Relume Corporation L.E.D. thermal management
JP2001345485A (ja) * 2000-06-02 2001-12-14 Toyoda Gosei Co Ltd 発光装置
US6452217B1 (en) * 2000-06-30 2002-09-17 General Electric Company High power LED lamp structure using phase change cooling enhancements for LED lighting products
DE10033502A1 (de) * 2000-07-10 2002-01-31 Osram Opto Semiconductors Gmbh Optoelektronisches Modul, Verfahren zu dessen Herstellung und dessen Verwendung
AT413062B (de) * 2000-07-12 2005-10-15 Tridonic Optoelectronics Gmbh Verfahren zur herstellung einer led-lichtquelle
TW459403B (en) * 2000-07-28 2001-10-11 Lee Jeong Hoon White light-emitting diode
US6614103B1 (en) * 2000-09-01 2003-09-02 General Electric Company Plastic packaging of LED arrays
US6345903B1 (en) * 2000-09-01 2002-02-12 Citizen Electronics Co., Ltd. Surface-mount type emitting diode and method of manufacturing same
JP4077170B2 (ja) * 2000-09-21 2008-04-16 シャープ株式会社 半導体発光装置
US6867493B2 (en) * 2000-11-15 2005-03-15 Skyworks Solutions, Inc. Structure and method for fabrication of a leadless multi-die carrier
JP5110744B2 (ja) * 2000-12-21 2012-12-26 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー 発光装置及びその製造方法
MY131962A (en) * 2001-01-24 2007-09-28 Nichia Corp Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
US6639360B2 (en) * 2001-01-31 2003-10-28 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
US7075112B2 (en) * 2001-01-31 2006-07-11 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
JP2003115204A (ja) * 2001-10-04 2003-04-18 Toyoda Gosei Co Ltd 遮光反射型デバイス及び光源
US6833566B2 (en) * 2001-03-28 2004-12-21 Toyoda Gosei Co., Ltd. Light emitting diode with heat sink
JP2002299698A (ja) * 2001-03-30 2002-10-11 Sumitomo Electric Ind Ltd 発光装置
EP1392998A1 (de) * 2001-05-08 2004-03-03 Lumileds Lighting the Netherlands B.V. Beleuchtungssystem und anzeige vorrichtung
KR100419611B1 (ko) * 2001-05-24 2004-02-25 삼성전기주식회사 발광다이오드 및 이를 이용한 발광장치와 그 제조방법
JP4813691B2 (ja) * 2001-06-06 2011-11-09 シチズン電子株式会社 発光ダイオード
JP4959071B2 (ja) 2001-07-04 2012-06-20 ローム株式会社 面実装型半導体装置
TW543128B (en) * 2001-07-12 2003-07-21 Highlink Technology Corp Surface mounted and flip chip type LED package
US6670648B2 (en) * 2001-07-19 2003-12-30 Rohm Co., Ltd. Semiconductor light-emitting device having a reflective case
CN1464953A (zh) * 2001-08-09 2003-12-31 松下电器产业株式会社 Led照明装置和卡型led照明光源
US6498355B1 (en) * 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
US6827468B2 (en) * 2001-12-10 2004-12-07 Robert D. Galli LED lighting assembly
US6599768B1 (en) * 2002-08-20 2003-07-29 United Epitaxy Co., Ltd. Surface mounting method for high power light emitting diode
US7800121B2 (en) * 2002-08-30 2010-09-21 Lumination Llc Light emitting diode component
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
TW578280B (en) * 2002-11-21 2004-03-01 United Epitaxy Co Ltd Light emitting diode and package scheme and method thereof
KR20040092512A (ko) * 2003-04-24 2004-11-04 (주)그래픽테크노재팬 방열 기능을 갖는 반사판이 구비된 반도체 발광장치
US6876008B2 (en) * 2003-07-31 2005-04-05 Lumileds Lighting U.S., Llc Mount for semiconductor light emitting device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19963264A1 (de) * 1999-12-17 2001-06-21 Sli Miniature Lighting Gmbh Trägermaterial für ein elektronisches Hochleistungs-Bauelement und ein damit hergestelltes Bauelement
US6531328B1 (en) * 2001-10-11 2003-03-11 Solidlite Corporation Packaging of light-emitting diode
WO2004088760A2 (en) * 2003-03-28 2004-10-14 Gelcore Llc Led power package

Non-Patent Citations (7)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 009, no. 208 (E - 338) 24 August 1985 (1985-08-24) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 255 (E - 1548) 16 May 1994 (1994-05-16) *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 02 28 February 1997 (1997-02-28) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 11 30 September 1999 (1999-09-30) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22) *
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 05 12 May 2003 (2003-05-12) *
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 08 6 August 2003 (2003-08-06) *

Also Published As

Publication number Publication date
EP2398080A3 (de) 2014-04-23
EP2398080B1 (de) 2019-08-14
EP1839344B1 (de) 2017-03-01
EP1839344A2 (de) 2007-10-03
WO2005008790A2 (de) 2005-01-27
AT501081B8 (de) 2007-02-15
AT501081A4 (de) 2006-06-15
CA2553921A1 (en) 2005-01-27
US8614456B2 (en) 2013-12-24
CA2553921C (en) 2014-03-18
EP2398080A2 (de) 2011-12-21
US20070111351A1 (en) 2007-05-17
AT501081B1 (de) 2006-06-15

Similar Documents

Publication Publication Date Title
US7420811B2 (en) Heat sink structure for light-emitting diode based streetlamp
EP3051586A3 (de) Integrierte leuchte auf led-basis für allgemeine beleuchtung
TW200505058A (en) Integrated light-emitting diode system
CN101687472B (zh) 具有散热罩的照明组件
WO2003016782A1 (en) Led illuminator and card type led illuminating light source
TW200639353A (en) Illumination device having at least one light-emitting diode and vehicle headlight
TW200644293A (en) LED unit and LED illuminating lamp using such LED unit
EP3770980A3 (de) Lichtemittierendes modul
WO2007124276A3 (en) Light emitting diode packages
MX2010003785A (es) Dispositivo de iluminacion con diodos emisores de luz.
EP1895232B1 (de) Verbesserte Kühlkörperstruktur für LED Strassenleuchte
EP1630474A3 (de) Lichtemittierendes Modul und Beleuchtungseinheit
ATE499569T1 (de) Glühbirne mit leuchtdioden
CA2549077A1 (en) Light emitting diode (led) light bulbs
DE60223050D1 (de) Fahrzeuglampenanordnung mit kühlkörper
JP2007012416A5 (de)
EP1453109A3 (de) Lichtquelleneinheit aus Leuchtdioden
WO2009016852A1 (ja) 照明装置、及びこれを用いた表示装置
WO2008078587A1 (ja) 発光装置、表示装置、および固体発光素子基板
TW200719028A (en) Backlight module
EP1795797A4 (de) Led-lampe
TW200723955A (en) Light-emitting diode work lamp
WO2012075891A8 (zh) 全方位led球泡灯
ATE537405T1 (de) Led-lampe mit wärmeabfuhrvorrichtung
WO2007002400A3 (en) Replaceable vehicle lamp with led light sources

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
REEP Request for entry into the european phase

Ref document number: 2004741760

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2004741760

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2553921

Country of ref document: CA

WWE Wipo information: entry into national phase

Ref document number: 2007111351

Country of ref document: US

Ref document number: 10586386

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 10586386

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 2004741760

Country of ref document: EP